JPWO2007032166A1 - Depositing plate for film forming apparatus and film forming apparatus - Google Patents

Abstract

The film is peeled off from the deposition plate to which the film is attached in the film forming apparatus, and the peeled film can be prevented from being taken into the film formed on the film forming substrate or the substrate and causing a film defect, In particular, a deposition preventing plate and a film forming apparatus for a film forming apparatus that require low defect film formation are provided. An adhesion preventing plate that prevents the film from adhering to the structure in the film forming apparatus, and the outer side of the bent portion obtained by folding the edge of the adhesion preventing plate or the vicinity of the edge of the adhesion preventing plate to the back side is prevented. It is formed by a curved surface having a radius of curvature larger than ½ of the plate thickness of the plate.

Description

  The present invention is an adhesion-preventing plate used for the purpose of preventing the film from adhering to the structure in the film-forming apparatus when the film is formed by sputtering, CVD, vacuum evaporation, or the like. The present invention relates to a deposition preventing plate and a film forming apparatus for a film forming apparatus used in the process.

  In recent years, in products in which a thin film is formed on a substrate in a vacuum, such as optical elements such as DWDM bandpass filters and dichroic filters, magnetic recording media and magnetic heads of hard disks, or mask blanks used in semiconductor lithography, The specifications of defects due to foreign matters mixed in the thin film have become very strict so that the size is smaller and the number is smaller with the miniaturization and higher integration of products.

  For example, in a mask blank used for extreme ultraviolet light reflection lithography, the wavelength of light used for lithography is as very short as 13.5 nm, and the fine pattern of a semiconductor produced by using it is very low at 45 nm or less. Since it is small, it is required to eliminate a defect having a size of 30 nm or more.

  Such a foreign substance in the thin film is attached to a deposition plate installed to prevent the film from adhering to the film forming chamber in a film forming process apparatus such as sputtering, CVD or vacuum deposition. One of the main causes is that the peeled film is peeled off, and a part of the peeled film adheres to the substrate or the film during the film forming process.

  The following reasons are considered as a reason for a film | membrane peeling from an adhesion prevention board. Residual stress is generated in the film attached to the adhesion preventing plate. Therefore, when the film adhering to the adhesion preventing plate becomes thicker, the shear stress due to this residual stress increases, and eventually the film self-collapses and the adhesion force to the adhesion preventing plate is increased. Lose and peel. In particular, at an acute angle portion at the end of the deposition preventing plate as shown in FIG. 7 or a curved surface at the end having a small curvature radius, the film is easily peeled off due to stress concentration.

  As a conventional technique for solving this problem, in order to make it difficult for the film to be peeled off from the deposition preventive plate, there is a method of integrating the deposition preventive plate or eliminating a sharp curved portion of the deposition preventive plate (for example, Patent Document 1). Or the method of spraying the material with the strong adhesive force with the film | membrane which adheres rather than the base material of an adhesion prevention board on the surface of an adhesion prevention board is mentioned (for example, refer patent document 2). In addition, as another method, in order to make it difficult for the film to be peeled off from the deposition preventive plate, the surface of the deposition preventive plate has a concavo-convex shape to improve the adhesion of the film adhered to the deposition preventive plate. (For example, refer to Patent Document 3). In addition, there is a method of making the edge of the adhesion preventing plate have an arc shape. However, in order to cut a rounded surface with a radius of 0.3 mm or more with a shape as shown in FIG. It was not possible to cut with a curved surface having a radius of curvature larger than ½ of (see, for example, Patent Document 4).

JP-A-1-316452 JP-A-60-120515 JP-A-3-183854 JP 2001-73115 A

  However, these conventional techniques are also effective for foreign matter defects in the film having a size of about several μm at the minimum, but the size of 1 μm or less and satisfying the specifications of fewer defects. Is not enough. The cause is peeling of the film from the end of the deposition preventing plate. If the end of the adhesion-preventing plate is left cut, it is dangerous during handling, and is usually chamfered. However, since the thickness of the deposition preventing plate is usually about 1.5 mm, the radius of curvature of the chamfered portion is at most about 0.6 to 0.7 mm. When a film adheres to a portion having such a small radius of curvature, the film easily peels due to stress concentration.

  In order to solve the above problems, the present invention provides an adhesion-preventing plate and a film forming apparatus for a film forming apparatus, which can prevent defects due to foreign matters mixed in the film being formed.

  In order to achieve the above object, the present invention provides an adhesion preventing plate for preventing a film from adhering to a structure in a film forming apparatus such as sputtering, CVD or vacuum deposition, and an end portion of the adhesion preventing plate is Provided is a deposition preventing plate for a film forming apparatus, which is formed by a curved surface having a radius of curvature larger than ½ of the thickness of the deposition preventing plate.

  The present invention also provides an adhesion-preventing plate for preventing a film from adhering to a structure in the film-forming apparatus, the adhesion-preventing plate being opposed to the front surface facing the vapor deposition source of the film-forming apparatus and from the vapor deposition source. And the vicinity of the end portion of the adhesion preventing plate is bent from the front side toward the back surface side, and the outer side of the adhesion preventing plate at the bent portion is 1 / th of the plate thickness of the adhesion preventing plate. Provided is a deposition preventing plate for a film forming apparatus, which is formed by a curved surface having a radius of curvature larger than 2.

  Further, according to the present invention, when the surface of the front and end portions of the deposition preventing plate for a film forming apparatus, which is opposite to the vapor deposition source, represents the surface roughness by the maximum height Ry (JIS B0601 1994), Ry is A deposition preventing plate for a film forming apparatus having a thickness of 5 to 100 μm is provided.

  Further, according to the present invention, when the front surface and the surface of the bent portion of the deposition preventing plate for a film forming apparatus described above represent the surface roughness with the maximum height Ry (JIS B0601 1994), Ry is A deposition preventing plate for a film forming apparatus having a thickness of 5 to 100 μm is provided.

  Further, the present invention is such that the front and end portions of the deposition plate for a film forming apparatus facing the vapor deposition source are coated with a material that prevents the film attached to the deposition plate from peeling off from the deposition plate. An adhesion preventing plate for a film forming apparatus is provided.

  In the present invention, the front face and the vicinity of the end of the deposition plate for a film formation apparatus described above are coated with a material that prevents the film adhering to the deposition plate from peeling off from the deposition plate. An adhesion preventing plate for a film forming apparatus is provided.

  Moreover, this invention provides the film-forming apparatus provided with each above-mentioned adhesion prevention board.

According to the deposition plate for a film forming apparatus of the present invention, the peeling of the film due to the stress of the film adhered to the deposition plate (hereinafter sometimes referred to as an adhesion film) is reduced, and the peeled film becomes a foreign substance in the film. A film having few defects due to mixing can be obtained. In particular, with an anti-adhesion plate whose end is formed with a curved surface with a radius of curvature greater than half the thickness of the anti-adhesion plate, it is protected with dust-free gloves for clean rooms during equipment maintenance. Even if it touches the end of the plate, dust generation from the dust-free glove due to friction between the dust-free glove and the end of the cover plate can be reduced.
Further, if a curved surface having a radius of curvature larger than ½ of the thickness of the deposition preventing plate is provided at the end of the deposition preventing plate, a rib portion thicker than the thickness is formed at the end. The strength of the deposition preventing plate is increased by the rib portion, and deformation due to heating of the deposition preventing plate during long-time film formation can be prevented.

According to the deposition plate for a film forming apparatus in which the vicinity of the end of the present invention is bent, the peeling of the film due to the stress of the film adhering to the deposition plate is similarly reduced. As a result, it is possible to reduce the disadvantages caused by mixing. Furthermore, an adhesion prevention board can be easily produced by bending the edge vicinity. In addition, since it is easy to increase the bending radius of curvature, it is possible to easily produce an adhesion-preventing plate having a bent portion with a larger curvature radius, thereby reducing the peeling of the film due to stress.
Moreover, the dust generation from a dust-free glove by friction with a dust-free glove and the bending part of a protection plate can also be reduced like the said protection plate.
Further, since the vicinity of the end portion of the deposition preventing plate is bent, the strength of the deposition preventing plate is increased, and deformation due to heating of the deposition preventing plate during long-time film formation can be prevented.

Furthermore, the surface of the said adhesion prevention board facing a vapor deposition source and the surface of an edge part or a bending part is made into the surface roughness whose maximum height Ry (JIS B0601 1994) is 5-100 micrometers, and is attached. The peeling of the film attached to the plate can be further reduced.
Such surface roughness can be obtained by roughening the surface of the deposition preventing plate using sand blasting or glass bead blasting. When a film adheres to such a surface, the adhesion area between the film and the adhesion-preventing plate increases, and the film stress is dispersed by the unevenness on the surface of the adhesion-prevention plate. Become.

  In addition, since there are many fine sharp scratches on the surface of the adhesion-preventing plate that has been subjected to rolling roll processing, press processing, or milling processing, if the film adheres to the surface, the film easily peels off due to stress concentration. Become. By making such a surface rough by sandblasting or glass bead blasting, it is possible to remove fine sharp scratches that cause such film peeling. In particular, since the end portion and the vicinity of the end portion of the adhesion-preventing plate are curved, there is a tendency that fine sharp scratches are generated more than in-plane portions. By roughening the end portion and the vicinity of the end after the curved surface processing so that the surface roughness Ry is 5 to 100 μm, peeling of the film in the end portion and the vicinity of the end portion can be further reduced.

  Further, the front surface and the end portion or the bent portion of the deposition preventive plate facing the vapor deposition source are covered with a material that suppresses the film adhering to the deposition preventive plate from being peeled off from the deposition plate. Peeling can be reduced or prevented. The reason why such an effect is obtained is not fully understood, but it is considered that the internal stress of the adhesion film is relieved by the material sandwiched between the adhesion film and the deposition preventing plate.

  According to the film forming apparatus of the present invention, it is possible to reduce the peeling due to the stress of the film adhering to the adhesion-preventing plate and to form a film with few defects due to foreign matter mixing. Further, since the peeling of the attached film can be suppressed, the thicker film can be attached to the deposition preventing plate before the peeling occurs. Thereby, the maintenance interval of the film forming apparatus becomes long, and the operating rate of the film forming apparatus can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS Sectional drawing which shows the whole the deposition preventive plate for film-forming apparatuses which is preferable embodiment of this invention. Sectional drawing of the edge part vicinity of the deposition preventing plate for film-forming apparatuses of FIG. Sectional drawing of the edge part vicinity of the deposition preventive plate for film-forming apparatuses which is other embodiment of this invention. Sectional drawing of the edge part vicinity of the deposition preventive plate for film-forming apparatuses which is other preferable embodiment of this invention. Schematic of the film-forming apparatus concerning this invention. Sectional drawing of the edge part vicinity of the conventional deposition prevention board for film-forming apparatuses. Sectional drawing of the edge part vicinity of the conventional deposition prevention board for film-forming apparatuses.

Explanation of symbols

1: deposition plate 2: front surface facing deposition source 3: deposition source 4: substrate 5: film forming apparatus 6: film forming chamber

  FIG. 1 is a cross-sectional view showing the entire deposition preventing plate for a film forming apparatus according to a preferred embodiment of the present invention. The deposition preventing plate 1 has a front surface 2 facing the vapor deposition source. In the deposition preventing plate 1 installed in the film forming apparatus, the film mainly adheres to the front surface 2 and the end portion facing the vapor deposition source, and wraps around the back surface of the front surface 2 facing the deposition source of the deposition coating plate 1. However, the film hardly adheres to the extent that the film adheres. The plate thickness t of the deposition preventing plate 1 refers to the thickness of the in-plane portion of the deposition preventing plate. Examples of the material of the adhesion-preventing plate include stainless steel, aluminum, and titanium. However, the material is not particularly limited as long as it has less gas emission in a vacuum, has corrosion resistance, and has sufficient strength as an adhesion-preventing plate. .

FIG. 2 is a cross-sectional view of the vicinity of the end of the deposition preventing plate 1 of FIG. The end portion of the deposition preventing plate 1 is formed with a curved surface having a radius of curvature larger than ½ of the plate thickness. That is, it is formed of a curved surface having a radius of curvature larger than t / 2. In FIG. 2 to FIG. 4, for easy understanding, a virtual circle having a diameter t is drawn with a broken line so as to contact the protection plate, and when the curved surface of the deposition plate in contact with the virtual circle is larger than the curved surface of the virtual circle, the portion is It represents a curved surface having a radius of curvature larger than 1/2 of the plate thickness. The front surface 2 of the deposition preventing plate 1 facing the vapor deposition source is substantially flat, and the deposition preventing plate 1 is concave at the inflection point A at the end of the deposition preventing plate 1 and has a curved surface with a radius of curvature larger than ½ of the plate thickness. The curved surface A has a curved surface A that is continuously convex and has a radius of curvature greater than ½ of the plate thickness, and then the curvature radius that is larger than ½ of the plate thickness, which is the next concave inflection point. It passes through the curved point B and is connected to the back surface which is substantially flat. The other end portion of the deposition preventing plate not shown in FIG. 2 and the end portions forming all sides of the deposition preventing plate are also formed from similar curved surfaces. As described above, the appearance of the end portion of the deposition preventing plate 1 has a shape in which a substantially circular shape formed of the curved surface A is formed at the end portion of the deposition preventing plate. The plate thickness t of the deposition preventing plate 1 is often 1.5 mm. In this case, a radius of curvature greater than ½ of the plate thickness indicates greater than 0.75 mm. In particular, in the case of an adhesion-preventing plate having a plate thickness of 1.5 mm or less, it is preferable from the viewpoint of preventing peeling of the film that the radius of the substantially circular shape formed by the curved surface A is 1.0 mm or more.
Here, the inflection point includes not only a change point from a convex curve to a concave curve and a change point from a concave curve to a convex curve, but also a change point from a straight line to a curve.

FIG. 3 is a cross-sectional view of the vicinity of an end portion of a deposition preventing plate for a film forming apparatus according to another embodiment of the present invention. At the inflection point C at the end of the deposition preventing plate 1, the deposition preventing plate 1 has a curved surface having a curvature radius larger than ½ of the plate thickness in a convex shape, and the curvature radius larger than ½ of the plate thickness while changing the curvature. Curved surface B, and is connected to a substantially flat back surface through a concave inflection point D having a radius of curvature greater than ½ of the plate thickness. In FIG. 3, the tip of the end portion of the deposition preventing plate 1 is tilted toward the back side from the center of the thickness of the deposition preventing plate, but may be tilted toward the front 2 side.
Further, the curvature of the curved surface forming the end portion of the deposition preventing plate may not be uniform as long as the curvature radius is larger than ½ of the plate thickness.

  FIG. 4 is a cross-sectional view of the vicinity of the end of the deposition apparatus deposition plate according to another preferred embodiment of the present invention. The adhesion preventing plate 1 of the present example is such that the end radius of the adhesion preventing plate 1 is opposite to the front surface 2 facing the vapor deposition source, that is, on the rear surface side, and the radius of curvature outside the adhesion preventing plate 1 is the thickness of the adhesion preventing plate. The edge of the adhesion prevention plate is bent to the back side of the adhesion prevention plate 1 to prevent the film from adhering to the edge of the adhesion prevention plate. In FIG. 4, the adhesion prevention plate 1 having a thickness t is bent so that a curved surface C between the inflection point E and the inflection point F has a curvature radius of 1.5 t (diameter 3 t) outside the bent portion. ing. The tip of the adhesion preventing plate 1 to be bent has the same thickness as the plate thickness t, and its corner is chamfered with a curve of the radius of curvature smaller than 1/2 of the plate thickness. Since the bent portion between the inflection point E and the inflection point F is a curved surface having a radius of curvature larger than ½ of the plate thickness, it is possible to reduce peeling of the film attached to the bent portion. Moreover, since it can produce by bending the adhesion prevention board which consists of flat plates, it is excellent in workability and can reduce manufacturing cost. Further, since the strength of the deposition preventing plate 1 can be increased by bending the tip portion, it is possible to prevent deformation caused by heating of the deposition preventing plate, particularly during long-time film formation.

  In FIG. 4, the radius of curvature inside the bent portion is t / 2, but it is only necessary that the outer radius of the bent portion can be bent so as to have a radius of curvature larger than ½ of the plate thickness. Therefore, the radius of curvature inside the bent portion may be smaller than ½ of the plate thickness, and the inside may not be a curved surface but the plates may be in contact with each other at an acute angle. In addition, it is desirable to produce a deposition preventing plate by bending a plurality of sides of the deposition preventing plate, preferably the ends of all the sides, but when trying to bend the ends of adjacent sides, the corners where both sides intersect It becomes difficult to bend. When the edge of a part of the side of the deposition preventing plate is not bent, the edge of the side that is not bent is placed on a part shielded from a vapor deposition source to which no film adheres, or shown in FIG. 1 or FIG. It is desirable to form with a curved surface.

Furthermore, in a preferable deposition preventing plate for a film forming apparatus of the present invention, for example, at least a front surface 2 of the deposition preventing plate 1 shown in FIGS. 1 and 3 and a curved surface having a radius of curvature of t / 2 or more facing the evaporation source. However, when the surface roughness is represented by the maximum height Ry (JIS B0601 1994), the surface is rough so that Ry is 5 to 100 μm. The maximum height Ry is more preferably in the range of 10 to 50 μm. Further, the surface other than the front surface 2 and the end portion of the deposition plate facing the vapor deposition source is slightly, but the vapor deposition particles wrap around and adhere to the film, and the adhering film peels off and causes foreign matter. Similarly, a rough surface is preferable. The roughening method is not limited as long as the maximum height Ry after roughening is 5 to 100 μm, but a sandblasting method, a chemical etching method, or the like is preferable.
The method of roughening the front and end surfaces can be applied to the bent portion shown in FIG.

Furthermore, the deposition preventing plate for a film forming apparatus according to the present invention is a material for preventing the attached film from peeling off the end portion (including the bent portion) that has been processed into a front surface and a curved surface facing the vapor deposition source ( Hereinafter, it is preferable to coat with an anti-peeling material). As the peeling preventing material, a material sprayed with aluminum, titanium, alumina, molybdenum, copper, alumina, titanium oxide, silicon carbide, or the like can be used. These materials are preferably selected as appropriate depending on the material of the deposition-preventing plate and the material of the attached film.
By using this peeling preventive coating together with the roughening described above, the effect of preventing the peeling of the adhered film can be further improved. In this case, the anti-peeling material may be coated either after or before roughening. In addition, the surface of the deposition plate, excluding the front and the end, opposite to the deposition source, is slightly attached, but the deposited particles may wrap around and the deposited film may peel off. Similarly, it is preferable to cover the surface with an anti-peeling material.

FIG. 5 is a schematic view of a film forming apparatus according to the present invention. As shown in FIG. 5, the film forming apparatus 5 is formed by depositing vapor deposition particles emitted from the vapor deposition source 3 provided on the top of the film forming chamber 6 on the substrate 4 installed at the bottom of the film forming chamber 6. It is comprised so that it may form a film. In order to prevent the film from adhering to the structure in the film forming chamber 6, the film forming chamber 6 has a front face 2 facing the vapor deposition source 3, and the deposition plate 1 faces the vapor deposition source 3. It is installed at the bottom and side.
A film forming apparatus according to the present invention is characterized in that the deposition preventing plate according to the present invention is provided on a part or all of the deposition preventing plate in the apparatus. That is, it is preferable to use the adhesion-preventing plate according to the present invention for all the adhesion-preventing plates 1 installed in the film forming apparatus, but using the adhesion-preventing plate according to the present invention only for a part of the adhesion-preventing plate 1, Others may use a conventional protective plate. In other words, the adhesion-preventing plate is properly used according to the thickness and state of the film adhering to the adhesion-preventing plate and the influence of the film peeled off from the adhesion-preventing plate.
Furthermore, as described above, the degree of film peeling varies depending on the roughening of the surface of the adhesion-preventing board and the covering with the anti-peeling material. Therefore, the adhesion preventing plate installed in the film forming chamber may be provided with only one type having the same effect of preventing the film from peeling, or depending on the thickness or state of the film adhering to the adhesion preventing plate. Further, a plurality of types of deposition preventing plates having different peeling prevention effects may be provided in combination.

The present invention can prevent the film adhering to the adhesion-preventing plate installed to prevent the film from adhering to the structure in the film forming apparatus, and can improve the quality of the film formation. It can be used in a film forming process that requires defects.

It should be noted that the entire contents of the specification, claims, drawings and abstract of Japanese Patent Application No. 2005-271031 filed on September 16, 2005 are cited herein as disclosure of the specification of the present invention. Incorporated.

Claims (8)

An adhesion preventing plate for preventing the film from adhering to the structure in the film forming apparatus,
An adhesion preventing plate for a film forming apparatus, wherein an end portion of the adhesion preventing plate is formed with a curved surface having a radius of curvature larger than ½ of a thickness of the adhesion preventing plate. An adhesion preventing plate for preventing the film from adhering to the structure in the film forming apparatus,
The deposition plate has a front surface facing the vapor deposition source of the film forming apparatus and a back surface that is shaded by the vapor deposition source, and an end portion of the deposition plate is bent from the front side toward the back surface side. A deposition preventing plate for a film forming apparatus, characterized in that the outer side of the deposition preventing plate at the bent portion is formed by a curved surface having a radius of curvature larger than ½ of the thickness of the deposition preventing plate.   The surface of the front surface and the end portion facing the deposition source of the deposition preventing plate is a rough surface having a Ry of 5 to 100 μm when the surface roughness is expressed by a maximum height Ry (JIS B0601 1994). The deposition preventing plate for film-forming apparatuses as described.   The front surface and the outer surface of the bent portion facing the deposition source of the deposition preventing plate are rough surfaces having a Ry of 5 to 100 μm when the surface roughness is expressed by a maximum height Ry (JIS B0601 1994). 2. A deposition preventing plate for a film forming apparatus according to 2.   4. The film formation according to claim 1, wherein a front surface and an end of the deposition prevention plate facing the deposition source are covered with a material that prevents the film attached to the deposition prevention plate from being peeled off from the deposition protection plate. Equipment protection plate.   The front surface and the outer surface of the bent portion facing the deposition source of the deposition preventing plate are coated with a material that prevents the film attached to the deposition preventing plate from being peeled off from the deposition preventing plate. Depositing plate for film forming equipment.   7. The composition according to claim 5, wherein the material for preventing the film adhering to the adhesion-preventing plate from peeling from the adhesion-preventing plate is aluminum, titanium, alumina, molybdenum, copper, alumina, titanium oxide, or silicon carbide. A protective plate for membrane devices.   The film-forming apparatus provided with the adhesion prevention board in any one of Claims 1-7.

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