TWM440823U - Horizontal dot/wire plating machine - Google Patents

Horizontal dot/wire plating machine Download PDF

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Publication number
TWM440823U
TWM440823U TW101211747U TW101211747U TWM440823U TW M440823 U TWM440823 U TW M440823U TW 101211747 U TW101211747 U TW 101211747U TW 101211747 U TW101211747 U TW 101211747U TW M440823 U TWM440823 U TW M440823U
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Taiwan
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point
wheel
plate
line
disposed
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TW101211747U
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Chinese (zh)
Inventor
jing-xiang Xu
Ming-Zheng Liu
ming-wei Luo
Yong-Zun Zhang
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Uwin Nanotech Co Ltd
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Priority to TW101211747U priority Critical patent/TWM440823U/en
Publication of TWM440823U publication Critical patent/TWM440823U/en

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M440823 五、新型說明: 【新型所屬之技術領域】 且特別是有關於一種 本創作是有關於一種電链機具 队式點/線錢機。 【先前技術】 電鍍是電子元件加工過程中攸關 步驟,直可协主^ 貝民秀之一重要 電子兀件表面鍍上例如是金、銀n锯蓉 之原料薄層’以提供電子元件 =鎳或錫等 料tr 之元件的表面都要鍍上—層電鍍片 =表=是使用所謂浸鍍之加工技術來進行:= 疋件表面電錢加工之目的。 接線架與連 接器等電子轉,為了提昇其接觸傳導性能同時並可節約 原料^本,通常只需在元件的傳導接觸部位,链上例如是 鲁金等貝金屬原料薄層即可,此時即無法使用傳統之浸鑛加 工技術來完成。 λ 因此,一種利用包覆羊毛布或ΡΡ不織布之刷鍍桿來 進行局部刷鍍,或利用點/線鍍輪來進行局部點鍍或線鍍之 電鍍加工技術乃應運而生。習知雖已有多種局部電鍍之機 具與電鍍技術,惟,尚無可適用於多種點/線鍍輪規格之臥 式點/線鍍機’且所提供之機具仍有電鍍效能不足等多項缺 失查待改善。 4 M440823 【新型内容】 有鑑於此,本創作之目的是提供一種臥式點/線鍍機, 其可適用於多種規格之點/線鍍輪,以利於因應各種不同需 求之使用。 本創作之另一目的是提供一種臥式點/線鍍機,其可在 相同壓力泵的壓力下,藉由增加水囊之喷壓來提高槽液交 換率,進而增進機具電鍍之效能。 本創作之又一目的是提供一種臥式點/線鍍機,其可方 _便地調整臥式點/線鍍機之基座的水平度,有利於使用者之 安裝與操作。 本創作之再一目的是提供一種臥式點/線鍍機,其可有 效地防止臥式點/線鍍機之點/線鍍輪的傾斜偏移,避免影 響機具之電鍍效能。 為達上述及其他目的,本創作提供一種臥式點/線鍍 機,包括基座、多個輪軸、水囊、點/線鍍輪、多個導料輪、 $皮帶輪與皮帶。 其中,基座具有分散配置之多個調位轴孔與固定軸 孔、中心輪軸、張力調整座與至少一入水口。多個輪軸係 分別可移位地裝置於調位轴孔或固定於固定轴孔上,水囊 係環繞中心輪轴地配置於基座上並連接於基座之入水口, 其外圍具有間隔設置之多個喷出孔。點/線鍍輪環繞水囊地 樞設於中心輪轴上,並具有對應於水囊喷出孔之電鍍開孔 圖樣,多個導料輪與皮帶輪分別樞設於那些輪軸上,皮帶 則環繞於點/線鍍輪與皮帶輪上,並藉由基座上之張力調整 5 M440823 座來調節皮帶貼附於點/線鍍輪之張力。 在一實施例中,此臥式點/線鍍機更包括兩個平衡輪與 另兩輪軸,而基座更具有用以裝置另兩輪軸之另兩調位軸 孔,且兩平衡輪係貼靠點/線鍍輪地柩設於前述之另兩輪軸 上,用以防止臥式點/線鍍機操作時,其點/線鍍輪因皮帶 張力之壓迫而造成傾斜偏移,進而能避免影響機具之電鍍 效能。 在一實施例中,此臥式點/線鍍機更包括螺設於基座上 _之多個基座水平調整錐,用以提供使用者藉由基座上之基 座水平調整錐的簡單旋轉動作,即可調整基座之水平度, 十分有利於使用者之安裝與操作。 在一實施例中,此臥式點/線鍍機之點/線鍍輪包括環 形輪與上蓋。環形輪具有環形配置之圍繞壁,圍繞壁上則 環繞配置有例如是點或線之電鍍開孔圖樣,上蓋則密合地 蓋覆於環形輪上方,用以防止電鍍液自點/線鍍輪之上方喷 藏所導致之溢鏡。 ® 在一實施例中,此臥式點/線鍍機之水囊包括下水囊 板、上水囊板與導電陽極。下水囊板係具下中心孔與至少 一連接孔之圓板所構成,其環繞下中心孔設有封閉之下内 環壁與具下弧形缺口之下外環壁,並沿著下弧形缺口間隔 設置有多數個下增壓塊,其中,連接孔係用以連接基座之 入水口,以便弓丨入電鍍液。上水囊板用以蓋合下水囊板, 其係具上中心孔之圓板所構成,並環繞上中心孔設有封閉 之上内環壁與具上弧形缺口之上外環壁,沿著上弧形缺口 則設置有對應於下增壓塊之多數個上增壓塊。導電陽極則 6 M440823 裝置於上弧形缺口與下弧形缺口之位置,用以封閉上外環 壁與下外環壁,其係一弧形導電板所構成,並於弧形導電 板之孤形圍繞邊間隔设置有前述之喷出孔。 在一實施例中,此臥式點/線鍍機之上水囊板於上外環 壁與上内環壁間並設置有上導流肋,而下水囊板於下外環 壁與下内環壁間則設置有錯開上導流肋之下導流肋,用以 進一步增加水囊之噴壓,進而能進一步提高機具電鍍之效 能。 在一實施例中,此臥式點/線鍍機之下水囊板於下導流 肋兩側各設置有一下減壓塊,上水囊板則對應柃 分別設置有一上減壓塊,用以避免兩侧電鍍液墾塊 成之溢鍍。 %幾所造 在一實施例中,此臥式點/線鍍機更包括電挺 陽極之下導電板’用以連接直流電源之正極,从,接導電 入水囊之導電陽極。 冬電力導 綜上所述,由於本創作所提供之一種臥式點/ 其基座上設有多個可移位之難軸孔,用以裝^錢機, 鍵輪運作之多個導料輪與皮帶輪,故可因應不^间點/線 線鍍輪,來調签導料輪與皮帶輪之裝置位置、寸之點/ 多種不同規格之點/線鍍輪的功效。實施例中戍適用於 /線鑛輪的直徑係介於150_至41〇匪之間。通用之點 此外本創作所提供之—種臥式點/線鍍機 囊中設置有增壓塊與導流肋,而可在相同壓=於在水 下,藉由增加水囊之噴壓來提高槽液交換率,的壓力 具之電鍍效能。 而增進機 7 M440823 為讓本創作之上述和其他目的、特徵、和優點能更明 顯易懂,下文特以較佳實施例,並配合所附圖式,作詳細 說明如下: 【實施方式】 請參圖1至圖4所示,其係顯示根據本創作較佳實施 例之一種臥式點/線鍍機的圖示。圖中,此臥式點/線鍍機 0 10包括基座11、多個輪轴12、水囊13、點/線鍍輪15、 多個導料輪16、皮帶輪17、皮帶18、平衡輪191與基座 水平調整錐192。 如圖所示,基座11具有分散配置之多個調位軸孔111 與固定軸孔112、中心輪軸113、張力調整座115與3個入 水口 116。多個輪軸12係分別可移位地裝置於調位軸孔111 或固定於固定軸孔112上,調位軸孔111之寬度約略等於 輪軸12之直徑,其長度及形狀則依所欲適用之各種點/線 $鍍輪15的規格而定,以便能夠依實際裝置之點/線鍍輪15 的大小,來調整樞設於輪軸12上之部分導料輪16與皮帶 輪17的位置,達成適用於多種規格之點/線鍍輪15的臥式 點/線鍍機10功能。本實施例中,調位軸孔111之長度及 形狀的構成,係為了適用直徑介於150mm至41 Omm間之 點/線鍍輪15而設計。 圖中,基座11兩側翼用以裝置輪軸12之調位軸孔 111,係設置於基座11兩側所鎖固之側翼板119上,以利 於枢設兩側翼輪轴12之導料輪16,使得以依前後製程料 8 =20之進料或出料方向與位置,來調整導料輪w導入或 义出料件20之位置,使此一臥式點/線鍍機10易於搭配其 前後不同之製程機具設備而使用。 —水囊13環繞中心輪軸113地配置於基座n上,其係 藉由設置於下水囊板131之3個連接孔1315(請參圖5), 來連接基座1〗之3個入水口 116而固定於基座〗丨上,其 外圍具有間隔設置之多個嘴出孔1331,以便經塵力果導入 籲之電鍍液,得以自噴出孔1331喷射而出。其中為搭配基座 ^之3個入水口 U6的突出式設計,並使水囊u得以平 穩地固疋於基座11上,基座^之中心輪轴⑴的周邊, 也同時配置有鎖合於下水囊板131上之兩固定柱ιΐ7,用 以將水囊13平穩地撐持於基座u上。 點/線鍍輪15包括環形輪151與上蓋152,環形輪151 具有環形配置之圍繞壁,圍繞壁上則環繞配置有一定間隔 之點狀電鍍開孔圖樣15U。上蓋152則藉由螺絲153而密 籲合地鎖固蓋覆於環形輪151之上方,以便可以防止自水囊 13之噴出孔1331噴出的電鍍液,從點/線鍍輪15之上方 噴濺,造成不想要之溢鍍。 此外,點/線鍍輪15並藉由相應設計之軸承155而環 繞水囊13地框設於中心輪轴113上,其電鏡開孔圖樣ΐ5ιι 於組裝後,乃係對應於水囊13之喷出孔1331,以利於進 行料件20之點錢。 ' 皮帶18環繞於點/線鍍輪15與皮帶輪17上,用以將 繞附於點/線鍍輪15與導料輪16之料件2〇,壓合而緊貼 於點/線鍍輪15之電鍍開孔圖樣1511中,以便將水囊13 9 M440823 噴出.之電鍍液限制噴灑在料件2〇位於雷 内之部分,以進行料件20之點狀局部圖樣⑸1 18壓合料件2〇之緊密度,乃是藉由基座中,皮帶 座115調節皮帶18貼附於點/線鍍輪15 之張力調整 節時,係操作旋骑叙1151以帶動螺=來達成。調 裝置有皮帶輪17之#塊1153前後移動’進而帶動 鬆緊度而成。 乂調整皮帶18之 其中,為了能夠改善臥式點/線鍍機 =鑛輪15因皮帶18張力之壓追而造成傾斜偏移,’其點/ 機具之電倾㈣缺點 ⑭’致影響 個平一兩_12與兩調二=機二増設兩 位轴孔111倍、用以裝置輪軸12與拖設於“又之兩調 191 ’並調整平衡輪191使貼靠於點/線^之平衡輪 以抵靠防止點/雜輪15之傾斜偏移。 之―側,藉 另外’在將臥式點/線鑛機1〇裝 =進行操作時,通常也需調校基座11之H未示) ,落,各螺設有一基座水平調整 藉由基座11上之基座水平調整錐 1 使用 安裝與操作。千度,此—設計十分有利於使用者之 由螺示’此臥式點/線鍍機10之水囊13係 ㈣與下導 由螺絲I35而電性連接雷/、中’ T導電板136係藉 連接於導電陽極133,以方便連接直流 M440823 電源之正極,進而將電力導至水囊13之導恭 ^ , 鱿%極 133。 圖中’下水囊板131係為具有下中心子丨 产11U 1319與對應基 座11入水口 116之3個連接孔1315的.㈣成,㈣ 繞下中心孔1319設有封閉之下内環壁1312血替 口 1318之下外環壁1313,並沿著下弧形缺/⑽間隔設 置有多數個下增壓塊1311。M440823 V. New description: [New technology field] and especially related to one. This creation is about an electric chain machine type point/line machine. [Prior Art] Electroplating is a step in the processing of electronic components. It can be used to provide a thin layer of raw materials such as gold and silver n-saws to provide electronic components = nickel. Or the surface of the component such as tin and other materials should be plated - layer plating = table = is processed using the so-called immersion plating technology: = the purpose of processing the surface of the wire. The electronic transfer of the wiring frame and the connector, in order to improve the contact conduction performance and save the raw material, usually only in the conductive contact part of the component, the chain is, for example, a thin layer of shell metal such as Lujin. That is, it cannot be done using traditional leaching processing technology. λ Therefore, a plating technique using a brushed rod coated with a wool cloth or a non-woven fabric for partial plating or a point/line plating wheel for local spot plating or wire plating has emerged. Although there are a variety of local electroplating tools and electroplating techniques, there are no horizontal point/line plating machines that can be applied to a variety of spot/line plating wheel specifications, and the tools provided are still lacking in plating efficiency. Check for improvement. 4 M440823 [New content] In view of this, the purpose of this creation is to provide a horizontal point/line plating machine that can be applied to a variety of point/line plating wheels to facilitate the use of various requirements. Another object of the present invention is to provide a horizontal point/line plating machine which can increase the bath exchange rate by increasing the pressure of the water bladder under the pressure of the same pressure pump, thereby improving the electroplating efficiency of the implement. Another object of the present invention is to provide a horizontal point/line plating machine which can adjust the level of the base of the horizontal point/line plating machine to facilitate the installation and operation of the user. A further object of the present invention is to provide a horizontal point/line plating machine which effectively prevents the tilting of the point/line plating wheel of the horizontal point/line plating machine and avoids the plating performance of the machine. To achieve these and other objectives, the present invention provides a horizontal point/line plating machine comprising a base, a plurality of axles, a water bladder, a point/line plating wheel, a plurality of guide wheels, a pulley and a belt. Wherein, the base has a plurality of positioning shaft holes and a fixed shaft hole, a central axle, a tension adjusting seat and at least one water inlet in a dispersed arrangement. The plurality of axle shafts are respectively displaceably disposed on the positioning shaft hole or fixed on the fixed shaft hole, and the water bladder is disposed on the base around the central axle and connected to the water inlet of the base, and the periphery thereof is spaced apart a plurality of ejection holes. The point/line plating wheel is pivoted around the water bag on the central axle, and has a plated opening pattern corresponding to the water bag ejection hole. The plurality of guide wheels and the pulley are respectively pivoted on the axles, and the belt surrounds Adjust the tension of the belt attached to the point/line plating wheel on the point/line plating wheel and the pulley and adjust the 5 M440823 seat by the tension on the base. In one embodiment, the horizontal point/line plating machine further comprises two balance wheels and the other two axles, and the base further has two other adjustment shaft holes for the other two axles, and the two balance wheel tie The point/line plating wheel mantle is arranged on the other two axles mentioned above to prevent the tilting of the point/line plating wheel due to the tension of the belt tension when the horizontal point/line plating machine is operated, thereby avoiding Affect the plating performance of the machine. In one embodiment, the horizontal dot/line plating machine further comprises a plurality of pedestal horizontal adjustment cones screwed on the base for providing a simple adjustment of the cone by the user through the base on the base. Rotating action can adjust the level of the base, which is very beneficial to the user's installation and operation. In one embodiment, the point/line plating wheel of the horizontal spot/line plating machine includes a ring wheel and an upper cover. The annular wheel has a surrounding wall surrounded by a ring, and the surrounding wall is surrounded by a plated opening pattern such as a dot or a line, and the upper cover is closely covered over the ring wheel to prevent the plating solution from the point/line plating wheel. The overflow caused by the spray above. ® In one embodiment, the water bladder of the horizontal spot/line plating machine includes a lower water bladder plate, an upper water bladder plate and a conductive anode. The lower water bladder plate is formed by a circular plate having a lower central hole and at least one connecting hole, and the lower central hole is provided with a closed lower inner ring wall and an outer annular wall having a lower curved notch, and is curved along the lower arc. The notch interval is provided with a plurality of lower pressurizing blocks, wherein the connecting holes are used to connect the water inlet of the base so as to be inserted into the plating solution. The upper water sac plate is used for covering the lower water sac plate, and is formed by a circular plate with a central hole, and is surrounded by the upper central hole and is provided with an upper inner ring wall and an upper annular wall with an upper curved notch. The upper curved notch is provided with a plurality of upper pressurizing blocks corresponding to the lower pressurizing block. The conductive anode 6 M440823 is placed at the position of the upper curved notch and the lower curved notch to close the upper outer ring wall and the lower outer ring wall, which is formed by an arc-shaped conductive plate and is isolated from the curved conductive plate. The aforementioned ejection holes are provided around the edge. In an embodiment, the water sac plate on the horizontal point/line plating machine is disposed between the upper outer ring wall and the upper inner ring wall and is provided with upper guiding ribs, and the lower water sac plate is disposed on the lower outer ring wall and the lower inner wall Between the ring walls, there are staggered guide ribs under the upper guide ribs to further increase the spray pressure of the water bladder, thereby further improving the electroplating efficiency of the implement. In an embodiment, the water sac plate of the horizontal point/line plating machine is provided with a decompression block on each side of the lower guiding rib, and the upper water sac plate is respectively provided with an upper decompression block for Avoid plating plating on both sides of the plating solution. In one embodiment, the horizontal spot/line plating machine further comprises a conductive plate under the anode of the anode for connecting the positive electrode of the direct current power source, and the conductive anode electrically connected to the water bladder. According to the winter power guide, the horizontal point provided by the creation/the base is provided with a plurality of displaceable hard shaft holes for loading the machine, and the plurality of guides for the operation of the key wheel Wheels and pulleys, so you can adjust the position of the guide wheel and pulley, the point of the inch / the effect of a variety of different specifications of the point / line plating wheel in response to the point / line plating wheel. In the embodiment, the diameter of the 矿 for the / wire mine is between 150 and 41 直径. In addition, the horizontal point/line plating machine bag provided by the present invention is provided with a pressurizing block and a guiding rib, and can be under the same pressure = under water, by increasing the pressure of the water bag. Improve the bath exchange rate, the pressure of the plating performance. The above and other objects, features, and advantages of the present invention will become more apparent and obvious. The following detailed description of the preferred embodiments and the accompanying drawings will be described as follows: Referring to Figures 1 through 4, there is shown an illustration of a horizontal spot/line plating machine in accordance with a preferred embodiment of the present invention. In the figure, the horizontal point/line plating machine 0 10 includes a base 11, a plurality of axles 12, a water bladder 13, a point/line plating wheel 15, a plurality of guide wheels 16, a pulley 17, a belt 18, and a balance wheel. 191 and the base horizontal adjustment cone 192. As shown, the susceptor 11 has a plurality of positioning shaft holes 111 and a fixed shaft hole 112, a center wheel shaft 113, a tension adjusting seat 115, and three water inlets 116 in a dispersed arrangement. The plurality of axles 12 are respectively displaceably disposed on the positioning shaft hole 111 or fixed to the fixed shaft hole 112. The width of the positioning shaft hole 111 is approximately equal to the diameter of the axle 12, and the length and shape thereof are applicable as desired. The specifications of the various points/wires of the plating wheel 15 are such that the position of the portion of the guide wheel 16 and the pulley 17 pivotally mounted on the axle 12 can be adjusted according to the size of the spot/line plating wheel 15 of the actual device. Horizontal point/line plating machine 10 function for point/line plating wheel 15 of various specifications. In the present embodiment, the length and shape of the alignment shaft hole 111 are designed to be applied to the spot/line plating wheel 15 having a diameter of 150 mm to 41 Omm. In the figure, the two sides of the base 11 are used for the positioning shaft hole 111 of the wheel axle 12, and are disposed on the side flaps 119 which are locked on both sides of the base 11 to facilitate pivoting the guide wheels of the wing axles 12 of the two sides. 16, so as to adjust the position of the guide wheel w or the output material 20 according to the feeding or discharging direction and position of the material 8 = 20, so that the horizontal point/line plating machine 10 is easy to match. It is used in different process equipments before and after. The water bladder 13 is disposed on the base n around the central axle 113. The three water inlets of the base 1 are connected by three connection holes 1315 (see FIG. 5) provided in the lower water bladder plate 131. 116 is fixed on the pedestal, and has a plurality of nozzle outlets 1331 spaced apart at the periphery thereof so as to be introduced into the blasting liquid 1331 by the dusting force. Among them, the protruding design of the three water inlets U6 of the pedestal ^, and the water bladder u can be smoothly fixed on the base 11, and the periphery of the central axle (1) of the base ^ is also equipped with a lock. Two fixed columns ι 7 on the lower water bladder plate 131 are used to smoothly support the water bladder 13 on the base u. The spot/line plating wheel 15 includes an annular wheel 151 and an upper cover 152 having a ring-shaped surrounding wall around which a point-like plated opening pattern 15U is disposed. The upper cover 152 is tightly locked over the annular wheel 151 by a screw 153 so as to prevent the plating solution ejected from the ejection hole 1331 of the water bladder 13 from being sprayed from above the spot/wire plating wheel 15. , causing unwanted spill plating. In addition, the spot/line plating wheel 15 is disposed on the center wheel shaft 113 around the water bladder 13 by a correspondingly designed bearing 155, and the electron mirror opening pattern ΐ5 ιι is assembled, which corresponds to the spray of the water bladder 13. The hole 1331 is provided to facilitate the payment of the material 20. 'The belt 18 surrounds the point/line plating wheel 15 and the pulley 17 for tying the material 2 绕 wound around the spot/line plating wheel 15 and the guide wheel 16 to be pressed against the spot/line plating wheel 15 plating opening pattern 1511, in order to spray the water tank 13 9 M440823. The plating solution is sprayed on the part of the material 2 〇 in the mine to perform the point-like partial pattern of the material 20 (5) 1 18 pressure fitting The tightness of the cymbal is achieved by adjusting the tension adjustment section of the belt 18 attached to the spot/line plating wheel 15 by the belt seat 115 in the susceptor, and operating the gyro 1151 to drive the snail. The adjustment device has a #1153 of the pulley 17 that moves forward and backward to drive the tightness.乂Adjusting the belt 18, in order to improve the horizontal point/line plating machine=the mining wheel 15 is tilted due to the tension of the belt 18 tension, 'the point / the electric tilt of the machine (four) shortcoming 14' affects a flat one Two _12 and two adjustment two = machine two 111 set two shaft holes 111 times, used to install the axle 12 and drag on the "two 191" and adjust the balance wheel 191 to make the balance wheel against the point / line ^ In order to abut against the inclination of the prevention point/missing wheel 15, the side is further indicated, when the horizontal point/line machine 1 is installed, the H of the base 11 is usually also adjusted. ), the snails are provided with a pedestal level adjustment. The pedestal level adjustment cone 1 on the pedestal 11 is used for installation and operation. Thousands of degrees, this design is very beneficial for the user to screw the 'this horizontal point The water bladder 13 of the wire plating machine 10 is connected to the conductive anode 133 by a screw I35 and the lower conductive wire 136 is connected to the conductive anode 133 to facilitate connection of the positive electrode of the DC power source of the DC power supply. Lead to the water sac 13 guide , ^, 鱿% pole 133. In the picture 'the lower water sac board 131 is the lower center sub-production 11U 1319 and Corresponding to the four connection holes 1315 of the water inlet 116 of the base 11 (4), (4) the lower central hole 1319 is provided with a closed lower inner ring wall 1312, and the outer annular wall 1313 below the blood outlet 1318, and along the lower arc The lower/(10) interval is provided with a plurality of lower pressurizing blocks 1311.

上水囊板132係為具有上中心孔1329之圓板所構成, 並環繞上中心孔1329設有封閉之上内環壁1322與具上弧 形缺口 1328之上外環壁1323,並沿著上弧形缺口'^別設 置有對應於下增壓塊1311之多數個上增壓塊1321。導電 %極133則裝置於上弧形缺口丨mg與下弧形缺口 1318之 位置’用以封閉上外環壁1323與下外環壁1313,其係一 弧形導電板所構成,並於弧形導電板之弧形圍繞邊間隔設 置有喷出孔133卜 如圖所示’為了進一步增加水囊13之噴壓,進而能進 鲁一步提两機戽電鍍之效能,上水囊板132於上外環壁1323 與上内環璧1322間並設置有上導流肋1327,而下水囊板 131於下外缳壁1313與下内環璧1312間則設置有錯開上 導2肋1327之下導流肋1317。此外,下水囊板131於下 導流肋丨3丨7兩側各設置有一下減壓塊1316,上水囊板132 則對應於下Μ塊1316分別設置有一上減壓塊1326,用 以避例電鍍液之噴機所造成之溢鍍。 _ 7所示,其為圖丨之臥式點人線鍍機的水囊噴流 效果不。圖中顯示,當電鈹液3〇自水囊13之連接孔 1315導八時,將依序受到田上水囊板132之上導流肋1327 M440823 下壓、下水囊板131之下導流肋1317上推、以及下增壓塊 1311與上增壓塊1321之擠壓後,方自其噴出孔133丨噴瀉 而出。因此,所噴流於點/線鍍輪15上之電鍍液水膜3丨的 長度較長,而可提高槽液交換率,進而增進此臥式點/線鍍 機10之電鍍效能。 ’又 雖然本創作已以較佳實施例揭露如上,然其並非用以限定本 創作,任何熟習此技藝者,在不脫離本創作之精神和範圍内:作 之各種更動與潤飾,亦屬本創作之範圍。因此, 圍當視後附之申請專利範圍所界定者為準。 ’、巳 【圖式簡單說明】 實施例之—種臥式點/線 圖1係顯示根據本創作較佳 鍵機的組合立體圖。 圖2係顯示圖1之臥式點/線賴的上視圖。 圖3係顯示圖1之臥式點/線鍍機的分解立體圖。The upper water bladder plate 132 is formed by a circular plate having an upper central hole 1329, and is disposed around the upper central hole 1329 to close the upper inner ring wall 1322 and the outer annular wall 1323 with the upper curved notch 1328, and along The upper curved notch is provided with a plurality of upper pressurizing blocks 1321 corresponding to the lower pressurizing block 1311. The conductive % pole 133 is disposed at the position of the upper curved notch 丨mg and the lower curved notch 1318 to close the upper outer ring wall 1323 and the lower outer ring wall 1313, which is formed by an arc-shaped conductive plate and is in the arc The arc-shaped conductive plate is provided with a discharge hole 133 around the edge of the arc. As shown in the figure, in order to further increase the spray pressure of the water bladder 13, the efficiency of electroplating can be further improved, and the upper water bladder plate 132 is The upper outer ring wall 1323 and the upper inner ring 1322 are disposed with upper guiding ribs 1327, and the lower water bag plate 131 is disposed between the lower outer wall 1313 and the lower inner ring 1312 with a staggered upper guiding 2 rib 1327. The guiding rib 1317. In addition, the lower water bladder plate 131 is provided with a decompression block 1316 on each side of the lower diversion rib 3丨7, and the upper water bladder plate 132 is respectively provided with an upper decompression block 1326 corresponding to the lower crotch block 1316. For example, the plating of the plating solution caused by the overflow plating. _ 7 shows that the water jet flow effect of the horizontal point line plating machine of the figure is not. The figure shows that when the electric sputum 3 is guided from the connecting hole 1315 of the water bladder 13, it will be sequentially pressed by the guiding rib 1327 M440823 above the upper water tank plate 132, and the guiding rib under the lower water sac plate 131. After the 1317 push-up and the lower pressurizing block 1311 and the upper pressurizing block 1321 are squeezed, they are ejected from the discharge holes 133. Therefore, the length of the plating liquid film 3丨 sprayed on the spot/line plating wheel 15 is long, and the bath exchange rate can be increased, thereby improving the plating performance of the horizontal spot/line plating machine 10. In addition, the present invention has been disclosed in the above preferred embodiments, and it is not intended to limit the present invention. Anyone skilled in the art, without departing from the spirit and scope of the present invention, The scope of creation. Therefore, the scope defined in the patent application scope is subject to the definition. ‘, 巳 [Simplified description of the drawings] Example of a horizontal dot/line Figure 1 shows a combined perspective view of a preferred key machine according to the present invention. Figure 2 is a top view showing the horizontal point/line of Figure 1. Fig. 3 is an exploded perspective view showing the horizontal point/line plating machine of Fig. 1.

圖4係顯示圖3之臥式點/線錢機的基座上視圖。 =5係顯示圖3之臥式點/⑽機的水囊分解立體圖。 =顯示圖5之水囊的上水囊板另-角度立體圖。 糸‘”、頁不圖1之臥式點/線鍍機的水囊噴流效果示意 【主要元件符號說明】 10臥式點/線鑛機 11基座 12Figure 4 is a top view of the base of the horizontal point/line machine of Figure 3. =5 shows a perspective view of the water bladder of the horizontal point/(10) machine of Fig. 3. = A perspective view of the upper water bladder of the water bladder of Figure 5 is shown.糸 ‘”, page not shown in Figure 1 horizontal point / line plating machine water tank jet flow effect [main components symbol description] 10 horizontal point / line mining machine 11 base 12

Ill調位軸孔 112固定軸孔 113中心輪軸 115張力調整座 1151旋鈕 1152螺桿 1153轴塊 116入水口 117固定柱 119側翼板 12輪軸 13水囊 131下水囊板 1311下增壓塊 1312下内環壁 1313下外環壁 1315連接孔 1316下減壓塊 1317下導流肋 1318下弧形缺口 1319下中心孔 132上水囊板 1321上增壓塊 1322上内環壁 1323上外環壁 M440823 1326上減壓塊 1327上導流肋 1328上弧形缺口 1329上中心孔 133導電陽極 1331噴出孔 135、153 螺絲 136下導電板 15點/線鍍輪 151環形輪 1511電鍍開孔圖樣 152上蓋 15 5軸承 16導料輪 17皮帶輪 18皮帶 191平衡輪 192基座水平調整錐 20料件 31電鍍液水膜 14Ill adjustment shaft hole 112 fixed shaft hole 113 center wheel shaft 115 tension adjustment seat 1151 knob 1152 screw 1153 shaft block 116 water inlet 117 fixed column 119 side wing plate 12 axle 13 water bladder 131 lower water bladder plate 1311 lower pressure block 1312 lower inner ring Wall 1313 lower outer ring wall 1315 connecting hole 1316 lower pressure reducing block 1317 lower guiding rib 1318 lower curved notch 1319 lower central hole 132 upper water tank plate 1321 upper pressure block 1322 upper inner ring wall 1323 upper outer ring wall M440823 1326 Upper pressure reducing block 1327 upper guiding rib 1328 upper curved notch 1329 upper center hole 133 conductive anode 1331 ejection hole 135, 153 screw 136 lower conductive plate 15 point / line plating wheel 151 annular wheel 1511 plating opening pattern 152 upper cover 15 5 Bearing 16 guide wheel 17 pulley 18 belt 191 balance wheel 192 base horizontal adjustment cone 20 material 31 plating liquid water film 14

Claims (1)

M440823 六、申請專利範圍: 1. 一種臥式點/線鍍機,包括: 一基座,具有分散配置之多個調位軸孔與固定軸孔、 一中心輪軸、一張力調整座與至少一入水口; 多個輪軸,分別可移位地裝置於該些調位軸孔或固定 於固定軸孔上; 一水囊,環繞該中心輪軸地配置於該基座上並連接於 該入水口’具有間隔設置之多個喷出孔; ® —點/線鍍輪,環繞該水囊地樞設於該中心輪軸上,並 具有對應於該些噴出孔之一電鍍開孔圖樣; 多個導料輪與皮帶輪,分別樞設於該些輪軸上;以及 一皮帶,環繞於該點/線鍍輪與該些皮帶輪上,並藉由 該張力調整座以調節該皮帶貼附該點/線鍍輪之張力。 2. 如申請專利範圍第1項所述之臥式點/線鍍機,更包 括兩個平衡輪與另兩輪軸,該基座更具有用以裝置另兩輪 鲁軸之另兩調位軸孔’而該兩平衡輪則貼靠該點/線鑛輪地極 設於該另兩輪軸上。 3·如申請專利範圍第1項所述之臥式點/線鍍機,更包 括螺設於該基座上之多個基座水平調整錐,用以調整該基 座之水平。 4.如申請專利範圍第1項所述之臥式點/線鍍機,其中 該點/線鍍輪包括: 一環形輪,具有環形配置之一圍繞壁,該圍繞壁上則 環繞配置有該電鍍開孔圖樣;以及 15 M440823 一上蓋,密合地蓋覆於該環形輪上方。 5. 如申請專利範圍第1項所述之臥式點/線鍍機,其中 該水囊包括: 一下水囊板,係具一下中心孔與至少一連接孔之圓板 所構成,並環繞該下中心孔設有封閉之一下内環壁與具一 下弧形缺口之一下外環壁,沿著該下弧形缺口則間隔設置 有多數個下增壓塊,該連接孔用以連接該基座之該入水口; 一上水囊板,用以蓋合該下水囊板,係具一上中心孔 籲之圓板所構成,並環繞該上中心孔設有封閉之一上内環壁 與具一上弧形缺口之一上外環壁,沿著該上弧形缺口則設 置有對應於該些下增壓塊之多數個上增壓塊;以及 一導電陽極,裝置於該上弧形缺口與該下弧形缺口之 位置,用以封閉該上外環壁與該下外環壁,係一弧形導電 板所構成,並於該弧形導電板之弧形圍繞邊間隔設置該些 噴出孔。 6. 如申請專利範圍第5項所述之臥式點/線鍍機,其中 鲁該上水囊板於該上外環壁與該上内環壁間設置有一上導流 肋,該下水囊板於該下外環壁與該下内環壁間則設置有錯 開該上導流肋之一下導流肋。 7. 如申請專利範圍第6項所述之臥式點/線鍍機,其中 該下水囊板於該下導流肋兩側各設置有一下減壓塊,該上 水囊板則對應於該下減壓塊分別設置有一上減壓塊。 8. 如申請專利範圍第5項所述之臥式點/線鍍機,更包 括電性連接該導電陽極之^一下導電板。 16M440823 VI. Patent application scope: 1. A horizontal point/line plating machine, comprising: a base, a plurality of positioning shaft holes and a fixed shaft hole, a central axle, a force adjustment seat and at least one a plurality of axles respectively displaceably disposed on the alignment shaft holes or fixed to the fixed shaft holes; a water bladder disposed on the base around the central axle and connected to the water inlet a plurality of ejection holes having a spacing arrangement; a - point/line plating wheel pivoted around the water bladder on the central axle, and having a plating opening pattern corresponding to one of the ejection holes; a wheel and a pulley are respectively pivoted on the axles; and a belt surrounds the point/line plating wheel and the pulleys, and the tension adjusting seat is used to adjust the belt to attach the point/line plating wheel The tension. 2. The horizontal point/line plating machine according to claim 1, further comprising two balance wheels and two other axles, the base further having two other adjustment axes for installing the other two rounds of the shaft The holes 'and the two balance wheels are disposed on the other two axles against the point/line wheel. 3. The horizontal point/line plating machine of claim 1, further comprising a plurality of pedestal leveling cones disposed on the base for adjusting the level of the base. 4. The horizontal point/line plating machine according to claim 1, wherein the point/line plating wheel comprises: an annular wheel having an annular configuration surrounding the wall, the surrounding wall being circumferentially disposed An electroplated aperture pattern; and a 15 M440823 upper cover that fits snugly over the annular wheel. 5. The horizontal point/line plating machine according to claim 1, wherein the water bag comprises: a lower water bag plate, which is formed by a circular plate having a central hole and at least one connecting hole, and surrounds the water bag The lower central hole is provided with a lower inner ring wall and a lower outer ring wall having a lower curved notch, and a plurality of lower pressurizing blocks are arranged along the lower curved notch, the connecting hole is used for connecting the base The water inlet plate; an upper water bag plate for covering the lower water bag plate, the system is formed by a circular plate with a central hole, and is surrounded by the upper central hole and has an inner ring wall and a cover An upper annular wall is disposed on one of the upper curved notches, and a plurality of upper pressurizing blocks corresponding to the lower pressing blocks are disposed along the upper curved notch; and a conductive anode is disposed on the upper curved notch And the position of the lower curved notch for closing the upper outer ring wall and the lower outer ring wall, is formed by an arc-shaped conductive plate, and the ejection is arranged at an arc-shaped surrounding edge of the curved conductive plate hole. 6. The horizontal point/line plating machine according to claim 5, wherein the upper water bladder plate is provided with an upper guiding rib between the upper outer ring wall and the upper inner ring wall, the lower water bladder The plate is disposed between the lower outer ring wall and the lower inner ring wall with a lower guiding rib that is offset from the upper guiding rib. 7. The horizontal point/line plating machine according to claim 6, wherein the lower water bag plate is provided with a decompression block on each side of the lower diversion rib, and the upper water bag plate corresponds to the The lower decompression block is respectively provided with an upper decompression block. 8. The horizontal dot/wire plating machine according to claim 5, further comprising a conductive plate electrically connected to the conductive anode. 16
TW101211747U 2012-06-19 2012-06-19 Horizontal dot/wire plating machine TWM440823U (en)

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