M303583 八、新型說明： 【新型所屬的技術領域】 本新型是有關於-種電磁波及靜電消散裝置，特別是 々曰一種電子產品的電磁波及靜電消散裝置。 、 【先前技術】 二圖1所示，一般電子產品ι〇(例如電腦）具有-主機板 π ’设置於該主機板11的多數銅箔連通導線（_此加 Ρ_π^2,安裝固定在該主機板u的一連接器區⑴並藉 由接地針腳（圖未示）與前述銅箱連通導線12電連接的數連 接器13’及—安裝固定於該主機板u並與其中—銅溶連通 導線12電連接且接觸一機殼（圖未示）的螺絲14。 該電子產品1G並可藉由該等連接器13的接地針聊、 銅猪連通導線12、螺絲14配合形成_電磁波或靜電消散路 徑I。 當前述連接器13受到外來電磁波或靜電時，可透過該 消散路徑I將電磁波或靜電導引至該螺絲14，最後透過該 機殼（圖未示）接地消散。 ~ 該電子產品10雖然可以藉由上述設計消散電磁波或靜 電，但實際使用時存有該消散路徑工較長、消散時間過長， 導致有安裝固定在該主機板U上的電子元件（圖未示）損壞 率較高的缺失。 或有業者欲藉由縮短前述連接器13與該螺絲14之間 的距離以期縮短該消散路徑J ’但是，如此會變更該主機板 11的設計，導致有生產成本較高的缺失。 5 M303583 【新型内容】 因此，本新型的目的，是在提供— 機板設計的情況下縮短消散路徑，可以 不變更主 靜電以降低電子元件損壞率的電子產σμ 電磁波或 散裝置。 半’-子產-的電磁波及靜電消 :疋’本新型電子產品的電磁波及靜電消 一主機板、數連接器、—機殼、—金屬屏蔽及-導電座 μ機板包括-連接器區及至少_mi連通導線。 «連接器是安裝固定”連接器區並與 通導線電連接。 白連 该機殼是安裝在該主機板外。 該金屬屏蔽是安裝固定於該機殼並位於前述連接 側。 叩, :導：座包括貼觸該金屬屏蔽的至少一第一接觸片， 及自前述第-接觸片延伸並貼觸該主機板且與該等連接器 透過前述銅箔連通導線電連接的至少一第二接觸片。σ 前述連接器、銅箱連通導線、導電座、金屬屏蔽與機 殼並配合形成一消散路徑。 藉由上述組成，當該等連接器受到外來電磁波或靜電 時，可透過該消散路徑將電磁波或靜電迅速導引至該機殼 終於接地消散，藉此使本新型具有在不變更該主機板的情 況下，有效縮短該消散路徑以能迅速消散電磁波或靜電， 相對可以降低安裝固定在該主機板上的多數電子元件損壞 率的特性。 6 M303583 【實施方式】 點與功效，在以 明中，將可清楚 有關本新型前述及其他技術内容 下配合參考圖式的 奴佺例的詳細說 的主現。 n i山 又/上思的是，沩 明内谷中所使用的相對 ，，接”，θ， 置用扣，例如，，頂”、，，底，，、”前，， 疋以正常操作方向使用，且類 號來表示。 件疋以相同的 w-m 電子產卩口的電磁波及靜電消 月文衣置一弟一較佳實施例包 主㈣？η Δ/ι ώ 主機板2〇,安裝固定在該 4板20的一連接器區26的數連接器3〇，一裝 機板20外的機殼4〇，一 Μ # 土 女展固疋於该主機板20並位於哕 寻連接器30外的金屬屏蔽5〇， μ _ . ^ 久文裝在該主機板2〇盥 该金屬屏蔽50之間的導電座6〇。 "、 該主機板20包括呈反向的一頂面21與一底面^，達 接該頂面21與該底面22的二側端面23、—前端面24应— ，端面·25(見圖7)，—位於前方的連接器區％，及多數銅 邊連通導線（conductor pattern)27。 。。在該較佳實施例中，言亥主機板20 t包括設置於該連接 器區26並相互間隔的二插孔28。 忒等連接器30是插固於該主機板2〇的連接器區26， 且藉由接地針腳3 1與前述銅箔連通導線2 7電連接。 該機殼40包括一供該主機板2〇置放的金屬底盤4ι， 及垂直固結於該底盤41的一前面板42。該前面板42具 M303583 有數穿孔421可供前述連接器 露出。 30與其他電子元件（圖未示） 如圖2、3、4所示，該金屬屏蔽5〇包括一基板51， 及自該基板51的周緣朝向後方延伸用以固結於該前面板42 與該底盤41的數支支腳52。該基板51具有數穿孔511可 供前述連接器30與其他電子元件（圖未示）露出。 士圖2 3 5所不，§亥導電座6〇包括一用以貼觸該M303583 VIII. New description: [New technical field] The new type is related to electromagnetic waves and static dissipative devices, especially electromagnetic waves and static dissipating devices for an electronic product. [Prior Art] As shown in FIG. 1 , a general electronic product ι (for example, a computer) has a plurality of copper foil connecting wires disposed on the motherboard 11 of the motherboard π ' (this is twisted _π^2, and is mounted and fixed thereto) a connector region (1) of the motherboard u and a plurality of connectors 13' electrically connected to the copper box communication wires 12 by ground pins (not shown) and mounted to the motherboard u and connected to the copper The wire 12 is electrically connected to and contacts a screw 14 of a casing (not shown). The electronic product 1G can be formed by the grounding pin of the connector 13, the copper pig connecting wire 12, and the screw 14 to form an electromagnetic wave or static electricity. Dissipation path I. When the connector 13 is subjected to external electromagnetic waves or static electricity, electromagnetic waves or static electricity can be guided to the screw 14 through the dissipation path I, and finally dissipated through the casing (not shown). ~ The electronic product 10 Although the electromagnetic wave or static electricity can be dissipated by the above design, in actual use, the dissipation path is long and the dissipation time is too long, resulting in damage rate of electronic components (not shown) mounted on the motherboard U. More The lack of the operator wants to shorten the dissipating path J' by shortening the distance between the aforementioned connector 13 and the screw 14. However, the design of the main board 11 is changed, resulting in a high production cost. 5 M303583 [New content] Therefore, the purpose of this new type is to shorten the dissipation path in the case of providing the design of the board, and to make the electronic production σμ electromagnetic wave or dispersion device without changing the main static electricity to reduce the damage rate of electronic components. Sub-production - electromagnetic wave and static elimination: 疋 'The electromagnetic wave and static elimination of the new electronic product motherboard, number connector, casing, metal shielding and - conductive seat μ board include - connector area and at least _ The mi-connecting wire. The connector is a fixed-mount connector area and is electrically connected to the through-wire. The white-connected casing is mounted outside the main board. The metal shield is mounted and fixed to the casing and is located on the connecting side. The pedestal: the socket includes at least one first contact piece that is in contact with the metal shield, and extends from the first contact piece and contacts the motherboard and transmits the copper through the connector The at least one second contact piece electrically connected to the connecting wire. σ the connector, the copper box connecting wire, the conductive seat, the metal shield and the casing cooperate to form a dissipating path. With the above composition, when the connectors are subjected to external electromagnetic waves Or static electricity, the electromagnetic wave or static electricity can be quickly guided to the casing through the dissipating path and finally grounded and dissipated, thereby enabling the present invention to effectively shorten the dissipating path to quickly dissipate the electromagnetic wave without changing the main board. Or static electricity, which can reduce the damage rate of most electronic components mounted on the motherboard. 6 M303583 [Embodiment] The point and effect, in the Ming and Qing, will be clearly related to the above-mentioned and other technical contents of this new model. The main statement of the detailed description of the slave example of the reference. Nishan/thinking is that the relatives used in the valley of Yuming are connected, ", θ, buckles, for example, top", ", bottom,", "before", 疋 use in normal operation direction And the class number is indicated. The electromagnetic wave and the static electricity of the same wm electronic production mouth are placed in a better embodiment. The main body (4)? η Δ / ι 主机 motherboard 2 〇, installed and fixed A plurality of connectors 3 of a connector region 26 of the 4 board 20, a casing 4 外 outside the mounting board 20, and a 女 土 土 疋 疋 疋 并 并 并 并 并 并 并 并 土 土 土 土 土 土 土 的 的 的Metal shield 5〇, μ _ . ^ The long-term conductive seat 6〇 between the motherboard 2 and the metal shield 50. The motherboard 20 includes a top surface 21 and a bottom surface in opposite directions. ^, reaching the top surface 23 of the top surface 21 and the bottom surface 22, the front end surface 24, the end surface 25 (see Fig. 7), the connector area at the front, and the majority of the copper edge connecting wires ( Conductor pattern 27 In the preferred embodiment, the motherboard 20 t includes two jacks 28 disposed in the connector region 26 and spaced apart from each other. The connector 30 is fastened to the connector area 26 of the motherboard 2, and is electrically connected to the copper foil communication wire 27 by the grounding pin 31. The casing 40 includes a mounting plate for the motherboard 2 The metal chassis 4i, and a front panel 42 vertically fixed to the chassis 41. The front panel 42 has M303583 with a plurality of through holes 421 for the connector to be exposed. 30 and other electronic components (not shown), as shown in Figs. As shown in FIG. 4, the metal shield 5 includes a substrate 51, and a plurality of legs 52 extending from the periphery of the substrate 51 toward the rear for fixing to the front panel 42 and the chassis 41. The substrate 51 has several The through hole 511 can be used to expose the connector 30 and other electronic components (not shown). Figure 2 3 5 does not, the ground conductive seat 6〇 includes a contact with the
基板的第一接觸片61，及自該第一接觸片μ的二反向 端面彎折延伸並相互間隔的二第二接觸片们。 進一步地’別述第二接觸片62是固結於該主機板20 並與前述銅箔連通導線27電連接。 值得說明的是，該較佳實施例是採用波焊 oldenng)方式將該等連接$ 3〇與該導電座㈤時焊固於 該主機板20並與前述㈣連通導線27電連接，具有可以 提高生產效率及可降低成本的特性。 如圖6所示，刖述連接器3〇的接地針腳3丨、銅箔連通 導線27、導電座60、金屬屏㉟5〇與機豸4〇並配合形成一 電磁波或靜電消散路徑]I。 當該等連接器30受到外來電磁波或靜電聘，可透過該 消散純π迅速將電磁波或靜電導引至該機殼4〇終於接地 消散，藉此達到可縮短該消散路徑^以能迅速消散電磁波 或靜電的效果。 如圖7、8、9、1 〇所示，本新型電子產品的電磁 波及靜電消散裝置一第二較佳實施例與該第一較佳實施例 M303583 相同包含-主機板20、數連 蔽50及一導電座7〇。 機或4。、一金屬屏 該第二較佳實施例與該 於兮士地』 平乂1土貝^例的不同處，在 於違主機板20更包括塗佈於該前 通導绩、月J而面24並與前述銅箔連 、V線27电連接的一導電層 白兮人净私層29及邊導電座70包括分別 自違金屬屏蔽50的基板51朝而％ 朝向後方延伸的二第一接觸片 電層71朝向後彻並貼觸該導 在該第二較佳實施例t ’該主機板⑼可刪除該 一插孔28。 ^ ^ 貝&例的連接15 3G的接地針腳3 1、銅領連 通‘線27、導電声2Q、道帝十 可、、 曰 V電座70、金屬屏蔽5〇與機殼40 ^形成—電磁波或靜電消散路徑。 田，等連接11 3G受到外來電磁波或靜電時，可透過該 间放^將電磁波或靜電導引至該機殼4G終於接地消散， ^ ·、丨可細紐，肖散路徑以能迅速消散電磁波或靜電的 欢果。 如圖 _ ♦ 斤不，本新型電子產品的電磁波及靜 包消月文I置一-繁二^ /4. 機殼40及—導電座80 弟二較佳實施例包含一主機板20、數連接哭 3 〇 Λ ^ *3- /1 A ^ σ〇 吕亥導霉*' 9 ^ g t _ a、、 〇具有一焊固於該主機板20的底面22並與 述銅冶連通導線27電連接的固定片8卜及一自該固定片 申並石亚觸該機殼4〇的底盤41的接觸片82。 猎此，當該等連接器30受到外來電磁波或靜電時，可 M303583 透過該等連接H 30的接地針腳31依序將f磁波或靜電導 引至該主機板2〇的mi連通導線27，該導電座⑽的固定 片81 =玄接觸片82 ’取後導引至該機殼4〇再接地消散， 藉此同樣能達到可縮短消散路徑以能迅速消散電磁波或靜 電的效果。 納上述’本新型電子產品的電磁波及靜電消散裝置 可獲致下述功效及優點，故確實能達到本新型之目的··The first contact piece 61 of the substrate, and the second contact pieces which are bent from the opposite end faces of the first contact piece μ and are spaced apart from each other. Further, the second contact piece 62 is fixed to the main board 20 and electrically connected to the copper foil communication wire 27. It should be noted that, in the preferred embodiment, the connection between the $3〇 and the conductive seat (5) is soldered to the motherboard 20 and electrically connected to the (four) communication wire 27, which can be improved. Productivity and features that reduce costs. As shown in Fig. 6, the grounding pin 3 of the connector 3, the copper foil communication wire 27, the conductive seat 60, the metal screen 355, and the casing 4 are combined to form an electromagnetic wave or a static dissipative path. When the connector 30 is subjected to external electromagnetic waves or static electricity, the electromagnetic wave or static electricity can be quickly guided to the casing through the dissipating pure π, and finally grounded and dissipated, thereby shortening the dissipating path to quickly dissipate the electromagnetic wave. Or the effect of static electricity. As shown in FIG. 7, 8, 9, and 1, a second preferred embodiment of the electromagnetic wave and static dissipating device of the electronic product of the present invention comprises the same as the first preferred embodiment M303583. And a conductive seat 7〇. Machine or 4. The difference between the second preferred embodiment of the metal screen and the example of the 兮 』 』 , , , , , , , , , , 违 违 违 违 违 违 违 24 24 24 24 24 And a conductive layer of the conductive layer and the side conductive seat 70 electrically connected to the copper foil and the V-wire 27, respectively, and the first contact piece extending from the substrate 51 of the metal shield 50 toward the rear. The electrical layer 71 is directed rearwardly and in contact with the guide. In the second preferred embodiment t', the motherboard (9) can delete the receptacle 28. ^ ^ Bay & example connection 15 3G grounding pin 3 1, copper collar connecting 'line 27, conductive sound 2Q, Dao Shishi, 曰V electric seat 70, metal shield 5 〇 and chassis 40 ^ formed - Electromagnetic waves or static dissipative paths. When the field is connected to the external electromagnetic wave or static electricity, the electromagnetic wave or static electricity can be guided to the casing 4G to finally dissipate through the ground. ^ ·, 丨 can be fine, and the viscous path can quickly dissipate the electromagnetic wave. Or the joy of static electricity. As shown in Figure _ ♦ 斤 不, the electromagnetic wave and static package of the new electronic product I set one-to-two ^ / 4. The casing 40 and the conductive seat 80 The second preferred embodiment includes a motherboard 20, number Connection crying 3 〇Λ ^ *3- /1 A ^ σ〇吕海导霉*' 9 ^ gt _ a, 〇 has a soldered to the bottom surface 22 of the motherboard 20 and is electrically connected to the copper wire The attached fixing piece 8 and a contact piece 82 of the chassis 41 from which the stone is attached to the casing 4A. When the connectors 30 are subjected to external electromagnetic waves or static electricity, the M303583 can sequentially guide f magnetic waves or static electricity to the mi-connecting wires 27 of the motherboard 2 through the ground pins 31 of the connection H 30. The fixing piece 81 of the conductive seat (10) = the sinuous contact piece 82' is guided to the casing 4 and then grounded and dissipated, thereby also achieving the effect of shortening the dissipation path to quickly dissipate electromagnetic waves or static electricity. The electromagnetic wave and static dissipating device of the above-mentioned electronic product can achieve the following functions and advantages, so it can achieve the purpose of the present invention.
―、將本新型該消散路徑n與習用電子產品ι〇的消散 路徑I做-比較’可以證明本新型該消散路徑π確實較短， 相對具有可以迅速消散電磁波或靜電，及可減少安裝固定 在該主機板2〇上的電子元件的損壞率的功效及優點。 、'二本新型具有在不變更該主機板2G的情況下，就可 迅速消散電磁波或靜電的功效及優點。 准以上所述者，僅為本新型的三較佳實施例而已，舍 不能以此限定本新型實施的範圍，即大凡依本新型申； 利範圍及新型說明内容所作的簡單的等效變化與修飾明皆 仍屬本新型專利涵蓋的範圍内。 【圖式簡單說明】 說明一電磁波或 圖1是習知一主機板的局部俯視圖 靜電消散路徑； 圖2是本新型電子產品的電磁波及靜電消散裝置一第 較佳實施例的一局部組合立體圖； 圖3疋.亥第-較佳實施例的一局部組合剖視圖； 圖4是該第-較佳實施例的—金屬屏蔽的—立體圖丨 10 M303583 圖5是該第一較佳實施例的一導電座的-立體圖； 圖6是一類似圖3的視圖，說明一消散路徑； 一圖7疋本新型電子產品的電磁波及靜電消散裝置一第 一車父佳實施例的一局部組合立體圖； 圖8是該第二較佳實施例的一導電座的一立體圖； 圖9是忒第一較佳實施例的一局部組合剖視立體圖； 圖1 0疋该第二較佳實施例的一局部組合剖視側視圖 ’ 5兒明一消散路徑； 圖11是本新型電子產品的電磁波及靜電消散裝置一 第〜較佳實施例的一局部組合剖視立體圖；及 圖1 2是該第三較佳實施例的一局部組合剖視側視圖 π M303583 【主要元件符號說明】 20... .主機板 70.. ..導電座 21... .頂面 71.· ..第一接觸片 22... .底面 72.. ..第二接觸片 23... .側端面 80·· ..導電座 24... .前端面 81·. ..固定片 25... .後端面 82·· ..接觸片 26... .連接器區 Π .· ..消散路徑 27... .銅箔連通導線 2 8... .插孔 29... .導電層 30... .連接器 31 ... .接地針腳 40... .機殼 41 ... .底盤 42... .前面板 421 . ..穿孔 50... .金屬屏蔽 51... •基板 511. ..穿孔 52... .支腳 60… .導電座 61.·· .第一接觸片 62... .第二接觸片―, comparing the dissipating path n of the new type with the dissipating path I of the conventional electronic product ι〇, it can be proved that the dissipating path π of the novel type is indeed shorter, relatively has the ability to quickly dissipate electromagnetic waves or static electricity, and can reduce the installation and fixation. The effectiveness and advantages of the damage rate of the electronic components on the motherboard 2. The two new models have the advantages and advantages of quickly dissipating electromagnetic waves or static electricity without changing the main board 2G. The above-mentioned ones are only the three preferred embodiments of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent changes made by the novel scope and the new description contents are Modifications are still within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial perspective view of a preferred embodiment of an electromagnetic wave and static dissipating device of the present invention; FIG. Figure 3 is a partial cross-sectional view of a preferred embodiment of the present invention. Figure 4 is a perspective view of a metal shield of the first preferred embodiment. Figure 10 is a conductive representation of the first preferred embodiment. Figure 6 is a view similar to Figure 3, illustrating a dissipating path; Figure 7 is a partial assembled perspective view of the first embodiment of the electromagnetic wave and static dissipating device of the novel electronic product; Figure 8 Figure 2 is a perspective view of a portion of the first preferred embodiment of the first preferred embodiment; Figure 9 is a partial cross-sectional perspective view of the first preferred embodiment; FIG. 11 is a partial cross-sectional perspective view of a first embodiment of the electromagnetic wave and static dissipating device of the electronic product of the present invention; and FIG. 12 is the third preferred embodiment. example A partial combined sectional view π M303583 [Main component symbol description] 20... . Motherboard 70... Conductive seat 21... Top surface 71...... First contact piece 22... Bottom surface 72...Second contact piece 23... Side end surface 80··. Conductive seat 24... Front end surface 81·..Fixed piece 25.... Rear end surface 82·· .. Contact piece 26... Connector area Π.. Dissipation path 27... Copper foil communication wire 2 8... Jack 29... Conductive layer 30... Connector 31. .. . Grounding pin 40.... Chassis 41 .... Chassis 42... Front panel 421 .. Perforation 50... Metal shield 51... • Substrate 511.. Perforation 52. .. . foot 60.... conductive seat 61.··. first contact piece 62.... second contact piece
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