M424727 五、新型說明： 【新型所屬之技術領域】 本創作是有關於一種電路板，且特別是有關於一種具 有電磁屏蔽（electromagnetic shielding )的功能的電路板。 【先前技術】 . 現今有些電子產品，例如手機（cell phone )、平板電 腦（tablet computer)、桌上型電腦（desk-top computer)以 參 及筆記型電腦（laptop )，大多具有精密的電路，以至於該 些電子產品受到電磁干擾（Electromagnetic Inference，EMI) 的不良影響而有可能會出現運作異常的情形。 【新型内容】 本創作提供一種電路板，其可以降低電磁干擾對電子 產品的不良影響。 本創作提出一種電路板，其具有至少一通孔，並包括 鲁一基板、一苐一線路層、至少一接地柱、一第一保護層以 及多個頂接地墊。基板具有一上平面。第一線路層配置在 : 上平面上，並包括至少一第一接地部。接地柱配置在基板 、 中，並連接第一接地部。第一保護層配置在第一線路層上， 並覆蓋第一接地部。通孔裸露於第一保護層，並位在第一 保護層、第一接地部與基板中。第一保護層具有至少一凸 部與多個局部暴露第一接地部的第一開口。該些第一開口 圍繞通孔。各個第一開口具有一邊緣，而凸部從其中一邊 緣凸出。該些頂接地墊分別位在該些第一開口内，並連接 3/17 M424727 第接地。P，其中该些頂接地塾凸出於第一保護層的一第 外表面，而凸部位在接地桂及其相鄰的頂接地塾之間。 在本創作一實施例中，該些頂接地墊呈等角分布。 夕在本創作一貫施例中，上述接地柱與凸部二者的數量 為夕個而各個凸部位在其中一接地柱及其相鄰的頂接地 墊之間。 在本創作戸'知例中，各個頂接地塾位在通孔以及其 中一接地柱之間。 、 在本創作一實施例中 部。各個間隔部位在相鄰 中一接地柱與通孔之間。 在本創作一實施例中 在本創作一實施例中 狀體。 ’上述第一保護層具有多個間隔 二個頂接地墊之間，以及位在其 ，該些接地柱呈等角分布。 ，上述第一接地部的形狀為一環 ，上述接地柱包括一金屬管與一 一接地部，並具有一管孔，而填 在本創作一實施例中 填充材料。金屬管連接第 充材料填滿管孔。 面 =創作—實施例t，上述基板還具有—相對 的下：面，而電路板還包括一第二線路層、一第二保， 固底接地塾。第二線路層配置在下平面上7並包二 至从一弟二接地部，苴中 匕栝 護層配置在第1肺 弟二接地部。第二保 更裸露於第二保護層。第二俘鮮罝；f也部，其甲通孔 弟一保叹層具有多個局部暴露第二 4/17 接地部的第二開σ ’ 口内，並禕盐楚 〜些底接地墊分別位在該些第二開 《砝弟二接地部。 保護 芦中，該些底接地墊凸出於第_ 層的一苐二外表面。 ® 、乐一 環 狀體 創作-實施例中，該些底接地塾呈等角分布 在本創作-實施例中，上述第二接地部的形狀為 第-—實施μ，上述接地柱的數量為多個，而 ===:::。各個間隔部位在相鄰二個底 - 在其中一接地柱與通孔之間。 在本創作一實施例中，該些底接地 頂接地墊的數量。 双里m 上述’利用該些頂接地墊，本創作的電路板可以 牛低电磁干擾對電子產品的不良影響。 為°襄本創作之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所„式，作詳細說明如下。文4寸 【實施方式】 圖1A是本創作一實施例之電路板的俯視示意圖，而 圖1B是圖1A中沿線A_A剖面所繪製的剖面示意圖。請參 閱圖1A與目1B ’本實施例的電路板1〇〇包括一第一線路 層110、一第二線路層120以及一基板130，其中基板⑽ 具有-上平面132以及-下平面134 ,而下平面134相對 於上平面132。第一線路層110配置在上平面上，而 5/17 /2/ 第〜線路層120配置在下平面134上，所以基板丨3〇位在 第一線路層110與第二線路層120之間。 基板130可為線路基板或絕緣板，其中線路基板乃是 已具有線路層的板材，例如是電路板的半成品。絕緣板為 不具有任何線路層且不具導電性的板材，其可為陶瓷板或 知Μ旨板，其中樹脂板例如是固化後的樹脂片（prepreg)或 疋已去除銅箔的銅箔基板（Copper Clad Laminate，CCL )。 因此，當基板130為線路基板時，電路板1〇〇可為多層電 路板（multilayer circuit board)。當基板13〇為絕緣板時，_ 電路板100可為雙面電路板（double-side circuit board)。 不過，須說明的是，電路板100也可以是單面電路板 (single-side circuit board)。詳細而言，在其他實施例中， 基板〗30所包括的線路層的數量可以僅為一層。舉例而 5，基板130可以不包括第二線路層12〇 ’但包括第一線 路層110。因此，圖1A與圖1B所示的電路板1 〇〇的類型 僅供舉例說明，並非限定本創作。 φ 電路板100還包括多個接地柱14〇。該些接地柱14〇 配置在基板130中，並連接在第一線路層11〇與第二線路 . 層120之間。各個接地柱14〇可以包括一金屬管142以及 . 一填充材料144，其中金屬管142連接第一線路層no，並 具有一管孔H2，而填充材料144填滿管孔H2。金屬管142 可以經由鑽孔與通孔電鍍（Plating Through Hole，PTH )而 形成，而填充材料144可為絕緣材料，例如油墨。 6/17 M424727 另外’電路板100還包括-第-保護層150以及-第 一保〜層〗60’其中第_保護層15〇配置在第一線路層！】〇 上並且设盍第一線路層ηα，而第二保護層16〇配置在 第二線路層丨20上，並且覆蓋第二線路層12〇。第一保護 層150产與第二保護層16〇皆為電性絕緣體，而第一保護層 150與第二賴層⑽可以皆為防焊層（s。此脑M424727 V. New description: [New technical field] This creation is related to a circuit board, and in particular to a circuit board having the function of electromagnetic shielding. [Prior Art] Today, some electronic products, such as cell phones, tablet computers, and desk-top computers, are involved in notebooks, and most of them have sophisticated circuits. As a result, these electronic products are adversely affected by Electromagnetic Inference (EMI) and may cause abnormal operation. [New Content] This creation provides a circuit board that reduces the adverse effects of electromagnetic interference on electronic products. The present invention proposes a circuit board having at least one through hole and including a substrate, a circuit layer, at least one grounding post, a first protective layer, and a plurality of top ground pads. The substrate has an upper plane. The first circuit layer is disposed on the upper plane and includes at least one first ground portion. The grounding post is disposed in the substrate, and is connected to the first grounding portion. The first protective layer is disposed on the first circuit layer and covers the first ground portion. The via hole is exposed in the first protective layer and is located in the first protective layer, the first ground portion and the substrate. The first protective layer has at least one protrusion and a plurality of first openings that partially expose the first ground. The first openings surround the through holes. Each of the first openings has an edge, and the projections project from one of the edges. The top grounding pads are respectively located in the first openings, and are connected to the 3/17 M424727 to be grounded. P, wherein the top grounding turns protrude from an outer surface of the first protective layer, and the convex portion is between the ground and its adjacent top grounding. In an embodiment of the present invention, the top ground pads are equiangularly distributed. In the conventional embodiment of the present invention, the number of the grounding posts and the convex portions is the same, and the convex portions are between one of the grounding posts and the adjacent top grounding pads. In the present example, each top ground is clamped between the via and one of the ground posts. In the middle of an embodiment of the present creation. Each of the spacing portions is between adjacent one of the grounding posts and the through holes. In an embodiment of the present invention, a shape is used in an embodiment of the present invention. The first protective layer has a plurality of spaced apart top ground pads, and is located there, and the ground posts are equiangularly distributed. The first grounding portion has a shape of a ring, and the grounding post includes a metal pipe and a grounding portion, and has a pipe hole, and is filled with a filling material in an embodiment of the present invention. The metal tube is connected to the filling material to fill the tube hole. Face = Creation - Embodiment t, the substrate further has an opposite lower surface, and the circuit board further includes a second circuit layer, a second security, and a solid ground connection. The second circuit layer is disposed on the lower plane 7 and is packaged to the ground portion of the second brother, and the protective layer of the middle layer is disposed at the ground portion of the first lung. The second warranty is exposed to the second protective layer. The second captive sputum; f is also a part of the armored hole, the sigh layer has a plurality of partially exposed second 4/17 grounding portion of the second open σ' mouth, and the sputum salt Chu ~ some bottom grounding pad respectively In the second opening, "The second brother of the two brothers." In the protection reed, the bottom ground pads protrude from the outer surface of the first layer. In the embodiment, the bottom grounding turns are equiangularly distributed. In the present invention, the shape of the second grounding portion is the first-implementing μ, and the number of the grounding posts is Multiple, and ===:::. Each spacer is between two adjacent bottoms - between one of the grounding posts and the through hole. In an embodiment of the present invention, the number of the bottom grounded ground pads. Shuangli m above the use of these top grounding pads, the circuit board of the creation can reduce the adverse effects of electromagnetic interference on electronic products. The above-mentioned features and advantages of the present invention can be more clearly understood. The following detailed description of the embodiments, together with the formula, is described in detail below. FIG. 1A is a circuit of an embodiment of the present invention. 1B is a schematic cross-sectional view taken along line A_A of FIG. 1A. Referring to FIG. 1A and FIG. 1B, the circuit board 1 of the present embodiment includes a first circuit layer 110 and a second line. The layer 120 and a substrate 130, wherein the substrate (10) has an upper plane 132 and a lower plane 134, and a lower plane 134 is opposite to the upper plane 132. The first wiring layer 110 is disposed on the upper plane, and 5/17 /2/ The circuit layer 120 is disposed on the lower plane 134, so that the substrate 丨 3 is sandwiched between the first circuit layer 110 and the second circuit layer 120. The substrate 130 may be a circuit substrate or an insulating board, wherein the circuit substrate has a circuit layer The sheet material is, for example, a semi-finished product of a circuit board. The insulating sheet is a sheet material that does not have any wiring layer and is not electrically conductive, and may be a ceramic board or a know-how board, wherein the resin sheet is, for example, a cured resin sheet (prepreg) or疋 has removed copper foil Copper Clad Laminate (CCL) Therefore, when the substrate 130 is a circuit substrate, the circuit board 1 may be a multilayer circuit board. When the substrate 13 is an insulating board, the circuit board 100 It may be a double-side circuit board. However, it should be noted that the circuit board 100 may also be a single-side circuit board. In detail, in other embodiments, the substrate The number of circuit layers included in the frame 30 may be only one layer. For example, the substrate 130 may not include the second circuit layer 12' but includes the first circuit layer 110. Therefore, the circuit board shown in FIG. 1A and FIG. 1B The type of 〇〇 is for illustrative purposes only and is not intended to limit the creation. φ The circuit board 100 further includes a plurality of grounding posts 14〇. The grounding posts 14〇 are disposed in the substrate 130 and connected to the first circuit layer 11〇 The second line between the layers 120. Each of the grounding posts 14A may include a metal tube 142 and a filling material 144, wherein the metal tube 142 is connected to the first circuit layer no and has a tube hole H2, and the filling material 144 is filled. Full tube hole H2. Metal 142 may be formed by drilling and through-hole plating (PTH), and the filling material 144 may be an insulating material such as ink. 6/17 M424727 In addition, 'the circuit board 100 further includes a -th protective layer 150 and- The first protection layer 60 60 ′′, wherein the first protection layer 15 〇 is disposed on the first circuit layer 〇 并且 and is disposed on the first circuit layer η α , and the second protection layer 16 〇 is disposed on the second circuit layer 丨 20 And covering the second circuit layer 12A. The first protective layer 150 and the second protective layer 16 are both electrically insulative, and the first protective layer 150 and the second layer (10) may both be solder resist layers (s.
—電路板1〇〇具有至少一通孔H1，其中通孔hi裸露於 第保叹層150與第二保護層16〇,並且位在第―保護層 1〕〇、第一線路層110、第二線路層12〇、第二保護層· 以及基板130中。所以，通孔H1是貫穿第-保護層150、 第-線路層m線路層12G、第二保護層⑽以及基 板130而形成。此外’該些接地柱14〇位在通孔出的周 圍’而且可以均勻分布在通孔H1的周圍。例如，該些接 地柱140可以呈等角分布，如圖1A所示。因此，任相鄰 二個接地柱140之間的距離可以實質相等。 圖1C是圖1A中的電路板_在去除第-保護層150 之後的俯視示意圖。請參閱圖1A、圖1B與圖ic， 路層no包括至少一第一接地％ 112， ' 设地邛112，而第一接地部】12 連接該些接地柱MG，其中第—接地部112可連接金屬管 142。因此，第-接地部112可經由接地柱14〇❿電性連接 部分第二線路層120。第一拯从加u 接地部112的形狀可為圍繞通 孔m的環㈣’如圖1C所示，所以通孔Ηι也位在第一 接地部112中。 7/17 M424727 第一線路層110還可以包括至少一條走線（trace)】l4 以及至少-個接塾（pad，未繪示），纟中走線114可以連 接接塾，以使走線U4與接㈣性導^此外，在圖⑴所 示的實施例中，走線n4沒有連接第一接地部112，但是在 其他實施例中，走線1M可以連接第一接地部U2。 凊茶閱圖1A與圖1B，第一保護層15〇覆蓋第一接地 部112，且是局部覆蓋第一接地部112。詳細而言，第一保 護層】50具有多個第一開口⑸’而該些第一開口⑸局 部暴露第-接地部112 ’並且圍繞通孔m，其中該些第一 開口 151可以呈等角分布’所以該些第一開口⑸可以均 勻分布在通孔Η1的周圍。 電路板100還包括多個頂接地墊17〇，而該些頂接地 墊m分別位在該些第一開口 151 β ’並且連接第一接地 部112’以至於該些頂接地墊170能與第一接地部ιΐ2電性 ‘通。頂接地墊170為導體，並且可由焊料（s〇lder )所形 成，而形成頂接地墊170的方法可以包括波峰焊，其中焊 料例如是焊錫或錫膏，並且可以填滿第一開口 151。 由此可知，該些頂接地墊17〇可以填滿該些第一開口 151，並且可以凸出於第一保護層15〇的一第一外表面 152,如圖1B所示。此外，由於頂接地塾17〇為導體，因 此頂接地墊170可具有電磁屏蔽的特性。所以，該些頂接 地塾170能抵抗電磁干擾’並能強化電路板1〇〇的電磁耐 受性（Electromagnet Susceptibimy，EMS)，從而降低電 8/17 M424727 磁干擾對電子產品的不良影響。 另外，由於頂接地墊170位在第一開σ 151内，因此 該些頂接地塾170也可以呈等角分布，所以任相鄰二個頂 接地墊170之間的距離可實質相等。此外，在本實施例中，' 頂接地墊170可以比接地柱〗4〇更接近通孔Η]，且各個頂 接地墊no可位在通孔Η]以及其中一個接地柱ΐ4〇之間。' 第一保護層150更具有多個凸部154,而該些凸部】％ 鲁圍繞通孔Η卜各個第一開σ 151具有一邊緣Ει，而各個 凸部154會從該邊緣E1凸出，並且位在其中一接地柱_ 及該接地柱140相鄰的頂接地墊17〇之間，如圖所示。 當頂接地墊170是採用波峰焊來形成時，凸部】可 將弟-開口 151與接地柱14〇分離，以促使頂接地塾17〇 不會與接地才主]40接觸。如此，可以降低因頂接地墊】％ 與接地柱140接觸所產生在電性方面的不良影響，例如減 鲁少寄生電容與寄生電感二者的產生。 纟本實關t，軸頂接地墊17Q可彼此分離。詳細 •而言’第一保護層150可以具有多個間隔部】56,即間隔 •部]56基本上不被頂接地塾17〇所覆蓋。各個間隔部… 位在相鄰二個頂接地塾17〇之間’並且局部覆蓋第一接地 部U2,以節省形成頂接地墊17〇的材料（例如谭料），從 而降低電路板]00的材料成本。 此外’各個間隔部156也位在其中一接地柱140與通 孔H1之間。因土匕’在進行波峰焊以形成頂接地塾1川的 9/17 M424727 過程中’間隔部156也可以促使頂接輕17〇不會與接地 柱/40接觸。如此，也能降低因頂接地墊170與接地柱140 接觸所產生在電性方面的不良影響。 值得一提的是，雖然在本實施例中，電路板1〇〇所包 括的接地柱刚與凸部154二者的數量皆為多個，但在其 他實施例中，接地柱⑽的數量可以僅為_個，而凸部154 賴量也可僅為-個。因此，本實施财的接地柱14〇與 凸部154二者的數量僅為舉例說明，並非限定本創作。 圖1D疋圖ία中沿線B_B剖面所繪製的剖面示意圖。 請參閱圖m，電路板可以與一接地件1〇結合，而接 地件10 τ以從通孔⑴貫穿電路板100,其中接地件⑺會 接觸頂接地墊17G。接地件1G具有導電性，並且可以是由 金屬材料所製成，因此當電路板i⑽與接地件iq結合時， 妾也件U)可讀由職地墊17G而電性連接第—接地部 Π2 ’從而讓電路板ι〇〇接地。 在本實施例中，接地件1G可以是螺絲，而通孔出可 =具内螺纹的螺孔，其中接地件1Q能與電子產品的機殼 4 ’並且能將電路板刚鎖固於上述機殼。如此，電路 板⑽得以裝設於機殼。此外，上述電子產品例如是 平板電腦、桌上型電腦、筆記型電腦、電子書（e一 b〇〇k)或工業電腦（industdaUomputer)。 由於該些頂接地塾17G凸出於第—保護層⑼的第一 卜表面152’因此在電路板1〇〇與接地件1〇結合的過程中， 10/17 M424727 2頂接M m料抗接地件㈣電料⑽所施予的 力。舉例而言’當接地件]G為螺絲時，該些頂接地墊 〇上能抵抗接地件10在旋轉時所產生的扭力，從而減少電 成100外表面被接地件10破壞的情形。 ' θ須說明的是，雖然接地件】0可以是螺絲，.通孔H1可 L是魏’但是在其他實施财，接地件1Q可以是插銷或 J 丁寻不具外螺紋的插件’而通孔H】可以不具有任何内 T，、·文。因此’本創作並不限定接地件10僅為螺絲，以及通 孔Η〗僅為螺孔。 圖2Α是圖1Α中的電路板的仰視示意圖，而圖犯是 :2Α中沿線c_c剖面所繪製的剖面示意圖。請參閱請、 圖2A與圖2B，電路板1〇〇還包括多個底接地塾⑽，而 弟-線路層]20包括至少一第二接地部丨22，其中第二接 地部122白勺結構與第一接地部112的結構相似。 』 ，接地塾】80的形成方法與材料皆可以相同於頂接地 二7〇,所以底接地墊⑽也為導體。此外，比較圖】八與 可以看出底接地墊18Q的數量（圖2a績示8個） 大於頂接地塾17Q (圖1A繪示4個）的數量。 第二接地部122連接該些接地才主14〇 (如圖⑺所 ::該些底接地墊180 ’因此第二接地部122能電性連接今 :底_墊180。此外，第二接地部122的形狀實質上二 同方、第一接地部112的形狀（如目1C所示），即第 地部122可以是圍繞通？LH1的環狀體，所.以通孔出也位 11/17 M424727 在第二接地部122中，並且也裸露於第二保護層ι6〇。 第一保護層160覆蓋第二接地部122，而且是局部覆 盍第二接地部122。詳細而言，第二保護層16〇具有多個 局部暴露第二接地部122的第二開口 162，而該些底接地 墊180分別位在該些第二開口 162内。該些第二開口 162 圍繞通孔H1，並且可以呈等角分布，所以該些底接地墊 iso也可以呈等角分布。此外，該些底接地墊丨8〇可以凸 出於第二保護層160的一第二外表面164(如圖2B所示）。 另外，第二保護層16〇可以更具有多個間隔部166。 各個間隔部166可以位在相鄰二底接地墊180之間，並且 局部覆蓋第二接地部122,以節省形成底接地墊]8〇的材 料（例如焊料），從而降低電路板1〇〇的材料成本。 此外，各個間隔部166還可以位在其t 一接地柱]4〇 與通孔H1之間。因此，在進行波峰焊以形成底揍地墊 的過程中，間隔部丨66可以促使底接地墊18〇不會與接地 柱140接觸，從而降低因底接地墊18〇與接地柱1牝接觸 所產生在電性方面的不良影響，例如減少寄生電容與寄生 笔感-者的產生。 综上所述’本創作的電路板包括上述接地塾（例如頂 接地墊170與底接地墊18〇) ’而該些接地墊所具有的電磁 屏敗的特性能提高電路板抵抗電磁干擾的能力，例如強化 毛磁耐受性。因此，當本創作的電路板應用於電子產品（例 如手機、平板電腦、桌上型電腦、筆記型電腦、電子蚩 12/17 二腦等）時，本創作的電路极可以降低+ …的不良影響，從而減少出里當：磁干優對Μ 以上所述僅為本創作的實施例，心：情形。 作的專利保護範圍。任何熟 ：：非用以限定本創 ::精神與範圍内，所作的更動及:二”^ 本創作的專利保護範園内。 寺放曰換，仍在 【圖式簡單說明】s 作一實施例之電路板的俯視示意圖。 圖：c:r中沿線A_A剖面所_ 意圖。疋圖1A中的電路板在去除第-保護層之後的俯視示The circuit board 1A has at least one through hole H1, wherein the through hole hi is exposed to the first smear layer 150 and the second protective layer 16A, and is located at the first protective layer 1 〇, the first circuit layer 110, and the second The circuit layer 12A, the second protective layer, and the substrate 130. Therefore, the through hole H1 is formed through the first protective layer 150, the first wiring layer m wiring layer 12G, the second protective layer (10), and the substrate 130. Further, the grounding posts 14 are positioned around the through-holes of the through-holes and can be evenly distributed around the through-holes H1. For example, the land posts 140 can be distributed at equal angles as shown in Figure 1A. Therefore, the distance between any two adjacent ground posts 140 can be substantially equal. FIG. 1C is a top plan view of the circuit board of FIG. 1A after the removal of the first protective layer 150. Referring to FIG. 1A, FIG. 1B and FIG. 1c, the road layer no includes at least one first grounding % 112, 'the grounding layer 112, and the first grounding portion 12' is connected to the grounding posts MG, wherein the first grounding portion 112 can be The metal pipe 142 is connected. Therefore, the first ground portion 112 can be electrically connected to the portion of the second wiring layer 120 via the ground stud 14 . The shape of the first slaving portion of the grounding portion 112 may be a ring (four) surrounding the through hole m as shown in Fig. 1C, so that the through hole Η is also located in the first ground portion 112. 7/17 M424727 The first circuit layer 110 may further include at least one trace (lrace) and at least one interface (pad, not shown), and the middle trace 114 may be connected to the interface so that the trace U4 In addition, in the embodiment shown in FIG. (1), the trace n4 is not connected to the first ground portion 112, but in other embodiments, the trace 1M may be connected to the first ground portion U2. Referring to Figures 1A and 1B, the first protective layer 15 covers the first ground portion 112 and partially covers the first ground portion 112. In detail, the first protective layer 50 has a plurality of first openings (5)', and the first openings (5) partially expose the first-ground portion 112' and surround the through-holes m, wherein the first openings 151 may be equiangular The distribution 'so the first openings (5) can be evenly distributed around the through-holes 1. The circuit board 100 further includes a plurality of top ground pads 17 , and the top ground pads m are respectively located in the first openings 151 β′ and connected to the first ground portions 112 ′ so that the top ground pads 170 can A grounding portion ιΐ2 is electrically 'on. The top ground pad 170 is a conductor and may be formed of solder, and the method of forming the top ground pad 170 may include wave soldering, wherein the solder is, for example, solder or solder paste, and may fill the first opening 151. It can be seen that the top ground pads 17A can fill the first openings 151 and can protrude from a first outer surface 152 of the first protective layer 15A, as shown in FIG. 1B. In addition, since the top ground 塾 17 turns as a conductor, the top ground pad 170 can have electromagnetic shielding characteristics. Therefore, the top-mounted cellars 170 are resistant to electromagnetic interference and can enhance the electromagnetic resistance of the circuit board (Electromagnet Susceptibimy, EMS), thereby reducing the adverse effects of the magnetic interference of the electrical 8/17 M424727 on the electronic products. In addition, since the top ground pad 170 is located in the first opening σ 151, the top ground pads 170 may also be equiangularly distributed, so that the distance between any two adjacent top ground pads 170 may be substantially equal. In addition, in the present embodiment, the 'top ground pad 170 may be closer to the via hole than the ground post , 4 ,, and each top ground pad no may be located between the via hole Η and one of the ground posts ΐ 4 。. The first protective layer 150 further has a plurality of convex portions 154, and the convex portions 5% around the through holes 各个 each of the first openings 151 has an edge ,ι, and each convex portion 154 protrudes from the edge E1 And located between one of the grounding posts _ and the top grounding pad 17〇 adjacent to the grounding post 140, as shown. When the top ground pad 170 is formed by wave soldering, the protrusions can separate the brother-opening 151 from the grounding post 14〇 to urge the top grounding 塾17〇 to not contact the grounding main 40. In this way, it is possible to reduce the electrical adverse effects caused by the contact of the top ground pad 】% with the ground post 140, such as reducing the generation of both parasitic capacitance and parasitic inductance. In this case, the shaft top ground pads 17Q can be separated from each other. DETAILED • The first protective layer 150 may have a plurality of spacers 56, i.e., the spacers 56 are substantially not covered by the top grounding 塾17〇. Each of the spacers ... is located between the adjacent two top grounds 〇 17 ' ' and partially covers the first ground portion U2 to save the material forming the top ground pad 17 ( (for example, tan), thereby reducing the board 00 Material costs. Further, each of the spacers 156 is also located between one of the grounding posts 140 and the through hole H1. The spacer 156 may also cause the top contact light 156 to not contact the ground post/40 during the 9/17 M424727 process in which the ballast is wave soldered to form a top ground. In this way, the adverse effect on the electrical properties caused by the contact of the top ground pad 170 with the ground post 140 can also be reduced. It is to be noted that, in the embodiment, the number of the grounding posts and the convex portions 154 included in the circuit board 1 is plural, but in other embodiments, the number of the grounding posts (10) may be It is only _, and the convex portion 154 may be only one. Therefore, the number of both the grounding post 14A and the convex portion 154 of the present embodiment is merely illustrative and does not limit the creation. Figure 1D is a cross-sectional view of the B_B section along the line ία. Referring to Fig. m, the circuit board can be combined with a grounding member 1?, and the grounding member 10? is inserted through the through hole (1) through the circuit board 100, wherein the grounding member (7) contacts the top grounding pad 17G. The grounding member 1G is electrically conductive and can be made of a metal material. Therefore, when the circuit board i (10) is combined with the grounding member iq, the cymbal member U) can be read by the ground pad 17G and electrically connected to the grounding portion Π2. 'This allows the board to be grounded. In this embodiment, the grounding member 1G may be a screw, and the through hole may be a screw hole having an internal thread, wherein the grounding member 1Q can be coupled to the casing 4' of the electronic product and the circuit board can be just locked to the above machine. shell. Thus, the circuit board (10) can be mounted to the casing. Further, the above electronic product is, for example, a tablet computer, a desktop computer, a notebook computer, an electronic book (e-b〇〇k) or an industrial computer (industdaUomputer). Since the top grounding turns 17G protrude from the first surface 152' of the first protective layer (9), 10/17 M424727 2 is connected to the M m material during the process of bonding the circuit board 1〇〇 to the grounding member 1〇. Grounding member (4) The force applied by the electric material (10). For example, when the grounding member G is a screw, the top grounding pads are resistant to the torsion generated when the grounding member 10 is rotated, thereby reducing the damage of the outer surface of the electrical component 100 by the grounding member 10. ' θ must be stated that although the grounding member] 0 can be a screw, the through hole H1 can be L' but in other implementations, the grounding member 1Q can be a pin or a plug that does not have an external thread. H] may not have any internal T,, · text. Therefore, the present invention does not limit the grounding member 10 to only the screw, and the through hole is only a screw hole. Figure 2 is a bottom view of the circuit board of Figure 1 and the diagram is a cross-sectional view of the c_c section along the line. Please refer to FIG. 2A and FIG. 2B. The circuit board 1 〇〇 further includes a plurality of bottom grounding rafts (10), and the second-side grounding layer 20 includes at least one second grounding portion ,22, wherein the second grounding portion 122 has a structure It is similar in structure to the first ground portion 112. 』, grounding 塾 80 can be formed in the same way and material as the top grounding, so the bottom grounding pad (10) is also a conductor. In addition, comparing the figure VIII and it can be seen that the number of bottom ground pads 18Q (eight in Figure 2a) is greater than the number of top ground 塾 17Q (four in Figure 1A). The second grounding portion 122 is connected to the grounding mains 14〇 (as shown in FIG. 7: the bottom grounding pad 180′′, so the second grounding portion 122 can be electrically connected to the bottom pad 180. In addition, the second grounding portion The shape of the 122 is substantially the same as the shape of the first grounding portion 112 (as shown in FIG. 1C), that is, the ground portion 122 may be an annular body surrounding the LH1, and the through hole is also located 11/17. M424727 is in the second ground portion 122, and is also exposed to the second protective layer 〇6. The first protective layer 160 covers the second ground portion 122, and partially covers the second ground portion 122. In detail, the second protection The layer 16 has a plurality of second openings 162 partially exposing the second ground portions 122, and the bottom ground pads 180 are respectively located in the second openings 162. The second openings 162 surround the through holes H1 and may The bottom ground pads iso may also be equiangularly distributed. In addition, the bottom ground pads 8 may protrude from a second outer surface 164 of the second protective layer 160 (as shown in FIG. 2B). In addition, the second protective layer 16A may further have a plurality of spacers 166. Each of the spacers 166 may Between adjacent two bottom ground pads 180, and partially covering the second ground portion 122, to save material (such as solder) forming the bottom ground pad], thereby reducing the material cost of the circuit board 1 此外. The spacer 166 may also be located between its t-ground post 4〇 and the via H1. Therefore, during the wave soldering to form the bottom pad, the spacer 66 may cause the bottom ground pad 18 to not It will be in contact with the grounding post 140, thereby reducing the electrical adverse effects caused by the contact of the bottom grounding pad 18〇 with the grounding post 1牝, such as reducing parasitic capacitance and parasitic pen feel. The created circuit board includes the above grounding 塾 (for example, the top grounding pad 170 and the bottom grounding pad 18 〇)' and the electromagnetic flops of the grounding pads have the special performance to improve the resistance of the circuit board to electromagnetic interference, such as strengthening the magnetic resistance. Therefore, when the circuit board of this creation is applied to electronic products (such as mobile phones, tablets, desktop computers, notebook computers, electronic cymbals 12/17, etc.), the circuit of this creation can be reduced + …of Good influence, thus reducing the outcrop: magnetic dry superiority Μ The above is only the embodiment of this creation, heart: situation. The scope of patent protection. Any familiar:: not used to limit the creation:: spirit and scope Inside, the changes made: 2" ^ The patent protection of this creation is in the garden. The temple is replaced by a schematic view of the circuit board of an embodiment. Figure: C: r along the line A_A section _ intended. 俯视 Figure 1A of the circuit board after removing the first - protective layer
100 110 112 114 120 122 13〇 圖2A 圖2B 【主要 10 :-1A中沿線B_B剖面所繪製的剖面示意圖 是圖1A中的電路板的仰視示意圖。 是圖2A中沿線c_c剖面所繪製的剖面示意圖 元件符號說明】 接地件 電路板 第一線路層 第一接地部 走線 第二線路層 第二接地部 基板 13/17 M424727 132 134 140 142 144 150 151 152 154 156 、 166 160 162 164 170 180 El HI H2 上平面 下平面 接地柱 金屬管 填充材料 第一保護層 第一開口 第一外表面 凸部 間隔部 第二保護層 第二開口 第二外表面 頂接地墊 底接地墊 邊緣 通孔 管孔 14/17100 110 112 114 120 122 13〇 Figure 2A Figure 2B [Main section 10: A schematic cross-sectional view taken along line B_B of -1A is a bottom view of the circuit board of Figure 1A. 2A is a cross-sectional view taken along the line c_c in FIG. 2A. Symbol description] Grounding piece circuit board First circuit layer First grounding part wiring Second wiring layer Second grounding part substrate 13/17 M424727 132 134 140 142 144 150 151 152 154 156 , 166 160 162 164 170 180 El HI H2 upper plane lower plane grounding column metal tube filling material first protective layer first opening first outer surface convex portion spacer second protective layer second opening second outer surface top Grounding pad bottom grounding pad edge through hole tube hole 14/17