M431032 五、新型說明： 【新型所屬之技術領域】 本創作係有關於一種光刻機，且特別是一種應用於大 尺寸觸控面板的一種雷射光刻機。 【先前技術】 近年來，隨著觸控技術的不斷發展，觸控面板已廣泛 應用于諸如手機、個人數位助理（PDA)、遊戲機輸入二面 、電腦觸控螢料各種電子產品巾，控面板與顯示面板 集成一體，通常包括透明基板及佈設於其上的導電層和導 電線路，以及保護層。所述導電線路形成於面板上導電層 的周邊，所述保護層敷設於導電層及透明基板上。觸控窗 板^使用時需與外接電路相貼合，f要將邊緣電極和周邊 的^電線路上的保護層蝕穿，使外接電路與面板上保護層 下方的導電層建立電接觸。 、J有的去除導電邊緣電極及導電線路上方的保護層的 方去有兩種：光侧微影和網印。網印是孔版印刷的一種 ^要印刷方法。網版面一般包括通孔與實體兩部分。印刷 ^將钱刻膏放置於預設的網版上，钱刻膏在到墨刀的擠 =了攸網版面通孔處漏印至保護層上而形成圖案，如圖工 下網印的工蟄比較簡單，所需設備費用少，製作費用 低但不易製作細小圖形（例如線寬〈 =的網版不能·，針對不_產品的不關案，= :二:f的網版。當所需圖案發生改變時，需要更換 所二尺二:;大!”、大尺寸的觸控面板，其 '、4層尺寸交大訏，所使用的網版的尺寸亦 尸刷時不易控制整個大尺寸網版的張力的—致性，從而 4/12 ^父難保賴印在承印物上的糊膏的—致卜而且，當 網版尺寸越大時，經翻墨刀的鱗間磨擦，其所造成的 網版磨損或變形就易，使得網版的壽命變短，生產時 的耗材成本變高。 光餘刻微影，即光刻，是—種圖形複印和化學腐餘相 3的精密表面加工技術，其目的就是在二氧化㈣金屬 相上面糊出與掩膜版完全對應或者互獅幾何圖形。 =是-個複雜的工藝流程，通過―系列生產步驟將表面 薄膜的特疋部分去除，最終形成_定的圖案。如圖2所示 、:一f的光刻工藝的生產步驟包括清洗、塗布光阻層、曝 光頌=、烘乾、钱刻及剝膜等過程，其設備所需投資較 大、准叹費用同’同時运需要大量的化學藥劑，導致生產 成本高，生紅時長。尤其是，對於大尺寸_控面板， 這些問題賴得尤為嚴峻，而且容㈣致生產良率下降。 【新型内容】 有鑑於此，本創作的目的在於提供一種雷射光刻機， 無需光罩，採mt射單步圖案化觸控面板的保護層表面， 可用於大尺寸觸控面板的加工。 -種雷射光刻機，包括雷射器、聚焦透鏡組、控制器 、驅動電機和定位平臺，所述雷射器發出雷射光束，該二 射光束經過所述聚焦透鏡組投射於所述定位平臺上的二: 表面；所述控制器控制所述驅動電機的運轉狀態；所' 動電機連接並受控於所述控制器’所述驅動電“之^ 接於所述聚焦透鏡組，控制所述聚焦透鏡組從而=^ 雷射光束投射在所述工件表面的預定區域内。 于所述 該雷射光刻機包括多個雷射器及其相應的多個所述取 5/12 M431032 焦透鏡組。 所述聚焦透鏡組包括擴束鏡、X軸反射鏡、Y軸反射 鏡以及掃描透鏡（scan lens)，所述雷射光束從雷射器發出 經所述擴束鏡擴束後，由所述X袖反射鏡和Y轴反射鏡反 射，再由所述掃描透鏡聚焦投射於所述工件表面。 所述驅動電機包括三軸方向的驅動電機，所述 驅動電機分別驅動所述X軸反射鏡、γ軸反射鏡以及掃描 透鏡。 所述控制器包括同步觸發模組、聚焦調節模組和透鏡 掃描模組’所述同步觸發模組使定位平臺的移動速度與雷 射的脈衝密度相一致，解決定位平臺在起始和結束時的加 減速運動導致雷射蝕刻線段的兩端刻痕不均勻或者過深的 現象，使得刻痕均勻；所述聚焦調節模組通過調節所述聚 焦透鏡組來改變投射於所述工件表面的光斑尺寸；所述透 鏡掃描模組改變所述掃描透鏡抖動頻率，控制所述雷射器 的旎買密度和蝕刻區域，提高雷射蝕刻的圖案精度和定位 精度。所述雷射光束的光斑直徑可小於ΙΟμπι，達到5-1〇μπι 〇 本創作提供的雷射光刻機，無需光罩，採用雷射單步 圖案化觸控面板的保護層表面，可用於大尺寸觸控面板的 ，工’實現採科步圖案化製程取代網版印㈣程或者是 夕步有光罩的光刻製程，降低生產成本。 【實施方式】 、下面結合附圖與具體實施方式對本創作進—步詳細描 實施例1 6/12 M431032 52和伴圖“所不’―種觸控面板包括玻璃基板51，導電層 52和保5隻層53，導雷厚w $ -於祐獻4 層 化銦錫（ΠΌ)材料製成佈 Ϊ電…21 2表面，保護層53為二氧化石夕層’敷設於 路祕科部的電㈣騎賴導電線 =電線路上的保一穿 亦可為聚石夕氧院保護層。1觸。其中’保躞層53 Α板上:重’如圖3所示，包括以下步驟:S1 :在 = 層；％ :採用雷㈣束對所_層的預定 nm，形成_化膜層；以及％:清潔絲雜質 ;_，聚焦透鏡組聚集該雷射光束 =广一組聚焦透鏡用以聚集雷射光Ϊ :3 將每射先束投射於預定區域進行钱刻，是通過一 控制所述雷射光束投射在所述膜層上的預定區域内 引所述控制器通過控制聚焦透鏡組的位置和抖動頻率來〆 制所述雷射光束的運動方向和運動速度。 、: 上述的_方法是透過雷射光刻^幾來實現的。 :細’如圖4所示，包括雷射器1〇、聚焦透鏡組種： (圖未不）、驅動電機和定位平臺。雷射器ι〇發出带 射光束，所述雷射光束經過所述聚焦透鏡組投射於 位平臺上工件100的表面，所述聚焦透鏡組 束鏡 /軸反織22、Υ贼射鏡加及掃贿鏡（ilns )24 ’所述雷射光束從雷射器1G發出經擴束鏡η ’由X軸反射鏡22和Y轴反射鏡23反射，再由掃^透鏡 7/12 4聚焦投射於所述工件100表面；所述控制器控制所述驅 動電機的運轉狀態，所述驅動電機包括χ_γ_ζ三軸方向的 龌動電機，其中X軸驅動電機31驅動X軸反射鏡22，γ 軸驅動電機32驅動Υ軸反射鏡23，Ζ軸驅動電機（圖未示 )驅動掃描透鏡24 ;所述Χ-Υ-Ζ三軸方向的驅動電機均連 接並受控於所述控制器，控制所述聚焦透鏡組，使得所述 雷射光束投射在工件100表面的預定區域内。 其中，所述控制器可進行同步觸發控制、聚焦調節控 制和透鏡掃描控制。所述同步觸發控制是使定位平臺的移 動速度與雷射的脈衝密度相一致，解決所述定位平臺在起 始和結束時的加減速運動導致雷射蝕刻線段的兩端刻痕不 岣勻或者過深的現象，使得蝕刻的刻痕均勻。所述聚焦調 即控制是調節所述聚焦透鏡組來控制所述雷射光束的直徑 大小，改變投射於所述工件100表面的光斑尺寸。所述透 鏡掃描控制，改變所述掃描透鏡24抖動頻率，用於控制所 述雷射器的能量密度和蝕刻區域，提高雷射蝕刻的圖案精 度和定位精度。 另外’上述的雷射光刻機可以採用多個雷射頭（mUiti laser head)，相應的有多個所述聚焦透鏡組與其相配合。所 述雷射的波長採用紫外光（UV)波段，所述雷射光束的光 斑直徑可小於ΙΟμηι，達到5-l(^m。 本發明人通過不斷試驗和驗證，發現採用適當波長的 雷射，即採用波長為266nm的雷射，可以將導電層52表面 的ιτο輕微剝蝕，由於在該波長下，下層導電層52的材料 (ITO)比保護層53的材料（&〇2)更容易吸收光能，使 ITO受熱氣化’造成Si〇2體積膨脹而被擠壓抬起被去除， 8/12 M431032 k而剝離去除保護層53材料。其中，所述雷射的脈衝能量 不大於16μ]/脈衝（pj/pluse)。本發明人採用波長為266_ 的雷射，其脈衝能量為灿/脈衝，脈衝頻率為6〇kHz，實現 Si〇2的剝蝕同時不損傷其他層結構。如圖5所示，本實施 例令玻璃基板51的厚度為〇.5mm左右，導電層&的厚卢 約為150A，保護層53的厚度約為500入。在雷射蝕刻二^ 本發明人將所試驗的樣品採用雷射測距儀（例如以卿⑵ 比er測距儀），並採用3〇〇〇倍的取像倍率觀測所蝕刻區域 ，其與周邊未姓刻區域的高度差正好等於保護層53的广卢 (約為5叫試驗結果表明，採用一定波長的雷射二: 口離該區域的保護層材料，並能針軸刻的 同加以區分，在剝離表層材質時，不易將其底 貝 併姓刻，從而避免引起不必要的損傷。 _曰 層53圖案化處理的過程中:為了保證不會對 斗造成損傷，可採用以下兩種方法。其一= 採用終點偵測器偵測不同成分的物質二 4貞/貝J到下一層（即導電声 、 — (即燒蝕）的動作。例= 77 k ’料止雷射剝離 ;曰渊乍例如’可採用光譜儀 貝的光譜’因為不同物質材料下兩層物 譜，即可通過光譜儀來長及顏色的光 方法亦可採用其他方式，純外^射:關於終點_的 法包括以下步驟：測量模式，該方 間;根據雷射的能量密度;=所需_時 订保護層53的剝離動作， 嶋時間’·進 離後，停止雷射_的動作，° ^來;^離時間的剝 了侍到保墁層53所需的圖 9/12 M431032 案。 以上所述僅為本創作的較佳實施例而已，並不用以限 制本創作，凡在本創作的精神和原則之内，所做的任何修 改、等同替換、改進等，均應包含在本創作保護的範圍之 内。 【圖式簡單說明】 圖一是現有的絲網印刷的裝置結構示意圖； 圖二是現有的光蝕刻微影的流程圖； 圖三是本創作膜層蝕刻方法的流程圖； 圖四是本創作雷射光刻機的工作原理示意圖； 圖五是本創作實施例1的結構示意圖。 【主要元件符號說明】 10雷射器 21擴束鏡 22 X軸反射鏡 23 Y軸反射鏡 24掃描透鏡 31 X軸驅動電機 32 Y軸驅動電機 51玻璃基板 52導電層 53保護層 100工件 S1至S3，S201至S203流程圖步驟說明 10/12M431032 V. New Description: [New Technology Field] This creation is about a lithography machine, and in particular, a laser lithography machine for large-size touch panels. [Prior Art] In recent years, with the continuous development of touch technology, touch panels have been widely used in mobile phones, personal digital assistants (PDAs), game console input, computer touch fluorescent materials, electronic products, control The panel is integrated with the display panel and generally includes a transparent substrate and a conductive layer and a conductive line disposed thereon, and a protective layer. The conductive line is formed on the periphery of the conductive layer on the panel, and the protective layer is disposed on the conductive layer and the transparent substrate. The touch panel must be attached to the external circuit when it is used. The protective layer of the edge electrode and the surrounding wire should be etched through, so that the external circuit can make electrical contact with the conductive layer under the protective layer on the panel. There are two ways to remove the conductive edge electrode and the protective layer above the conductive line: light side lithography and screen printing. Screen printing is a kind of printing method for stencil printing. The screen layout generally includes two parts: a through hole and an entity. Printing ^ Place the money paste on the preset screen, and the money paste is printed on the protective layer by the squeezing of the ink knife to the through-hole of the screen, forming a pattern.蛰It is relatively simple, the equipment cost is low, the production cost is low, but it is not easy to make small graphics (for example, the line width <= of the screen can not be, for the non-products of the case, =: two: f network version. When the pattern needs to be changed, it needs to be replaced by two feet: large!", large-size touch panel, its '4 layer size is large, and the size of the screen used is also difficult to control the entire large size. The tension of the screen version, so that 4/12 ^ father is difficult to protect the paste printed on the substrate - and when the size of the screen is larger, the scale of the ink knife is rubbed, The resulting screen wear or deformation is easy, so that the life of the screen is shortened, and the cost of consumables during production becomes higher. The lithography, that is, photolithography, is a kind of precision surface of graphic copying and chemical corrosion residual phase 3. Processing technology, the purpose is to completely correspond to the mask on the metal oxide phase of the dioxide (4) or the mutual lion What is the pattern? = Yes - a complex process, through the series of production steps to remove the special part of the surface film, and finally form a _ fixed pattern. As shown in Figure 2: a f lithography process production steps include Cleaning, coating of photoresist layer, exposure 颂 =, drying, money engraving and film stripping, etc., the equipment needs a large investment, the cost of sighing with 'at the same time requires a large amount of chemical agents, resulting in high production costs, red In particular, for large size _ control panels, these problems are particularly severe, and capacity (4) results in a decline in production yield. [New content] In view of this, the purpose of this creation is to provide a laser lithography machine, no need The reticle adopts mt to single-step the surface of the protective layer of the touch panel, which can be used for processing large-size touch panels. - A laser lithography machine, including a laser, a focusing lens group, a controller, a driving motor, and a positioning platform, the laser emits a laser beam, the two-beam is projected through the focusing lens group on a surface of the positioning platform: the controller controls an operating state of the driving motor The 'moving motor is connected and controlled by the controller 'the driving power' is connected to the focusing lens group, and the focusing lens group is controlled so that the laser beam is projected on the surface of the workpiece. The laser lithography machine includes a plurality of lasers and a corresponding plurality of the selected 5/12 M431032 focal lens groups. The focusing lens group includes a beam expander mirror, an X-axis mirror, and a Y. An axial mirror and a scan lens, the laser beam emitted from the laser beam is expanded by the beam expander, reflected by the X-sleeve mirror and the Y-axis mirror, and then scanned The lens is focused on the surface of the workpiece. The drive motor includes a drive motor in a three-axis direction, the drive motor drives the X-axis mirror, the γ-axis mirror, and the scan lens, respectively. The controller includes a synchronous trigger mode. The group, the focus adjustment module and the lens scanning module 'the synchronous trigger module make the moving speed of the positioning platform coincide with the pulse density of the laser, and solve the acceleration and deceleration motion of the positioning platform at the beginning and the end, resulting in laser etching Two segments a phenomenon in which the score is uneven or too deep, so that the score is uniform; the focus adjustment module changes the size of the spot projected on the surface of the workpiece by adjusting the focus lens group; the lens scan module changes the scan The lens jitter frequency controls the purchase density and etching area of the laser to improve the pattern precision and positioning accuracy of the laser etching. The spot diameter of the laser beam can be less than ΙΟμπι, reaching 5-1 〇μπι 〇 The laser lithography machine provided by the present invention does not need a reticle, and adopts a laser single-step patterning surface of the protective layer of the touch panel, which can be used for large For the size of the touch panel, the worker's implementation of the patterning process replaces the screen printing (four) process or the photolithography process with the mask, reducing the production cost. [Embodiment] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. The embodiment 1 6/12 M431032 52 and the accompanying figure "No" touch panel include a glass substrate 51, a conductive layer 52 and a protection layer. 5 layers 53, lead-thickness thickness w $ - Yu You Xian 4 layer of indium tin (bismuth) material made of cloth ... 21 2 surface, protective layer 53 for the dioxide layer ' layer 'laying in the road secret department Electric (4) riding the conductive line = the protection of the wire on the road can also be the protective layer of the Ju Shi Xi oxygen courtyard. 1 touch. Among them, 'protective layer 53 Α board: heavy' as shown in Figure 3, including the following steps: S1 : at = layer; %: using Ray (four) beam to the predetermined nm of the layer, forming a _ film layer; and %: cleaning wire impurities; _, focusing lens group gathers the laser beam = a group of focusing lenses for Aggregating a laser beam: 3 projecting each of the first beam to a predetermined area for engraving by directing the laser beam onto a predetermined area on the film layer to guide the controller by controlling the focusing lens group The position and the dithering frequency are used to clamp the direction of motion and the speed of motion of the laser beam. Laser lithography is achieved by several: : Fine ' as shown in Figure 4, including laser 1 〇, focusing lens group: (picture is not), drive motor and positioning platform. Laser 〇 〇 belt a beam of light that is projected through the focusing lens group onto the surface of the workpiece 100 on the platform, the focusing lens assembly mirror/axis anti-weaving 22, the thief mirror plus the bristol mirror (ilns) 24 The laser beam emitted from the laser 1G is reflected by the X-axis mirror 22 and the Y-axis mirror 23, and then focused by the scanning lens 7/12 4 onto the surface of the workpiece 100; The controller controls an operating state of the driving motor, the driving motor includes a χ_γ_ζ three-axis direction tilting motor, wherein the X-axis driving motor 31 drives the X-axis mirror 22, and the γ-axis driving motor 32 drives the Υ-axis mirror 23, a x-axis driving motor (not shown) drives the scanning lens 24; the Χ-Υ-Ζ three-axis direction driving motor is connected and controlled by the controller, and the focusing lens group is controlled such that The laser beam is projected in a predetermined area on the surface of the workpiece 100. wherein the controller is Line synchronization trigger control, focus adjustment control and lens scanning control. The synchronous trigger control is to make the moving speed of the positioning platform coincide with the pulse density of the laser, and solve the acceleration and deceleration motion of the positioning platform at the beginning and the end. The phenomenon that the two ends of the laser etched line segment are not even or too deep, so that the etched mark is uniform. The focus adjustment is to adjust the focus lens group to control the diameter of the laser beam, and change a spot size projected onto the surface of the workpiece 100. The lens scanning control changes the dithering frequency of the scanning lens 24 for controlling the energy density and etching area of the laser to improve the pattern precision and positioning of the laser etching. Precision. Further, the laser lithography machine described above may employ a plurality of mUiti laser heads, and a plurality of the focus lens groups are associated therewith. The wavelength of the laser is in the ultraviolet (UV) band, and the spot diameter of the laser beam can be less than ΙΟμηι, reaching 5-1 (^m. The inventors have continuously tested and verified that lasers with appropriate wavelengths are used. That is, using a laser having a wavelength of 266 nm, the surface of the conductive layer 52 can be slightly ablated, because at this wavelength, the material of the lower conductive layer 52 (ITO) is easier than the material of the protective layer 53 (& 〇 2) Absorbing light energy, causing ITO to be heated and vaporized, causing the volume of Si〇2 to expand and being lifted and removed, 8/12 M431032 k and peeling off the protective layer 53 material. The laser energy of the laser is not more than 16μ. ] / pulse (pj / pluse). The inventors used a laser with a wavelength of 266_, the pulse energy is can / pulse, the pulse frequency is 6 〇 kHz, to achieve the erosion of Si 〇 2 without damaging other layer structures. As shown in Fig. 5, in the present embodiment, the thickness of the glass substrate 51 is about 55 mm, the thickness of the conductive layer &ample is about 150 A, and the thickness of the protective layer 53 is about 500 Å. In the laser etching, the inventor will The sample tested was a laser range finder (for example, with Qing (2) Er rangefinder, and observe the etched area with the magnification of 3 times, the height difference between the area and the surrounding area is exactly equal to the width of the protective layer 53 (about 5 test results show that Laser with a certain wavelength: The material of the protective layer from the area is separated from the needle axis. When the surface material is peeled off, it is not easy to engrave the bottom and the last name, so as to avoid unnecessary damage. During the patterning process of the enamel layer 53: in order to ensure that the bucket will not be damaged, the following two methods can be used: One = use the end point detector to detect the different components of the material 2 贞 / J J to the next layer ( That is, the action of conductive sound, — (ie, ablation). Example = 77 k 'Material to avoid laser stripping; 曰 Yuan乍, for example, 'Spectrum of Spectrometer' can be passed through the spectrometer because of the two layers of spectrum under different material materials The method of light length and color can also be used in other ways, purely externally: the method of the end point _ includes the following steps: measurement mode, the square; according to the energy density of the laser; = required _ when the protective layer 53 Peeling action, 嶋 time'· After that, the action of stopping the laser_, ^^来; ^ is stripped from the time to the protective film layer 53 required Figure 9/12 M431032. The above description is only a preferred embodiment of the present creation, and It is not intended to limit this creation. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this creation shall be included in the scope of this creation protection. [Simplified illustration] Figure 1 FIG. 2 is a flow chart of a conventional photolithography lithography; FIG. 3 is a flow chart of the etching method of the present invention; FIG. 4 is a schematic diagram of the working principle of the laser lithography machine of the present invention; FIG. 5 is a schematic structural view of Embodiment 1 of the present creation. [Main component symbol description] 10 laser 21 beam expander 22 X-axis mirror 23 Y-axis mirror 24 scan lens 31 X-axis drive motor 32 Y-axis drive motor 51 glass substrate 52 conductive layer 53 protective layer 100 workpiece S1 to S3, S201 to S203 flow chart step description 10/12