• M278222 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種電子裝置之防電磁干擾結構改良。 【先前技術】 電磁干擾係目前電子産業中存在之一大問題，特別係隨著 積體電路之頻率愈來愈高，其内部之傳輸導線、電源或主機板 上具有南工作鮮之電子元件都會對外發散出電磁波，使得其 他元件受到干擾，影響正常之工作運作，故從業者十分重視電 子裝置在防止電磁干擾方面之設計。 習知電子産品中，防電磁干擾可藉由多種途徑實現。以目 前應用較·泛之電腦❹彳，其线板上裝設有複數電子元 件，在防止該主機板上靠近後板之區域内之電子元件（如連接 器）産生電磁干擾時’可在該後板輸入/輸出窗口之屏蔽撐片上 設計-彈片，使該電子元件與該彈片接觸，從而使該主機板藉 由該電子元件及該彈片與該後板接地導通。惟，採用該種方法 防電磁干擾時，由於該主機板係藉由其上裝設的電子元件與該 後板導通，接地路徑阻抗較高。 【新型内容】 繁於以上内容，翁必要韻有恤抗躺路徑之電 子裝置之防電磁干擾結構改良。 -種電子裝置之防電磁干擾結構改良，其包括—後板、一主 機板及-裝設於該後板上之屏紐片，該主機板上設有至少—鋼 • M278222 箔部，該屏蔽擋片對應所述銅箔部設有與其接觸之彈片。 相較習知技術，所述電子裝置之防電磁干擾結構改良係根據 主機板上電子元件之佈局在適當位置處預留出銅箔部，並根據节 銅箔部設計該屏蔽擋片，在其上對應該銅箔部設計該彈片，使节 彈片與該銅箔部相接觸，實現了利用低阻抗之接地路徑防該主機 板電磁干擾之目的。 I 【實施方式】 請參閱第一圖，本創作較佳實施方式之電子裝置之防電磁干 擾結構改良可以應用於電腦、伺服器或網路電腦等，其包括一後 板1、一主機板2及一屏蔽擋片3。 該後板1上設有一輸入/輸出窗口 12，該輸入/輸出窗口 12 可供該主機板2上之連接器（圖未示）與外部設備（圖未示）導 通。 • 該主機板2靠近該後板1之一端裝設複數電子元件21，並 根據該等電子元件21之佈局，在該主機板2上適當位置處預留 出一裸露之銅箔部22，每一銅箔部22均與該主機板2内之接地 層導通。 該屏蔽擋片3對應該後板1之輸入/輸出窗口 12設計，其對 應該主機板2之二銅箔部22位置處分別設有一彈片32。每一彈 片32自该屏蔽擔片3靠近底部處向下傾斜延伸形成一彈性部 322，該彈性部322末端彎折後水平延伸形成一接觸部324。同 呀，该屏蔽擋片3對應該主機板2上各連接器（圖未示)處挖空， 6 M278222 形成供各連接器與外部設備導通之通孔34。 i 請繼續參閱第二圖’該主機板2與該後板丄垂直設置，該屏 蔽擋片3裝設於該後板丨之輸入/輸出窗口 12，其上每一彈片幻 之接觸部324與該主機板2上對應之銅箔部22相接觸。 與習知技術相比，該較佳實施方式係根據電子元件21之佈 局在適當位置處預留出裸露之銅細22，並根據該銅箱部^設 計該屏蔽擔片3，在其上對應該銅落部22延伸形成該彈片^， 1 使該彈片32與該鋪部22相接觸，實現了利用低阻抗之接地路 徑防電磁干擾之目的。 糊作稀於祕防電腦、做料電子裝置之域板之電 磁干擾’任何資訊産品之電路板均可採用本創作提供之結構防電 磁干擾，同時，該結構亦可用於防靜電干擾。 綜上所述’本解確已符合_料要求，纽法提出專利 申請。惟，以上所述者僅為本創作之較佳實施例，舉凡熟悉本創 賴蟄之人士’狄本創作之精神所作之等效修飾或變化，皆應 涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 第-圖係本創作較佳實施方式之電子裝置之防電磁干擾結 構改良之立體分解圖。 第二圖係本創作較佳實施方式之電子裝置之防電磁干擾結 構改良之立體組裝圖。 【主要元件符號說明】 7 M278222 後板 1 輸入/輸出窗口 12 主機板 2 電子元件 21 銅箔部 22 屏蔽擋片 3 彈片 32 彈性部 322 接觸部 324 通孔 34 8• M278222 8. Description of the new type: [Technical field to which the new type belongs] This creation relates to the improvement of the electromagnetic interference prevention structure of an electronic device. [Prior technology] Electromagnetic interference is a major problem in the current electronics industry, especially as the frequency of integrated circuits is getting higher and higher, the internal transmission wires, power supplies, or electronic components with fresh components on the motherboard Electromagnetic waves are emitted to the outside, causing other components to be disturbed and affecting normal operation. Therefore, practitioners attach great importance to the design of electronic devices to prevent electromagnetic interference. In conventional electronic products, the prevention of electromagnetic interference can be achieved in a variety of ways. Based on the current general-purpose computer, multiple electronic components are installed on the wire board. When preventing electronic components (such as connectors) in the area close to the rear board from generating electromagnetic interference in the motherboard, The shield plate on the input / output window of the rear plate is designed with a spring plate, so that the electronic component is in contact with the spring plate, so that the motherboard is electrically connected to the rear plate through the electronic component and the spring plate. However, when using this method to prevent electromagnetic interference, the motherboard has a high impedance to the ground path because the motherboard is connected to the rear board by electronic components mounted on it. [New content] In addition to the above, Weng Neiyun has improved the anti-electromagnetic interference structure of the electronic device that has an anti-laying path. An improved electromagnetic interference prevention structure for an electronic device, which includes a back plate, a main board, and a screen button installed on the back plate. The main board is provided with at least a steel M278222 foil portion, and the shield The blocking piece is provided with an elastic piece corresponding to the copper foil portion in contact therewith. Compared with the conventional technology, the improvement of the electromagnetic interference prevention structure of the electronic device is to reserve a copper foil portion at an appropriate position according to the layout of the electronic components on the motherboard, and design the shielding baffle according to the copper foil saving portion. The elastic sheet is designed corresponding to the copper foil portion, so that the elastic piece contacts the copper foil portion, and the purpose of preventing the motherboard from electromagnetic interference by using a low-impedance ground path is achieved. I [Embodiment] Please refer to the first figure. The improved electromagnetic interference prevention structure of the electronic device according to the preferred embodiment of the present invention can be applied to a computer, a server, or a network computer. And a shielding baffle 3. The rear board 1 is provided with an input / output window 12, which can be used to connect a connector (not shown) on the motherboard 2 with an external device (not shown). • The motherboard 2 is provided with a plurality of electronic components 21 near one end of the rear plate 1. According to the layout of the electronic components 21, a bare copper foil portion 22 is reserved at an appropriate position on the motherboard 2. A copper foil portion 22 is electrically connected to the ground layer in the motherboard 2. The shielding baffle 3 is designed to correspond to the input / output window 12 of the rear plate 1, and an elastic piece 32 is provided at a position corresponding to the copper foil portion 22 of the main board 2. Each elastic piece 32 extends obliquely downward from the shielding stretcher 3 near the bottom to form an elastic portion 322, and the end of the elastic portion 322 is bent to extend horizontally to form a contact portion 324. At the same time, the shielding baffle 3 is hollowed out at each connector (not shown) on the motherboard 2, and 6 M278222 forms a through hole 34 for each connector to communicate with external devices. i Please continue to refer to the second figure, 'The main board 2 and the rear plate 设置 are arranged perpendicularly, and the shielding baffle 3 is installed on the input / output window 12 of the rear plate 丨. Corresponding copper foil portions 22 on the motherboard 2 are in contact. Compared with the conventional technology, the preferred embodiment is to leave bare copper fines 22 at appropriate positions according to the layout of the electronic components 21, and design the shielding stretcher 3 according to the copper box part ^, on which The copper drop portion 22 should be extended to form the elastic piece ^, 1 so that the elastic piece 32 is in contact with the laying portion 22, and the purpose of preventing electromagnetic interference by using a low-impedance ground path is achieved. It ’s rare to prevent electromagnetic interference in the domain board of computers and electronic devices. Any circuit board of information products can use the structure provided by this creation to prevent electromagnetic interference. At the same time, the structure can also be used to prevent electrostatic interference. In summary, the 'this solution has indeed met the material requirements, and Newfat filed a patent application. However, the above is only a preferred embodiment of this creation. For example, any equivalent modification or change made by the person who is familiar with this creation and the spirit of Diben's creation should be covered by the following patent applications. [Brief Description of the Drawings] The first figure is a three-dimensional exploded view of the improved electromagnetic interference prevention structure of the electronic device in the preferred embodiment of the present invention. The second figure is a three-dimensional assembly diagram of the improved electromagnetic interference prevention structure of the electronic device according to the preferred embodiment of the present invention. [Description of Symbols of Main Components] 7 M278222 Rear panel 1 Input / output window 12 Main board 2 Electronic components 21 Copper foil section 22 Shield stopper 3 Spring piece 32 Elastic portion 322 Contact portion 324 Through hole 34 8