CN103796462A - Electronic device and method for manufacturing housing structure thereof - Google Patents
Electronic device and method for manufacturing housing structure thereof Download PDFInfo
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- CN103796462A CN103796462A CN201210426012.1A CN201210426012A CN103796462A CN 103796462 A CN103796462 A CN 103796462A CN 201210426012 A CN201210426012 A CN 201210426012A CN 103796462 A CN103796462 A CN 103796462A
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- conductive layer
- top board
- casing structure
- button hole
- electronic component
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Abstract
Provided is an electronic device which comprises a housing structure and an electronic component. The housing structure comprises a top plate and an elastic arm. The top plate comprises a first surface, and a buckle hole and a first conductive layer arranged on the first surface. The elastic arm comprises a body, a fixing end, and a buckle end. The fixing end is disposed on the first surface. The body comprises a second conductive layer. The buckle end is detachably buckled in the buckle hole in order that the second conductive layer is connected with the first conductive layer. The electronic component is configured in the housing structure. The second conductive layer of the body is abutted against the electronic component in order that the electronic component, the second conductive layer, and the first conductive layer are electrically connected mutually. Further, a method for manufacturing the housing structure is disclosed.
Description
Technical field
The invention relates to the manufacture method of a kind of electronic installation and its casing structure, and relate to especially a kind of manufacture method of electronic installation and its casing structure of the structure with the electromagnetic interference of preventing and static discharge.
Background technology
Along with scientific and technological development, the electronic installation of many consumption-orientations appears on market, such as mobile phone (MobilePhone), panel computer (Tablet PC) and notebook computer (Notebook computer) etc.These electronic installations are convenient people's life not only, also indispensable role in performer's life.
Take notebook computer as example; in traditional technology; in order to make notebook computer can there is the electromagnetic interference of preventing (electro-magnetic interference; EMI) with static discharge (electro-static discharge; ESD) function, conventionally can attach multiple conductive gaskets as earth terminal (Gasket) in the casing inside of notebook computer be for example metallic gasket or conductive fabric.When after the conductive shell or conductive foil of these conductive gasket contact electronic components, electronic component can see through these conductive gasket ground connection.
But, because conductive gasket not only has higher production cost, also comparatively time-consuming in its assembling, therefore, use conductive gasket can improve the production cost of notebook computer.
Summary of the invention
The invention provides the manufacture method of a kind of electronic installation and its casing structure, it has the manufacture of being easy to and the structure that prevents electromagnetic interference and static discharge of installing.
The present invention proposes a kind of electronic installation, comprises casing structure and electronic component.Casing structure comprises top board and elastic arm.Top board has first surface, is positioned at button hole and the first conductive layer on first surface.Elastic arm has body, stiff end and buckle end.Stiff end is arranged on first surface.Body has the second conductive layer.Buckle end is removably snapped in button hole, so that the second conductive layer connects the first conductive layer.Electronic component arrangements is in casing structure.The second conductive layer of body is connected on electronic component, so that electronic component, the second conductive layer and the first conductive layer are electrically connected to each other.
The present invention proposes a kind of manufacture method of casing structure.Casing structure comprises top board and elastic arm.Top board has first surface and is positioned at the button hole on first surface.Elastic arm has body, stiff end and buckle end.Stiff end is arranged on first surface.Buckle end deviates from first surface and extends.The manufacture method of casing structure comprises, bending body, so that buckle end is clipped in button hole, and, configuration conductive layer on first surface with elastic arm on.
In one embodiment of this invention, above-mentioned body is bending and has relative second surface and the 3rd surface.The 3rd surface is towards top board, and second surface is back to top board and butt electronic component.The second conductive layer is configured on second surface.
In one embodiment of this invention, above-mentioned top board also has the 3rd conductive layer that is positioned at first surface.The first conductive layer and the 3rd conductive layer are separated by elastic arm and button hole.The second conductive layer is connected between the first conductive layer and the 3rd conductive layer.
In one embodiment of this invention, the second above-mentioned conductive layer protrudes from first surface.
In one embodiment of this invention, above-mentioned casing structure also comprises base plate, is assembled to top board.Electronic component is between top board and base plate.Electronic component comprises circuit board and connector.Circuit board is arranged on base plate.Connector is arranged on circuit board, and the second conductive layer is connected on connector.
In one embodiment of this invention, above-mentioned wherein body has relative second surface and the 3rd surface.In the time that buckle end is not clipped to button hole, body erects on first surface, and second surface is back to button hole, and the 3rd surface is between button hole and second surface.In the time that buckle end is clipped in button hole, the 3rd surface is towards top board, and second surface is back to top board, and the local configuration of conductive layer is on second surface.
In one embodiment of this invention, in the time that above-mentioned buckle end is clipped in button hole, second surface connects first surface and protrudes from first surface.
Based on above-mentioned, casing structure of the present invention is by the bent elastic arm that is snapped in button hole, and configuration conductive layer thereon, thereby can be connected on electronic component elastic arm after allowing electronic component install after its bending.So, the conductive layer on conductive layer, top board on elastic arm and electronic component just can reach the effect of mutual electric connection, so that the static in electronic installation is led to outside casing structure.Moreover position and the kenel of elastic arm in casing structure can change according to the configuration condition of electronic component, thereby has more the preferably scope of application, also can effectively reduce and the required cost of conducting element is additionally set to improve the prouctiveness of casing structure simultaneously.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended graphic being described in detail below.
Accompanying drawing explanation
Fig. 1 is the stereogram of the electronic installation of one embodiment of the invention.
Fig. 2 is that the housing of Fig. 1 is along the partial sectional view of I-I face line.
Fig. 3 is the making flow chart of the casing structure of one embodiment of the invention.
Fig. 4 A illustrates respectively with Fig. 4 B the schematic diagram that contrasts Fig. 3 flow process.
[main element symbol description]
100: electronic installation
110: casing structure
112: top board
112a: lateral openings
112b: button hole
114: base plate
116: elastic arm
116a: body
120: electronic component
122: circuit board
124: connector
130: input module
C1: the first conductive layer
C2: the second conductive layer
C3: the 3rd conductive layer
E1: stiff end
E2: buckle end
S1: first surface
S2: second surface
S3: the 3rd surface
S4: the 4th surface
Embodiment
Fig. 1 is the stereogram of the electronic installation of one embodiment of the invention.Fig. 2 is that the electronic installation of Fig. 1 is along the partial sectional view of I-I line.Please refer to Fig. 1 and Fig. 2, in the present embodiment, electronic installation 100 is for example notebook computer, it comprises casing structure 110 and configuration electronic component 120 therein, the host machine part that is notebook computer at this casing structure 110, and electronic component 120 is arranged on the connector modules in main frame, for example USB (USB) link block, or network connecting module (as RJ45), but the present embodiment is not as limit.
Hold above-mentionedly, casing structure 110 has the top board 112 and base plate 114 that mutually fit together, and is arranged on the elastic arm 116 on top board 112.Electronic component 120 is between top board 112 and base plate 114.Say further, electronic component 120 comprises the circuit board 122 being arranged on base plate 114, and with the connector 124 being arranged on circuit board 122, and connector 124 is from the lateral openings 112a of top board 112 and expose casing structure 110.
Refer again to Fig. 2, top board 112 has each other relative first surface S1 and the 4th surperficial S4, and wherein first surface S1 is towards base plate 114, and the 4th surperficial S4 is in order to carry such as keyboard of input module 130().In the present embodiment, top board 112 also has the button hole 112b and the first conductive layer C1 that are positioned on first surface S1, and wherein the first conductive layer C1 is plated in conductive material on first surface S1 by sputtering way.
Moreover, elastic arm 116 has body 116a, stiff end E1 and buckle end E2, wherein body 116a is installed on first surface S1 by stiff end E1, buckle end E2 is removably clipped to button hole 112b, so that body 116a presents take stiff end E1 and buckle end E2 as the strong point, and protrude from the curved bend folded structure of first surface S1.In addition, body 116a has second surface S2 respect to one another and the 3rd surperficial S3, and second surface S2 is back to first surface S1 and towards base plate 114, the three surperficial S3 towards first surface S1 and back to base plate 114.
On the other hand, top board 112 also has the 3rd conductive layer C3 that is positioned at first surface S1, and the first conductive layer C1 and the 3rd conductive layer C3 separated with button hole 112b by elastic arm 116, and the second conductive layer C2 is connected between the first conductive layer C1 and the 3rd conductive layer C3.In the present embodiment, the 3rd conductive layer C3 provides another conducting path in order to the static on connector 124 is conducted casing structure 110.Meanwhile, under the state being electrically connected to each other at the first conductive layer C1, the second conductive layer C2, with the 3rd conductive layer C3, also can improve charge-conduction flux, to improve the conductive performance of casing structure 110 for electrostatic charge.
Fig. 3 is the making flow chart of the casing structure of one embodiment of the invention.Fig. 4 A illustrates respectively with Fig. 4 B the schematic diagram that contrasts Fig. 3 flow process.Please also refer to Fig. 3, Fig. 4 A and Fig. 4 B, wherein associated components illustrates in above-described embodiment, just repeats no more at this.
In the present embodiment, after designer determines that connector 124 is configured in the position in casing structure 110, just can design according to this elastic arm 116 and be positioned at the position on top board 112.In addition, designer also can arrange multiple elastic arms 116 on the first surface S1 of top board 112, and with the position of corresponding possible configuration connector 124, this measure equally also can reach above-mentioned effect.
Accordingly, after having made casing structure 110, be positioned at the elastic arm 116 on the first surface S1 of top board 112, can be as Fig. 4 A person of illustrating, its stiff end E1 is on first surface S1, and its buckle end E2 is extended and is strip towards base plate 114 by first surface S1.Moreover the second surface S2 of body 116a is back to button hole 112b, and the 3rd surperficial S3 of body 116a has a side of button hole 112b towards top board 112, and the 3rd surperficial S3 is between second surface S2 and button hole 112b.
Therefore,, before electronic component 120 is assembled in casing structure 110, need first in step S110, the body 116a of elastic arm 116 to be bent, so that buckle end E2 is clipped in button hole 112b.Then,, in step S120, in the mode of for example sputter, configuration conductive layer is on the first surface S1 and elastic arm 116 of top board 112.Now due to the 3rd surperficial S3 of elastic arm 116 and the part of first surface S1, can be because of the bending crested of body 116a, therefore can't have conductive layer, that is conductive layer only can be configured on the part of first surface S1 and the second surface S2 of elastic arm 116 of top board 112.In this case easily understand, still in Fig. 4 B, according to previous embodiment, conductive layer is divided into the second conductive layer C2 on the second surface S2 of the 3rd conductive layer C3, elastic arm 116 in top board 112 left sides, and be positioned at the first conductive layer C1 on top board 112 right sides, wherein left side, right side are defined as central compartment using the elastic arm 116 of Fig. 4 A or Fig. 4 B.
This, casing structure 110 just completes the preparation before assembling.Then, in step S130, assembling electronic component 120 is in casing structure 110, and wherein elastic arm 116 is pressed on connector 124, so that the conductive layer on connector 124 and elastic arm 116, the conductive layer on first surface S1 are electrically connected mutually.In other words, when electronic component 120 is assembled to casing structure 110 when interior, the body 116a that elastic arm 116 bends just can be pressed on connector 124 and (be illustrated in Fig. 2), and makes to produce between above-mentioned conductive layer C1 to C3 and connector 124 effect electrically conducting.Simultaneously, the body 116a of bending still can be served as the use of alignment connector 124, and need not worry to cause between connector 124 and the second conductive layer C2 producing because casing structure 110 vibrates the situation coming off, also allow and between connector 124 and top board 112, possess the buffering effect of the suitable distance of maintenance simultaneously.In addition, while producing line assembling, also can avoid carefully considering the height and position of connector 124 in casing structure 110, can effectively contain the height tolerance of connector 124 in the time manufacturing or assemble because now there is the elastic arm 116 of buffering effect.
In sum, the present invention utilizes conductive layer to be arranged on housing and elastic arm, wherein elastic arm protrudes from top board by stiff end and buckle end as support, so that the second conductive layer can be connected on connector, and and then first on the second conductive layer and top board, the 3rd conductive layer are electrically connected mutually so that the electrostatic charge of electronic component can be conducted to outside casing structure effectively through this path.Compared to traditional electronic devices, the casing structure of this case can be shortened assembling man-hour and be reduced part consumption by above-mentioned configuration, and then can reduce the production cost of electronic installation.
In addition, elastic arm utilizes buckle end and stiff end as support, thereby can be pressed on connector with comparatively firm structure, between decapacitation maintenance and connector, outside firm annexation, still can provide by this buffering effect between connector and casing structure.
Although the present invention discloses as above with embodiment; so it is not in order to limit the present invention; under any, in technical field, have and conventionally know the knowledgeable; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion of defining depending on accompanying claim.
Claims (8)
1. an electronic installation, comprising:
One casing structure, comprising:
One top board, has a first surface, is positioned at a button hole and one first conductive layer of this first surface;
One elastic arm, has a body, a stiff end and a buckle end, and this stiff end is arranged on this first surface, and this body has one second conductive layer, and this buckle end is removably snapped in this button hole, so that this second conductive layer connects this first conductive layer; And
One electronic component, is configured in this casing structure, and this second conductive layer of this body is connected on this electronic component, so that this electronic component, this second conductive layer and this first conductive layer are electrically connected to each other.
2. electronic installation as claimed in claim 1, it is characterized in that, this body is bending and has a relative second surface and one the 3rd surface, the 3rd surface is towards this top board, this second surface is back to this top board and this electronic component of butt, and this second conductive layer is configured on this second surface.
3. electronic installation as claimed in claim 2, it is characterized in that, this top board also has one the 3rd conductive layer that is positioned at this first surface, and this first conductive layer and the 3rd conductive layer are separated by this elastic arm and this button hole, and this second conductive layer is connected between this first conductive layer and the 3rd conductive layer.
4. electronic installation as claimed in claim 1, is characterized in that, this second conductive layer protrudes from this first surface.
5. electronic installation as claimed in claim 1, is characterized in that, this casing structure also comprises a base plate, is assembled to this top board, and this electronic component is between this top board and this base plate, and this electronic component comprises:
One circuit board, is arranged on this base plate; And
A connector, is arranged on this circuit board, and this second conductive layer is connected on this connector.
6. the manufacture method of a casing structure, this casing structure comprises a top board and an elastic arm, this top board has a first surface and is positioned at the button hole on this first surface, this elastic arm has a body, a stiff end and a buckle end, wherein this stiff end is arranged on this first surface, this buckle end deviates from this first surface and extends, and the manufacture method of this casing structure comprises:
Bend this body, so that this buckle end is clipped in this button hole; And
Configure a conductive layer on this first surface with this elastic arm on.
7. the manufacture method of casing structure as claimed in claim 6, it is characterized in that, this body has a relative second surface and one the 3rd surface, in the time that this buckle end is not clipped to this button hole, this body erects on this first surface, this second surface is back to this button hole, the 3rd surface is between this button hole and this second surface, in the time that this buckle end is clipped in this button hole, the 3rd surface is towards this top board, this second surface is back to this top board, and the local configuration of this conductive layer is on this second surface.
8. the manufacture method of casing structure as claimed in claim 7, is characterized in that, in the time that this buckle end is clipped in this button hole, this second surface connects this first surface and protrudes from this first surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210426012.1A CN103796462A (en) | 2012-10-30 | 2012-10-30 | Electronic device and method for manufacturing housing structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210426012.1A CN103796462A (en) | 2012-10-30 | 2012-10-30 | Electronic device and method for manufacturing housing structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103796462A true CN103796462A (en) | 2014-05-14 |
Family
ID=50671582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210426012.1A Pending CN103796462A (en) | 2012-10-30 | 2012-10-30 | Electronic device and method for manufacturing housing structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103796462A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4967316A (en) * | 1988-11-02 | 1990-10-30 | Robert Bosch Gmbh | Electric circuit unit |
| JPH05299867A (en) * | 1992-04-17 | 1993-11-12 | Fujitsu Ltd | Structure of door |
| TWM359722U (en) * | 2009-03-06 | 2009-06-21 | Cheng Uei Prec Ind Co Ltd | Liquid crystal display device |
| CN201536451U (en) * | 2009-09-30 | 2010-07-28 | 英业达股份有限公司 | Electronic device |
| CN201733568U (en) * | 2010-06-18 | 2011-02-02 | 东莞宇球电子有限公司 | Electromagnetic-interference resistant metal shielding panel |
| TW201137560A (en) * | 2010-04-16 | 2011-11-01 | Inventec Corp | Spring plate for grounding shells of notebook computers |
| CN102595826A (en) * | 2011-01-14 | 2012-07-18 | 和硕联合科技股份有限公司 | Electronic device |
-
2012
- 2012-10-30 CN CN201210426012.1A patent/CN103796462A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4967316A (en) * | 1988-11-02 | 1990-10-30 | Robert Bosch Gmbh | Electric circuit unit |
| JPH05299867A (en) * | 1992-04-17 | 1993-11-12 | Fujitsu Ltd | Structure of door |
| TWM359722U (en) * | 2009-03-06 | 2009-06-21 | Cheng Uei Prec Ind Co Ltd | Liquid crystal display device |
| CN201536451U (en) * | 2009-09-30 | 2010-07-28 | 英业达股份有限公司 | Electronic device |
| TW201137560A (en) * | 2010-04-16 | 2011-11-01 | Inventec Corp | Spring plate for grounding shells of notebook computers |
| CN201733568U (en) * | 2010-06-18 | 2011-02-02 | 东莞宇球电子有限公司 | Electromagnetic-interference resistant metal shielding panel |
| CN102595826A (en) * | 2011-01-14 | 2012-07-18 | 和硕联合科技股份有限公司 | Electronic device |
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Application publication date: 20140514 |