TWM444481U - Led lamp of the heat convection heat dissipation structure - Google Patents

Description

Thermal convection heat dissipation structure of LED lamp

The present invention is a heat convection heat dissipation structure of an LED lamp, especially a heat dissipation structure for providing an LED lighting module of an LED lamp.

At present, the existing lighting fixtures are based on environmental protection and power saving requirements, and because of the excellent characteristics of low energy consumption, small size and long service life of the LED, the LED lamps have been gradually replaced by conventional tungsten lamps. Or lighting fixtures such as fluorescent lamps.

Although the LED lamp has the aforementioned advantages compared with the conventional lamp, in the actual operation process of the LED lamp, the high-power LED lamp still has a high temperature phenomenon, and when the high temperature continues for too long, the LED lamp may be caused. Damage, or cause a decrease in luminous efficiency, so how to solve the heat dissipation problem becomes a major problem for whether the LED lamp can operate stably.

At present, the solution to the heat dissipation problem of the LED lamp is to provide a heat sink on the LED lamp, and the heat dissipation function of the LED module is performed by the heat sink, which is mainly provided with a plurality of heat dissipation fins on the outer surface of the heat sink. Therefore, the high-temperature heat generated when the LED module is operated can be directly dissipated into the air through the heat-dissipating fins after being guided and absorbed by a contact surface, thereby achieving the purpose of dissipating heat from the LED module.

However, the existing heat sink structure is simply to dissipate heat from the heat sink fins to the outside world by means of heat dissipation fins, and the heat dissipation fins are dissipated to the outside world unless the fan is assisted to increase the air convection between the heat sink fins. Improve its heat dissipation efficiency.

In order to effectively overcome the problems of the above-mentioned prior art, the present invention mainly comprises a heat dissipating substrate, and a plurality of heat convection cells are formed on the surface of the heat dissipating substrate, and the heat convection cell is convected by air to convect the heat source surface. The heat energy is led to the external air contact surface of the heat dissipation substrate to improve the heat dissipation efficiency of the heat dissipation substrate.

To this end, the present invention discloses a heat convection heat dissipation structure of an LED lamp, which is used as a heat source surface on a surface of a heat dissipation substrate for contacting a heat source component, and the other surface of the heat dissipation substrate serves as an external air contact surface. The outer air contact surface of the heat dissipating substrate has a flat surface, and a plurality of heat convection cells are formed on the heat dissipating substrate, and the heat convection single system includes a large and small conical shape. a groove and a through hole penetrating through the bottom of the tapered groove to the heat source surface, wherein heat generated by the heat source element forms air convection through the heat source surface of the heat dissipation substrate, the through hole and the tapered groove, The heat energy of the heat source surface is led to the outside air contact surface of the heat sink substrate.

The heat convection heat dissipation structure of the LED lamp, wherein the heat convection single system is selected by one of an angular vertebral body and a circular vertebral body.

The heat convection heat dissipation structure of the LED lamp, wherein a heat carrier surface of the heat dissipation substrate and the heat source component further comprise a carrier.

The heat convection heat dissipation structure of the LED lamp, wherein the heat dissipation substrate is a continuous substrate structure made of a plastic material.

The heat convection heat dissipation structure of the LED lamp, wherein the heat dissipation substrate The outer air contact surface is further formed with a plurality of concave arc portions.

Please refer to FIG. 1 to FIG. 3 , which are respectively a partial perspective view, a side cross-sectional view of the heat-dissipating substrate, and a schematic diagram of the air flow direction when the heat dissipation is performed. As shown in the figure, the present invention is mainly provided with a heat dissipating substrate 10, and the heat dissipating substrate 10 has a sheet-like appearance and has upper and lower surfaces, wherein a surface of the heat dissipating substrate 10 serves as a heat source surface 11 For contacting a heat source element 20 or facing a heat source element 20, the other surface of the heat dissipation substrate 10 acts as an external air contact surface 12, and the external air contact surface 12 is a flat surface. In the present creation, the heat dissipating substrate 10 is mainly made of a continuous substrate structure made of a plastic material, and a plurality of heat convection cells 13 are formed on the outer air contact surface 12 of the heat dissipating substrate 10, and the heat convection monomer is The 13 includes a large and small tapered groove 131 and a through hole 132 extending through the bottom of the tapered groove 131 to the heat source surface 11. The tapered groove 131 can be selected from the angular vertebral body and the circular vertebral body. In one case, the thermal energy generated by the heat source element 20 can be concentrated in the tapered groove 131 of the heat convection unit 13 via the heat conduction of the heat source surface 11 of the heat dissipation substrate 10, so that the heat energy H generated by the heat source element 20 can be The air convection is formed through the heat source surface 11 , the through hole 132 and the tapered groove 131 of the heat dissipation substrate 10 , so as to guide the heat energy H of the heat source surface 11 to the external air contact surface 12 of the heat dissipation substrate 10 , thereby achieving rapid heat dissipation. purpose.

It can be understood from the above description that the heat-dissipating substrate 10 of the present invention can pass the general heat between the outside air contact surface 12 and the outside air. The exchange achieves the purpose of dissipating heat. In addition, the heat convection of the heat source surface 13 can be simultaneously conducted to the outside air contact surface 12 of the heat dissipation substrate 10 through the convection of the heat convection unit 13, so that the present invention has The structure of the heat convection unit 13 can greatly enhance and accelerate the heat dissipation efficiency of the heat dissipation substrate 10 to provide better heat dissipation.

Please refer to Fig. 4, which is an embodiment of the heat-dissipating substrate of the present invention applied to an LED lamp. As shown in the figure, the heat dissipation substrate 10 of the present invention can be formed on the surface of the lamp body 35 of an LED lamp 30 to assist the LED lamp 30 to achieve a heat dissipation effect. The LED lamp 30 has a hollow lamp body 35 in the lamp body 35. The upper opening has a partition 32, and an LED module 33 is disposed on the surface of the partition 32 for providing the light source of the LED lamp 30, and a lamp cover 31 is disposed above the lamp body 35 and the partition 32 for use. The LED module 33 is covered and protected, and the lower end of the lamp body 35 is sleeved with a power connector 34. The power connector 34 is electrically connected to the LED module 33. The LED lamp 30 can be mounted on the power connector 34. The lamp holder (not shown) is electrically connected to the lamp holder to provide a working power supply for the LED module 33 through the lamp holder. The surface of the lamp body 35 of the LED lamp 30 is formed with a plurality of heat convection cells 13 . . By providing the heat convection unit 13 on the surface of the lamp body 35, when the LED lamp 30 is in operation, the heat energy generated by the LED module 33 can be guided to the lamp body 35 through the partition 32, except in the lamp body. The surface of the lamp body 35 can be dissipated by heat exchange with the outside air. On the other hand, the heat convection unit 13 can be convected by air to conduct heat from the inner surface of the lamp body 35 to the outer surface of the lamp body 35 for heat dissipation. Since the lamp body 35 has the heat convection unit 13, the LED lamp 30 of the embodiment has better heat dissipation efficiency, and The operating temperature of the LED module 33 is effectively reduced, thereby prolonging the service life of the LED module 33.

Please refer to FIG. 5, which is an embodiment of the present invention when the heat-dissipating substrate is applied to an LED module. As shown in the figure, in the embodiment, the heat dissipation substrate 10 can be directly attached to an LED module 40 to perform heat dissipation. The heat source surface 11 of the heat dissipation substrate 10 is directly attached to the LED module 40. On the surface of a carrier 41, the other surface of the carrier 41 is provided with a plurality of LED elements 42 for providing an output of the light source. When the LED element 42 is operated, the generated thermal energy will be guided via the carrier 41. It is led to the heat dissipation substrate 10 and is radiated through the heat convection unit 13 on the heat dissipation substrate 10.

Please refer to Fig. 6, which is an embodiment of the heat-dissipating substrate of the present invention applied to a heat-generating component. As shown in the figure, in the embodiment, the heat dissipation substrate 10 can also be directly attached to a heat generating component 50 for performing heat dissipation. The heat generating component 50 can be an electronic component such as a processing wafer or a display wafer. The heat source surface 11 of the heat dissipation substrate 10 is directly attached to the surface of the heat generating component 50, so that the heat energy generated when the heat generating component 50 operates can be directly conducted to the heat dissipation substrate 10 and transmitted through the heat convection on the heat dissipation substrate 10. The heat dissipation of the monomer 13 is used to replace and improve the disadvantages of the heat dissipation fins of the conventional heat sink fins.

Please refer to FIG. 7 , which is an embodiment of the heat sink substrate of the present invention applied to an LED downlight. As shown in the figure, the structure of the heat-dissipating substrate 10 of the present invention can also be simultaneously applied to an LED downlight 60 to assist the LED recessed lamp 60 to achieve an accelerated heat dissipation effect, wherein the LED recessed lamp 60 has a hollow tubular lamp. The body 61 is provided with an LED module 62 under the lamp body 61 for A light source of the LED recessed lamp 60 is provided. A power connector 63 is connected to the upper side of the lamp body 61, and a lamp cover 64 is disposed at the opening below the lamp body 61 for covering and protecting the LED module 62. A plurality of heat dissipation fins 65 are respectively disposed on the outer surface of the outer surface, and a connecting piece 66 is respectively connected to the lower surface of each of the heat dissipation fins 65. The upper surface of the connecting piece 66 is respectively formed with a plurality of heat convection cells 67, and the heat convection is formed. The monomer 67 is also composed of a large and small tapered groove 671 (the upper and lower small lines are defined above and below by the orientation of the heat convection unit 13 in Fig. 1), and are located at The through hole 672 is formed in the bottom of the tapered groove 671 of the heat convection unit 67, so that the thermal energy generated by the LED module 62 can be dissipated into the atmosphere through the heat conduction through the heat dissipation fin 65 and the connecting piece 66. At the same time, the heat convection unit 67 on the connecting piece 66 accelerates the heat dissipation of the heat dissipation fins 65. In order to speed up the heat dissipation efficiency, the present invention further comprises a plurality of concave arc portions 68 on the lower surface of the connecting piece 66, thereby increasing the connection piece 66. The surface area of the lower surface is such that when the connecting piece 66 is external After the contact surface of the air has been greatly increased, it may take to achieve efficiency gains and the outside air heat exchange.

In summary, it is only a preferred embodiment of the present invention, and is not intended to limit the present invention; any equivalent modification or replacement that is not done in the spirit of the present disclosure should be included in the patent application described later. Within the scope.

10‧‧‧heating substrate

11‧‧‧heat source surface

12‧‧‧ outside air contact surface

13‧‧‧Hot convection monomer

131‧‧‧Conical groove

132‧‧‧through holes

20‧‧‧Heat source components

30‧‧‧LED lights

31‧‧‧shade

32‧‧‧Baffle

33‧‧‧LED module

34‧‧‧Power connector

35‧‧‧Light body

40‧‧‧LED module

41‧‧‧ Carrier Board

42‧‧‧LED components

50‧‧‧heating components

60‧‧‧ recessed light

61‧‧‧Light body

62‧‧‧LED module

63‧‧‧Power connector

64‧‧‧shade

65‧‧‧Heat fins

66‧‧‧Connecting piece

67‧‧‧Hot convection monomer

671‧‧‧ tapered slot

672‧‧‧through holes

68‧‧‧ concave arc

H‧‧‧ Thermal Energy

Fig. 1 is a partial perspective sectional view showing the heat-dissipating substrate of the present invention.

Figure 2 is a side cross-sectional view of the heat-dissipating substrate of the present invention.

The third figure shows the direction of the airflow when the heat-dissipating substrate is heat-dissipating. Figure.

Fig. 4 is a view showing an embodiment of the heat-dissipating substrate of the present invention applied to an LED lamp.

Fig. 5 is a view showing an embodiment of the heat-dissipating substrate of the present invention applied to an LED module.

Fig. 6 is a view showing an embodiment of the heat-dissipating substrate of the present invention applied to a heat-generating component.

Fig. 7 is a view showing an embodiment of the heat-dissipating substrate of the present invention applied to an LED downlight.

10‧‧‧heating substrate

11‧‧‧heat source surface

12‧‧‧ outside air contact surface

13‧‧‧Hot convection monomer

131‧‧‧Conical groove

132‧‧‧through holes

Claims (5)

A heat convection heat dissipation structure of an LED lamp is used as a heat source surface on a surface of a heat dissipation substrate for contacting a heat source component, and the other surface of the heat dissipation substrate is an external air contact surface, characterized in that: The outer air contact surface of the heat dissipating substrate is a flat surface, and a plurality of heat convection cells are formed on the heat dissipating substrate, and the heat convection single system includes a conical groove with a large upper and a small diameter and a through hole Forming a through hole from the bottom of the groove to the heat source surface, the heat energy generated by the heat source element forms air convection through the heat source surface of the heat dissipation substrate, the through hole and the tapered groove, and the heat energy of the heat source surface is exported to The outside air contact surface of the heat dissipating substrate. The thermal convection heat dissipation structure of the LED lamp according to claim 1, wherein the thermal convection single system is selected by one of an angular vertebral body and a circular vertebral body. The heat convection heat dissipation structure of the LED lamp of claim 1, wherein the heat source surface of the heat dissipation substrate and the heat source element further comprise a carrier. The heat convection heat dissipation structure of the LED lamp of claim 1, wherein the heat dissipation substrate is a continuous substrate structure made of a plastic material. The heat convection heat dissipation structure of the LED lamp of claim 1, wherein the outer air contact surface of the heat dissipation substrate is further formed with a plurality of concave arc portions.