M436315 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種電極式微流道散熱裝置，尤其是一 種以電極驅動工作流體之一種電極式微流道散熱裝置。 【先前技術】M436315 V. New description: [New technical field] This is a kind of electrode type micro flow channel heat dissipating device, especially an electrode type micro flow channel heat dissipating device which drives working fluid with electrodes. [Prior Art]
一般3C產品在工作狀態下，IC或cpu等電子元件會 產生大1的熱能，為了使該電子元件能維持正常操作，必 須使用一散熱裝置幫助該電子元件進行散熱。 請參照第1及2圖所示，習知散熱裝置包含一散熱座 7及-魏系統8 ’該散熱座7具有數個微流道71、一底 座72、:蓋板73及數肋條74，各該微流道71形成於該底 座72與盍板73之間，並由該底座72與蓋板乃之一端延 伸至另-端，並於該底座72與蓋板73之―_成^入口 端7Π，且於該底座72與蓋板73之另一端形成一出口端 :。5亥肋條74設置於相鄰二微流道71之間，且該肋條 74之一端連接該底座72，哕 π ^ °亥肋條74之另一端連接該蓋板 73〇 5亥入口端711與出口姓八cm 土、 為712刀別連接該循環系統8之 一官路81，該管路81連掊―人欠 ^ 7卩钇82及一幫浦83，使該 冷部槽82之一工作流體可夢 ^ ^ 稭由幫浦83的推動，沿著該管 ^ 81 k至職錄流道71之人口端7ιι，並㈣工作流 流回該冷卻槽δ2。 之出％ 712’再藉由該管㈣ 電子元件9,當該電子元件 該電子元件9會將熱量傳 該底座72係用以貼接於一 9處於工作狀態而產生熱能時， 導至相貼接之該底座72，使該底座72及肋條74之溫度上 升。此時，該微流道71中之工作流體可吸收該底座72及 肋條74之熱能，並藉由該幫浦83的推動，將冷卻槽82 中較低溫之工作流體由該入口端711送入該數個微流道 71，並將該數個微流道71中已升溫之工作流體由該出口端 712推出，以持續對該電子元件9進行散熱。 然而’該習知散熱裝置之工作流體係由幫浦83驅動， 該幫浦83在運轉的過程中，會產生多餘的噪音與震動，且 為了、隹持5亥幫浦83的正常運轉，需要較大之電壓與電流， ，有較高之功率損耗，此外，該幫浦83的設置也將增加該 散，裝置於實際使㈣之整體體積，減少該散熱裝置的配 【新型内容】 署，作之主要目的係提供—種電極式微流道散熱！ =創靜音與無震動冰兄下進行散熱作業 置，該散缝置電極式微流道散熱莱 置，蝴崎歸 為達到前述創作目的，本創 置，係包含^包極式微流道散熱裝 1座，具有一基板，續其紅p日 肋架以形成數個微Μ &絲板間隔設置數個 端及n，該數個微流道具有相對之—入口 至少+… 架之開放端共同形成-社人却 至r，’具有一正電極與—負電極成 。亥正電極與 負電極没置於該墓座之結合部， 個微流迢’且該正電極與負電極係 :;=過? 座:::部該結合_該至少1極組件二該: 本紹乍之甩極式微流道散熱襄置，盆中兮至,1、一 組件設置於該基座之基板與數個肋架之間’該極 組件之正電極與負電極通 ^包極 電極r手由销治、^ 亥微机道，且該正電極與負 方触正_負電極 間呈==式=·熱裝置，其中各該電極組件 -電極間距，該組件間距大於該電_距。 -有 本創作之電極式微流道餘裝置，其巾各該正電極斑 負笔極之延伸方向與各該微流道之延伸方向垂直。、 本創作之電極式微流道散熱裝置，豆 係由低電導材料製成。 -…座縣件 本創作之電極式微流道散熱裝置，其中另具有 供電組件，該變塵供電組件之一正電端連接該至少—電極 組件之正電極，該變職電組件之—負電端連接該至 電極組件之負電極。 【實施方式】 “為讓本創作之上述及其他目的、特徵及優點能更明顯 易1M，下文特舉本創作之較佳實施例，並配合所附圖式， 作詳細說明如下： 裝置圖T，本創作之電極式微流道散熱 $極組件2及—板件3，該電極組 I 1之—結合部14，該板件3緊鄰該電極組 件2亚、纟。合該基座1之結合部14。 該基座1係由高熱傳與低電導之材料製成，例如玻璃 =料材質’以加_基座1之導熱效果，朗免該I 座1與該電極組件2彼此導電。該基座1具有—美板u， 該基板η間隔設置數個肋架12以形成數個微流^ i3，該 數個微流道η具有相對之_入口端131及—出口端132°: $個肋架12之開放端共_成—結合部14。該數個微 >瓜道13可供—工作流體流動，該功流體可由該入口端 ⑶，入，並吸收該基座！之熱能，.再由該出口端132产 出y匕降低該基座i之溫度。該工作流體可為任何液體， 在本貫施例巾储擇具有低導電度讀體，使該工作 受到電場影㈣H有難之流體麟效果。 件2具有相對之一正電極21.與—負電極 。/正迅極21與負電極22設置於該基座丨之結合部 該正電極21與負電極22通過數個微流道13，且該正 21與負電極22係由該微流道13之入口端131朝出口蠕1幻 之方向依正-負電極順序排列。由於該正電極21與負2 22通過紐個微流道13,故該電極組件2所形成之—〜 可對數個微流道13之卫作流體產生驅動力。該正電^二 二負包極22之延伸方向較佳與各該微流道13之延伸方 垂直，以增加該電極組件2對數個微流道13中之工作旋體 二2致果。此外，該正電極21與負電極22之設置方式， _ =電極組件2在該人σ端⑶朝該出e端m的方向 差驅位往低電位之電場，並利用該電場之高低電位 數個微流道13内之工作流體，使該工作流體由該 利用❻該出口端132流動。其中，該電極組件2可 部 1 離子緣等微機電形成方式，結合於該基座1之結合 組件=結合面31緊鄰該電極 與低電導之材料製成，例=係由高熱傳 板件3夕道也田 ' 央荨材貝，以加強该 導電。，^ ’亚避免該板件3與該電極組件 2彼此 凊再參照第3及4圖示， 在此並不設限，在太每心丨士二电極組件2之設置數量 mu 只轭例中，係將數個電極組件2执詈 =基座1之結合部14與基板η及數個: 之杨’進而加強該微流道13内之工作 诞电位差 果，使該I作流體縣較高之錢，敍驅動效 且各該電極組件2之正電極21可相互、/·的效果。 一鍾供電組件4之_正電端，各該電極‘=時=至 22亦可相互連接’並同時連接該變壓供 ：、：： 端，以透過兮辯厫如士，， 电，、’且件4之一負電 電屋值提供數個電極組件2所需之 八Y 5又置於該結合部14與某虹η „ & 之^?極組件2間具有—組件間距U，同細=. 件之正電極21與負電極趨有-電極間距L2; 、'且件間距Ll較佳大於該電極間距l2，以避免不同電極組 件2之正電極21與負電極。產生反向之電場’進而影響 該微流道13内之工作流體的流動方向。 請參照第5及6圖所示，更詳言之，本創作之電極式 微流道散熱裝置於實際使用時，可將該基座1之基板U外 表面貼接—電子元件5,並將該數個微流道13之入口端131 與出口端132分別連接一循環系統6之一管路61，該管路 61另外連接一冷卻槽62 ’該數個微流道13内之工作流體 可藉由電極組件2所形成之電場驅動效果，使該工作流體 由"亥入口端131朝該出口端132流出，再藉由該管路61 流至該冷卻槽62進行該工作流體之降溫作業，隨著工作流 體不斷進人該冷卻槽62，該冷卻槽62中已冷卻之工作流 體可再度流人該管路61，並藉路61流至該數個微 流道13之入口端131。 當該電子元件5產生熱能時，該電子元件5會將該熱 能傳導至該基座1，使該基座丨之溫度逐漸上升，並使該 數個微流道13内之工作流體隨之升溫。該升溫後之工作流 體受到該電麵件2之電場_影響後，可使該工作流體L 自δ亥出口端132流出，並推擠或驅動該管路61内之工作流 體，進而將該冷卻# 62崎低溫之工作流體推送至該數個 微流道之人口端m ’以持續對該電子元件5進行熱交換。 其中，該卫傾體於魏個減道13與獅纟統6内流動 之動力，係藉由該電極組件2_成之電場驅動 子拖良造成’不需利用幫浦推動該I作流體，係為靜3 益振動之酿勤方式，。 ' 此外，该電極組件2對工 果，可利用該電場強度 ；產生之離子驅動效 電^之電位差距越大；^㈣極21與負 果，若該正電極21與負電極之流體離子驅動效 作漭髀夕4 2之电位差距較小時，嗜工 體之離子驅動效果也隨 位差可控制在10κν至3QKV之間。t广例中，該電 、/主独彻纟趙賴升電壓差生紅 ，之電流’相較於幫浦所消耗之電壓二、、Γ ’ 入 咕式《道散熱裝置可具有較低之。，本創作之 :右本創作於實際使用時，用以驅動 具有較小之體積與複雜度，可增加該幸 :於幫 熱教置之配置彈性。 Μ电極式微流道散 本創作之電極式微流道散熱 成::離子驅動效果’該電極不會土 曰或震動’具有靜音與無震動之功效。 夕餘的木 之本射m㈣道散料置_ 之电場造成流體離子驅動效果， 才所產生 之特性，具錢低功率娜之功效。，、有w壓低電流 本創作之電_微流道散缺置_ 之笔場造成越離子驅動效果，料極本身 =生 具有較高配置彈性之功效。 體積較小’ .雖然本創作已利用上述較佳實施例揭示，缺 μ定本創作’任何熟習此技藝者在不脫離本_之 和视圍之内’相對上述實施例進行各種更動盘月 創作所保護之技術範嘴，因此本 ^乃萄本 • <保。又乾圍當視後附 M436315 之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖：習知散熱裝置結構圖。 第2圖：習知散熱裝置使用示意圖。 第3圖：本創作之電極式微流道散熱裝置分解圖。 第4圖：本創作之電極式微流道散熱裝置上視圖。 第5圖：.本創作之電極式微流道散熱裝置使用示意圖。 第6圖：本創作之電極式微流道散熱裝置使用示意圖。 【主要元件符號說明】 〔本創作〕 1 基座 11 基板 12 肋架 13 微流道 131 入口端 132 出口端 14 結合部 2 電極組件 21 正電極 22 負電極 3 板件 31 結合面 4 變壓供電組件 5 電子元件 6 循環系統 61 管路 62 冷卻槽 L1 組件間距 L2 電極間. !0 M436315 〔習知〕 7 . 底座 71 微流道 711 入口端 712 出口端 72 底座 73 蓋板 74 肋條 8 循環系統 81 管路 82 冷卻槽 83 幫浦 9 電子元件Generally, when the 3C product is in operation, an electronic component such as an IC or a cpu generates a large amount of thermal energy. In order to maintain the normal operation of the electronic component, a heat sink must be used to help the electronic component to dissipate heat. Referring to Figures 1 and 2, the conventional heat sink includes a heat sink 7 and a Wei system 8'. The heat sink 7 has a plurality of microchannels 71, a base 72, a cover plate 73 and a plurality of ribs 74. Each of the micro flow passages 71 is formed between the base 72 and the sill plate 73, and extends from one end of the base 72 and the cover plate to the other end, and the inlet of the base 72 and the cover plate 73 The end 7 is formed, and an outlet end is formed at the other end of the base 72 and the cover plate 73. 5 ridges 74 are disposed between the adjacent two microchannels 71, and one end of the ribs 74 is connected to the base 72, and the other end of the 哕π^° ribs 74 is connected to the cover plate 73〇5, the inlet end 711 and the outlet The first name is eight cm soil, and the 712 knife is connected to one of the circulation system 8 of the official road 81. The pipeline 81 is connected with a 掊 人 人 卩钇 卩钇 卩钇 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 , , , , , The dream ^ ^ straw is pushed by the pump 83, along the tube ^ 81 k to the population end 7 of the job channel 71, and (4) the workflow flows back to the cooling tank δ2. The % 712' is further connected to the electronic component 9 by the tube (4). When the electronic component 9 transmits heat to the base 72 for attaching to a working state to generate thermal energy, the corresponding component is attached. The base 72 is connected to raise the temperature of the base 72 and the ribs 74. At this time, the working fluid in the microchannel 71 can absorb the thermal energy of the base 72 and the rib 74, and the lower temperature working fluid in the cooling tank 82 is sent from the inlet end 711 by the pushing of the pump 83. The plurality of microchannels 71 push the heated working fluid in the plurality of microchannels 71 from the outlet end 712 to continuously dissipate heat from the electronic component 9. However, the workflow system of the conventional heat sink is driven by the pump 83. During the operation of the pump 83, excessive noise and vibration are generated, and in order to maintain the normal operation of the 5 Haipu 83, Larger voltage and current, and higher power loss, in addition, the setting of the pump 83 will also increase the dispersion, the device actually makes the overall volume of (4), reducing the distribution of the heat sink device [new content], The main purpose of the system is to provide an electrode-type micro-channel heat dissipation! = Create a silent and non-vibration ice brother to carry out the heat-dissipation operation, the splice-mounted electrode-type micro-flow channel heat-dissipation, the butterfly is attributed to the above-mentioned creative purpose, the creation, including the package-type micro-flow cooling device 1 The base has a substrate, and the red rib rib frame is continued to form a plurality of micro cymbals. The silk plate is spaced apart from the plurality of ends and n, and the plurality of micro flow channels have opposite sides - at least the entrance end of the frame. Forming - the community is to r, 'has a positive electrode and a negative electrode. The positive electrode and the negative electrode are not placed at the junction of the tomb, and the micro-flow 且 ' and the positive electrode and the negative electrode are:; = over the seat::: the combination _ the at least one-pole component two: Ben Shaohao's bungee micro-channel heat sink, in the basin, 1, a component is placed between the base of the base and a plurality of ribs 'the positive and negative electrodes of the pole assembly pass through the pole The electrode r is controlled by the pin, and the micro-channel is, and the positive electrode and the negative-side positive-negative electrode are in the form of a ==== thermal device, wherein the electrode assembly-electrode spacing, the component spacing is greater than the electricity_ distance. - The electrode-type microfluidic residual device of the present invention has a direction in which the positive electrode strips of the positive electrode strips extend perpendicularly to the direction in which the microchannels extend. The electrode-type micro-channel heat sink of the present invention is made of a low-conductivity material. - The electrode-type micro-channel heat-dissipating device of the present invention has a power supply component, and one positive terminal of the dust-removing power supply component is connected to the positive electrode of the at least electrode assembly, and the negative terminal of the variable electrical component The negative electrode to the electrode assembly is connected. [Embodiment] In order to make the above and other objects, features and advantages of the present invention more obvious, the preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. The electrode-type micro-channel cooling device of the present invention has a heat-dissipating component 2 and a plate member 3, a bonding portion 14 of the electrode group I1, and the plate member 3 is adjacent to the electrode assembly 2, and the combination of the base member 1. The pedestal 1 is made of a material having high heat transfer and low conductance, for example, a glass material material, and the heat conduction effect of the susceptor 1 is used to prevent the I block 1 and the electrode assembly 2 from conducting electricity with each other. The susceptor 1 has a slab u, and the substrate η is spaced apart from the plurality of ribs 12 to form a plurality of microfluids i i3 having opposite sides _ inlet end 131 and an outlet end 132°: The open ends of the ribs 12 are collectively coupled to each other. The plurality of micro-> melons 13 are available for the working fluid to flow, and the working fluid can be introduced into the inlet end (3) and absorb the heat of the base! Then, the outlet end 132 produces y匕 to lower the temperature of the susceptor i. The working fluid can be any liquid, in the present application. The towel storage has a low conductivity reading body, so that the work is affected by the electric field shadow (4) H. The workpiece 2 has a relative positive electrode 21. and a negative electrode. / The positive electrode 21 and the negative electrode 22 are disposed on the body. The junction of the pedestal and the negative electrode 22 passes through the plurality of microchannels 13, and the positive 21 and the negative electrode 22 are symmetrical by the entrance end 131 of the microchannel 13 toward the exit. - The negative electrodes are sequentially arranged. Since the positive electrode 21 and the negative 2 22 pass through the new microchannels 13, the electrode assembly 2 is formed to generate a driving force for the servo fluid of the plurality of microchannels 13. The extending direction of the negative 22 poles is preferably perpendicular to the extension of each of the microchannels 13 to increase the working rotation of the electrode assembly 2 in the plurality of microchannels 13. Further, the The positive electrode 21 and the negative electrode 22 are disposed in such a manner that the electrode assembly 2 is driven to a low potential electric field at a direction of the e-terminal end of the human σ end (3), and a plurality of micro-flows are utilized by the high-low potential of the electric field. The working fluid in the channel 13 causes the working fluid to flow from the utilization port 132. The electrode assembly 2 Part 1 is a microelectromechanical forming method such as an ion edge, and is combined with a bonding component of the susceptor 1 = a bonding surface 31 is formed adjacent to the electrode and a material of low conductance, for example, by a high heat transfer plate member 3 夕道也田' The material is reinforced to strengthen the conductive. ^ 'Au avoid the plate member 3 and the electrode assembly 2 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 每 每 每 每 每 每 每 每 每 每The number of sets of 2 is only a yoke example, in which a plurality of electrode assemblies 2 are attached = the joint portion 14 of the susceptor 1 and the substrate η and a plurality of: yang' to further enhance the potential difference in the microchannel 13 Therefore, the I is made of a higher amount of money in the fluid county, and the positive electrode 21 of each of the electrode assemblies 2 can be mutually effective. One positive power terminal of the power supply component 4, each of the electrodes '=time=to 22 can also be connected to each other' and simultaneously connected to the transformer for:::: terminal, through the 兮 厫 厫 厫 , ,, 电,,,, And one of the negative electric current values of the component 4 provides a plurality of electrode assemblies 2, and the required Y Y 5 is placed between the bonding portion 14 and a certain component of the rainbow θ & The positive electrode 21 and the negative electrode of the piece tend to have an electrode spacing L2; ', and the piece spacing L1 is preferably larger than the electrode spacing l2 to avoid the positive electrode 21 and the negative electrode of the different electrode assemblies 2. The electric field' in turn affects the flow direction of the working fluid in the microchannel 13. Referring to Figures 5 and 6, in more detail, the electrode-type microchannel heat sink of the present invention can be used in actual use. The outer surface of the substrate U of the socket 1 is attached to the electronic component 5, and the inlet end 131 and the outlet end 132 of the plurality of microchannels 13 are respectively connected to a pipeline 61 of a circulation system 6, and the pipeline 61 is additionally connected Cooling tank 62' The working fluid in the plurality of microchannels 13 can be driven by the electric field formed by the electrode assembly 2, so that The fluid flows out from the inlet end 131 toward the outlet end 132, and the conduit 61 flows to the cooling tank 62 to perform the cooling operation of the working fluid. As the working fluid continuously enters the cooling tank 62, the fluid is continuously introduced into the cooling tank 62. The cooled working fluid in the cooling tank 62 can again flow to the pipeline 61 and flow through the path 61 to the inlet ends 131 of the plurality of microchannels 13. When the electronic component 5 generates thermal energy, the electronic component 5 Conducting the thermal energy to the susceptor 1, gradually increasing the temperature of the susceptor, and heating the working fluid in the plurality of microchannels 13. The heated working fluid is subjected to the electrical component 2 After the electric field _ is affected, the working fluid L can be discharged from the δ-Hui outlet end 132, and the working fluid in the pipeline 61 is pushed or driven, and the cooling fluid is cooled to the plurality of micro-flowing working fluids. The population end of the flow channel m' is used to continuously exchange heat with the electronic component 5. The power of the slanting body flowing through the Weishui 13 and the Griffin 6 is formed by the electrode assembly 2_ The electric field driver is dragged to cause 'no need to use the pump to push the I fluid. Static 3 yin vibration brewing method, ' In addition, the electrode assembly 2 pairs of work, the electric field strength can be utilized; the potential difference between the generated ion-driven utility power ^; ^ (four) pole 21 and negative fruit, if When the potential difference between the positive electrode 21 and the negative electrode of the fluid ion driving effect is small, the ion driving effect of the sinusoidal body can also be controlled between 10 κν and 3 QKV with a potential difference. Electricity, / the main independent Zhao Laisheng voltage difference red, the current 'compared to the voltage consumed by the pump II, Γ ' into the 咕 type "channel heat sink can have a lower., the creation of this: the right creation In actual use, it is used to drive with a small volume and complexity, which can increase the fortune: the flexibility of the configuration of the hot teaching. ΜElectrode micro-channel dispersal The electrode-type micro-channel heat dissipation created by this method:: Ion-driven effect 'The electrode will not be soiled or vibrated' and has the effect of being silent and vibration-free. The eve of the wood's original shot of m (four) of the bulk material set _ the electric field caused by the fluid ion drive effect, the characteristics produced, the effect of money and low power. ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The volume is smaller. Although the present invention has been disclosed by the above-described preferred embodiments, the authors of the present invention have made various changes to the above-mentioned embodiments without departing from the scope of the present invention. The technical model of protection is the mouth, so this is the book. The scope of the patent application scope of M436315 shall prevail. [Simple description of the figure] Fig. 1: Structure diagram of a conventional heat sink. Figure 2: Schematic diagram of the use of conventional heat sinks. Figure 3: Exploded view of the electrode-type microchannel heat sink of this creation. Figure 4: Top view of the electrode-type microchannel heat sink of this creation. Figure 5: Schematic diagram of the use of the electrode-type microchannel heat sink. Figure 6: Schematic diagram of the use of the electrode-type microchannel heat sink of the present invention. [Main component symbol description] [This creation] 1 Base 11 Substrate 12 Rib frame 13 Micro flow path 131 Inlet end 132 Outlet end 14 Joint part 2 Electrode assembly 21 Positive electrode 22 Negative electrode 3 Plate 31 Bonding surface 4 Variable voltage power supply Component 5 Electronic component 6 Circulatory system 61 Piping 62 Cooling trough L1 Component spacing L2 Electrode. !0 M436315 [General] 7. Base 71 Microchannel 711 Inlet end 712 Outlet end 72 Base 73 Cover 74 Rib 8 Circulatory system 81 Piping 82 Cooling trough 83 Pump 9 Electronic components