TWI483659B - Electronic apparatus and manufacture method for casing thereof - Google Patents

Description

Electronic device and its casing structure manufacturing method

The present invention relates to an electronic device and a method for fabricating the same, and more particularly to an electronic device having a structure for preventing electromagnetic interference and electrostatic discharge and a method for fabricating the same.

With the development of technology, many consumer electronic devices have appeared on the market, such as mobile phones, tablet PCs, and notebook computers. These electronic devices not only facilitate people's lives, but also play an indispensable role in the lives of people.

Taking a notebook computer as an example, in the prior art, in order to enable the notebook computer to have functions of preventing electromagnetic-electromagnetic interference (EMI) and electro-static discharge (ESD), in a notebook computer A plurality of conductive gaskets (gaskets) as grounding ends are usually attached to the inside of the casing, such as metal gaskets or conductive cloths. After the conductive pads contact the conductive housing or conductive foil of the electronic component, the electronic components can be grounded through the conductive pads.

However, since the conductive gasket not only has a high production cost, but also is time consuming to assemble, the use of the conductive gasket increases the production cost of the notebook computer.

The present invention provides an electronic device and a method of fabricating the same, which have a structure for preventing electromagnetic interference and electrostatic discharge which is easy to manufacture and install.

The invention provides an electronic device comprising a casing structure and an electronic component. The casing structure includes a top plate and a spring arm. The top plate has a first surface, a buttonhole on the first surface, and a first conductive layer. The elastic arm has a body, a fixed end and a snap end. The fixed end is disposed on the first surface. The body has a second conductive layer. The buckle end is detachably snapped into the buckle hole to connect the second conductive layer to the first conductive layer. The electronic components are disposed within the housing structure. The second conductive layer of the body abuts on the electronic component such that the electronic component, the second conductive layer and the first conductive layer are electrically connected to each other.

The invention provides a method for manufacturing a casing structure. The casing structure includes a top plate and a spring arm. The top plate has a first surface and a buttonhole located on the first surface. The elastic arm has a body, a fixed end and a snap end. The fixed end is disposed on the first surface. The snap end extends away from the first surface. The manufacturing method of the casing structure comprises: bending the body to buckle the buckle end into the buckle hole, and arranging the conductive layer on the first surface and the elastic arm.

In an embodiment of the invention, the body is bent and has opposite second and third surfaces. The third surface faces the top plate and the second surface faces away from the top plate and abuts the electronic components. The second conductive layer is disposed on the second surface.

In an embodiment of the invention, the top plate further has a third conductive layer on the first surface. The first conductive layer and the third conductive layer are separated by a spring arm and a buttonhole. The second conductive layer is connected between the first conductive layer and the third conductive layer.

In an embodiment of the invention, the second conductive layer protrudes from the first surface.

In an embodiment of the invention, the casing structure further includes a bottom Board, assembled to the top plate. The electronic component is located between the top plate and the bottom plate. Electronic components include circuit boards and connectors. The board is placed on the backplane. The connector is disposed on the circuit board and the second conductive layer abuts on the connector.

In an embodiment of the invention, the body has an opposite second surface and a third surface. When the buckle end is not buckled to the buckle hole, the body is erected on the first surface, the second surface is opposite to the buckle hole, and the third surface is located between the buckle hole and the second surface. When the snap end is snapped into the buckle hole, the third surface faces the top plate, the second surface faces away from the top plate, and the conductive layer is partially disposed on the second surface.

In an embodiment of the invention, when the snap end is snapped into the buckle hole, the second surface is coupled to the first surface and protrudes from the first surface.

Based on the above, the casing structure of the present invention can be bent and fastened to the elastic arm of the buckle hole, and after the bending, the conductive layer is disposed thereon, so that the electronic component can be mounted to make the elastic arm abut on the electronic component. on. In this way, the conductive layer on the elastic arm, the conductive layer on the top plate and the electronic component can achieve the electrical connection effect, so that the static electricity in the electronic device is guided outside the casing structure. Moreover, the position and type of the elastic arm in the casing structure can be changed according to the configuration conditions of the electronic component, thereby having a better applicable range, and at the same time effectively reducing the cost required for additionally providing the conductive component to improve Production efficiency of the casing structure.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a perspective view of an electronic device according to an embodiment of the present invention. Figure 2 is A partial cross-sectional view of the electronic device of Fig. 1 taken along line I-I. Referring to FIG. 1 and FIG. 2 , in the embodiment, the electronic device 100 is, for example, a notebook computer, and includes a casing structure 110 and an electronic component 120 disposed therein. The casing structure 110 is a notebook computer. The host part, and the electronic component 120 is a connector module disposed in the host, such as a universal serial bus (USB) connection module, or a network connection module (such as RJ45), but this embodiment does not Limited.

In view of the above, the casing structure 110 has a top plate 112 and a bottom plate 114 that are assembled to each other, and a spring arm 116 that is disposed on the top plate 112. The electronic component 120 is positioned between the top plate 112 and the bottom plate 114. Further, the electronic component 120 includes a circuit board 122 disposed on the backplane 114, and a connector 124 disposed on the circuit board 122, and the connector 124 exposes the chassis structure 110 from the lateral opening 112a of the top panel 112.

Referring to FIG. 2 again, the top plate 112 has a first surface S1 and a fourth surface S4 opposite to each other, wherein the first surface S1 faces the bottom plate 114, and the fourth surface S4 is used to carry the input module 130 (eg, a keyboard). In the embodiment, the top plate 112 further has a button hole 112b on the first surface S1 and the first conductive layer C1, wherein the first conductive layer C1 is plated on the first surface by sputtering, for example. On S1.

Furthermore, the elastic arm 116 has a body 116a, a fixed end E1 and a latching end E2, wherein the body 116a is fixed on the first surface S1 by the fixed end E1, and the latching end E2 is detachably snapped to the latching hole 112b. So that the body 116a presents an arc-shaped bent structure with the fixed end E1 and the snap end E2 as supporting points and protruding from the first surface S1. Further, the body 116a has opposite to each other The second surface S2 and the third surface S3, the second surface S2 faces away from the first surface S1 toward the bottom plate 114, and the third surface S3 faces the first surface S1 and faces away from the bottom plate 114.

The body 116a also has a second conductive layer C2 positioned on the second surface S2, similar to the first conductive layer C1, on which the conductive material is plated. When the latching end E2 is snapped to the latching hole 112b, the first conductive layer C1 and the second conductive layer C2 are connected to each other. It is worth mentioning that when the electronic component 120 is assembled into the casing structure 110, the elastic arm 116 located at the first surface S1 of the top plate 112 will press against the connector 124 with its second surface S2, thereby The connector 124, the second conductive layer C2 located on the second surface S2, and the first conductive layer C1 located on the first surface S1 are electrically connected to each other to be electrically conductive. Accordingly, static electricity inside the electronic device 100 can be guided out of the casing structure 110 via the above-described conduction path. This allows the electronic device 100 to reduce the configuration requirements of the conductive pads compared to the conventional electronic device, and can shorten the assembly man-hour and reduce the amount of parts, thereby reducing the production cost of the electronic device 100.

On the other hand, the top plate 112 further has a third conductive layer C3 located on the first surface S1, and the first conductive layer C1 and the third conductive layer C3 are separated by the elastic arm 116 and the button hole 112b, and the second conductive layer C2 is separated. Connected between the first conductive layer C1 and the third conductive layer C3. In the present embodiment, the third conductive layer C3 provides another conductive path for conducting static electricity from the connector 124 out of the housing structure 110. At the same time, in a state where the first conductive layer C1, the second conductive layer C2, and the third conductive layer C3 are electrically connected to each other, the charge conduction flux can also be improved to improve the conduction performance of the casing structure 110 for electrostatic charges.

3 is a flow chart showing the fabrication of a casing structure according to an embodiment of the present invention. 4A and 4B are schematic views respectively showing the flow of FIG. 3. Please refer to FIG. 3, FIG. 4A and FIG. 4B at the same time, wherein related components have been described in the above embodiments, and details are not described herein again.

In the present embodiment, after the designer determines that the connector 124 is disposed in the position within the casing structure 110, the position of the elastic arm 116 on the top plate 112 can be designed accordingly. In addition, the designer can also provide a plurality of elastic arms 116 on the first surface S1 of the top plate 112 to correspond to the position where the connector 124 may be disposed, which also achieves the above effects.

Accordingly, after the casing structure 110 is fabricated, the elastic arm 116 located on the first surface S1 of the top plate 112 will be as shown in FIG. 4A, and its fixed end E1 is on the first surface S1, and its card The buckle end E2 is elongated by the first surface S1 toward the bottom plate 114. Furthermore, the second surface S2 of the body 116a faces away from the buckle hole 112b, and the third surface S3 of the body 116a faces the top plate 112 with one of the buckle holes 112b, that is, the third surface S3 is located at the second surface S2 and the buckle hole 112b. between.

Therefore, before the electronic component 120 is assembled in the casing structure 110, the body 116a of the elastic arm 116 is first bent in step S110 to buckle the buckle end E2 into the buckle hole 112b. Next, in step S120, the conductive layer is disposed on the first surface S1 of the top plate 112 and the elastic arm 116 by, for example, sputtering. At this time, since the third surface S3 of the elastic arm 116 and the portion of the first surface S1 are shielded by the bending of the body 116a, there is no conductive layer, that is, the conductive layer is only disposed on the top plate 112. A portion of a surface S1 and a second surface S2 of the elastic arm 116. Easy here It is understood that the conductive layer is further divided into the third conductive layer C3 on the left side of the top plate 112, the second conductive layer C2 on the second surface S2 of the elastic arm 116, and the second side on the right side of the top plate 112, in accordance with the foregoing embodiment. A conductive layer C1 in which the left side and the right side are defined by the elastic arms 116 of FIG. 4A or 4B as a center.

At this point, the casing structure 110 is ready for assembly. Next, in step S130, the electronic component 120 is assembled in the casing structure 110, wherein the elastic arm 116 is pressed against the connector 124 to make the connector 124 and the conductive layer on the elastic arm 116, on the first surface S1. The conductive layers are electrically connected to each other. In other words, when the electronic component 120 is assembled into the casing structure 110, the body 116a bent by the elastic arm 116 is pressed against the connector 124 (shown in FIG. 2), and the conductive layers C1 to C3 are made. An electrical conduction effect is produced between the connector 124 and the connector 124. At the same time, the bent body 116a can still be used as the positioning connector 124, and there is no need to worry about the occurrence of falling off between the connector 124 and the second conductive layer C2 due to the vibration of the casing structure 110, and also the connector 124. A buffering effect is maintained between the top plate 112 and an appropriate distance. In addition, the height of the connector 124 in the casing structure 110 can be avoided when the production line is assembled, because the elastic arm 116 having the cushioning effect can effectively cover the connector 124 during manufacture or assembly. Height tolerance.

In summary, the present invention utilizes a conductive layer disposed on the housing and the elastic arm, wherein the elastic arm protrudes from the top plate by the fixed end and the snap end as a support, so that the second conductive layer can abut on the connector. And further electrically connecting the second conductive layer and the first and third conductive layers on the top plate to make the electronic component The static charge can be effectively conducted outside the casing structure via this path. Compared with the conventional electronic device, the casing structure of the present invention can shorten the assembly man-hour and reduce the amount of parts by the above configuration, thereby reducing the production cost of the electronic device.

In addition, the spring arm is supported by the buckle end and the fixed end, so that the connector can be pressed against the connector with a relatively stable structure, and the connector can be provided in addition to maintaining a stable connection relationship with the connector. The cushioning effect between the structure and the casing.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Electronic devices

110‧‧‧Shell structure

112‧‧‧ top board

112a‧‧‧ lateral opening

112b‧‧‧ buttonhole

114‧‧‧floor

116‧‧‧Bounce arm

116a‧‧‧ Ontology

120‧‧‧Electronic components

122‧‧‧ boards

124‧‧‧Connector

130‧‧‧Input module

C1‧‧‧First Conductive Layer

C2‧‧‧Second conductive layer

C3‧‧‧ third conductive layer

E1‧‧‧ fixed end

E2‧‧‧ buckle end

S1‧‧‧ first surface

S2‧‧‧ second surface

S3‧‧‧ third surface

S4‧‧‧ fourth surface

1 is a perspective view of an electronic device according to an embodiment of the present invention.

Figure 2 is a partial cross-sectional view of the housing of Figure 1 taken along line I-I.

3 is a flow chart showing the fabrication of a casing structure according to an embodiment of the present invention.

4A and 4B are schematic views respectively showing the flow of FIG. 3.

110‧‧‧Shell structure

112‧‧‧ top board

112a‧‧‧ lateral opening

112b‧‧‧ buttonhole

114‧‧‧floor

116‧‧‧Bounce arm

116a‧‧‧ Ontology

120‧‧‧Electronic components

122‧‧‧ boards

124‧‧‧Connector

130‧‧‧Input module

C1‧‧‧First Conductive Layer

C2‧‧‧Second conductive layer

C3‧‧‧ third conductive layer

E1‧‧‧ fixed end

E2‧‧‧ buckle end

S1‧‧‧ first surface

S2‧‧‧ second surface

S3‧‧‧ third surface

S4‧‧‧ fourth surface

Claims (6)

An electronic device comprising: a casing structure, comprising: a top plate having a first surface, a button hole located on the first surface, a first conductive layer and a third conductive layer, the third conductive layer Positioned on the first surface; a spring arm having a body, a fixed end and a snap end, the body being bent and having an opposite second surface and a third surface, the second surface facing away from The top plate has a third surface facing the top plate, the fixed end is disposed on the first surface, the body has a second conductive layer disposed on the second surface, and the second conductive layer is coupled to the first conductive layer The first conductive layer and the third conductive layer are separated from the buckle hole by the elastic arm, and the buckle end is detachably snapped into the buckle hole to make the second a conductive layer is connected to the first conductive layer; and an electronic component is disposed in the casing structure, the second surface abuts the electronic component, and the second conductive layer of the body abuts on the electronic component Electrically connecting the electronic component, the second conductive layer and the first conductive layer to each other . The electronic device of claim 1, wherein the second conductive layer protrudes from the first surface. The electronic device of claim 1, wherein the casing structure further comprises a bottom plate assembled to the top plate, and the electronic component is located between the top plate and the bottom plate, the electronic component comprising: a circuit board , disposed on the bottom plate; A connector is disposed on the circuit board, and the second conductive layer abuts on the connector. A method for manufacturing a casing structure, the casing structure comprising a top plate and a spring arm, the top plate having a first surface and a buckle hole on the first surface, the elastic arm having a body and a fixed end And a buckle end, wherein the fixed end is disposed on the first surface, the buckle end extends away from the first surface, and the casing structure is formed by: bending the body to buckle the buckle end Fastening into the buckle hole; and arranging a conductive layer on the first surface and the elastic arm. The manufacturing method of the casing structure of claim 4, wherein the body has an opposite second surface and a third surface, and when the buckle end is not buckled to the buckle hole, the body is The first surface is disposed on the first surface, the second surface is opposite to the buckle hole, and the third surface is located between the buckle hole and the second surface. When the buckle end is snapped into the buckle hole, the The third surface faces the top plate, the second surface faces away from the top plate, and the conductive layer is partially disposed on the second surface. The method of manufacturing the casing structure of claim 5, wherein the second surface is coupled to the first surface and protrudes from the first surface when the buckle end is snapped into the buckle hole.