TWM446413U - Deposition isolated disk - Google Patents

Deposition isolated disk Download PDF

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Publication number
TWM446413U
TWM446413U TW101215903U TW101215903U TWM446413U TW M446413 U TWM446413 U TW M446413U TW 101215903 U TW101215903 U TW 101215903U TW 101215903 U TW101215903 U TW 101215903U TW M446413 U TWM446413 U TW M446413U
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TW
Taiwan
Prior art keywords
disk
tension
barrier
wall
deposition
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TW101215903U
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Chinese (zh)
Inventor
Jung-Feng Yang
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Lextar Electronics Corp
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Priority to TW101215903U priority Critical patent/TWM446413U/en
Publication of TWM446413U publication Critical patent/TWM446413U/en

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Abstract

A Deposition isolated disk using in a chemical vapor deposition system is provided. The deposition isolated disk comprises a blocking disk and a tension disk. The blocking disk has a plurality of arc edges, an inner wall , a relative upper surface and lower surface. The tension disk has a tension surface and an outer wall. The outer wall of the tension disk further has an assembling structure. The outer wall of the tension disk supports the inner wall of the blocking disk by the assembling structure.

Description

沉積隔離盤Deposition spacer

本創作關於一種沉積隔離盤,特別是指一種用於化學氣相沉積系統內之沉積隔離盤。This creation relates to a deposition separator disk, and more particularly to a deposition separator disk for use in a chemical vapor deposition system.

化學氣相沉積(Chemical Vapor Deposition,CVD)是一種能夠產生高純度固態材料的技術,廣泛運用在半導體產業之中。一般的CVD製程係將基底放置在混合氣體環境中,並以中高溫加熱,使基底表面發生化學反應而產生欲沉積之薄膜。Chemical Vapor Deposition (CVD) is a technology that produces high-purity solid materials and is widely used in the semiconductor industry. A typical CVD process places the substrate in a mixed gas atmosphere and heats it at a medium to high temperature to chemically react the surface of the substrate to produce a film to be deposited.

為防止沉積物進入機台內部而損壞零件,CVD反應器多設置有隔離元件,以區隔機台零件與基材反應區。然而,現行之隔離元件相當脆弱,沉積一定量的沉積物後容易發生暗裂或破裂,甚至在清洗時就有可能破裂,徒然增加成本。In order to prevent deposits from entering the inside of the machine and damaging the parts, the CVD reactor is often provided with isolation elements to separate the reaction parts of the machine parts from the substrate. However, the current isolation elements are quite fragile, and it is prone to cracking or cracking after depositing a certain amount of deposits, and may even rupture during cleaning, which in vain increases costs.

本創作提出一種沉積隔離盤,能提昇強度同時延長其生命週期。This work proposes a deposition isolation disk that increases strength while extending its life cycle.

根據本創作之一實施例,提供一種設於化學氣相沉積系統內之沉積隔離盤,此沉積隔離盤包括阻隔盤及張力盤。阻隔盤具有複數個圓弧狀外緣、內壁及相對之阻隔表面與阻隔底面。張力盤具有張力表面及外壁。張力盤之外壁更具有組合結構,使得張力盤之外壁支撐阻隔盤之內 壁。According to an embodiment of the present invention, a deposition spacer disposed in a chemical vapor deposition system is provided, the deposition spacer including a barrier disk and a tension disk. The barrier disk has a plurality of arcuate outer edges, an inner wall and opposite barrier surfaces and a barrier bottom surface. The tension disk has a tension surface and an outer wall. The outer wall of the tension disc has a combined structure, so that the outer wall of the tension disc supports the inside of the barrier disc wall.

為了對本創作之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式,作詳細說明如下:In order to better understand the above and other aspects of the present invention, the following specific embodiments, together with the drawings, are described in detail below:

請參照第1圖,其繪示依據本創作一實施例之沉積隔離盤的立體分解圖。沉積隔離盤100為包括阻隔盤110及張力盤120的兩件式結構。阻隔盤110上形成有組合結構121。張力盤120藉由組合結構121與阻隔盤110結合成沉積隔離盤100。Please refer to FIG. 1 , which is a perspective exploded view of a deposition spacer according to an embodiment of the present invention. The deposition spacer 100 is a two-piece structure including a barrier disk 110 and a tension disk 120. A composite structure 121 is formed on the barrier disk 110. The tension disk 120 is combined with the barrier disk 110 by the combination structure 121 to deposit the spacer disk 100.

如第1圖所示,阻隔盤110為一均勻的環形結構,具有外緣110a、內壁110b及相對之阻隔表面110a與阻隔底面110b(第2圖)。As shown in Fig. 1, the barrier disk 110 has a uniform annular structure having an outer edge 110a, an inner wall 110b, and a opposing barrier surface 110a and a barrier bottom surface 110b (Fig. 2).

外緣110a呈圓弧狀,每個圓弧可密接一待沉積之晶圓(未繪示)。本實施例中外緣110a係由11個圓弧所組成,然數量並非限制於此。此外,其它實施例中,可依機台設計或製程需要調整阻隔盤外緣110a之形狀。The outer edge 110a has an arc shape, and each arc can be closely attached to a wafer to be deposited (not shown). In the present embodiment, the outer edge 110a is composed of eleven arcs, but the number is not limited thereto. In addition, in other embodiments, the shape of the outer edge 110a of the barrier disk may be adjusted depending on the design or process of the machine.

內壁110b為環形,其圍繞出空間111,以容納張力盤120。The inner wall 110b is annular and surrounds the exit space 111 to accommodate the tension disk 120.

請參照第2圖,其繪示阻隔盤110與張力盤120分離狀態的剖面圖。阻隔盤110自內壁110b到外緣110a的厚度相同,較佳但非限定地約為3.8毫米(mm),此均勻厚度提供阻隔盤110足夠強度,避免暗裂與破裂的發生,然此數值並非用以限定此實施例。Referring to FIG. 2, a cross-sectional view showing the state in which the barrier disk 110 is separated from the tension disk 120 is shown. The thickness of the barrier disk 110 from the inner wall 110b to the outer edge 110a is the same, preferably but not limited to about 3.8 millimeters (mm). This uniform thickness provides sufficient strength for the barrier disk 110 to avoid the occurrence of cracks and cracks. It is not intended to limit this embodiment.

張力盤120具有外壁120a及相對之張力表面120c與 張力底面120d。The tension disk 120 has an outer wall 120a and an opposite tension surface 120c and Tension bottom surface 120d.

張力盤120之厚度大於阻隔盤110之厚度,較佳但非限定地約為17毫米,然此數值並非用以限定此實施例。張力盤120的厚度提供張力盤120足夠強度,其上之沉積物即使堆疊也較難造成暗裂或破裂。The thickness of the tension disk 120 is greater than the thickness of the barrier disk 110, preferably but not limited to about 17 millimeters, although this value is not intended to limit this embodiment. The thickness of the tension disk 120 provides the tension disk 120 with sufficient strength that deposits thereon are less likely to cause cracking or cracking even if stacked.

上述張力盤120與阻隔盤110可選用相同或不同之材質製成,其材質係選自不會與化學氣相沉積系統之反應物反應的材料,例如是石英。The tension disk 120 and the barrier disk 110 may be made of the same or different materials, and the material is selected from materials which do not react with the reactants of the chemical vapor deposition system, such as quartz.

此外,張力盤120之外壁120a上形成有組合結構121。張力盤120之外壁120a可藉由組合結構121支撐阻隔盤110之內壁110b,進而結合成沉積隔離盤100。Further, a combined structure 121 is formed on the outer wall 120a of the tension disk 120. The outer wall 120a of the tension disc 120 can support the inner wall 110b of the barrier disk 110 by the combined structure 121, thereby being combined to form the deposition spacer 100.

組合結構121為環狀內凹部122。環狀內凹部122自張力盤120之外壁120a向張力盤120之內側凹入,而形成內側壁122b及內側平面122c,其中內側壁122b與內側平面122c構成一相似於L型的結構,使張力表面120c之面積小於張力底面120d之面積。The combined structure 121 is an annular inner recess 122. The annular inner recess 122 is recessed from the outer wall 120a of the tension disc 120 toward the inner side of the tension disc 120 to form an inner side wall 122b and an inner side plane 122c. The inner side wall 122b and the inner side plane 122c form an L-shaped structure, so that the tension The area of the surface 120c is smaller than the area of the tension bottom surface 120d.

請參照第3圖,其繪示阻隔盤110與張力盤120組合狀態的剖面圖。當阻隔盤110與張力盤120組合時,張力盤120置入阻隔盤110內部之空間111,且部份之阻隔盤110卡合於張力盤120之環狀內凹部122中,使得內側平面122c支撐阻隔盤110之部份阻隔底面110d。Referring to FIG. 3, a cross-sectional view showing a state in which the barrier disk 110 and the tension disk 120 are combined is shown. When the barrier disk 110 is combined with the tension disk 120, the tension disk 120 is placed in the space 111 inside the barrier disk 110, and a part of the barrier disk 110 is engaged in the annular inner recess 122 of the tension disk 120, so that the inner plane 122c supports Part of the barrier disk 110 blocks the bottom surface 110d.

阻隔盤110之厚度可與張力盤120之環狀內凹部的高度相等,以使阻隔盤110之阻隔表面110c與張力盤120之張力表面120c對齊。The thickness of the barrier disk 110 may be equal to the height of the annular inner recess of the tension disk 120 such that the barrier surface 110c of the barrier disk 110 is aligned with the tension surface 120c of the tension disk 120.

張力盤120之尺寸可以略小於阻隔盤110內部之空間 111,使得組合完畢之阻隔盤與張力盤之間產生間隙I,減少熱脹冷縮產生的應力。張力盤120之尺寸亦可與阻隔盤110內部之空間111相等,使阻隔盤110之內壁110b能夠緊貼環狀內凹部122之內側壁122b。The size of the tension disk 120 may be slightly smaller than the space inside the barrier disk 110 111, a gap I is formed between the combined barrier disk and the tension disk to reduce stress caused by thermal expansion and contraction. The tension disk 120 may also be equal in size to the space 111 inside the barrier disk 110 such that the inner wall 110b of the barrier disk 110 can abut against the inner side wall 122b of the annular inner recess 122.

本例中之組合結構121係以第2圖之環狀內凹部122為例,然其非用以限定組合結構之形狀。本創作之組合結構121只要能以張力盤120支撐阻隔盤110即可。The combined structure 121 in this example is exemplified by the annular inner recess 122 of Fig. 2, but it is not intended to define the shape of the combined structure. The combined structure 121 of the present invention is only required to support the barrier disk 110 with the tension disk 120.

藉由組合結構121的設計,本創作之沉積隔離盤能分為兩件式,提高張力盤之厚度並以張力盤架起阻隔盤。不但便於清潔,更大大提昇了組件強度。By the design of the combined structure 121, the deposition spacer of the present invention can be divided into two parts, the thickness of the tension disk is increased, and the tension disk is used as a barrier disk. Not only is it easy to clean, but it also increases the strength of the components.

綜上所述,雖然本創作已以實施例揭露如上,然其並非用以限定本創作。本創作所屬技術領域中具有通常知識者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾。因此,本創作之保護範圍當視後附之申請專利範圍所界定者為準。In summary, although the present invention has been disclosed above by way of example, it is not intended to limit the present invention. Those who have ordinary knowledge in the technical field of the present invention can make various changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application.

100‧‧‧沉積隔離盤100‧‧‧Deposition isolation tray

110‧‧‧阻隔盤110‧‧‧Block

110a‧‧‧外緣110a‧‧‧ outer edge

110b‧‧‧內壁110b‧‧‧ inner wall

110c‧‧‧阻隔表面110c‧‧‧Baffle surface

110d‧‧‧阻隔底面110d‧‧‧Baffle bottom

111‧‧‧空間111‧‧‧ Space

120‧‧‧張力盤120‧‧‧Tension disk

120a‧‧‧外壁120a‧‧‧ outer wall

120c‧‧‧張力表面120c‧‧‧ Tension surface

120d‧‧‧張力底面120d‧‧‧ Tension bottom

121‧‧‧組合結構121‧‧‧Combined structure

122‧‧‧環狀內凹部122‧‧‧Circular recess

122b‧‧‧內側壁122b‧‧‧ inner side wall

122c‧‧‧內側平面122c‧‧‧ inside plane

I‧‧‧間隙I‧‧‧ gap

第1圖繪示依據本創作一實施例之沉積隔離盤的立體分解圖。FIG. 1 is an exploded perspective view of a deposition spacer according to an embodiment of the present invention.

第2圖繪示阻隔盤與張力盤分離狀態的剖面圖。Figure 2 is a cross-sectional view showing the state in which the barrier disk and the tension disk are separated.

第3圖繪示阻隔盤與張力盤組合狀態的剖面圖。Figure 3 is a cross-sectional view showing the state in which the barrier disk and the tension disk are combined.

100‧‧‧沉積隔離盤100‧‧‧Deposition isolation tray

110‧‧‧阻隔盤110‧‧‧Block

110a‧‧‧外緣110a‧‧‧ outer edge

110b‧‧‧內壁110b‧‧‧ inner wall

110c‧‧‧阻隔表面110c‧‧‧Baffle surface

111‧‧‧空間111‧‧‧ Space

120‧‧‧張力盤120‧‧‧Tension disk

120c‧‧‧張力表面120c‧‧‧ Tension surface

121‧‧‧組合結構121‧‧‧Combined structure

Claims (8)

一種沉積隔離盤,設於一化學氣相沉積系統之內,該沉積隔離盤包括:一阻隔盤,具有複數個圓弧狀外緣、一內壁、一阻隔表面及一阻隔底面;以及一張力盤,具有一張力表面及一外壁,其中該張力盤之該外壁具有一組合結構,使得該張力盤之該外壁支撐該阻隔盤之該內壁。A deposition spacer disposed in a chemical vapor deposition system, the deposition spacer comprising: a barrier disk having a plurality of arcuate outer edges, an inner wall, a barrier surface, and a barrier bottom surface; and a force The disc has a force surface and an outer wall, wherein the outer wall of the tension disc has a combined structure such that the outer wall of the tension disc supports the inner wall of the barrier disc. 如申請專利範圍第1項所述之沉積隔離盤,其中該組合結構係為一環狀內凹部,該環狀內凹部具有一內側壁,部份之該阻隔盤卡合於該環狀內凹部中,使得該阻隔盤之該內壁緊貼該環狀內凹部之該內側壁。The deposition isolation disk of claim 1, wherein the composite structure is an annular inner recess having an inner side wall, and a portion of the barrier disk is engaged with the annular inner recess The inner wall of the barrier disk is brought into close contact with the inner side wall of the annular inner recess. 如申請專利範圍第2項所述之沉積隔離盤,其中該環狀內凹部更具有一內側平面,使得該內側平面支撐該阻隔盤之部份該阻隔底面。The deposited spacer disk of claim 2, wherein the annular inner recess further has an inner plane such that the inner plane supports a portion of the barrier bottom surface of the barrier disk. 如申請專利範圍第1項所述之沉積隔離盤,其中該阻隔盤從該內壁至該外緣的厚度相同。The deposition separator of claim 1, wherein the barrier disk has the same thickness from the inner wall to the outer edge. 如申請專利範圍第1項所述之沉積隔離盤,其中該張力盤具有相對於該張力表面之一張力底面,該張力表面的面積小於該張力底面的面積。The deposition spacer of claim 1, wherein the tension disk has a tension bottom surface with respect to the tension surface, the tension surface having an area smaller than an area of the tension bottom surface. 如申請專利範圍第1項所述之沉積隔離盤,其中該張力盤的厚度大於該阻隔盤的厚度。The deposition separator of claim 1, wherein the tension disk has a thickness greater than a thickness of the barrier disk. 如申請專利範圍第1項所述之沉積隔離盤,其中該阻隔盤的厚度至少3.8毫米。The deposition separator of claim 1, wherein the barrier disk has a thickness of at least 3.8 mm. 如申請專利範圍第1項所述之沉積隔離盤,其中該張 力盤的平均厚度至少17毫米。The deposition separator disc of claim 1, wherein the sheet is The force plate has an average thickness of at least 17 mm.
TW101215903U 2012-08-17 2012-08-17 Deposition isolated disk TWM446413U (en)

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