101年.04月23日核正替換頁 M432220 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關一種發光二極體封裝結構，特別是為了提 供較佳之LED基板的熱效率。 【先前技術】 [0002] 因應市場的需要，目前業界開發了許多高功率發光二極 體，由於發光二極體光源模組上的LED晶粒，具有點光源 集中的特性與體積小的優點，故能廣泛運用在面光源、 點光源、照明等用途。 [0003] 這些高功率發光二極‘體可以產生高亮度的光源，但相對 也產生極高的熱源，而這些高熱源將會影響到高功率發 光二極體的使用壽命，因此會在高功率發光二極體製作 時，使用散熱效率較佳的材質來製作基座，讓發光晶片 所產生的熱源直接傳遞於該基座上，以確保高功率發光 二極體的使用壽命，惟使用高散熱效率的材質會使業者 的製造成本較高，相對的消費者亦需付出更多的代價。 [0004] 一般LED係固定於具有電路介質之基板上，基板材質可為 PCB多層板、金屬或陶瓷基板。氧化鋁基板是典型的結構 陶瓷材料，一般常應用在需要承受機械應力的結構用零 件，尤其利用其本身具有高熔點、高硬度、絕緣性佳、 散熱效率高與耐蝕性優良等特性，可在嚴苛的高溫腐蝕 性環境下使用或應用在電氣絕緣的用途。 [0005] 影響熱傳導的效率有眾多因素，除了電路本身的熱阻界 面造成溫度落差外，其基板本身的材質與散熱面積亦是 10022428# 單編號 A0101 第3頁/共14頁 1013153297-0 M432220 -〜 ，101.04.23 Nuclear replacement page M432220 V. New description: [New technical field] [0001] This creation is about a light-emitting diode package structure, especially to provide better thermal efficiency of the LED substrate. [Prior Art] [0002] In response to the needs of the market, many high-power light-emitting diodes have been developed in the industry. Due to the LED crystal grains on the light-emitting diode light source module, the characteristics of the point light source are concentrated and the volume is small. Therefore, it can be widely used in surface light sources, point light sources, and lighting applications. [0003] These high-power light-emitting diodes can produce high-brightness light sources, but they also produce extremely high heat sources, which will affect the service life of high-power light-emitting diodes, and therefore will be at high power. In the production of the light-emitting diode, the base is made of a material with better heat dissipation efficiency, and the heat source generated by the light-emitting chip is directly transmitted to the base to ensure the service life of the high-power light-emitting diode, but high heat dissipation is used. The material of efficiency will make the manufacturing cost of the industry higher, and the relative consumers will have to pay more. [0004] A general LED is fixed on a substrate having a circuit medium, and the substrate material may be a PCB multilayer board, a metal or a ceramic substrate. Alumina substrate is a typical structural ceramic material. It is commonly used in structural parts that need to withstand mechanical stress. In particular, it has its own characteristics of high melting point, high hardness, good insulation, high heat dissipation efficiency and excellent corrosion resistance. Use in harsh or high temperature corrosive environments or in electrical insulation applications. [0005] There are many factors affecting the efficiency of heat conduction. In addition to the temperature drop caused by the thermal resistance interface of the circuit itself, the material and heat dissipation area of the substrate itself is 10022428# Single No. A0101 Page 3 / Total 14 Page 1013153297-0 M432220 - ~ ,
匕?日接正雜頁I 重要的因素之一，由於LED基座的體積通常很小 熱速度受限’並使得熱源散熱不及，長久時間下來， •4 能損及發光晶片效能，使晶片光源均勻度不能滿足所需 求的規格。 【新塑内容】 [0006] 為解決前述問題，本創作提供一種具有金屬柱的氧化鋁 陶瓷電路板，包含：氧化鋁陶瓷基板，具有第一側邊與 第二侧邊，且氧化鋁陶瓷陶瓷基板於預定固晶區設置有 至少一個導熱孔，該等導熱孔自氧化鋁陶瓷基板的第— 側邊延伸至第二側邊；及複數個金屬柱位於該等導熱孔 中。本創作的導熱扎可透過雷射鑽孔加工方法形成，再 以填孔印刷的方式將含銀材料或含錫材料填入導熱孔内 ，最後將填充好的氧化鋁陶瓷基板進行燒結以完成LED基 板。 [0007] 本創作另外提供一種發光二極體（LED )封裝結構，包含 :上述具有金屬柱的氡化鋁陶瓷電路板；第一焊墊與一 第二焊墊位於氧化鋁陶瓷基板的第一側邊，且第三焊墊 · 與第四焊塾/立於氧化鋁陶瓷基板的第二側邊，其中第一 焊墊藉由第一導電孔與第三焊墊連接，而第二焊墊藉由 第二導電孔與第四焊墊連接；電性連接至該第一焊墊與 該第二焊墊的LED晶片》 [0008] 在固晶區下方的氧化鋁陶瓷基板中設置複數個金屬柱， 這些金屬柱會直接穿過氧化鋁陶瓷基板形成一快速的導 熱途徑。當設於固晶區上的發光二極體晶片被點亮並開 始產生熱源時，該等金屬柱便能迅速的引導熱源遠離固 10022428#單编號 第 4 頁 / 共 Η 頁 1013153297-0 M432220 .101 年 晶區至散熱片上，如此一來便能使發光二極體晶片能更 有效率的發揮其功能。 【實施方式】 [0009]有關本創作之詳細說明及技術内容，配合圖式說明如下 ’然而所附圖式僅提供參考與說明用，並非用來對本創 作加以限制者。 [0010]請參照第一圖及第二圖，第一圖係依據本創作之較佳實 施例之具有金屬柱的氧化鋁陶瓷電路板的剖面圖；第二 • 圖為依據本創作之較佳實施例之具有金屬柱的氧化鋁陶 瓷電路板的上視圖。本創作提供一種具有金屬柱的氧化 鋁陶瓷電路板100，包含：氧化鋁陶瓷基板101，具有第 一側邊103與第二側邊105，且氧化鋁陶瓷基板丨〇1於預 定固晶區106設置有複數個導熱孔125，該等導熱孔i25 自氧化鋁陶瓷基板1〇1的第一側邊1〇3延伸至第二側邊 105 ;及複數個金屬柱127位於該等導熱孔125中。 鲁 [0011]導熱孔125可透過雷射鑽孔或沖孔法形成圓形、方形或矩 形可依需要形成其他任何形狀。導熱孔丨25可利用填 . 孔印刷法將含銀材料或含錫材料填入其中以形成複數個 金屬柱127。如第二圖所示，導熱孔125的大小、數量及 排列方式可依所須導熱速率及加工方便性決定，並不r 圖中所示者為限。 [0012]位於導熱孔125的兩側邊可分別設置第一月楚、* 久弟一導電孔 115、117，可利用填孔印刷法將含銀材料或含錫材 入其中’以形成第一導電柱116及第二導電柱118 、 第5頁/共14頁 10022428夢單編號 A〇101 1013153297-0 M432220 [0013]One of the important factors in the daily connection of the page I, because the size of the LED pedestal is usually very small, the thermal speed is limited, and the heat source is not able to dissipate heat. For a long time, Uniformity does not meet the required specifications. [New Plastic Content] [0006] In order to solve the aforementioned problems, the present invention provides an alumina ceramic circuit board having a metal pillar, comprising: an alumina ceramic substrate having a first side and a second side, and an alumina ceramic ceramic The substrate is provided with at least one heat conducting hole extending from the first side to the second side of the alumina ceramic substrate in the predetermined die bonding region; and a plurality of metal pillars are located in the heat conducting holes. The heat conduction wire of the present invention can be formed by a laser drilling method, and then the silver-containing material or the tin-containing material is filled into the heat conduction hole by filling and hole printing, and finally the filled alumina ceramic substrate is sintered to complete the LED. Substrate. [0007] The present invention further provides a light emitting diode (LED) package structure, comprising: the above-described aluminum-aluminum ceramic circuit board with a metal pillar; the first solder pad and a second solder pad are first located on the alumina ceramic substrate a side, and a third pad and a fourth pad/standing on the second side of the alumina ceramic substrate, wherein the first pad is connected to the third pad by the first conductive hole, and the second pad Connecting to the fourth pad by the second conductive hole; electrically connecting to the LED pad of the first pad and the second pad. [0008] setting a plurality of metals in the alumina ceramic substrate below the solid crystal region Columns, these metal columns form a fast thermal conduction path directly through the alumina ceramic substrate. When the light-emitting diode wafers disposed on the solid crystal region are illuminated and begin to generate heat sources, the metal pillars can quickly guide the heat source away from the solid 10022428#单号第4页 / 共Η Page 1013153297-0 M432220 The 101-year crystal region is on the heat sink, which enables the LED chip to perform its functions more efficiently. DETAILED DESCRIPTION OF THE INVENTION [0009] The detailed description and technical contents of the present invention are described with reference to the drawings. However, the drawings are only for reference and description, and are not intended to limit the present invention. [0010] Referring to the first and second figures, the first drawing is a cross-sectional view of an alumina ceramic circuit board having a metal post according to a preferred embodiment of the present invention; A top view of an alumina ceramic circuit board with metal posts of an embodiment. The present invention provides an alumina ceramic circuit board 100 having a metal pillar, comprising: an alumina ceramic substrate 101 having a first side 103 and a second side 105, and the alumina ceramic substrate 1 is in a predetermined solid crystal region 106. A plurality of heat conducting holes 125 are provided, and the heat conducting holes i25 extend from the first side 1〇3 of the alumina ceramic substrate 1〇1 to the second side 105; and a plurality of metal pillars 127 are located in the heat conducting holes 125. . Lu [0011] The heat conducting holes 125 may be formed into a circular shape, a square shape or a rectangular shape by laser drilling or punching to form any other shape as needed. The thermally conductive apertures 25 can be filled with a silver-containing material or a tin-containing material by a via printing method to form a plurality of metal pillars 127. As shown in the second figure, the size, number, and arrangement of the heat conducting holes 125 can be determined according to the required heat transfer rate and processing convenience, and are not limited to those shown in the figure. [0012] The first side of the heat conducting hole 125 can be respectively provided with a first month Chu, * a long-distance conductive hole 115, 117, which can be filled into the silver-containing material or the tin-containing material by the hole-filling printing method to form the first Conductive column 116 and second conductive column 118, page 5 / total 14 pages 10022428 dream list number A 〇 101 1013153297-0 M432220 [0013]
社 ^ [101^04^ 23 B 請參照第三@及第E3®，第三圖係依據；~~ 佳實施例之發光二極體封裝結構的剖面圖；第四圖為依 據本創作之第一較佳實施例之發光二極體封裝結構的上 視圖β如苐三圖所示，本創作之發光二極體封裝結構300 包含··氧化鋁陶瓷基板101,具有第一側邊103與第二側 邊105 ;第一焊墊〗07與第二焊墊1〇9位於氧化鋁陶瓷基 板101的第一側邊103，且第三焊墊U1與第四焊墊113位 於氧化鋁陶瓷基板10!的第二側邊1〇5，其中第一焊墊 107藉由第一導電孔115與第三焊墊連接lu，而第二焊 墊109藉由第二導電孔11 7與第四焊墊11 3連接；LED晶片 119藉由二焊線121、123電性連接至第一焊墊1〇7與第二 焊墊109，及複數個導熱孔125位於LED晶片119下方的氧. 化紹陶兗基板101 _，該等導熱孔125自氧化紹陶宪基板 101的第一側邊103延伸至第二侧邊1〇5。 _]本實施例的氧化銘陶兗基板1〇1為—具有較高導熱係數的 基板，其可為氧化鋁板，但不以此為限。第一焊塾1 藉 由第一導電柱116與第三焊墊連接111，而第二焊墊109 ( 藉由第二導電柱118與第四焊墊113連接。 [0015]金屬柱127成柱狀結構，藉由連接層129與LED晶片119接 合。LED晶片119與金屬柱127接合前，可在金屬柱12?接 合部表面鍍上一鍍金屬層，之後再與LED晶片119在適當 溫度下進行接合。LED晶片119與金屬柱127的接合方式 ’除了上述共晶方式外’也可藉由具有高導熱係數的黏 膠進行接合’黏膠可為銅膠、銀膠或焊錫。此外，金屬 柱127在氧化鋁陶瓷基板丨〇1的第二側邊可連接有一社^ [101^04^ 23 B Please refer to the third @ and E3®, the third figure is based; ~~ The cross-sectional view of the LED package structure of the preferred embodiment; the fourth picture is based on the creation of the A top view of a light emitting diode package structure of a preferred embodiment is shown in FIG. 3, and the LED package structure 300 of the present invention comprises an alumina ceramic substrate 101 having a first side 103 and a first side Two sides 105; a first pad -07 and a second pad 1 〇 9 are located on the first side 103 of the alumina ceramic substrate 101, and the third pad U1 and the fourth pad 113 are located on the alumina ceramic substrate 10. The second side 1〇5 of the first pad 107 is connected to the third pad by the first conductive via 115, and the second pad 109 is connected to the fourth pad by the second conductive via 11 7 and the fourth pad 11 3 connection; the LED chip 119 is electrically connected to the first pad 1 〇 7 and the second pad 109 by the second bonding wires 121 and 123, and the plurality of thermal holes 125 are located under the LED wafer 119. The 兖 substrate 101 _, the heat conducting holes 125 extend from the first side 103 of the oxidized Shao Taoxian substrate 101 to the second side 1〇5. _] The oxidized ceramic substrate 1〇1 of the present embodiment is a substrate having a high thermal conductivity, which may be an alumina plate, but is not limited thereto. The first pad 1 is connected to the third pad 111 by the first conductive post 116, and the second pad 109 is connected to the fourth pad 113 by the second conductive post 118. [0015] The metal post 127 is columned The structure is bonded to the LED chip 119 by the connection layer 129. Before the LED wafer 119 is bonded to the metal pillar 127, a metallization layer may be plated on the surface of the metal pillar 12? joint portion, and then the LED wafer 119 is at an appropriate temperature. Bonding. The bonding method of the LED wafer 119 and the metal post 127 'in addition to the above-mentioned eutectic method' can also be bonded by a glue having a high thermal conductivity. The adhesive can be copper, silver or solder. In addition, the metal The column 127 is connectable to the second side of the alumina ceramic substrate 1
10022428^^^^ A〇101 ^ 6 1 / ^ Η I 1013153297-0 M432220 101年.04月23日修正替換頁 散熱片131 ，散熱片131可以由高導熱係數的鋁或銅金屬 製成。 [0016] 由於金屬柱127與LED晶片119是共晶接合，具有較低的 熱阻抗，因此LED晶片119所產生的熱量可迅速經由連接 層129傳導至下方穿過氧化鋁陶瓷基板101的散熱柱127 ，再由導熱柱127傳導至氧化鋁陶瓷基板101與散熱片 131上，所以在整體導熱效率上可大幅提升。 [0017] 第五圖係依據本創作之第二較佳實施例之發光二極體封 裝結構的剖面圖。與第一較佳實施例之差異在於本實施 例的LED晶片119電性連接至第一焊墊107與第二焊墊109 的方式改以焊線321連接至第一焊墊107，錫球層323連 接至第二焊墊109。 [0018] 第六圖係依據本創作之第三較佳實施例之發光二極體封 裝結構的剖面圖。與第一較佳實施例之差異在於本實施 例的LED晶片119電性連接至第一焊墊107與第二焊墊109 的方式改以二錫球層421、423連接至第一焊墊107與第 二焊墊109。 [0019] 以上所述僅為本創作之較佳實施例，非用以限定本創作 之專利範圍，其他運用本創作之專利精神之等效變化， 均應俱屬本創作之專利範圍。 【圖式簡單說明】 [0020] 第一圖係依據本創作之較佳實施例之具有金屬柱的氧化 鋁陶瓷電路板的剖面圖。 [0021] 第二圖係依據本創作之較佳實施例之具有金屬柱的氧化 10022428^^ AQ1Q1 第7頁/共14頁 1013153297-0 M432220 101年.04月23日梭正钥^頁 鋁陶瓷電路板的上視圖。 [0022] 第三圖係依據本創作之第一較佳實施例之發光二極體封 裝結構的剖面圖。 [0023] 第四圖係依據本創作之第一較佳實施例之發光二極體封 裝結構的上視圖。 [0024] 第五圖係依據本創作之第二較佳實施例之發光二極體封 裝結構的剖面圖。 [0025] 第六圖係依據本創作之第三較佳實施例之發光二極體封 裝結構的剖面圖。 【主要元件符號說明】 [0026] 100氧化鋁陶瓷電路板 101氧化紹陶竞基板 103第一側邊 105第二側邊 106預定固晶區 107第一焊墊 109第二焊墊 111第三焊墊 113第四焊墊 11 5導電孔 116導電柱 117導電孔 118導電柱 119LED晶片 10022428^^^^ A〇101 第8頁/共14頁 1013153297-0 M432220 101年.04月23日按正替換頁 121焊線 123焊線 129連接層 131散熱片 300發光二極體封裝結 321焊線 323錫球層 421錫球層 423錫球層 • 10022428^^^ A0101 第9頁/共14頁 1013153297-010022428^^^^ A〇101 ^ 6 1 / ^ Η I 1013153297-0 M432220 101. April 23rd Amendment Replacement Sheet Heat sink 131, heat sink 131 can be made of aluminum or copper metal with high thermal conductivity. [0016] Since the metal pillar 127 and the LED wafer 119 are eutectic bonded and have a lower thermal impedance, the heat generated by the LED wafer 119 can be quickly conducted to the heat sink column passing through the alumina ceramic substrate 101 via the connection layer 129. 127 is further conducted by the heat conducting column 127 to the alumina ceramic substrate 101 and the heat sink 131, so that the overall heat conduction efficiency can be greatly improved. [0017] The fifth drawing is a cross-sectional view of a light emitting diode package structure according to a second preferred embodiment of the present invention. The difference from the first preferred embodiment is that the LED chip 119 of the present embodiment is electrically connected to the first pad 107 and the second pad 109, and is connected to the first pad 107 by a bonding wire 321 . 323 is connected to the second pad 109. [0018] Figure 6 is a cross-sectional view of a light emitting diode package structure in accordance with a third preferred embodiment of the present invention. The difference from the first preferred embodiment is that the LED chip 119 of the embodiment is electrically connected to the first pad 107 and the second pad 109, and the second solder ball layer 421, 423 is connected to the first pad 107. And the second pad 109. The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent of the present invention, and other equivalent variations of the patent spirit using the present invention are all within the scope of the patent. BRIEF DESCRIPTION OF THE DRAWINGS [0020] The first drawing is a cross-sectional view of an aluminum oxide ceramic circuit board having a metal post in accordance with a preferred embodiment of the present invention. [0021] The second figure is an oxidation of a metal column according to a preferred embodiment of the present invention. 10022428^^ AQ1Q1 Page 7/14 pages 1013153297-0 M432220 101.04.23. Upper view of the board. [0022] The third drawing is a cross-sectional view of a light emitting diode package structure in accordance with a first preferred embodiment of the present invention. [0023] The fourth drawing is a top view of the light emitting diode package structure according to the first preferred embodiment of the present invention. [0024] The fifth drawing is a cross-sectional view of a light emitting diode package structure according to a second preferred embodiment of the present invention. [0025] Figure 6 is a cross-sectional view of a light emitting diode package structure in accordance with a third preferred embodiment of the present invention. [Main component symbol description] [0026] 100 alumina ceramic circuit board 101 oxidation Shao Tao competition substrate 103 first side 105 second side 106 predetermined solid crystal region 107 first pad 109 second pad 111 third welding Pad 113 fourth pad 11 5 conductive hole 116 conductive column 117 conductive hole 118 conductive column 119 LED chip 10022428 ^ ^ ^ ^ A 〇 101 page 8 / a total of 14 pages 1013153297-0 M432220 101 years. April 23rd is replaced by positive Page 121 Bonding wire 123 Bonding wire 129 Connection layer 131 Heat sink 300 Light-emitting diode package junction 321 Wire 323 Tin ball layer 421 Tin ball layer 423 Tin ball layer • 10022428^^^ A0101 Page 9 of 14 Page 1013153297- 0