M437534 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作是有關於一種溫度控制裝置，特別是有關於—種 於測試有機發光二極體元件時控制溫度的溫度控制裝置 〇 [0002] • 【先前技術】 量測有機發光二極體元件（Organic Light-Emitting Diode ’ 0LED)各項特性時’由於有機發光二極體的各項 特性會隨溫度而產生明顯變化，因此在量測時必須隨時 控制量測時的環境溫度，以避免有機發光二極體損壞。 換句話說，若欲取得有機發光二極體的各項特性量測值 時，需同時控制其量測時溫度。 [0003] • 現今量測有機發光二極體元件是將測試樣品放入大型恆 溫室中進行特性測試，此大型恆溫室之溫控系統是使用 壓縮機、冷凝管線、冷媒及加熱器等設備。然而，此系 統體積魔大、價格不斐、重量不輕、移動性低，並且該 愿機會產生尚分貝的旁音。而且，若需同時進行多組 實驗則需多組大型恆溫室，體積更加龐大，使量測成本 提高。另，待測物放入恆溫室中需引線至資料收集設備 與分析設備’因恆溫室體積龐大容易導致引線過長，進 而造成量測誤差’且使用大型恆溫室量測有機發光二極 體元件具有過程耗時、耗工及高誤差等問題《故，综觀 前所述，本創作之創作人思索並設計一種可測試有機發 光二極體元件的溫度控制裝置，以期針對現有技術之缺 失加以改善，進而增進產業上之實施利用。 1012〇552产單編號 A0101 第3頁/共15頁 .1012018079-0 M437534 【新型内容】 [0004] 有鑑於上述習知技藝之問題，本創作之目的就是在提供 一種可控制測試有機發光二極體元件時的溫度控制裝置 ，以解決習知技術量測不精準，誤差較大，且整體設備 及系統體積龐大不易移動、製造成本昂貴的問題。 [0005] 根據本發明之目的，提出一種溫度控制裝置，其包含一 主控制模組及複數個溫度控制模組。主控制模組係接收 一控制指令，且根據控制指令執行控制動作。各溫度控 制模組包含一第一盒體、一隔板及一第二盒體。第一盒 體係具有一容置空間，由底部至頂部依序係包含一控溫 單元、一感測單元及一板材，感測單元設置於控溫單元 之上方，且板材與感測單元間係設置一待測元件。隔板 係分隔第一盒體及第二盒體，且設置一孔洞以放置一致 冷致熱單元，致冷致熱單元之上側係貼合控溫單元。第 二盒體係具有另一容置空間，且包含一散熱單元、一第 一熱導出單元及一第二熱導出單元，散熱單元係設置於 致冷致熱單元下方，第一熱導出單元設置於第A盒體之 一側，且第二熱導出單元係相對應第一熱導出單元之位 置設置於第二盒體之另一側，以藉由熱對流導出熱能》 [0006] 其中，板材係藉由複數個彈簧柱固定於隔板之上。 [0007] 其中，板材係藉由複數個彈簧柱上下移動，使待測元件 置入板材之下方，且與控溫單元之上表面互相貼合。 [0008] 其中，溫度控制裝置更包含一輸入模組及一顯示模組， 輸入模組及顯示模組係電性連接主控制模組。 10120552产單编號 A〇101 第4頁/共15頁 1012018079-0 M437534 [0009] 其中，輸入模組係輸入控制指令，並傳送至主控制模組 [0010] 其中，輪入模组係為一桌上型電腦或一筆記型電腦。 [0011] 其中，顯示模組係顯示複數個溫度控制模組之一運轉狀 態及控制指令。 [0012] 其中，主控制模組係包含一微處理器及複數個驅動單元 ，微處理器電性連接輸入模組及驅動單元，且微處理器 接收輸入模組之控制指令，並將控制指令轉換為一控制 訊號，且傳送至各驅動單元。 [0013] 其中，驅動單元係包含一邏輯控制元件及一電子電路， 邏輯控制元件電性連接於微處理器，且邏輯控制元件接 收控制訊號，並根據控制訊號控制電子電路調節致冷致 熱單元之一輸出功率，並接收溫度感測單元之一溫度訊 號。 [0014] 其中，電子電路係為一Η型線路。 [0015] 其中，驅動單元更包含一電源供應元件，電源供應元件 係電性連接於邏輯控制元件及電子電路，且供應一電源 至邏輯控制元件及電子電路。 [0016] 承上所述，本創作之溫度控制裝置，其可具有下述優點 (1) 此溫度控制裝置可藉由致冷致熱單元縮小測試時所需 的體積並減少量測值的誤差。 (2) 此溫度控制裝置可藉由複數個溫度控制模組獨立控溫 ，不需耗費時間及空間設置多個大型控溫室，也無需設 10120552#單編號 Α0101 第5頁/共15頁 1012018079-0 M437534 置過長之引線而使測試更迅速確實。 [0017] 為讓本創作之上述和其他目的、特徵和優點能更明顯易 懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 [0018] 以下將參照相關圖式，說明依本創作之溫度控制裝置之 實施例，為使便於理解，下述實施例中之相同元件係以 相同之符號標示來說明。M437534 V. New description: [New technical field] [0001] This creation is about a temperature control device, especially for temperature control devices that control temperature when testing organic light-emitting diode components. ] [Previous Technology] When measuring the characteristics of the Organic Light-Emitting Diode '0LED', the measurement of the organic light-emitting diode changes significantly with temperature, so the measurement is performed. The ambient temperature during measurement must be controlled at all times to avoid damage to the organic light-emitting diode. In other words, if you want to obtain the measured values of the organic light-emitting diodes, you need to control the temperature at the same time. [0003] • Today's measurement of organic light-emitting diode components is to test the samples in a large constant temperature greenhouse. The temperature control system of this large-scale constant temperature room uses compressors, condensation lines, refrigerants and heaters. However, this system is extremely large, inexpensive, lightweight, and mobile, and the opportunity to produce a decibel. Moreover, if multiple sets of experiments are required at the same time, multiple sets of large-scale thermostatic chambers are required, which is more bulky and increases the cost of measurement. In addition, the object to be tested is placed in a constant temperature room and needs to be led to the data collection device and the analysis device. [Because the volume of the thermostatic chamber is too large, the lead wire is too long, resulting in measurement error, and the large-scale constant temperature room is used to measure the organic light-emitting diode component. It has the problems of time-consuming, labor-intensive and high-error. Therefore, the author of this creation thinks about and designs a temperature control device that can test the organic light-emitting diode components in order to solve the problem of the prior art. Improve, and thus enhance the implementation and utilization of the industry. 1012〇552Bill No. A0101 Page 3/15.1012018079-0 M437534 [New Content] [0004] In view of the above-mentioned problems of the prior art, the purpose of this creation is to provide a controllable test organic light-emitting diode The temperature control device for the body component solves the problem that the prior art measurement is inaccurate, the error is large, and the overall device and system are bulky and difficult to move, and the manufacturing cost is expensive. In accordance with the purpose of the present invention, a temperature control apparatus is provided that includes a main control module and a plurality of temperature control modules. The main control module receives a control command and performs a control action in accordance with the control command. Each temperature control module includes a first case, a partition, and a second case. The first box system has an accommodating space, and includes a temperature control unit, a sensing unit and a plate from the bottom to the top, and the sensing unit is disposed above the temperature control unit, and the plate and the sensing unit are Set a component to be tested. The partition partitions the first box body and the second box body, and a hole is arranged to place the uniform cold heat generating unit, and the upper side of the cooling heat generating unit is attached to the temperature control unit. The second box system has another accommodating space, and includes a heat dissipating unit, a first heat deriving unit and a second heat deriving unit. The heat dissipating unit is disposed under the refrigerating and heating unit, and the first heat deriving unit is disposed at One side of the A-box, and the second heat-extracting unit is disposed on the other side of the second box corresponding to the position of the first heat-extracting unit to derive heat energy by heat convection. [0006] It is fixed on the partition by a plurality of spring columns. [0007] wherein the plate is moved up and down by a plurality of spring columns, so that the component to be tested is placed under the plate and adhered to the upper surface of the temperature control unit. [0008] The temperature control device further includes an input module and a display module, and the input module and the display module are electrically connected to the main control module. 10120552Product No.A〇101 Page 4/15 pages 1012018079-0 M437534 [0009] The input module is input control command and transmitted to the main control module [0010], wherein the wheeled module is A desktop computer or a laptop. [0011] wherein the display module displays an operating state and a control command of the plurality of temperature control modules. [0012] wherein, the main control module comprises a microprocessor and a plurality of driving units, the microprocessor is electrically connected to the input module and the driving unit, and the microprocessor receives the control command of the input module, and the control command Converted to a control signal and transmitted to each drive unit. [0013] wherein the driving unit comprises a logic control component and an electronic circuit, the logic control component is electrically connected to the microprocessor, and the logic control component receives the control signal, and controls the electronic circuit to adjust the refrigeration and heating unit according to the control signal. One of the output powers and receives a temperature signal from the temperature sensing unit. [0014] wherein, the electronic circuit is a Η-type line. [0015] wherein the driving unit further comprises a power supply component, the power supply component is electrically connected to the logic control component and the electronic circuit, and supplies a power source to the logic control component and the electronic circuit. [0016] As described above, the temperature control device of the present invention can have the following advantages: (1) The temperature control device can reduce the volume required for testing and reduce the error of the measurement value by the refrigeration and heating unit. . (2) The temperature control device can independently control the temperature by a plurality of temperature control modules, and does not need to take time and space to set a plurality of large-scale control greenhouses, and does not need to set 10120552# single number Α0101 5th page/total 15 pages 1012018079 -0 M437534 Set the lead to make the test faster and more accurate. The above and other objects, features, and advantages of the present invention will become more apparent from the aspects of the invention. [Embodiment] Hereinafter, embodiments of the temperature control device according to the present invention will be described with reference to the related drawings. For the sake of easy understanding, the same components in the following embodiments are denoted by the same reference numerals.
[0019] 本創作之溫度控制裝置可置入一待測元件，待測元件可 為有機發光二極體元件，但不以此為限。 [0020] 請一併參閱第1圖及第2圖，第1圖係為本創作之溫度控制 裝置第一實施例之方塊圖，第2圖係為本創作之溫度控制 裝置第一實施例之示意圖。如第1圖及第2圖所示，溫度 控制裝置1包含一主控制模組11、一輸入模組12、一顯示 模組13及複數個溫度控制模組14。主控制模組11電性連 接輸入模組12及顯示模組13，且主控制模組11可接收控 制指令120，並根據控制指令120於複數個溫度控制模組 14執行控制動作110，以控制複數個溫度控制模組14之環 境溫度。輸入模組12輸入控制指令120後可傳送至主控制 模組11，其可為桌上型電腦或筆記型電腦，但不以此為 限。複數個溫度控制模組14感測溫度控制模組14實際提 供的溫度，並且傳送溫度訊號140至顯示模組13。顯示模 組13可顯示複數個溫度控制模組14之運轉狀態及控制指 令 120。 1〇12〇55#單编號删1 第6頁/共15頁 1012018079-0 M437534 [0021]單—個溫度控制模組14可包含一第一盒體141、一隔板 142及一第二盒體143。第一盒體141具有一容置空間， 可作為溫控室，其由底部至頂部依序可包含一控溫單元 1411、一感測單元1412及一板材1413。控溫單元1411 較佳可為鋁製方塊柱，其可使溫控室内保持固定溫度， 但材質或形狀不以此為限。感測單元1412較佳可為溫度 感測器，且設置於控溫單元1411之上方，並且感測單元 1412貼合於待測元件1414之下方，以感測待測元件1414 之溫度。 [0022] 板材1413利用複數個彈簧柱1415將板材1413固定於隔板 142上方，且藉由複數個彈簧柱1415上下移動，使待測元 件1414可置入板材1413之下方，且與控溫單元丨仏丨之上 表面互相貼合。其中，板材1413較佳可為壓克力材質或 其他塑膠材質，但不以此為限。 [0023] 第二盒體143可為熱交換室，其包含一散熱單元1431、一 第一熱導出單元1432及一第二熱導出單元1433。散熱單 ® 元1431設置於致冷致熱單元1421下方。第一熱導出單元 1432設置於第二盒體143之一側，且第二熱導出單元 1433相對應第一熱導出單元1432之位置設置於第二盒體 143之另一側，以藉由熱對流導出熱能。其中，散熱單元 1431較佳可為具有導熱管之散熱器或純銅锻造多鰭片的 散熱器，但不以此為限。 [0024] 另外，隔板142分隔第一盒體141及第二盒體143，且設 置一孔洞以放置致冷致熱單元1421，致冷致熱單元1421 之上侧可貼合控溫單元1411。致冷致熱單元1421可為熱 1012018079-0 10120552#單織删1 第7頁/共15頁 M437534 電晶片’但不以此為限。 则附帶一提的S，藉由輪入模组12及顯示模組13可提供良 好的人機介面，完整地操控與呈現複數個溫度控制模組 14分別的實際溫度、欲控制之溫度及溫度控制模組“分 別的運轉狀態，使量測更為快速確實。 _] tf參閱第3圖’其係為本創作之溫度控龍置第二實施例 之方塊圖。如第3圖所示，主控制模組21包含一微處理器 211及複數個驅動單元212。微處理器211電性連接輸入 模組22及複數個㈣單元212，當微處理器211接收來自 輸入模組22之控制指令220，微處理器211將控制指令 220轉換為-控制訊號211〇，且傳送至各驅動單元犯， 各驅動單元212根據控制訊號211〇於各溫度控制模組^ 執行控制動作2124 » _各驅動單元212可分別地驅動各溫度控制模㈣，舉例來 說，欲設置2個溫度控制模組23時，各個溫度控制模組23 需連接2個驅動單元212以分別地驅動各個溫度控制模組 23。其中’本溫度控制裝置2最多可達8個獨立控溫的溫 度控制模組23，以加速特性量測實驗。 [0028] 10_产單编就 值得注意的是，各驅動單元212係包含一邏輯控制元件 2121、_電子電路2】22及一電源供應元件2〗23。邏輯控 制凡件2121電性連接於微處理器2U，且邏輯控制元件 2121接收控制訊號211〇，並根據控制訊號控制電子 電路2122以調節致冷致熱單元231之輸出功率。電子電路 2122可調節輸入致冷致熱單元23i的平均電屡以調節致冷 =熱單元231輸_功率。财致熱單元231可藉由 第8頁/共15頁 1012018079-0 [0029]M437534 φ [0030] [0031][0019] The temperature control device of the present invention can be placed into a component to be tested, and the component to be tested can be an organic light emitting diode component, but is not limited thereto. [0020] Please refer to FIG. 1 and FIG. 2 together. FIG. 1 is a block diagram of a first embodiment of the temperature control device of the present invention, and FIG. 2 is a first embodiment of the temperature control device of the present invention. schematic diagram. As shown in Figures 1 and 2, the temperature control device 1 includes a main control module 11, an input module 12, a display module 13, and a plurality of temperature control modules 14. The main control module 11 is electrically connected to the input module 12 and the display module 13 , and the main control module 11 can receive the control command 120 and perform a control action 110 on the plurality of temperature control modules 14 according to the control command 120 to control The ambient temperature of a plurality of temperature control modules 14. The input module 12 can be transmitted to the main control module 11 after inputting the control command 120, which can be a desktop computer or a notebook computer, but is not limited thereto. A plurality of temperature control modules 14 sense the temperature actually provided by the temperature control module 14, and transmit the temperature signal 140 to the display module 13. Display module 13 can display the operational status of a plurality of temperature control modules 14 and control commands 120. 1〇12〇55#单单除1 page 6/15 pages 1012018079-0 M437534 [0021] The single temperature control module 14 can include a first box 141, a partition 142 and a second Case 143. The first casing 141 has an accommodating space, and can serve as a temperature control chamber. The bottom to the top may sequentially include a temperature control unit 1411, a sensing unit 1412, and a plate 1413. The temperature control unit 1411 is preferably an aluminum square column, which can maintain a fixed temperature in the temperature control room, but the material or shape is not limited thereto. The sensing unit 1412 is preferably a temperature sensor and is disposed above the temperature control unit 1411, and the sensing unit 1412 is attached to the underside of the device under test 1414 to sense the temperature of the device under test 1414. [0022] The plate 1413 uses a plurality of spring posts 1415 to fix the plate 1413 above the partition 142, and the plurality of spring posts 1415 move up and down, so that the component 1414 to be tested can be placed under the plate 1413, and the temperature control unit The top surface of the crucible fits on each other. The plate 1413 is preferably made of acrylic material or other plastic material, but is not limited thereto. [0023] The second casing 143 may be a heat exchange chamber, and includes a heat dissipation unit 1431, a first heat extraction unit 1432, and a second heat extraction unit 1433. The heat sink unit ® 1431 is disposed below the cooling and heating unit 1421. The first heat deriving unit 1432 is disposed on one side of the second case 143, and the second heat deriving unit 1433 is disposed on the other side of the second case 143 corresponding to the position of the first heat deriving unit 1432 to be heated Convection derives thermal energy. The heat dissipating unit 1431 is preferably a heat sink having a heat pipe or a pure copper forged multi-fin heat sink, but is not limited thereto. [0024] In addition, the partition 142 separates the first box body 141 and the second box body 143, and a hole is disposed to place the cooling and heating unit 1421, and the upper side of the cooling and heating unit 1421 can be attached to the temperature control unit 1411. . The cooling and heating unit 1421 can be heat 1012018079-0 10120552# single weave 1 page 7 / total 15 pages M437534 electric wafer 'but not limited thereto. With the S mentioned above, the wheel module 12 and the display module 13 can provide a good man-machine interface, and completely control and present the actual temperature, temperature and temperature of the plurality of temperature control modules 14 respectively. The control module "respectively operates the state to make the measurement faster and more accurate. _] tf see Fig. 3, which is the block diagram of the second embodiment of the temperature control device of the present creation. As shown in Fig. 3, The main control module 21 includes a microprocessor 211 and a plurality of driving units 212. The microprocessor 211 is electrically connected to the input module 22 and a plurality of (four) units 212, and the microprocessor 211 receives the control command from the input module 22. 220, the microprocessor 211 converts the control command 220 into a control signal 211, and transmits it to each driving unit. Each driving unit 212 performs a control action 2124 according to the control signal 211. The unit 212 can drive each temperature control module (4) separately. For example, when two temperature control modules 23 are to be provided, each temperature control module 23 needs to connect two driving units 212 to drive the respective temperature control modules 23 respectively. .its 'The temperature control device 2 can have up to 8 independent temperature control temperature control modules 23 to accelerate the characteristic measurement experiment. [0028] 10_Products It is worth noting that each drive unit 212 contains a logic The control component 2121, the electronic circuit 2 22 and a power supply component 2 are 23. The logic control component 2121 is electrically connected to the microprocessor 2U, and the logic control component 2121 receives the control signal 211, and controls the electronic device according to the control signal. The circuit 2122 is configured to adjust the output power of the refrigeration unit 231. The electronic circuit 2122 can adjust the average power of the input refrigeration unit 23i to adjust the cooling = thermal unit 231. The fuel cell 231 can be used by Page 8 of 15 1012018079-0 [0029] M437534 φ [0030] [0031]
[0032] 極性的切換❹m冷或致熱的功能。 另外’邏輯控制元件2121亦可接收溫度控制模㈣之溫 度訊號23G，並將溫度訊㈣〇傳送回微處”211，再 經由顯示模組24顯示溫度控制模⑽的實際溫度。電源 供應兀件2123電性連接於邏輯控制元件2121及電子電路 2122 ’且供應-電源至邏輯控制元件2ΐ2ι及電子電路 2122 °其中’電子魏2122較佳可為H魏路，但不以 此為限。 因此在本實〜例中，主控制模組21可藉由微處理器⑴ 接收輸入模組22傳送之㈣指令22G，並將控制指令22〇 轉換為控舰號211〇傳送至雜單元212中的邏輯控制元 件2m ’邏輯控制元件2121接收控制訊奶⑴，並根據 控制訊號2110控制電子窄路2122調節致冷致熱單元231 的輸出功率，以控制溫度控制模組23的溫度。 以上所述僅為舉舰，㈣為限舰者^任何未脫離本 創作之精神與料，㈣其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單説明】 第1圖係為本創作之溫度控制裝置第—實施例之方塊圖 第2圖係為本創作之溫度控制裝置第一實施例之示意圖 第3圖係為本創作之溫度控制裝置第二實施例之方塊圖 10120552#單編號 ΑΟίοι 第9頁/共15頁 1012018079-0 [0033]M437534 【主要元件符號說明】 I、 2 :溫度控制裝置 II、 21 :主控制模組 110、2124 :控制動作 12、 22 :輸入模組 120、220 :控制指令 13、 24 :顯示模組 14、 23 :溫度控制模組 140、230 :溫度訊號[0032] Switching polarity ❹m cold or hot function. In addition, the logic control component 2121 can also receive the temperature signal 23G of the temperature control module (4), and transmit the temperature signal (4) to the micro-portion 211, and then display the actual temperature of the temperature control module (10) via the display module 24. 2123 is electrically connected to the logic control component 2121 and the electronic circuit 2122' and supplies-power to the logic control component 2ΐ2ι and the electronic circuit 2122 °, wherein the 'electronic Wei 2122 is preferably H Weilu, but not limited thereto. In the present embodiment, the main control module 21 can receive the (4) command 22G transmitted by the input module 22 by the microprocessor (1), and convert the control command 22〇 into the logic of the control unit 211 〇 transmitted to the hybrid unit 212. The control element 2m 'logic control element 2121 receives the control milk (1), and controls the electronic narrow path 2122 to adjust the output power of the refrigeration unit 231 according to the control signal 2110 to control the temperature of the temperature control module 23. Lifting the ship, (4) for the ship-limiter ^ Any spirit and material that does not deviate from the creation, (4) The equivalent modification or change made by it shall be included in the scope of the patent application attached. 1 is a block diagram of a temperature control device of the present invention. FIG. 2 is a schematic view of a first embodiment of the temperature control device of the present invention. FIG. 3 is a second embodiment of the temperature control device of the present invention. Example block diagram 10120552#单号ΑΟίοι Page 9 of 151012018079-0 [0033]M437534 [Main component symbol description] I, 2: Temperature control device II, 21: Main control module 110, 2124: Control action 12, 22: input module 120, 220: control command 13, 24: display module 14, 23: temperature control module 140, 230: temperature signal
141 :第一盒體 1411 :控溫單元 1412 :感測單元 1413 :板材 1414 :待測元件 1415 :彈簧柱 142 :隔板 1421、231 :致冷致熱單元141: First case 1411: Temperature control unit 1412: Sensing unit 1413: Plate 1414: Component to be tested 1415: Spring column 142: Separator 1421, 231: Refrigeration and heating unit
143 :第二盒體 1431 :散熱單元 1432 :第一熱導出單元 1433 :第二熱導出單元 211 :微處理器 2110 :控制訊號 212 :驅動單元 2121 :邏輯控制元件 2122 :電子電路 10120552^^^^ 1012018079-0 A0101 第ίο頁/共15頁 M437534 2123 :電源供應元件 10120552#單編號 A〇101 第11頁/共15頁 1012018079-0143: second case 1431: heat dissipation unit 1432: first heat extraction unit 1433: second heat extraction unit 211: microprocessor 2110: control signal 212: drive unit 2121: logic control element 2122: electronic circuit 10120552^^^ ^ 1012018079-0 A0101 Page 395 of 15 M437534 2123 : Power Supply Element 10120552#单号A〇101 Page 11 of 15 1012018079-0