TWI488559B - Casing structure and manufacture method thereof - Google Patents

Description

Case structure and manufacturing method thereof

The present invention relates to a casing structure and a method of fabricating the same, and more particularly to a casing structure of an electronic device and a method of fabricating the same.

With the development of technology, many consumer electronic devices have appeared on the market, such as mobile phones, tablet PCs, and notebook computers. These electronic devices not only facilitate people's lives, but also play an indispensable role in the lives of people.

Taking a notebook computer as an example, in the prior art, in order to enable the notebook computer to have functions of preventing electromagnetic-electromagnetic interference (EMI) and electro-static discharge (ESD), in a notebook computer A plurality of conductive gaskets (gaskets) as grounding ends are usually attached to the inside of the casing, such as metal gaskets or conductive cloths. After the conductive pads contact the conductive housing or conductive foil of the electronic component, the electronic components can be grounded through the conductive pads.

However, since the conductive gasket not only has a high production cost, but also is time consuming to assemble, the use of the conductive gasket increases the production cost of the notebook computer.

The present invention provides a casing structure having a structure that is easy to install and inexpensive to prevent electromagnetic interference and electrostatic discharge.

The present invention provides a method of fabricating a casing structure that can produce a casing structure that is easy to install and inexpensive to prevent electromagnetic interference and electrostatic discharge.

The invention provides a casing structure comprising a casing and a back cover. The housing includes a bottom plate, a spring arm, a snap member and a first conductive layer. The bottom plate has an opening. The snap member is disposed on the bottom plate and is located beside the opening. The elastic arm is detachably snapped over the snap member across the opening. The elastic arm has a pressing portion. The first conductive layer is disposed on the bottom plate, the elastic arm and the snap member. The back cover is assembled to the housing to shield the opening. The back cover has a second conductive layer facing the housing. The pressing portion is pressed against the back cover through the opening to electrically connect the first conductive layer and the second conductive layer.

The invention provides a method for manufacturing a casing structure. The casing structure comprises a casing and a back cover, wherein the casing comprises a bottom plate, an elastic arm and a snap member. The bottom plate has an opening. The elastic arm and the snap member are disposed on the bottom plate and are located on opposite sides of the opening. The manufacturing method of the casing structure comprises: arranging the first conductive layer on the bottom plate, the elastic arm and the snap member. Next, the second conductive layer is disposed on the back cover. Next, the spring arm is bent so that the spring arm spans the opening and snaps to the snap member. Finally, the back cover is assembled to the casing, wherein the pressing portion of the elastic arm passes through the opening and is pressed against the back cover to electrically connect the first conductive layer and the second conductive layer to each other.

In an embodiment of the invention, the elastic arm has a body that spans the opening and a button hole that is located on the body. The pressing portion has a first fixed end and a first snap end. The first fixed end is disposed on the body. The first snap end extends from the first fixed end and is detachably snapped to the buckle hole to form a hollow closed contour of the pressing portion and the body.

In an embodiment of the invention, the body further has a second fixed end and a second snap end. The second fixed end is disposed on the bottom plate, and the second fixed end and the latching member are located on opposite sides of the opening. The second buckle end is detachably snapped to the buckle. The pressing portion is between the second fixed end and the second snap end.

In an embodiment of the invention, the pressing portion further has a first surface disposed between the first fixed end and the first snap end and abutting on the second conductive layer of the back cover. A portion of the first conductive layer is on the first surface.

In an embodiment of the invention, the body further has a second surface and a third surface located at the second snap end. The second surface is coupled between the third surface and the first surface. The snap member has a fourth surface that abuts against the third surface. A portion of the first conductive layer is located on the second surface, the third surface, and the fourth surface, respectively.

In an embodiment of the invention, the bottom plate and the back cover are at an angle to form a gap. A portion of the pressing portion passes through the opening and is located in the gap to abut the second conductive layer of the back cover.

In an embodiment of the invention, the elastic arm has a body, a branch and a button hole located on the body. The branch has a first fixed end and a first snap end. The first fixed end is disposed on the body, and the first snap end extends from the first fixed end. The manufacturing method of the casing structure further includes: bending the branch before the first conductive layer is disposed on the elastic arm, so that the first buckle end is buckled to the buckle hole to form the pressing portion.

In an embodiment of the invention, the body has a second fixed end and a second snap end. The second fixed end is disposed on the bottom plate, and the first fixed end and the buckle hole are located between the second fixed end and the second buckle end. When the elastic arm is not buckled to the latching member, the first latching end and the second latching end extend away from the bottom plate in the same direction of each other.

In an embodiment of the invention, the branch has a first surface. The body has a second surface and a third surface that are located at the second snap end and are connected to each other. The snap member has a fourth surface. When the first snap end is snapped to the buckle hole, The first surface is coupled to the second surface. When the spring arm is snapped to the buckle, the fourth surface abuts against the third surface.

Based on the above, the housing and the back cover of the present invention respectively have a conductive layer, and the housing further has a spring arm that passes through the opening of the bottom plate. When the housing and the back cover are assembled with each other, the elastic arm can be pressed against the back cover. In turn, the conductive layers on the housing and the back cover are electrically connected to each other. Therefore, the casing structure of the present invention does not need to be separately provided with a conductive member to be connected between the back cover and the bottom plate, thereby reducing the assembly man-hour and the number of parts of the electronic device, thereby reducing the production cost of the electronic device.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a schematic view of a casing structure applied to an electronic device according to an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the casing structure 100 is applicable to the electronic device 10 , for example, a notebook computer, and the casing structure 100 belongs to the main body portion of the notebook computer, but is not limited thereto. The casing structure 100 of the present embodiment is used to guide the static electricity in the electronic device 10 to the outside to avoid electromagnetic interference or electrostatic discharge affecting the operation of the electronic components (not shown) of the electronic device 10.

2 is a partial schematic view of the housing structure of FIG. 1. It should be noted that FIG. 2 is a view from the inside to the outside of the casing structure. Referring to FIG. 1 and FIG. 2 simultaneously, the casing structure 100 includes a casing 110 and a back cover 120. The housing 110 is for accommodating related electronic components (not shown), and the back cover 120 is assembled to the housing 110 to provide related protection functions and effects of the electronic components. In the present embodiment, the housing 110 includes a bottom plate 112, a spring arm 114 and a snap member 116. bottom The plate 112 has an opening 112b. The elastic arm 114 and the latching member 116 are disposed on the bottom plate 112, wherein the latching member 116 is located beside the opening 112b, and the elastic arm 114 is buckled to the latching member 116 across the opening 112b.

Figure 3 is a partial cross-sectional view showing the structure of the casing of Figure 2; Referring to FIG. 2 and FIG. 3 simultaneously, the housing 110 further includes a first conductive layer C1 disposed on the bottom plate 112, the elastic arm 114 and the latching member 116, and the back cover 120 is assembled to the housing 110 to shield the opening 112b. The back cover 120 has a second conductive layer C2 facing the housing 110. Furthermore, the elastic arm 114 has a pressing portion 114b that faces the back cover 120 and partially passes through the opening 112b. In this embodiment, after the bottom plate 112, the elastic arm 114, the snap member 116 and the back cover 120 are formed, the first conductive layer C1 may be deposited on the surface of the bottom plate 112, the surface of the elastic arm 114 and the card respectively. The surface of the fastener 116 is deposited while the second conductive layer C2 is deposited on the surface of the back cover 120. In this manner, when the back cover 120 and the housing 110 are assembled to each other, the first conductive layer C1 and the second conductive layer C2 can be electrically connected to each other by the pressing portion 114b pressing against the back cover 120. This allows the electrostatic charge in the electronic device 10 to be led out of the casing structure 100 via the first conductive layer C1 and the second conductive layer C2.

In detail, the elastic arm 114 of the embodiment has a body 114a and a button hole 114c disposed on the body 114a, wherein the body 114a has a second fixed end E3 and a second latching end E4, and the second fixed end E3 is disposed on The bottom plate 112 has a second fixed end E3 and a snap member 116 on opposite sides of the opening 112b. The second latching end E4 extends from the second fixed end E3 and is detachably snapped to the latching member 116, thereby causing a cantilever structure across the opening 112b as illustrated in FIG. Furthermore, the pressing portion 114b has the first fixed end E1 and the first a latching end E2, wherein the first fixed end E1 is disposed on the body 114a, and the first latching end E2 extends from the first fixed end E1 and is detachably snapped to the latching hole 114c. Therefore, as shown in FIG. Between the second fixed end E3 and the second snap end E4 in the casing structure 100 of the embodiment, the pressing portion 114b and the portion of the body 114a form a hollow closed contour.

Further, in order to clearly describe the relationship between the conductive layer and the related member, the first conductive layer C1 is divided into five portions such as C1A to C1E. Referring to FIG. 3 again, in the embodiment, the pressing portion 114b further has a first surface S1 between the first fixed end E1 and the first snap end E2 and abuts against the second cover 120. On the conductive layer C2, further, the first portion C1A of the first conductive layer C1 is disposed on the first surface S1 of the pressing portion 114b, so that the abutting between the pressing portion 114b and the back cover 120 can be achieved. The relationship is such that the second conductive layer C2 is electrically connected to the first portion C1A.

Furthermore, the body 114a of the elastic arm 114 further has a second surface S2 and a third surface S3 located at the second latching end E4, wherein the second surface S2 is connected between the third surface S3 and the first surface S1, and As shown in FIG. 3, the second surface S2 and the third surface S3 are respectively on opposite sides of the body 114a. The second portion C1B and the third portion C1C of the first conductive layer C1 are respectively located on the second surface S2 and the third surface S3, and are electrically connected from the first portion C1A to the third portion C1C due to the above.

In addition, the latching member 116 has a fourth surface S4 at the end. When the latching member 116 and the elastic arm 114 are engaged with each other, the fourth surface S4 abuts against the third surface S3, thereby making the first conductive layer C1 The third portion C1C located on the third surface S3 is positioned on the fourth surface S4 with the first conductive layer C1 The fourth part of C1D is electrically conductive. Further, the snap member 116 has a fifth surface S5 connected to the bottom plate 112, and the fifth portion C1E of the first conductive layer C1 is disposed on the fifth surface S5.

Based on the above, when the elastic arm 114 is pressed against the back cover 120, the first conductive layer C1 and the second conductive layer C2 can be electrically connected to each other due to the above-mentioned component relationship, that is, when there is static electricity inside the casing structure 100. When the charge is applied, the fifth portion C1E, the fourth portion C1D, the third portion C1C, the second portion C1B, and the first portion C1A of the first conductive layer C1 can be conducted to the second conductive layer C2 via the bottom plate 112 to achieve The effect of the charge transfer inside the casing structure 100.

On the other hand, the pressing portion 114b of the elastic arm 114 can provide a good connection relationship between the housing 110 and the back cover 120 in addition to being used as a conductive charge. In the present embodiment, the elastic arm 114 and the latching member 116 are integrally formed with the plastic material in the same manner as the bottom plate 112, and thus retain certain elastic characteristics by the characteristics of the plastic material. In other words, the pressing portion 114b of the elastic arm 114 and the hollow closed contour presented by the body 114a further structurally provide an elastic abutting effect between the elastic arm 114 and the back cover 120. Furthermore, the housing 110 and the back cover 120 of the present embodiment are at an angle to each other, that is, there is a gap G1 between the housing 110 and the back cover 120, and the portion of the pressing portion 114b that passes through the opening 112b is located at This gap is in G1. The gap G1 simultaneously provides a buffering effect for the assembly tolerance of the housing 110 and the back cover 120 during assembly, that is, in the present embodiment, the housing is made by the elastic abutting structure of the pressing portion 114b and the gap G1. The first conductive layer C1 and the first between the 110 and the back cover 120 are not caused by assembly tolerances. The case where the two conductive layers C2 cannot be electrically connected.

4 is a flow chart of a method of fabricating a casing structure in accordance with an embodiment of the present invention. 5 and FIG. 6 respectively show partial cross-sectional views of the casing structure corresponding to the partial flow of FIG. 4. Please refer to FIG. 3 to FIG. 6 at the same time. It should be explained first that the same component is denoted by different numbers but in different states. Further, after the housing 110 is plastically molded, as shown in FIG. 5, the elastic arm 214 includes a body 214a, a branch 214b and a buckle hole 114c, and the second fixed end E3 of the body 214a is disposed on the bottom plate 112, and branches. The first fixed end E1 of the 214b is disposed on the body 214a, and the first latching end E1 of the branch 214b and the second latching end E4 of the body 214a extend away from the bottom plate 112 in the same direction, thereby forming a structure as shown in FIG. The cactus structure.

Next, in step S110, the branch 214b is bent toward the body 214a, so that the first snap end E2 of the branch 214b is snapped into the button hole 114c of the body 214a, so that the branch 214b and the body 214a are partially hollow. The contoured portion 114b of the closed contour. At this time, the first surface S1 of the pressing portion 114b is connected to the second surface S2 of the body 214a.

In the steps S120 and S130, the first conductive layer C1 is disposed on the bottom plate 112, the elastic arm 214 and the latching member 116, and the second conductive layer C2 is disposed on the back cover 120, wherein the first conductive layer C1 is disposed in the area In the above description, it will not be described here. Next, in step S140, the body 214a of the elastic arm 214 is bent so that the body 214a spans the opening 112b, and the second snap end E4 is snapped to the latching member 116 to form a state as shown in FIG. The elastic arm 114, wherein the pressing portion 114b passes through the opening 112b as the body 114a is bent toward the snap member 116. Finally, in step S150, the group The back cover 120 is mounted to the housing 110, and a gap G1 is formed therebetween to allow a portion of the pressing portion 114b to be located in the gap G1 to be pressed against the back cover 120, thereby reaching the first conductive layer C1 and The effect that the second conductive layer C2 is electrically connected to each other.

In summary, in the above embodiment of the present invention, the conductive layer is respectively disposed on the housing and the back cover, and the bendable elastic arm and the snap member are fastened to each other, so that the pressing portion can protrude from the opening. And abut on the back cover. In this way, the conductive layers on the housing and the back cover can achieve the effect of electrically connecting to each other by the above-mentioned member phases. Compared with the conventional casing structure, the casing structure of the present invention does not require an additional conductive gasket, thereby shortening the assembly man-hour and reducing the amount of parts, thereby reducing the production cost of the electronic device. In addition, due to the elastic abutting structure of the elastic arm and the pressing portion, and the gap between the back cover and the casing, the casing structure of the present case is no longer affected by the assembly tolerance, and the connection effect of the conductive layer is also affected. The elastic arm of the casing structure and the back cover can thus achieve a good abutting effect.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧Electronic devices

100‧‧‧Shell structure

110‧‧‧shell

112‧‧‧floor

112b‧‧‧ openings

114, 214‧‧‧ arm

114a, 214a‧‧‧ ontology

114b‧‧‧Resistance Department

114c‧‧‧ buttonhole

116‧‧‧Snap fasteners

120‧‧‧Back cover

214b‧‧‧ branch

C1‧‧‧First Conductive Layer

C1A‧‧‧Part I

C1B‧‧‧Part II

C1C‧‧‧Part III

C1D‧‧‧Part IV

C1E‧‧‧Part V

C2‧‧‧Second conductive layer

E1‧‧‧first fixed end

E2‧‧‧ first buckle end

E3‧‧‧second fixed end

E4‧‧‧Second snap end

G1‧‧‧ gap

S1‧‧‧ first surface

S2‧‧‧ second surface

S3‧‧‧ third surface

S4‧‧‧ fourth surface

S5‧‧‧ fifth surface

1 is a schematic view of a casing structure applied to an electronic device according to an embodiment of the present invention.

2 is a partial schematic view of the housing structure of FIG. 1.

Figure 3 is a partial cross-sectional view showing the structure of the casing of Figure 2;

4 is a flow chart of a method of fabricating a casing structure in accordance with an embodiment of the present invention.

5 and FIG. 6 respectively show partial cross-sectional views of the casing structure corresponding to the partial flow of FIG. 4.

100‧‧‧Shell structure

110‧‧‧shell

112‧‧‧floor

112b‧‧‧ openings

114‧‧‧Bounce arm

114c‧‧‧ buttonhole

116‧‧‧Snap fasteners

120‧‧‧Back cover

C1‧‧‧First Conductive Layer

C2‧‧‧Second conductive layer

G1‧‧‧ gap

Claims (9)

A casing structure includes: a casing, comprising: a bottom plate having an opening; a fastening member disposed on the bottom plate and located beside the opening; a resilient arm detachably snapping across the opening The latching member has a pressing portion, the elastic arm further has a body spanning the opening, and a button hole located on the body, and the pressing portion has a first fixed end and a a first fastening end disposed on the body, the first fastening end extending from the first fixing end and detachably snapping to the buckle hole, so that the pressing portion and the body are Forming a hollow closed contour; a first conductive layer disposed on the bottom plate, the elastic arm and the snap member; and a back cover assembled to the housing and shielding the opening, the back cover having the housing facing a second conductive layer, the pressing portion passes through the opening and is pressed against the back cover, so that the first conductive layer is electrically connected to the second conductive layer. The casing structure of claim 1, wherein the body further has a second fixed end and a second snap end, the second fixed end is disposed on the bottom plate, and the second fixed end is The latching member is located on opposite sides of the opening, and the second latching end is detachably fastened to the latching member, and the pressing portion is between the second fixed end and the second latching end. The casing structure of claim 1, wherein the pressing portion further has a first surface at the first fixed end and the first buckle Between the ends, and abutting on the second conductive layer of the back cover, a portion of the first conductive layer is located on the first surface. The casing structure of claim 3, wherein the body further has a second surface and a third surface located at the second buckle end, the second surface being coupled to the third surface and the first surface Between a surface, the latching member has a fourth surface abutting the third surface, and the first conductive layer is respectively located on the second surface, the third surface and the fourth surface. The casing structure of claim 1, wherein the bottom plate and the back cover are at an angle to form a gap, and a portion of the pressing portion passes through the opening to be located in the gap to abut the back cover. The second conductive layer. A manufacturing method of a casing structure, the casing structure comprises a casing and a back cover, wherein the casing comprises a bottom plate, a spring arm and a buckle member, the bottom plate has an opening, the elastic arm and the card The fastener is disposed on the bottom plate and is located on opposite sides of the opening. The manufacturing method of the casing structure comprises: arranging a first conductive layer on the bottom plate, the elastic arm and the fastening component; and arranging a second conductive Laying the arm over the back cover; bending the elastic arm to cause the elastic arm to span the opening and snapping to the latching member; and assembling the back cover to the housing, wherein a pressing portion of the elastic arm passes through The opening is pressed against the back cover to electrically connect the first conductive layer and the second conductive layer to each other. The manufacturing method of the casing structure according to claim 6, wherein the elastic arm has a body, a branch and a button hole located on the body, the branch having a first fixed end and a first Snap end, the first The fixed end is disposed on the body, and the first latching end extends from the first fixed end. The method further includes: bending the branch before configuring the first conductive layer on the elastic arm The first buckle end is snapped to the buckle hole to form the pressing portion. The method of manufacturing the casing structure of claim 7, wherein the body has a second fixed end and a second snap end, the second fixed end is disposed on the bottom plate, and the first fixed end is The buckle hole is located between the second fixed end and the second buckle end. When the elastic arm is not buckled to the buckle, the first buckle end and the second buckle end are in the same direction The ground extends away from the bottom plate. The manufacturing method of the casing structure of claim 8, wherein the branch has a first surface, and the body has a second surface and a third surface which are located at the second fastening end and are connected to each other. The fastening component has a fourth surface. When the first fastening end is fastened to the fastening hole, the first surface is connected to the second surface. When the elastic arm is buckled to the fastening component, the fastening component The fourth surface abuts against the third surface.