TWM468066U - High frequency cable connector structure - Google Patents

Description

High frequency cable connector structure

The present invention is a high frequency cable connector structure, especially a high frequency cable connector structure with low high frequency impedance.

With the advancement of technology, human beings are increasingly relying on information and communication products, and the computing speed and information transmission volume of information electronic products have also increased significantly. Therefore, the importance of the high-frequency characteristics of electronic components has been highlighted. Relatively, the existing specifications are becoming more and more complex, which can truly reflect the high-frequency performance of components. For example, in the past, connectors that are considered to be simply used for bridging, when applied to high frequencies, must meet the specifications of Characteristic Impedance to meet the requirements of high frequency characteristics in the application environment.

Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a front perspective view showing a high-frequency cable connector structure of the prior art without a cable assembly, and FIG. 2 is a high-frequency cable connector structure of the prior art. Rear perspective view when the cable is not assembled. The high frequency cable connector structure 1 of the prior art comprises a housing 11, a plurality of terminals (not shown), an end cap 13, and a line before unassembled cables (not shown). Shelf 14. The end cover 13 is provided with a plurality of soldering pads 131. The wire rack 14 has a plurality of cable slots 141. When assembling cables (not shown), the cables (not shown) are respectively The corresponding cable slot 141 is inserted into the wire frame 14, and then the cables (not shown) that have been inserted into the respective cable slots 141 are soldered to the respective pads 131 to complete the cable (not shown). In the figure) the connection to the rest of the high frequency cable connector structure 1. It can be understood that the card slot 141 restricts the cable (not The position shown in the figure), so that during assembly welding, the individual cables (not shown) can be easily aligned to the corresponding pads 131.

However, such a convenient design has also caused significant limitations. Please refer to FIG. 3A and FIG. 3B , FIG. 3A is a top view of the high frequency cable connector structure of the prior art, and FIG. 3B is a cross section of the high frequency cable connector structure of FIG. 3A. Sectional view of line 3-3 ' . In Fig. 3A, the cable 15 is only symbolically depicted in part, and the Fig. 3B is for the purpose of clear display, and the cable 15 is not shown. As shown in Fig. 3A, since the section line 3-3 ' is cut vertically downward along the bobbin 14, the 3B diagram clearly shows the center distance a of the card slot 141, and a is 2 mm. Please refer to FIG. 4A and FIG. 4B again. FIG. 4A is a top view of the high frequency cable connector structure of the prior art, and FIG. 4B is a high frequency cable connector structure along the 4A. Sectional view of the line 4-4 ' . In Fig. 4A, the cable 15 is only symbolically shown in part, and Fig. 4B is for the purpose of clear display, and the cable 15 is not shown. As shown in Fig. 4A, since the section line 4-4 ' is cut vertically downward along the pad 131 on the end cap 13, the 4B diagram clearly shows the center distance b of the pad 131, and b is 2 mm. That is, in the high-frequency cable connector structure 1 of the prior art, the center distance of the adjacent card slot 141 is equal to the center distance of the adjacent pads 131.

As mentioned above, although such a design is very convenient for assembly alignment during soldering, when the center distance of the pad 131 is greater than the center distance of the original signal line conductor, the wire bonding end of the wire must be used for wire bonding processing. The center distance of the conductor is increased to match the above structure. In this way, when the current flows, the capacitive coupling between the welding end conductors is reduced, thereby causing the characteristic impedance of the wire processing section to become higher, and when the impedance is increased, the transmission of the signal is inevitably affected. quality.

Therefore, how to design a new high-frequency cable connector structure to reduce the influence of high-frequency impedance during wire bonding processing has become an important issue.

Therefore, the purpose of the present invention is to provide a high-frequency cable connector structure, which utilizes the design of the wire frame to adjust the center distance of the conductor of the signal wire soldering end to solve the problem of the influence of the characteristic impedance during the welding process of the high-frequency cable.

The present invention provides a high frequency cable connector structure, which includes a casing, a plurality of terminals, an end cover, a wire frame, and a plurality of cables. The housing includes a plurality of first holes. The end cover includes a plurality of solder pads and a plurality of second holes respectively corresponding to the first holes, and two ends of the terminals are respectively inserted into the corresponding first holes and the second holes and connected to the respective holes The corresponding solder pad. The wire rack includes a plurality of card slots. The two conductors of the soldering end of each of the cables are respectively inserted into the corresponding ones of the wire slots of the wire frame and soldered to the corresponding pads. One of the pads has a center distance greater than a center distance of each of the card slots for accommodating each of the conductors.

According to an embodiment of the present invention, the end cover further includes at least one fastening component, and the wire frame further includes at least one corresponding card slot, and the end cover is buckled to the card slot via the fastening component.

According to an embodiment of the present invention, each of the cables includes at least one first signal line and at least one second signal line.

According to an embodiment of the present invention, the first signal line is a USB 3.0 signal line, and the second signal line is a USB 2.0 signal line.

According to the embodiment of the present invention, the center distance of each of the card slots of the conductors for receiving the soldering ends of the first signal line is smaller than the center distance of the pads.

According to an embodiment of the present invention, a center distance of one of the adjacent two wires of the one of the first signal lines is smaller than each of the wires of the conductors for receiving the soldering end of the first signal line. The center distance of the slot.

According to an embodiment of the present invention, the center distance of each of the card slots of the conductors for receiving the soldering ends of the second signal line is smaller than the center distance of the pads.

According to an embodiment of the present invention, one of the second signal lines is not soldered The center distance of one of the adjacent two wires is smaller than the center distance of each of the wire slots of the respective conductors of the soldering end for accommodating the second signal line.

The present invention further provides a high-frequency cable connector structure, which includes a casing, a plurality of terminals, an end cover, a wire frame, at least one first signal wire, and at least a second signal wire. The housing includes a plurality of first holes. The end cover includes a plurality of solder pads and a plurality of second holes respectively corresponding to the first holes, and two ends of the terminals are respectively inserted into the corresponding first holes and the second holes and connected to the respective holes The corresponding solder pad. The wire rack includes a plurality of card slots. The first conductor of the soldering end of one of the first signal lines is inserted into each of the corresponding card slots on the wire frame and soldered to each of the corresponding pads. The second conductor of the soldering end of the second signal line is inserted into each of the corresponding card slots on the wire frame and soldered to each of the corresponding pads. One of the pads has a center distance greater than a center distance of each of the card slots for accommodating the first conductors and a center distance of each of the card slots for accommodating the second conductors.

According to an embodiment of the present invention, the end cover further includes at least one fastening component, and the wire frame further includes at least one corresponding card slot, and the end cover is buckled to the card slot via the fastening component.

According to an embodiment of the present invention, the first signal line is a USB 3.0 signal line, and the second signal line is a USB 2.0 signal line.

According to an embodiment of the present invention, a center distance of one of the adjacent two wires of the non-welding end of the first signal line is smaller than a center distance of each of the card slots for accommodating each of the first conductors.

According to an embodiment of the present invention, a center distance of one of the adjacent two wires of the non-welding end of the second signal line is smaller than the center distance of each of the card slots for accommodating the second conductor.

Compared with the prior art, the high frequency cable connector structure of the present invention is adjusted to be smaller than the center distance of the adjacent pads by adjusting the center distance of adjacent card slots on the wire frame, but whether it is in USB2. In the case of a 0 signal line or a USB 3.0 signal line, it is still larger than the center distance of the adjacent USB 3.0 signal line or The center distance of the adjacent wires of the USB2.0 signal line. Therefore, the conductor of the soldering end of the USB3.0 signal wire and the conductor of the soldering end of the USB2.0 signal wire can still be aligned and soldered to the corresponding pads to complete the necessary electricity. connection. It is not necessary to increase the center distance of the signal wire soldering end conductor in order to match the center distance of the bonding pad as in the conventional technique. In this way, when the current flows, the center distance of the soldering end conductor of the adjacent USB3.0 signal line and the center distance of the soldering end conductor of the adjacent USB2.0 signal line are not enlarged, so the adjacent end of the soldering end conductor The coupling capacitance between them does not decrease, and the characteristic impedance of the wire processing section does not become high, thereby reducing the influence of the wire bonding process on the high-frequency impedance and improving the transmission quality of the high-speed signal.

1, 100‧‧‧High frequency cable connector structure

11, 101‧‧‧ shell

1011, 1032‧‧ hole

12, 102‧‧‧ terminals

13, 103‧‧‧ end caps

131, 1031‧‧‧ solder pads

1033‧‧‧Snap fasteners

1021‧‧‧Weld Department

1022‧‧‧Contacts

14, 104‧‧‧ wire rack

141, 1041‧‧‧ card slot

1042‧‧‧ card slot

15, 105‧‧‧ cable

1051‧‧‧USB3.0 signal line

1052‧‧‧USB2.0 signal line

10511, 10521‧‧‧ conductor

10512, 10522‧‧‧ wire

1 is a front perspective view of a conventional high frequency cable connector structure in which a cable is not assembled; and FIG. 2 is a rear perspective view of a conventional high frequency cable connector structure in which a cable is not assembled. Figure 3A is a top view of the high-frequency cable connector structure of the prior art after assembling the cable; Figure 3B is a cross-sectional view of the high-frequency cable connector structure of Figure 3A taken along line 3-3 ' ; 4A is a top view of the high frequency cable connector structure of the prior art after assembling the cable; FIG. 4B is a cross-sectional view of the high frequency cable connector structure of FIG. 4A along the line 4-4 ′ ; 5A is a front view of a high-frequency cable connector structure according to an embodiment of the present invention; FIG. 5B is a front exploded view of the high-frequency cable connector structure of FIG. 5A; FIG. 6A is a creative embodiment of the present invention FIG. 6B is a rear exploded view of the high frequency cable connector structure of the present embodiment; FIG. 7 is a high frequency cable connector structure of FIG. 5A FIG. 8A is a top view of the high frequency cable connector structure of the present embodiment after assembling the cable; FIG. 8B is the height of FIG. 8A A cross-sectional view of the frequency cable connector structure along the line 8-8 ' ; FIG. 9A is a top view of the high frequency cable connector structure of the present embodiment after assembling the cable; FIG. 9B is a height of FIG. 9A A cross-sectional view of the frequency cable connector structure along section line 9-9 ' ;

The following description of the various embodiments is provided to illustrate the specific embodiments in which the present invention may be practiced. Directional terms mentioned in this creation, such as "upper", "lower", "before", "after", "left", "right", "top", "bottom", "level", "vertical", etc. , just refer to the direction of the additional schema. Therefore, the directional terminology used is used to describe and understand the creation, and is not intended to limit the creation.

Please refer to FIG. 5A, FIG. 5B and FIG. 6A and FIG. 6B. FIG. 5A is a front combined view of a high frequency cable connector structure according to an embodiment of the present invention, and FIG. 5B is a high frequency cable connection of FIG. 5A. A front exploded view of the structure of the high frequency cable connector of the present embodiment is shown in FIG. 6A, and a rear exploded view of the high frequency cable connector structure of the present embodiment is shown in FIG. 6B. As shown in FIG. 5B, the high frequency cable connector 100 of the present invention includes a housing 101, a plurality of terminals 102, an end cover 103, a wire frame 104, and a plurality of cables 105. The end cap 103 is an insulating material and is a soldering portion 1021 for supporting the front end of the terminal 102. It is also possible to prevent the colloid from filling the contact portion 1022 at the rear end of the terminal 102 when the wire is formed. At the time of assembly, the rear ends of the terminals 102 are respectively inserted into the corresponding holes 1011 of the outer casing 101, and then the front ends of the terminals 102 are respectively inserted into the corresponding holes 1032 of the end cover 103 (refer to FIG. 6) until The soldering portions 1021 at the front ends of the terminals 102 are respectively in contact with and connected to the corresponding pads 1031 of the end caps 103. It can be understood that the hole 1011 in the outer casing 101 and the hole 1032 in the end cover 103 restrict the terminal 102 from both ends of the terminal 102 and fix the position of the terminal 102, which not only facilitates assembly, but also facilitates assembly. The terminal 102 is easily in contact with the pad 1031. On the other hand, each cable 105 is inserted into a corresponding card slot 1041 of the cable holder 104, and then the soldering ends 1051 of the cables 105 inserted into the card slots 1041 are soldered to the corresponding pads. On the 1031, and through the snap member 1033 on the end cover 103, the end cover 103 is snapped to the card slot 1042 on the wire frame 104 (please refer to FIG. 6) to complete the assembly. It will also be appreciated that the card slot 1041 limits the position of the cable 105 so that each cable 105 can be easily aligned to the corresponding pad 1031 during assembly. In addition, the number of the latching member 1033 and the card slot 1042 is not limited to two as shown.

Please refer to Figures 5A, 5B and 7 together. Figure 7 is an enlarged view of the structure of the high frequency cable connector of Figure 5A. As shown in Figures 5A and 7, the high frequency cable connector structure 101 is a hybrid cable connector structure, and the so-called hybrid cable connector structure, that is, the cable 105 includes USB3. The 0 signal line 1051 and the USB2.0 signal line 1052 are therefore more flexible in application because they are compatible with the specifications of USB 3.0 and USB 2.0. Meanwhile, please refer to FIG. 5B. The USB3.0 signal line 1051 is covered with an insulating layer except that the soldering end includes two conductors 10511. The USB 2.0 signal line 1052 is covered with an insulating layer except that the soldering end includes two conductors 10521. When the cables 105 are respectively inserted into the corresponding card slots 1041 of the bobbin 104, the card slot 1041 on the bobbin 104 contacts and holds the insulating layers of the USB 3.0 signal line 1051 and the USB 2.0 signal line 1052. In addition, the cable 105 has only a grounding wire (without an insulating layer) positioned by the conductors placed in the card slot 1041.

Please refer to FIG. 8A and FIG. 8B. FIG. 8A is a top view of the high frequency cable connector structure of the present invention after assembling the cable, and FIG. 8B is a high frequency cable connector structure along the 8A. Sectional view of the line 8-8 ' . In Fig. 8B, the cable 105 is not shown for the purpose of clarity of display. As shown in FIG. 8A, since the section line 8-8 ' is cut vertically downward along the pad 1031 on the end cap 103, the center distance b' of the pad 1031 can be clearly shown in FIG. 8B, and b' It is 2mm. Please refer to FIG. 7 together, because the USB3.0 signal line 1051 and the USB2.0 signal line 1052 are all accommodated in the corresponding card slot 1041, and the center of the conductor 10511 or the conductor 10521 of the soldering end is aligned with The center of the card slot 1041, therefore, by measuring the center distance of the conductor 10511 or the conductor 10521, can reflect the center distance of the card slot 1041. As shown in FIG. 8B, according to the actual situation, the center distance of the card slot 1041 for accommodating the USB3.0 signal line 1051 is a', and a' is 1.27 mm, and the card of the USB2.0 signal line 1052 is accommodated. The center distance of the wire groove 1041 is a", and a" is 1.62 mm.

Please refer to FIG. 9A and FIG. 9B again. FIG. 9A is a top view of the high frequency cable connector structure of the present embodiment, and FIG. 9B is a high frequency cable connector structure of FIG. 9A. A section along the line 9-9 ' . As shown in Fig. 9A, since the section line 9-9 ' is cut vertically downward along the portion of the non-welded end of the cable 105 (i.e., the non-welded end of the USB3.0 signal line 1051 and the USB 2.0 signal line 1052), Therefore, Figure 9B clearly shows the center distance c' of the adjacent two wires 10512 of the USB3.0 signal line 1051, and the center distance c" of the adjacent two wires 10522 of the USB2.0 signal line 1052, and c' is 0.7. Mm, c" is 0.9 mm. That is, in the high-frequency cable connector structure 100 of the present invention, the center distance of the adjacent card slot 1041 is smaller than the center distance of the adjacent pads 1031, and the center of the adjacent USB3.0 signal line 1051 the wire 10512 The distance between the distance and the center distance of the adjacent USB2.0 signal line 1052 wire 10522 is smaller than the center distance of the adjacent card slot 1041, but the conductor of the soldering end of the USB3.0 signal line 1051 and the conductor of the USB2.0 signal line 1052. 10521, still can be aligned and soldered to the corresponding pad 1031 to complete the necessary electrical connection, without having to increase the center distance of the soldering end conductor of the signal line 15 to match the pad 131 as in the prior art. Center distance.

In this way, when the current flows, since the center distance of the soldering end conductor 10511 of the adjacent USB3.0 signal line 1051 and the center distance of the soldering end conductor 10521 of the adjacent USB2.0 signal line 1052 are not increased, the soldering is performed. The coupling capacitance between the adjacent conductors 10511 or the adjacent conductors 10521 is not lowered, and the characteristic impedance of the wire processing section is not increased, and since the impedance is not increased, the quality of the signal transmission will not be unaffected.

In addition, this creation can be applied to shielded twisted pair or unshielded Twisted pair. The former is shielded by a layer of aluminum foil or metal layer between the stranded wire and the outer skin, so the ability to resist electromagnetic interference is better, the latter is the twisted pair twisted state, but without the aforementioned shielding protective layer, so there is no interference prevention. effect. In addition to this, the outer casing and the end cap can be designed as an integral structure and manufactured by means of integral molding, and are not limited to the manner in which two separate components are formed in the present embodiment.

In summary, the high-frequency cable connector structure of the present invention is adjusted to be smaller than the center distance of the adjacent pads by adjusting the center distance of adjacent card slots on the wire frame, but whether it is in the USB2.0 signal In the case of a line or a USB3.0 signal line, it is still larger than the center distance of the adjacent wire of the corresponding USB3.0 signal line or the center distance of the adjacent wire of the USB2.0 signal line. Therefore, the USB3.0 signal line is soldered. The conductor of the end and the conductor of the soldered end of the USB2.0 signal wire can still be soldered to the corresponding pad to complete the necessary electrical connection. It is not necessary to increase the center distance of the signal wire soldering end conductor in order to match the center distance of the bonding pad as in the conventional technique. In this way, when the current flows, the center distance of the soldering end conductor of the adjacent USB3.0 signal line and the center distance of the soldering end conductor of the adjacent USB2.0 signal line are not enlarged, so the adjacent end of the soldering end conductor The coupling capacitance between them does not decrease, and the characteristic impedance of the wire processing section does not become high, thereby reducing the influence of the wire bonding process on the high-frequency impedance and improving the transmission quality of the high-speed signal.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application.

1031‧‧‧ solder pads

Claims (13)

A high frequency cable connector structure, comprising: a casing, the casing comprising a plurality of first holes; a plurality of terminals; an end cover, the end cover comprising a plurality of pads and a plurality of corresponding corresponding to a second hole of each of the first holes, two ends of each of the terminals are respectively inserted into the corresponding first holes and the second holes and connected to the corresponding pads; a wire frame, the wire frame includes a plurality of a card slot; and a plurality of cables, wherein the two conductors of the soldering end of each of the cables are respectively inserted into the corresponding slot of the cable holder and soldered to each of the corresponding pads; The center distance of one of the pads is greater than the center distance of one of the card slots for accommodating each of the conductors. The high frequency cable connector structure of claim 1, wherein the end cover further comprises at least one snap member, the wire frame further comprising at least one corresponding card slot, wherein the end cover is The snap fastener is snapped to the card slot. The high frequency cable connector structure of claim 1, wherein each of the cables comprises at least one first signal line and at least one second signal line. The high frequency cable connector structure of claim 3, wherein the first signal line is a USB 3.0 signal line, and the second signal line is a USB 2.0 signal line. The high-frequency cable connector structure of claim 3, wherein the card slot of each of the conductors of the soldering end of the first signal line is received therein The center distance is less than the center distance of the respective pads. The high-frequency cable connector structure according to claim 5, wherein one of the first signal wires and one of the adjacent two wires of the non-welding end has a center distance smaller than that for accommodating the first signal line. The center distance of each of the card slots of each of the conductors of the soldering end. The high-frequency cable connector structure according to claim 3, wherein the center distance of each of the card slots of the conductors for receiving the soldering ends of the second signal lines is smaller than the The center distance of the pad. The high-frequency cable connector structure of claim 7, wherein a center distance of one of the adjacent two wires of the non-welded end of the second signal line is smaller than that for accommodating the second signal line. The center distance of each of the card slots of each of the conductors of the soldering end. A high frequency cable connector structure, comprising: a casing, the casing comprising a plurality of first holes; a plurality of terminals; an end cover, the end cover comprising a plurality of pads and a plurality of corresponding corresponding to a second hole of each of the first holes, two ends of each of the terminals are respectively inserted into the corresponding first holes and the second holes and connected to the corresponding pads; a wire frame, the wire frame includes a plurality of a card slot; at least one first signal line, wherein the first conductor of the soldering end of the first signal line is inserted into each of the corresponding card slots on the bobbin and soldered to each of the corresponding pads; At least one second signal line, the second conductor of the soldering end of the second signal line is inserted into each of the corresponding card slot on the wire frame and soldered to each of the corresponding pads; one of the partial pads The center distance is greater than a center distance of each of the card slots for accommodating the first conductors and a center distance of each of the card slots for accommodating the second conductors. The high frequency cable connector structure of claim 9, wherein the end cover further comprises at least one fastening component, the wire frame further comprising at least one corresponding card slot, the end cover is The snap fastener is snapped to the card slot. The high frequency cable connector structure according to claim 9, wherein the first signal line is a USB 3.0 signal line, and the second signal line is a USB 2.0 signal line. The high-frequency cable connector structure according to claim 9, wherein one of the first signal wires and one of the adjacent two wires of the non-welding end has a center distance smaller than that for accommodating the first conductors. The center distance of each of the card slots. The high-frequency cable connector structure according to claim 9, wherein a center distance of one of the adjacent two wires of the non-welded end of the second signal line is smaller than each of the second conductors for accommodating the second conductor The center distance of the card slot.