M420702 .五、新型說明： 【新型所屬之技術領域】 . -種晶片賴治具’尤指藉由磁力㈣方式，使限位框達到 快速定位及易於拆離之晶片測試治具。 【先前技術】 按’晶片為現有的f子裝置巾不可或㈣組件之―，並且隨 著曰曰片的廣泛普及’除了需求量日益增加之外，晶片的效能更是 φ 極為重要的使用參考依據，因此為維護晶片之品質，製造商於晶 片製造完成後’均會進行效能的測試，以避免晶片因瑕疫導致電 子裝置效能不佳或損壞而造成更大的損失。習知之晶片測試治具 係利用限健來容置晶片，而不同種類之晶#則需不同尺寸之限 位框’-般限位框為利用鎖固元件鎖附於測試治具，而於更換限 位框時，皆必須利用器械拆除鎖固元件，而使得測試過程較為繁 瑣’易影響整體測試效率。 春 疋以’要如何解決上述習知影響測試效率之問題與缺失，即 為從事此相關業者所亟欲研發之課題。 【新型内容】 本創作之主要目的乃在於基絲祕^^接$ —側間隔凸設複 數金屬材質之定位柱’以及設置於限位框表面凹槽内之磁鐵，使 •磁及力及附疋位柱，讓限位框於基座表面形成穩定之定 位’以達到可針對待戦晶片大小快速拆換合雜健之目的。 為達上述目的，本創作係設置有基座，基座内並排設置有複 3 M420702 數連接器，且連接器表面為露出於基座，基座表面於連接器一側 間隔凸設有複數金屬材質之定位柱’而基座上方設置有限位框， 限位框表面間隔設置有複數限位槽，且各限位槽為分別正對於基 座表面之連接器，並於限位框底表面一側設置有複數定位孔，使 基座之疋位柱為穿入定位孔内形成定位，而限位框表面於正對定 位孔處設置有凹槽，並於凹槽内設置有磁鐵，俾使磁鐵以磁吸力 吸附定位柱，以讓限位框於基座表面形成穩定之定位。 【實施方式】 請參閱第-圖至第六圖所示，由圖中可清楚看出該晶片測試 治具係設置有基座1、限位框2以及上蓋3，其中： 基座i内並排設置有複數連接器u，且連接器u表面為露出 於基座1，基座i表面於連接器n 一側間隔凸設有複數金屬材質 之定位柱12。 限純2為設置於基座！上方，鎌健2表_隔設置有 複數用以放置制晶片（圖中未示）之限位槽2卜且各限位槽] 為分別正對於基座！表面之連接器„，並於限純2底表面一側 設置有複數定位孔22，使基座】之定位柱12為穿入定位孔^内 形成定位，而限位框2表面於正對定位孔22處設置有凹㈣，定 位孔22與凹槽23為呈連通狀，且定位孔22之内徑為小於凹槽μ 之内徑，並於凹槽23内設置有磁鐵24。 上蓋3為框接於基座1 一側，且上蓋3可翻掀蓋合於限位框2 表面該上蓋3於减限位框2表面側為插接有減部 4 本創作於使用時係翻掀上蓋3，將適合待測晶片大小之限位框 2放置於基座1表面’使基座1之定位柱12為穿人限位框2之定 位孔22内，藉由設置限位框2凹槽23内磁鐵24之磁吸力吸附於 定位柱12 ’以讓限位框2於基座i表面形成定位後，再將制晶 片放入限他2之歸槽21内，將上蓋3蓋合於基座丨使上蓋3 之抵壓部3i抵壓於待測“表面，讓待測晶片之接糊中未示) 與基座1之連接器11接觸，以檢測待測晶片之良莠。 综上所述，由於本創作基座！表面於連接器H 一側間隔凸設 有複數金屬材質之&位柱12，且限位框2之定位孔22與凹槽^ 為呈連通狀’並於凹槽23内設置有磁鐵24，因此當使用者將限位 框2置入基座i ’使基座i之定位柱12為穿入限位框2之定位孔 22内形成定辦，設置於_ 23内之磁鐵％為會藉由磁吸力吸 附定位柱12，使限位框2於基座丨表㈣成敎之定位而讓使 用者可快速地將限健2定位於基座丨表面。反之，當使用者欲 f換不同尺寸之限位框2時，僅需對限位框2辭大於磁鐵24與 定位柱12間產生磁吸力之力道即可㈣地使限位框2之定位孔 脫離基座1之定位;ϋ I2,俾使本創料具有藉由磁鐵％與定位柱 12相互產生之磁吸力，快速地針對待測晶片之大小更換合適之限 位框2之優點。 再者，鎌_ 24蚊錄12 _互纽之磁吸力為大於 待測晶片無位框2之限位槽U產生之摩擦力，因此當使用者拿 取待測晶片時，磁鐵24與定她12間相互產生之磁吸力為會使 M420702 限位框2持續地吸附於基座丨，而不會產生限位框 U又待測晶片 摩擦力之影響與基座1產生分離進而增加作業困擾等缺失。 【圖式簡單說明】 第一圖係為本創作之立體外觀圖。 第二圖係為本創作不同側方之立體外觀圖。 第三圖係為本創作之局部分解圖。 第四圖係為本創作限位框之立體外觀圖。 第五圖係為本創作之局部立體剖面圖。 第六圖係為本創作第五圖A部分之放大圖。 【主要元件符號說明】 I、 基座 II、 連接器 U、定位柱 2、限位框 21、 限位槽 22、 定位孔 23 '凹槽 、磁鐵 3、上蓋 31、抵壓部 6M420702 . V. New description: [New technology field] - The type of wafer razor ‘, especially the magnetic test tool, which enables the limit frame to be quickly positioned and easily detached. [Prior Art] According to the 'wafer is the existing f sub-device towel can not be (four) components, and with the widespread popularity of the cymbal', in addition to increasing demand, the performance of the wafer is more important φ. Therefore, in order to maintain the quality of the wafer, the manufacturer will perform the performance test after the wafer is manufactured to avoid further damage caused by the poor performance or damage of the electronic device due to the plague. The conventional wafer test fixture utilizes the limit to accommodate the wafer, and the different types of crystal # require different size limit frames. The general limit frame is locked to the test fixture by the locking component, and is replaced. When the limit frame is used, it is necessary to use the instrument to remove the locking component, which makes the test process more cumbersome 'easy to affect the overall test efficiency. Chun Yu's question and how to solve the above-mentioned problems affecting the efficiency of testing is the subject of research and development for those involved in this industry. [New content] The main purpose of this creation is to provide a positioning column for a plurality of metal materials and a magnet placed in the groove of the surface of the limiting frame to make magnetic and force attached. The clamping column allows the limiting frame to form a stable positioning on the surface of the pedestal to achieve the purpose of quickly disassembling and matching the size of the wafer to be smashed. In order to achieve the above purposes, the creation system is provided with a base, and a plurality of M M 502702 connectors are arranged side by side in the base, and the surface of the connector is exposed on the base, and the surface of the base is spaced apart from the side of the connector with a plurality of metal The positioning column of the material is provided with a finite frame above the pedestal, and the surface of the limiting frame is provided with a plurality of limiting slots, and each of the limiting slots is a connector respectively facing the surface of the pedestal, and a bottom surface of the limiting frame A plurality of positioning holes are arranged on the side, so that the clamping post of the base is positioned into the positioning hole, and the surface of the limiting frame is provided with a groove at the facing positioning hole, and a magnet is arranged in the groove, so that The magnet adsorbs the positioning post with magnetic attraction to form a stable positioning of the limiting frame on the surface of the base. [Embodiment] Please refer to the first to sixth figures. It can be clearly seen from the figure that the wafer test fixture is provided with a base 1, a limit frame 2 and an upper cover 3, wherein: the base i is side by side A plurality of connectors u are disposed, and the surface of the connector u is exposed on the base 1. The surface of the base i is spaced apart from the connector n side by a plurality of positioning posts 12 of a plurality of metal materials. Limit pure 2 is set on the base! Above, the 镰健2表_ spacer is provided with a plurality of limit slots 2 for placing the wafers (not shown) and the limit slots are respectively for the pedestal! The surface connector „, and a plurality of positioning holes 22 are disposed on one side of the bottom surface of the limited pure 2, so that the positioning post 12 of the base is positioned into the positioning hole ^, and the surface of the limiting frame 2 is directly positioned. The hole 22 is provided with a concave (four), the positioning hole 22 and the groove 23 are in communication, and the inner diameter of the positioning hole 22 is smaller than the inner diameter of the groove μ, and the magnet 24 is disposed in the groove 23. The upper cover 3 is The frame is connected to the side of the base 1 , and the upper cover 3 can be flipped over the surface of the limiting frame 2 . The upper cover 3 is inserted into the surface of the lower limit position frame 2 and has a reduced portion 4 . 3. Place the limit frame 2 suitable for the size of the wafer to be tested on the surface of the base 1 so that the positioning post 12 of the base 1 is in the positioning hole 22 of the wearing limit frame 2, by setting the recess of the limiting frame 2 The magnetic attraction of the inner magnet 24 is adsorbed to the positioning post 12' to position the limiting frame 2 on the surface of the base i, and then the wafer is placed in the slot 21 of the second cover, and the upper cover 3 is closed to the base. The seat 丨 presses the pressing portion 3i of the upper cover 3 against the "surface, which is not shown in the paste of the wafer to be tested", and contacts the connector 11 of the susceptor 1 to detect the goodness of the wafer to be tested. In summary, due to the creation of the pedestal! A plurality of metal material & position posts 12 are disposed on the surface of the connector H, and the positioning holes 22 of the limiting frame 2 are connected to the groove ^ and a magnet 24 is disposed in the groove 23, Therefore, when the user places the limiting frame 2 into the base i', the positioning post 12 of the base i is formed into the positioning hole 22 of the limiting frame 2, and the magnets disposed in the _23 are borrowed. The positioning column 12 is adsorbed by the magnetic force, so that the position of the limiting frame 2 on the pedestal table (4) is allowed to be positioned so that the user can quickly position the limiter 2 on the surface of the pedestal. On the other hand, when the user wants to change the limit frame 2 of different sizes, the position of the limit frame 2 is greater than the force of the magnetic force between the magnet 24 and the positioning post 12 (4). Deviation from the positioning of the susceptor 1; ϋ I2, so that the inventive material has the magnetic attraction generated by the magnet % and the positioning post 12, and quickly replaces the advantage of the suitable limit frame 2 for the size of the wafer to be tested. Furthermore, the magnetic attraction force of the 镰_24 mosquito record 12 _ mutual nucleus is greater than the friction force generated by the limit groove U of the test piece without the frame 2, so when the user takes the wafer to be tested, the magnet 24 and her The 12 mutually generated magnetic attraction forces the M420702 limit frame 2 to be continuously adsorbed to the susceptor, without causing the limit frame U and the influence of the friction of the wafer to be tested to be separated from the susceptor 1 to increase work troubles, etc. Missing. [Simple description of the diagram] The first picture is a three-dimensional appearance of the creation. The second picture is a three-dimensional appearance of the different sides of the creation. The third picture is a partial exploded view of the creation. The fourth picture is a three-dimensional appearance of the creation limit frame. The fifth figure is a partial perspective view of the creation. The sixth picture is an enlarged view of part A of the fifth picture of the creation. [Main component symbol description] I, base II, connector U, positioning post 2. Limit frame 21, limit groove 22, positioning hole 23 'groove, magnet 3, upper cover 31, pressing part 6