TWM417765U - Shielding device and electronic device with the shielding element - Google Patents

Shielding device and electronic device with the shielding element Download PDF

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Publication number
TWM417765U
TWM417765U TW100211888U TW100211888U TWM417765U TW M417765 U TWM417765 U TW M417765U TW 100211888 U TW100211888 U TW 100211888U TW 100211888 U TW100211888 U TW 100211888U TW M417765 U TWM417765 U TW M417765U
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TW
Taiwan
Prior art keywords
electronic device
baffle
shielding
electronic
circuit board
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TW100211888U
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Chinese (zh)
Inventor
Lung-Fai Tuen
Chiu-Hsien Chang
Chih-Long Chou
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Wistron Corp
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Application filed by Wistron Corp filed Critical Wistron Corp
Priority to TW100211888U priority Critical patent/TWM417765U/en
Priority to CN2011202441068U priority patent/CN202143346U/en
Publication of TWM417765U publication Critical patent/TWM417765U/en

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Description

M417765 五、新型說明: 【新型所屬之技術領域】 本創作係為一種屏蔽元件及其具有屏蔽元件之電子裝 置,特別是一種可利用檔板來遮蔽電磁波之屏蔽元件及其 具有屏蔽元件之電子裝置之創作。 【先前技術】 • 隨著科技的進步,各式電子產品之功能也日益強大。 但當各式電子元件之速度越快,電磁波干擾 (Electromagnetic interference,EMI)的問題也隨之產生。 以下請先參考圖1A到圖1C有關先前技術之電子裝置 之第一實施例之相關示意圖,其中圖1A係先前技術之電 子裝置之第一實施例之組裝示意圖;圖1B係根據圖1A, 為電子裝置之第一實施例於水平方向之電磁波強度之示意 圖;圖1C係根據圖1A,為電子裝置之第一實施例於垂直 φ 方向之電磁波強度之示意圖。 先前技術之電子裝置90a包括電路板91、電子元件92 及插槽93。電子元件92係藉由插槽93以安裝於電路板91 上,再包覆於電子裝置90a之殼體(圖未示)内。在此情 況下,高頻之電子元件92會使得週遭的元件容易形成如同 一天線模組之作用,容易產生電場與磁場而對外界造成電 磁波干擾。如圖1B及圖1C所示,其中最大容許值VI為 不影響到外界電子產品的最大電磁場容許值,設定容許值 V2則為各廠商所設定之電磁場容許值。因此由圖1B及圖 3 M417765 1C可知,電子裝置90a所具有之水平方向及垂直方向幅射 出電磁波強度很容易會超出最大容許值VI,而對其他的電 子產品造成影響。 為了解決電磁波干擾之問題,在先前技術中已經揭示 另一種實施例。請參考圖2A到圖2C有關先前技術之電子 裝置之第二實施例之相關示意圖,其中圖2A係先前技術 之電子裝置之第二實施例之組裝示意圖;圖2B係根據圖 2A,為電子裝置之第二實施例於水平方向之電磁波強度之 示意圖;圖2C係根據圖2A,為電子裝置之第二實施例於 垂直方向之電磁波強度之示意圖。 在先前技術之第二實施例中,電子裝置90b之電路板 91係設置了複數個彈片94。複數個彈片94係設置於插槽 93的四周,以減少電子元件92逸出之電磁波。可是就如 同圖2B及圖2C所示,彈片94雖然可以減少電子裝置90b 之電磁波強度,但效果不彰,電子裝置90b之水平方向及 垂直方向輻射出電磁波強度仍然會接近最大容許值VI。且 彈片94針對不同類型的電子元件92也會有不同的抑制效 果,無法適用於所有類型的電子元件92。所以電子裝置90b 之水平方向及垂直方向幅射出電磁波強度也不一定能降到 設定容許值V2以下,可能要針對不同類型的電子元件92 重新設計彈片94。另一方面,電路板91上必須要設置複 數個彈片94,亦會導致製造上的繁雜及成本的增加。 【新型内容】 M417765 本創作之主要目的係在提供一種屏蔽元件,其具有可 利用檔板來遮蔽電磁波之功能 、 本創作之另一主要目的係在提供一種具有上述屏蔽元 件之電子裝置。 為達成上述之目的,本創作之屏蔽元件係用於電子妒 置所安裝之電子元件。屏蔽元件包括檔板及支撐件。檔^ 係設置於電子裝置之電路板上並接觸電子裝置之殼體其 中檔板係鄰近於電子元件,且檔板之長度係實質上大於或 等於電子元件之寬度。支撐件係用以支撐檔板。 本創作之具有屏蔽元件之電子裝置包括電路板、電子 元件及屏蔽元件。電子元件係安裝於電路板上。屏蔽元件 包括檔板及支撐件。檔板係設置於電子裝置之電路板上並 接觸電子裝置之殼體,其中檔板係鄰近於電子元件,且檔 板之長度係實質上大於或等於電子元件之寬度。支撐件係 用以支撐檔板。 由於本創作構造新穎,能提供產業上利用,且確有增 進功效,故依法申請新型專利。 【實施方式】 ▲為讓本創作之上述和其他目的、特徵和優點能更明顯 易!·董下文特舉出本創作之具體實施例,並配合所附圖式, 作詳細說明如下。 以下請一併參考圖3及圖3A關於本創作之電子裝置之 相關示意圖,其中圖3係本創作之電子裝置之其中一實施 5 M417765 方式之組裝示意圖;圖3A係本創作之電子裝置之其中一 實施方式之剖視圖。 本創作之電子裝置1〇可為一筆記型電腦,但本創作並 不限於此,電子裝置10亦可為桌上型電腦等電子設備。電 子裝置10包括電路板u、電子元件12及屏蔽元件2〇,並 且上述元件皆包覆於一殼體14内。在本實施例中,電子元 件12係藉由插槽13來安裝於電路板11上,還可以藉由卡 勾131將電子元件12與電路板u之插槽13互相卡固。在 本實施方式中’電子元件係以記憶體模組為例進行說 明,但不同的電子元件12可利用不同的方式絲於在電路 板11上,例如利用痒接的方式,本創作並不以此為限。 在本創作之實施方式中,屏蔽元件2〇係設置於電路 板11上並分別鄰近於電子元件12之賴,但屏蔽元件2〇 之位置與數量可以絲f求來改變。屏蔽元件2G包括標板 21及支料22。樓板21可由金屬材質製成但本創作並 不限於此。檔板21具有第一面211及第二面212,第一面 211係設置於電路板11上,並實質上與電路板U垂直相 接。第二面212係與第—面211垂直相接,並且接觸於電 =置H)之殼體14。檔板21之長度係實質上大於或等於 該電t元件之寬度’亦即檔板21之第-面2U之長度可完M417765 V. New description: [New technical field] This is a shielding element and its electronic device with shielding elements, especially a shielding element that can shield electromagnetic waves by using a baffle and its electronic device with shielding elements Creation. [Prior Art] • With the advancement of technology, the functions of various electronic products are becoming increasingly powerful. However, the faster the speed of various electronic components, the problem of electromagnetic interference (EMI) also arises. 1A to FIG. 1C are related to the first embodiment of the electronic device of the prior art, wherein FIG. 1A is an assembled view of the first embodiment of the prior art electronic device; FIG. 1B is based on FIG. A schematic diagram of the electromagnetic wave intensity in the horizontal direction of the first embodiment of the electronic device; and FIG. 1C is a schematic diagram of the electromagnetic wave intensity in the vertical φ direction of the first embodiment of the electronic device according to FIG. 1A. The prior art electronic device 90a includes a circuit board 91, electronic components 92, and a slot 93. The electronic component 92 is mounted on the circuit board 91 via the slot 93 and is then covered in a housing (not shown) of the electronic device 90a. In this case, the high frequency electronic component 92 causes the surrounding components to be easily formed as an antenna module, and is susceptible to electric and magnetic fields to cause electromagnetic interference to the outside. As shown in Fig. 1B and Fig. 1C, the maximum allowable value VI is the maximum electromagnetic field allowable value that does not affect the external electronic product, and the set allowable value V2 is the allowable value of the electromagnetic field set by each manufacturer. Therefore, as is apparent from Fig. 1B and Fig. 3 M417765 1C, the intensity of the electromagnetic wave radiated from the horizontal direction and the vertical direction of the electronic device 90a easily exceeds the maximum allowable value VI, and affects other electronic products. In order to solve the problem of electromagnetic wave interference, another embodiment has been disclosed in the prior art. Please refer to FIG. 2A to FIG. 2C for related diagrams of a second embodiment of the prior art electronic device, wherein FIG. 2A is an assembly diagram of a second embodiment of the prior art electronic device; FIG. 2B is an electronic device according to FIG. 2A. 2 is a schematic diagram of electromagnetic wave intensity in a horizontal direction; FIG. 2C is a schematic diagram of electromagnetic wave intensity in a vertical direction according to a second embodiment of the electronic device according to FIG. 2A. In the second embodiment of the prior art, the circuit board 91 of the electronic device 90b is provided with a plurality of elastic pieces 94. A plurality of elastic pieces 94 are disposed around the slot 93 to reduce electromagnetic waves escaping from the electronic component 92. However, as shown in Fig. 2B and Fig. 2C, although the elastic piece 94 can reduce the electromagnetic wave intensity of the electronic device 90b, the effect is not good, and the electromagnetic wave intensity radiated from the horizontal direction and the vertical direction of the electronic device 90b is still close to the maximum allowable value VI. Moreover, the shrapnel 94 also has different suppression effects for different types of electronic components 92 and cannot be applied to all types of electronic components 92. Therefore, the electromagnetic wave intensity radiated from the horizontal direction and the vertical direction of the electronic device 90b does not necessarily fall below the set allowable value V2, and the elastic piece 94 may be redesigned for different types of electronic components 92. On the other hand, a plurality of elastic pieces 94 must be provided on the circuit board 91, which also causes a complicated and costly increase in manufacturing. [New Content] M417765 The main purpose of this creation is to provide a shielding element having a function of shielding electromagnetic waves by means of a baffle. Another main object of the present invention is to provide an electronic device having the above shielding element. In order to achieve the above objectives, the shielding elements of the present invention are used for electronic components mounted by electronic devices. The shielding element includes a baffle and a support. The gear is disposed on the circuit board of the electronic device and contacts the casing of the electronic device. The middle plate is adjacent to the electronic component, and the length of the baffle is substantially greater than or equal to the width of the electronic component. The support member is used to support the baffle. The electronic device with shielding elements of the present invention includes a circuit board, an electronic component, and a shielding component. The electronic components are mounted on a circuit board. Shielding components include baffles and supports. The baffle is disposed on the circuit board of the electronic device and contacts the casing of the electronic device, wherein the baffle is adjacent to the electronic component, and the length of the baffle is substantially greater than or equal to the width of the electronic component. The support is used to support the baffle. Due to the novel construction of this creation, it can provide industrial use, and it has improved efficiency. Therefore, it applies for a new type of patent according to law. [Embodiment] ▲ To make the above and other purposes, features and advantages of this creation more obvious! · The following is a detailed description of the specific examples of the creation, and is described in detail below with reference to the drawings. Please refer to FIG. 3 and FIG. 3A for related diagrams of the electronic device of the present invention. FIG. 3 is a schematic diagram of the assembly of the M417765 mode of one of the electronic devices of the present invention; FIG. 3A is the electronic device of the present invention. A cross-sectional view of an embodiment. The electronic device 1 of the present invention can be a notebook computer, but the present invention is not limited thereto, and the electronic device 10 can also be an electronic device such as a desktop computer. The electronic device 10 includes a circuit board u, an electronic component 12, and a shielding member 2, and the components are all enclosed in a casing 14. In the present embodiment, the electronic component 12 is mounted on the circuit board 11 by the slot 13, and the electronic component 12 and the slot 13 of the circuit board u can be locked to each other by the hook 131. In the present embodiment, the electronic component is described by taking a memory module as an example. However, different electronic components 12 can be wired on the circuit board 11 in different ways, for example, by using an itching method. This is limited. In the embodiment of the present invention, the shielding members 2 are disposed on the circuit board 11 and adjacent to the electronic components 12, respectively, but the position and number of the shielding members 2' can be changed. The shield member 2G includes a target 21 and a support 22. The floor panel 21 may be made of a metal material, but the present invention is not limited thereto. The baffle 21 has a first surface 211 and a second surface 212. The first surface 211 is disposed on the circuit board 11 and is substantially perpendicular to the circuit board U. The second face 212 is perpendicularly connected to the first face 211 and is in contact with the housing 14 of the electric device. The length of the baffle 21 is substantially greater than or equal to the width of the electric t-element, that is, the length of the first face 2U of the baffle 21 is complete.

^遮蔽電子元件12逸出之電磁波,以避免電子元件12的 電磁浊千墦。 J 另-方面,為了配合卡勾131之結構,播板Μ之第一 上還可具有凹陷部2Ua。使用者可^ Shielding electromagnetic waves escaping from the electronic component 12 to avoid electromagnetic turbidity of the electronic component 12. In another aspect, in order to match the structure of the hook 131, the first layer of the broadcast board may have a recess 2Ua. User can

所預留的空間來扳開卡勾⑶,以安裝或拆卸電子I M417.765 件12。 支撐件22係用以支撐檔板21,使得檔板21可保持站 立以接觸殼體14。支撐件22可為彈性體,例如圖3所示 之8字型的結構,但本創作並不限於此。 若插槽13之卡勾131為金屬材質時,容易因為高頻的 電子元件12之作用而使得卡勾131成為一輻射導體。本創 作之屏蔽元件20之檔板21可以消除卡勾131在高頻的電 子元件12之作用下,因電子元件12之雜訊所激發出的電 • 場與磁場,不會因此而共振出電磁訊號。同時由於檔板21 接觸到電路板11及殼體14,因此可以提供更佳的遮蔽效 果以抑制電子元件12幅射出之電磁波。 需注意的是,本創作之屏蔽元件20所具有之檔板21 與支撐件22並不以圖3及圖3A所示之形狀為限,只要能 遮蔽電子元件12所產生之電磁波的形狀皆在本創作的保 護範圍内。 最後請參考圖4A及圖4B之電磁波強度之示意圖,其 • 中圖4A係根據圖3,為本創作之電子裝置於水平方向之電 磁波強度之示意圖;圖4B係根據圖3,為本創作之電子裝 置於垂直方向之電磁波強度之示意圖。 圖4A及圖4B中所示的最大容許值VI為不影響到外 界電子產品的最大電磁場容許值,設定容許值V2則為各 廠商所設定之電磁場容許值。就如同圖4A及圖4B中所 示,電子裝置10可以藉由屏蔽元件20來大幅降低電子元 件12在水平方向及垂直方向幅射出之電磁波,使其電磁波 遠低於最大容許值VI且不超過設定容許值V2。 7 M417765 因此本創作之屏蔽元件20可大幅降低電子元件12造 成的電磁波干擾,明顯優於先前技術之方式。另一方面, 本創作之屏蔽元件20亦可方便且迅速地設置在任何電子 裝置10之電路板11上,可大幅降低製造時的成本。 綜上所陳,本創作無論就目的、手段及功效,在在均 顯示其迥異於習知技術之特徵,懇請貴審查委員明察, 早曰賜准專利,俾嘉惠社會,實感德便。惟應注意的是, 上述諸多實施例僅係為了便於說明而舉例而已,本創作所 主張之權利範圍自應以申請專利範圍所述為準,而非僅限 於上述實施例。 【圖式簡單說明】 圖1A係先前技術之電子裝置之第一實施例之組裝示意圖。 圖1B係根據圖1A,為電子裝置之第一實施例於水平方向之 電磁波強度之示意圖。 圖1C係根據圖1A,為電子裝置之第一實施例於垂直方向之 電磁波強度之示意圖。 圖2 A係先前技術之電子裝置之第二實施例之組裝示意圖。 圖2B係根據圖2A,為電子裝置之第二實施例於水平方向之 電磁波強度之示意圖。 圖2C係根據圖2A,為電子裝置之第二實施例於垂直方向之 電磁波強度之示意圖。 圖3係本創作之電子裝置之其中一實施方式之組裝示意圖。 圖3A係本創作之電子裝置之其中一實施方式之剖視圖。 M417.765 圖4A係根據圖3,為本創作之電子裝置於水平方向之電磁 波強度之示意圖。 圖4B係根據圖3,為本創作之電子裝置於垂直方向之電磁波 強度之示意圖。 【主要元件符號說明】 先前技術: 電子裝置90a、90b ® 電路板91 電子元件92 插槽93 彈片94 最大容許值VI 設定容許值V2 φ 本創作: 電子裝置10 電路板11 電子元件12 插槽13 卡勾131 殼體14 屏蔽元件20 M417765 檔板21 第一面211 凹陷部211a 第二面212 支撐件22 最大容許值VI 設定容許值V2The reserved space is used to open the hook (3) to install or remove the electronic I M417.765 piece 12. The support member 22 is for supporting the baffle 21 such that the baffle 21 can remain standing to contact the housing 14. The support member 22 may be an elastic body such as a figure-eight structure as shown in Fig. 3, but the creation is not limited thereto. If the hook 131 of the slot 13 is made of a metal material, the hook 131 is likely to become a radiation conductor due to the action of the high frequency electronic component 12. The baffle 21 of the shielding element 20 of the present invention can eliminate the electric field and magnetic field excited by the noise of the electronic component 12 under the action of the high frequency electronic component 12, and will not resonate electromagnetically. Signal. At the same time, since the shutter 21 contacts the circuit board 11 and the housing 14, it is possible to provide a better shielding effect to suppress electromagnetic waves radiated from the electronic component 12. It should be noted that the baffle 21 and the support member 22 of the shield member 20 of the present invention are not limited to the shape shown in FIG. 3 and FIG. 3A, as long as the shape of the electromagnetic wave generated by the electronic component 12 can be shielded. Within the scope of this creation. Finally, please refer to the schematic diagram of the electromagnetic wave intensity in FIG. 4A and FIG. 4B, wherein FIG. 4A is a schematic diagram of the electromagnetic wave intensity in the horizontal direction of the electronic device according to FIG. 3; FIG. 4B is based on FIG. Schematic diagram of the electromagnetic wave intensity of the electronic device in the vertical direction. The maximum allowable value VI shown in Figs. 4A and 4B is the maximum electromagnetic field allowable value that does not affect the external electronic product, and the allowable value V2 is the allowable value of the electromagnetic field set by each manufacturer. As shown in FIG. 4A and FIG. 4B, the electronic device 10 can greatly reduce the electromagnetic waves radiated by the electronic component 12 in the horizontal direction and the vertical direction by the shielding member 20, so that the electromagnetic wave is far below the maximum allowable value VI and The set allowable value V2 is exceeded. 7 M417765 Therefore, the shield element 20 of the present invention can greatly reduce the electromagnetic wave interference caused by the electronic component 12, which is significantly superior to the prior art. On the other hand, the shield member 20 of the present invention can be conveniently and quickly disposed on the circuit board 11 of any electronic device 10, which can greatly reduce the cost at the time of manufacture. In summary, this creation, regardless of its purpose, means and efficacy, is showing its characteristics different from the well-known technology. You are kindly asked to review the examinations and give you a patent in advance, and you will feel the virtues. It is to be noted that the various embodiments described above are merely illustrative for ease of explanation, and the scope of the claims is intended to be limited by the scope of the application, and not limited to the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is an assembled view of a first embodiment of an electronic device of the prior art. Fig. 1B is a schematic view showing the electromagnetic wave intensity in the horizontal direction of the first embodiment of the electronic device according to Fig. 1A. Fig. 1C is a schematic view showing the electromagnetic wave intensity in the vertical direction of the first embodiment of the electronic device according to Fig. 1A. 2A is an assembled view of a second embodiment of a prior art electronic device. Fig. 2B is a schematic view showing the intensity of electromagnetic waves in the horizontal direction according to the second embodiment of the electronic device according to Fig. 2A. Fig. 2C is a schematic view showing the electromagnetic wave intensity in the vertical direction of the second embodiment of the electronic device according to Fig. 2A. FIG. 3 is an assembled view of one embodiment of the electronic device of the present invention. 3A is a cross-sectional view of one embodiment of the electronic device of the present invention. M417.765 Fig. 4A is a schematic diagram showing the electromagnetic wave intensity in the horizontal direction of the electronic device according to Fig. 3 according to Fig. 3. Fig. 4B is a schematic view showing the electromagnetic wave intensity in the vertical direction of the electronic device according to Fig. 3; [Main component symbol description] Prior art: Electronic device 90a, 90b ® Circuit board 91 Electronic component 92 Slot 93 Shrapnel 94 Maximum allowable value VI Setting tolerance V2 φ Original creation: Electronic device 10 Circuit board 11 Electronic component 12 Slot 13 Hook 131 Housing 14 Shielding element 20 M417765 Baffle 21 First face 211 Depression 211a Second face 212 Support 22 Maximum allowable value VI Set tolerance V2

Claims (1)

M417.765 六、申請專利範圍: 1. 一種屏蔽元件,係用於一電子裝置所安裝之一電子元 件,該屏蔽元件包括: 一檔板,係設置於該電子裝置之一電路板上並接觸該電 子裝置之一殼體,其中該檔板係鄰近於該電子元件,且 該檔板之長度係實質上大於或等於該電子元件之寬 度;以及 一支撐件,係用以支撐該檔板。 鲁 2.如申請專利範圍第1項所述之屏蔽元件,其中該檔板包 括: 一第一面,係實質上與該電路板垂直相接;以及 一第二面,係實質上與該第一面垂直相接,並接觸該電 子裝置之該殼體。 3. 如申請專利範圍第2項所述之屏蔽元件,其中該第一面更 具有一凹陷部。 4. 如申請專利範圍第1項所述之屏蔽元件,其中該支撐件可 鲁 為一彈性體。 5. 如申請專利範圍第1項所述之屏蔽元件,其中該檔板係為 一金屬材質。 6. —種具有屏蔽元件之電子裝置,包括: 一電路板; 一電子元件,係安裝於該電路板上;以及 一屏蔽元件,包括: 11 M417765 一檔板,係設置於該電子裝置之該電路板上並接觸該 電子裝置之一殼體,其中該檔板係鄰近於該電子元 件,且該檔板之長度係實質上大於或等於該電子元件 之寬度;以及 一支撐件,係用以支撐該檔板。 7. 如申請專利範圍第6項所述之具有屏蔽元件之電子裝 置,其中該檔板包括: 一第一面,係實質上與該電路板垂直相接;以及 一第二面,係實質上與該第一面垂直相接,並接觸該電 子裝置之該殼體。 8. 如申請專利範圍第7項所述之具有屏蔽元件之電子裝 置,其中該電子元件係藉由一卡勾以卡固於電路板上, 該第一面更具有一凹陷部以配合該卡勾。 9. 如申請專利範圍第6項所述之具有屏蔽元件之電子裝 置,其中該支撐件可為一彈性體。 10. 如申請專利範圍第6項所述之具有屏蔽元件之電子裝 置,其中該檔板係為一金屬材質。 12M417.765 VI. Patent Application Range: 1. A shielding component for an electronic component mounted on an electronic device, the shielding component comprising: a baffle plate disposed on one of the circuit boards of the electronic device and contacting A housing of the electronic device, wherein the baffle is adjacent to the electronic component, and the baffle has a length substantially greater than or equal to a width of the electronic component; and a support member for supporting the baffle. The shield member of claim 1, wherein the baffle comprises: a first face substantially perpendicularly to the circuit board; and a second face substantially opposite the first One side is vertically connected and contacts the housing of the electronic device. 3. The shielding member of claim 2, wherein the first side further has a recess. 4. The shielding member of claim 1, wherein the support member is an elastomer. 5. The shielding member of claim 1, wherein the baffle is made of a metal material. 6. An electronic device having a shielding component, comprising: a circuit board; an electronic component mounted on the circuit board; and a shielding component comprising: 11 M417765 a baffle plate disposed on the electronic device And contacting a casing of the electronic device, wherein the baffle is adjacent to the electronic component, and the baffle has a length substantially greater than or equal to a width of the electronic component; and a support member is used Support the baffle. 7. The electronic device with a shielding element according to claim 6, wherein the baffle comprises: a first surface substantially perpendicular to the circuit board; and a second surface substantially Directly contacting the first surface and contacting the housing of the electronic device. 8. The electronic device with a shielding component according to claim 7, wherein the electronic component is fastened to the circuit board by a hook, the first surface further having a recess to match the card hook. 9. The electronic device having a shielding member according to claim 6, wherein the support member is an elastomer. 10. The electronic device having a shielding member according to claim 6, wherein the baffle is made of a metal material. 12
TW100211888U 2011-06-29 2011-06-29 Shielding device and electronic device with the shielding element TWM417765U (en)

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TW100211888U TWM417765U (en) 2011-06-29 2011-06-29 Shielding device and electronic device with the shielding element
CN2011202441068U CN202143346U (en) 2011-06-29 2011-07-12 Shielding assembly and electronic device with same

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TW100211888U TWM417765U (en) 2011-06-29 2011-06-29 Shielding device and electronic device with the shielding element

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CN108738289A (en) * 2017-04-20 2018-11-02 仁宝电脑工业股份有限公司 Radio frequency interference preventing electronic assembly

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