TWM421506U - Inspection system - Google Patents

Inspection system Download PDF

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Publication number
TWM421506U
TWM421506U TW100215072U TW100215072U TWM421506U TW M421506 U TWM421506 U TW M421506U TW 100215072 U TW100215072 U TW 100215072U TW 100215072 U TW100215072 U TW 100215072U TW M421506 U TWM421506 U TW M421506U
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Taiwan
Prior art keywords
detection system
tested
wafer
electrically connected
value
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TW100215072U
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Chinese (zh)
Inventor
Ming-Lung Yao
Chia-Pin Wu
Ching-Yuan Hu
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Wistron Corp
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Priority to TW100215072U priority Critical patent/TWM421506U/en
Priority to CN2011203081479U priority patent/CN202256604U/en
Publication of TWM421506U publication Critical patent/TWM421506U/en

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

M421506 五、新型說明: 【新型所屬之技術領域】 本創作係關於一種檢測系統,特別是一種利用電腦判 讀且整合多項測試功能之檢測系統。 【先前技術】 現有的測試電壓、頻率或電流之技術大多係以人工操 作硬體設備的方式以取得量測數據,再藉由以人工判讀該 φ 數據’來判斷該項產品是否正常;然利用人工作業進行判 讀不僅使得產線效率無法提升,且由於需要手動開關按 鈕’有時會因為人為疏失而導致誤判的情況發生。 再者’目前欲使電子裝置進行韌體更新均必須於產品 組裝完成後始能對其進行更新,且還必須透過記憶卡Mini SD來執行’不僅使生產製程相當地耗時,更造成人力資源 的浪費。 【新型内容】 # #創作之主要目的係在提供-種利用電腦判讀且具有 整合多項測試功能之檢測系統。 為達成_Lit之目的,本創作之檢測系統係電性連接示 2及電源供應器’其係用以檢測-待測晶片,其中待測 :電連接於不波II與電源供應器;檢H统包括判斷 二及電波測試裝置,其中電波測試裝置係與判斷裝置電 1曰接’用以發出第—指令至示波器,以使示波器量測待 測曰曰片所產生之第一電磁波,以操取第一電磁波之電波 3 M421506 值,並回傳該電波值至檢測系統,以使判斷裝置根據該電 波值判斷待測晶片是否異常。 依據本創作之實施例,本創作之檢測系統係與待測晶 片電性連接,並且檢測系統更包括有更新裝置,用以傳輸 一韌體檔案至待測晶片,以使待測晶片進行更新動作,並 於更新動作執行完畢後,回傳訊號至檢測系統,以告知檢 測系統更新動作是否執行成功。 依據本創作之實施例,本創作之檢測系統更包括有感 測裝置,用以當第二電磁波傳遞至待測晶片時,感測待測 晶片是否有感應電流產生,藉以判斷待測晶片功能是否正 常。 依據本創作之實施例,本創作之檢測系統更包括有頻 率測試裝置,其係與判斷裝置電性連接,用以發出第二指 令至示波器,以使示波器擷取待測晶片之頻率值,並回傳 該頻率值至檢測系統,以使判斷裝置可根據該頻率值判斷 待測晶片是否異常。 依據本創作之實施例,本創作之檢測系統係與一資料 擷取裝置電性連接,且檢測系統更包括有電壓測試裝置, 其係與判斷裝置電性連接,用以發出第三指令至資料擷取 裝置,以使資料擷取裝置擷取待測晶片之電壓值,並回傳 該電壓值至檢測系統,以使判斷裝置根據該電壓值判斷待 測晶片是否異常。 依據本創作之實施例,本創作之檢測系統更包括有電 流測試裝置,係與判斷裝置電性連接,用以量測電源供應 器所提供予待測晶片之電流,以擷取該電流之電流值,並 M421506 回傳該電流值至檢測系統,以使判斷裝置根據該電流值判 斷待測晶片是否異常。 由於本創作構造新穎,能提供產業上利用,且確有增 進功效’故依法申請新型專利。 【實施方式】 為讓本創作之上述和其他目的、特徵和優點能更明顯 易懂,下文特舉出本創作之具體實施例,並配合所附圖式, 作詳細說明如下。 以下請參考圖1係關於本創作之檢測系統之系統架構 圖。 如圖1所示,於本創作之一具體實施例中,本創作之 檢測系統1係與示波器92、電源供應器94、資料擷取裝置 96及待測晶片90電性連接,且示波器92、電源供應器94 及資料擷取裝置96均電性連接於待測晶片9〇。於本創作9 之一實施例中,檢測系統丨為一電腦系統,惟本創作不以 此為限。此外,於本創作之一實施例中,待測晶片9〇為無 線射頻辨識晶片(Radio Frequency Identification),惟本創作 不以此為限。 本創作之檢測系統1包括判斷裝置1〇、電波測試裝置 20、更新装置30、感測裝置40、頻率測試裝置50、電壓 測試裝置60、電流測試裝置70及記憶體8〇。 電波測試襞置20係電性連接判斷裝置1〇,其係用以 發出一第一指令至示波器80 ’以使示波器80對於待測晶 片90所產生之第一電磁波進行量測,並擷取該第一電磁波 之電波值,在取得電波值之後,再將該電波值傳回檢測系 5 M421506 統l ’以提供判斷裝置 是否異常。 10根據該電波值以判斷待測晶片 以使二= = =案35給待測晶片9。, 行完畢後,待測二::::體::=更新動作執 告知檢測“丨__是純行心力。於本之藉以 實施例中’勃體檔案35係被儲存在記憶體80 ^之具體 更新初二動作/到待測晶片90,以使待測晶片90進行 感測裝置40用以當有第二電磁波傳遞至待測晶片9〇 時’感測待測晶# 90是否有感應電流產生,#以判斷待测 晶片9〇功能是否正常。其中第二電磁波係藉由一外部元件 所虞生(圖未示),且於待測晶片90功能為正常之情況下, 當有第二電磁波傳遞至該待測晶片90時,該待測晶片90 便會因為該第二電磁波而發生電磁感應現象而產生感應電 流,此時利用感測裝置40以感測該電流是否存在即苛判斷 符測晶片90功能是否正常。由於電磁感應乃為熟悉該領域 異有通常知識者所能輕易理解,故在此即不多做贅述。 頻率測試裝置50係與判斷裝置1〇電性連接,用以發 出第二指令至示波器80,以使示波器80可擷取待測晶片 9〇之頻率值,並回傳該頻率值至檢測系統1,提供判斷裝 置1〇可根據該頻率值以判斷待測晶片90是否異常。 電壓測試裝置60係與判斷裝置1〇電性連接,用以發 出第三指令到資料擷取裝置96,以使資料擷取裝置96擷 M421506 取待測晶片90之電壓值,並回傳該電壓值至檢測系統1, 以使判斷裝置10根據電壓值判斷待測晶片90是否異常。 電流測試裝置70係與判斷裝置10電性連接,用以量 測電源供應器82所提供予待測晶片90之電流(即流經待測 晶片9 0之電流),並榻取該電流之電流值’之後再將該電 流值回傳到檢測系統1,以使判斷裝置10根據電流值判斷 待測晶片90是否異常。 記憶體80係電性連接於判斷裝置10及更新裝置30, φ 其儲存有韌體檔案35、有關各項的測試數據及其他檔案資 料,其中各項的測試數據(例如:電波值、頻率值或電壓值 等)係為用以提供判斷裝置10判斷的準據;當示波器92或 資料擷取裝置9 6將其所量得之電波值、頻率值或電壓值傳 回檢測系統1,此時判斷裝置10便是根據這些儲存在記憶 體80中之各項數據來判斷該待測晶片90之電波值、頻率 值、電壓值是否正常(當然電流值也是如此);因此,藉由 利用上述的檢測系統1來進行量測工作,即不再需要以人 φ 工手動的方式來進行量測,可有效提升產率並避免人為的 誤判。 需注意的是,於本發明之一實施例中,上述各個裝置 除可配置為硬體裝置、軟體程式、韌體或其組合外,亦可 藉電路迴路或其他適當型式配置。此外,本實施方式僅例 示本創作之較佳實施例,為避免贅述,並未詳加記載所 有可能的變化組合。然而,本領域之通常知識者應可理 解,上述各裝置或元件未必皆為必要。且為實施本發明, 亦可能包含其他較細節之習知裝置或元件。各裝置或元 7 M421506 件皆可月&視需求加以省略或修改,且任兩裝置間未必不 存在其他裝置或元件。 一综上所陳,本創作無論就目的、手段及功效,在在均 顯示其迥異於習知技術之特徵,懇請責審查委員明察, 早曰賜准專利,俾嘉惠社會,實感德便。惟應注意的是, 上述諸多實施例僅係為了便於說明而舉例而已,本創作所 主張之權利範圍自應以申請專利範圍所述為準,而非 於上述實施例。 限 【圖式簡單說明】 圖1係本創作之檢測系統之系統架構圖。. 【主要元件符號說明】 判斷裝置10 更新裝置30 感測裝置40 電壓測試裝置60 記憶體80 示波器92 資料操取裝置96 檢測系統1 電波測試裝置20 韌體檔案35 頻率測試裝置50 電流測試裝置70 待測晶片90 電源供應器94M421506 V. New description: [New technical field] This creation is about a detection system, especially a detection system that uses computer to interpret and integrate multiple test functions. [Prior Art] The existing techniques for testing voltage, frequency or current mostly use manual operation of hardware devices to obtain measurement data, and then manually judge the φ data to judge whether the product is normal or not; The interpretation of manual work not only makes the production line efficiency not improve, but also requires a manual switch button to sometimes cause misjudgment due to human error. Furthermore, 'currently, the firmware update of the electronic device must be updated after the product is assembled, and must also be executed through the memory card Mini SD' not only makes the production process time-consuming, but also causes human resources. Waste. [New Content] # # The main purpose of the creation is to provide a detection system that uses computer interpretation and has multiple test functions integrated. In order to achieve the purpose of _Lit, the detection system of the present invention is an electrical connection 2 and a power supply 'which is used for detecting - the wafer to be tested, wherein the test is to be tested: electrically connected to the non-wave II and the power supply; The system includes a judgment second and a radio wave test device, wherein the radio wave test device is connected to the judging device to send a first command to the oscilloscope, so that the oscilloscope measures the first electromagnetic wave generated by the test piece to operate. Taking the value of the electric wave 3 M421506 of the first electromagnetic wave, and returning the electric wave value to the detecting system, so that the judging device judges whether the wafer to be tested is abnormal according to the electric wave value. According to the embodiment of the present invention, the detection system of the present invention is electrically connected to the chip to be tested, and the detection system further includes an updating device for transmitting a firmware file to the wafer to be tested, so that the wafer to be tested is updated. And after the update action is completed, the signal is sent back to the detection system to inform the detection system whether the update action is successful. According to the embodiment of the present invention, the detection system of the present invention further includes a sensing device for sensing whether the detected wafer has an induced current when the second electromagnetic wave is transmitted to the wafer to be tested, thereby determining whether the function of the wafer to be tested is normal. According to an embodiment of the present invention, the detection system of the present invention further includes a frequency testing device electrically connected to the determining device for issuing a second command to the oscilloscope to enable the oscilloscope to capture the frequency value of the chip to be tested, and The frequency value is returned to the detection system, so that the determining device can determine whether the wafer to be tested is abnormal according to the frequency value. According to an embodiment of the present invention, the detection system of the present invention is electrically connected to a data capture device, and the detection system further includes a voltage test device electrically connected to the determination device for issuing a third command to the data. The device is configured to enable the data acquisition device to capture the voltage value of the wafer to be tested, and return the voltage value to the detection system, so that the determination device determines whether the wafer to be tested is abnormal according to the voltage value. According to the embodiment of the present invention, the detection system of the present invention further includes a current testing device electrically connected to the determining device for measuring the current supplied by the power supply to the chip to be tested to extract the current of the current. Value, and M421506 returns the current value to the detection system, so that the judging device judges whether the wafer to be tested is abnormal according to the current value. Due to the novel construction of this creation, it can provide industrial use, and it has improved efficiency. [Embodiment] The above and other objects, features and advantages of the present invention will become more apparent and understood. Please refer to FIG. 1 for a system architecture diagram of the detection system of the present invention. As shown in FIG. 1 , in one embodiment of the present invention, the detection system 1 of the present invention is electrically connected to an oscilloscope 92, a power supply 94, a data capture device 96, and a wafer to be tested 90, and an oscilloscope 92, The power supply 94 and the data capture device 96 are electrically connected to the wafer 9 to be tested. In one embodiment of the present invention 9, the detection system is a computer system, but the creation is not limited thereto. In addition, in one embodiment of the present invention, the wafer to be tested 9 is a Radio Frequency Identification, but the creation is not limited thereto. The detection system 1 of the present invention includes a judging device 1 , an electric wave testing device 20 , an updating device 30 , a sensing device 40 , a frequency testing device 50 , a voltage testing device 60 , a current testing device 70 , and a memory 8 . The radio wave test device 20 is electrically connected to the oscilloscope 80' to cause the oscilloscope 80 to measure the first electromagnetic wave generated by the wafer 90 to be tested, and to extract the After obtaining the electric wave value, the electric wave value of the first electromagnetic wave is transmitted back to the detecting system 5 M421506 to provide an abnormality. 10 based on the value of the electric wave to determine the wafer to be tested so that the second === case 35 is given to the wafer 9 to be tested. After the completion of the line, the second test to be tested:::: body::= update action to inform the test "丨__ is a pure line of heart. In the example of the use of the example, the Boss file 35 series is stored in the memory 80 ^ Specifically, the second action/to the test wafer 90 is updated, so that the sensing device 40 is used to sense the device 40 to sense whether the crystal to be measured #90 is inductive when the second electromagnetic wave is transmitted to the wafer 9 to be tested. The current is generated, to determine whether the function of the wafer to be tested is normal, wherein the second electromagnetic wave is generated by an external component (not shown), and when the function of the wafer to be tested is normal, When the electromagnetic wave is transmitted to the wafer 90 to be tested, the wafer to be tested 90 generates an induced current due to the electromagnetic induction phenomenon of the second electromagnetic wave. At this time, the sensing device 40 is used to sense whether the current exists or not. It is normal to test whether the function of the chip 90 is normal. Since the electromagnetic induction is easily understood by those who are familiar with the field, it is not described here. The frequency test device 50 is electrically connected to the determination device 1 To issue a second command to the oscilloscope 80 In order to enable the oscilloscope 80 to capture the frequency value of the wafer to be tested and return the frequency value to the detection system 1, the providing device 1 can determine whether the wafer to be tested is abnormal according to the frequency value. The device is electrically connected to the determining device 1 for issuing a third command to the data capturing device 96, so that the data capturing device 96撷M421506 takes the voltage value of the wafer 90 to be tested, and returns the voltage value to the detecting system. 1. The judging device 10 determines whether the wafer to be tested 90 is abnormal according to the voltage value. The current testing device 70 is electrically connected to the judging device 10 for measuring the current supplied from the power supply 82 to the wafer 90 to be tested (ie, The current flowing through the wafer to be tested 90) and the current value of the current are taken back to the detection system 1 to cause the determination device 10 to determine whether the wafer to be tested 90 is abnormal according to the current value. The body 80 is electrically connected to the judging device 10 and the updating device 30, and stores the firmware file 35, the test data of the relevant items and other file materials, and the test data of each item (for example, the electric wave value, the frequency value or The voltage value or the like is used to provide the criterion for determining by the determining device 10; when the oscilloscope 92 or the data capturing device 96 returns the measured radio wave value, frequency value or voltage value to the detecting system 1, it is judged at this time. The device 10 determines whether the radio wave value, the frequency value, and the voltage value of the wafer to be tested 90 are normal according to the data stored in the memory 80 (of course, the current value is also the same); therefore, by using the above detection The system 1 performs the measurement work, that is, it is no longer necessary to perform the measurement in a manual manner, which can effectively improve the yield and avoid artificial misjudgment. It should be noted that in an embodiment of the present invention, the above In addition to being configurable as a hardware device, a software program, a firmware, or a combination thereof, each device may be configured by a circuit loop or other suitable type. In addition, the present embodiment is merely illustrative of the preferred embodiment of the present invention, and in order to avoid redundancy, the possible combinations of variations are not described in detail. However, those of ordinary skill in the art should understand that the various devices or components described above are not necessarily required. In order to implement the invention, other well-known devices or components of the details may be included. Each device or element 7 M421506 may be omitted or modified as needed, and no other device or component may exist between any two devices. In summary, this creation, regardless of its purpose, means and efficacy, is showing its characteristics that are different from the well-known techniques. The reviewing committee is open to the public, and the company is granted a patent. It should be noted that the above-described embodiments are merely illustrative for ease of explanation, and the scope of the claims should be based on the scope of the patent application, rather than the above embodiments. Limits [Simple description of the diagram] Figure 1 is the system architecture diagram of the detection system of this creation. [Description of main component symbols] Judging device 10 Update device 30 Sensing device 40 Voltage test device 60 Memory 80 Oscilloscope 92 Data operation device 96 Detection system 1 Radio wave test device 20 Firmware file 35 Frequency test device 50 Current test device 70 Chip to be tested 90 power supply 94

Claims (1)

M421506 六、申請專利範圍: 1. 一種檢測系統,係電性連接一示波器及一電源供應器, 用以檢測一待測晶片,其中該待測晶片電性連接於該示 波器與該電源供應器,該檢測系統包括: 一判斷裝置;以及 一電波測試裝置,係與該判斷裝置電性連接,用以發出 一第一指令至該示波器,以使該示波器量測該待測晶片 所產生之一第一電磁波,以擷取該第一電磁波之一電波 _ 值,並回傳該電波值至該檢測系統,以使該判斷裝置根 據該電波值判斷該待測晶片是否異常。 2. 如申請專利範圍第1項所述之檢測系統,其中該檢測系統 係與該待測晶片電性連接,並且該檢測系統更包括一更 新裝置,用以傳輸一韌體檔案至該待測晶片,以該使待 測晶片進行一更新動作,並於該更新動作執行完畢後, 回傳一訊號至該檢測系統,以告知該檢測系統該更新動 作是否執行成功。 • 3.如申請專利範圍第2項所述之檢測系統,其中該檢測系統 更包括一感測裝置,用以當一第二電磁波傳遞至該待測 晶片時,感測該待測晶片是否有一感應電流產生,以判 斷該待測晶片功能是否正常。 4.如申請專利範圍第3項所述之檢測系統,其中該檢測系統 更包括一頻率測試裝置,係與該判斷裝置電性連接,用 以發出一第二指令至該示波器,以使該示波器擷取該待 9 M421506 測晶片之一頻率值,並回傳該頻率值至該檢測系統,以 使該判斷裝置根據該頻率值判斷該待測晶片是否異常。 5. 如申請專利範圍第4項所述之檢測系統,其中該檢測系統 電性連接一資料擷取裝置,並且該檢測系統更包括一電 壓測試裝置,係與該判斷裝置電性連接,用以發出一第 三指令至該資料擷取裝置,以使該資料擷取裝置擷取該 待測晶片之一電壓值,並回傳該電壓值至該檢測系統, 以使該判斷裝置根據該電壓值判斷該待測晶片是否異 常。 6. 如申請專利範圍第5項所述之檢測系統,其中該檢測系統 更包括一電流測試裝置,係與該判斷裝置電性連接,用 以量測該電源供應器所提供予該待測晶片之一電流,以 擷取該電流之一電流值,並回傳該電流值至該檢測系 統,以使該判斷裝置根據該電流值判斷該待測晶片是否 異常。 7. 如申請專利範圍第1項所述之檢測系統,其中該檢測系統 更包括一感測裝置,用以當一第二電磁波傳遞至該待測 晶片時,感測該待測晶片是否有一感應電流產生,以判 斷該待測晶片功能是否正常。 8. 如申請專利範圍第1項所述之檢測系統,其中該檢測系統 更包括一頻率測試裝置,係與該判斷裝置電性連接,用 以發出一第二指令至該示波器,以使該示波器擷取該待 測晶片之一頻率值,並回傳該頻率值至該檢測系統,以 使該判斷裝置根據該頻率值判斷該待測晶片是否異常。M421506 VI. Patent application scope: 1. A detection system is electrically connected to an oscilloscope and a power supply for detecting a wafer to be tested, wherein the wafer to be tested is electrically connected to the oscilloscope and the power supply. The detection system includes: a judging device; and a radio wave testing device electrically connected to the judging device for issuing a first command to the oscilloscope, so that the oscilloscope measures one of the chips to be tested An electromagnetic wave for extracting one of the first electromagnetic waves, and returning the electric wave value to the detecting system, so that the determining device determines whether the wafer to be tested is abnormal according to the electric wave value. 2. The detection system of claim 1, wherein the detection system is electrically connected to the wafer to be tested, and the detection system further comprises an updating device for transmitting a firmware file to the to-be-tested The chip is configured to perform an update operation on the wafer to be tested, and after the update operation is completed, return a signal to the detection system to notify the detection system whether the update operation is successful. 3. The detection system of claim 2, wherein the detection system further comprises a sensing device for sensing whether the wafer to be tested has a second electromagnetic wave transmitted to the wafer to be tested. An induced current is generated to determine whether the function of the wafer to be tested is normal. 4. The detection system of claim 3, wherein the detection system further comprises a frequency testing device electrically connected to the determining device for issuing a second command to the oscilloscope to enable the oscilloscope Taking a frequency value of the chip to be tested and returning the frequency value to the detection system, so that the determining device determines whether the wafer to be tested is abnormal according to the frequency value. 5. The detection system of claim 4, wherein the detection system is electrically connected to a data acquisition device, and the detection system further comprises a voltage test device electrically connected to the determination device for Sending a third command to the data capture device, so that the data capture device captures a voltage value of the chip to be tested, and returns the voltage value to the detection system, so that the determination device is based on the voltage value It is judged whether the wafer to be tested is abnormal. 6. The detection system of claim 5, wherein the detection system further comprises a current testing device electrically connected to the determining device for measuring the power supply provided by the power supply to the wafer to be tested. One current is used to draw a current value of the current, and the current value is returned to the detection system, so that the determining device determines whether the wafer to be tested is abnormal according to the current value. 7. The detection system of claim 1, wherein the detection system further comprises a sensing device for sensing whether the wafer to be tested has an induction when a second electromagnetic wave is transmitted to the wafer to be tested. A current is generated to determine whether the function of the wafer to be tested is normal. 8. The detection system of claim 1, wherein the detection system further comprises a frequency testing device electrically connected to the determining device for issuing a second command to the oscilloscope to enable the oscilloscope Taking a frequency value of the chip to be tested, and returning the frequency value to the detection system, so that the determining device determines whether the wafer to be tested is abnormal according to the frequency value.
TW100215072U 2011-08-12 2011-08-12 Inspection system TWM421506U (en)

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TW100215072U TWM421506U (en) 2011-08-12 2011-08-12 Inspection system
CN2011203081479U CN202256604U (en) 2011-08-12 2011-08-23 Detection system

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Application Number Priority Date Filing Date Title
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