M416148 五、新型說明： 【新型所屬之技術領域】 -. 本創作係關於貼附於智慧卡上之積體電路貼片。 【先前技術】 現有技術中’行動電話所能使用的功能或通訊服務(例如 行動網路銀行服務），通常係仰賴行動電話所使用的智慧卡(例 如SIM/USIM卡）是否能夠支援而定。為此台灣專利申請號 94106675所提出之「用於可攜式裝置之雙通用積體電路卡系 0 統」、台灣專利申請號94217529所提出之「雙積體電路卡系 統」、美國專利申請公開號US2007/0262156所提出之 「Functional module improvement structure for expanded and enhanced SIM card」、美國專利申請公開號US2009/0061933 所提出之「Multiple Interface Card in A Mobile Phone」，皆提 出一些方法來突破傳統SIM/USIM卡所造成的限制。 此外，市面上也有行動電話所使用的SIM/USIM卡貼片 (film)，例如可參考台灣的威寶電信公司所推出的威通卡 (http://www.vibo.com.tw/CWS/Consumer_05—08_08，，,,.html) 〇 威通卡及此類貼片基本上是一張薄膜式貼片，使用者可將此 貼片貼附於傳統的SIM卡，並同時置入手機，經由行動電話 STK選項功能，可使用原先SIM卡並無提供的功能或應用程 式。關於此類薄膜式貼片’亦可參考美國專利7198199、 7303137或是同屬申請人之台灣專利申請號98144154中關於 此類積體電路貼片的說明。 【新型内容】 略晶貼片之特點之一即為:積體電 墊之門：積體電路貼片一面上至少兩個電性接觸 體C可減少積體電路貼片所使用的面積。此外，積 的間，因此可受到周圍電性接』 片貼==體:r片具有可撓部，當積體電路貼 字、“卡上時’職性電路板·由該可撓部折成c 位於晶片與用來與智慧卡連結之電性接觸墊係 的2·;卡之相對兩側。祕積體電路貼片上電路所使用 曰日片之厚度可以具有較大的彈性。 積體電路 片包=ί::實ri，：於貼附於智慧卡的積體電路貼 與積體接觸墊、第二組電性接觸塾、 楚積體電路晶片。軟性電路板具有相對之第ϋ第二面. 人:組電性接觸塾係設置於第—面，且第—組電性接^包 3 ^兩個電性接觸墊；第二組電性接觸墊係設置於第二 面，積體電路晶片，設置於該軟性電路板上之第一面上 ZTTV1 "niead)#^(b〇nding) : 孕又仫地，弟一組電性接觸墊係具有凸點以電性連結該智攀 卡’且其設置係符合IS07816-2。此外，本創作另—實施例曰令二 行動通訊裝置具有智慧卡以及與如上述之積體電路貼片，其 中積體電路貼片係貼附於智慧卡卡上c舉例來說智犛卡係 為 SIM/USlM/UlM/RUIM/rmcro SIM 卡其中之一。、丁 M416148 根據本創作另一實施例，用於貼附於智慧卡的積體電路 • ·貼片包含軟性電路板、第一組電性接觸墊、第二組電性接觸 墊、與積體電路晶片。軟性電路板具有相對之第—面與第二 面，且具一可撓部以及位於該可挽部兩側之一第一部份與一 第二部份，其中當積體電路貼片貼附於智慧卡上時，軟性電 路板係藉由可撓部折成c字型，而第一部分與第二部份係位 於智慧卡之相對兩側；第一組電性接觸墊係設置於第一面， 並位於第一部份；第二組電性接觸墊係設置於第二面，並位 Φ 於第一部份；積體電路晶片，設置於該軟性電路板上之第一 面上，並位於第二部份，並與軟性電路板之引腳接合而形成 電性連結。 參考以下說明及隨附申請專利範圍或利用如下文所提之 本創作的實施方式’即可更加明瞭本創作的這些特色及優點。 【實施方式】 • 以下實施例將以用於貼附於一 micro SIM卡上之積體電 路貼片來說明本創作。『Micro SIM卡』係屬一種Mini-UICC 智慧卡，其尺寸約為12mmX 15mm，關於Mini-UICC卡的其 他細節進一步可參考歐洲電信標準協會（European Telecommunications Standards Institute > ETSI)對於 Smart Cards; UICC-Terminal interface; Physical and logical characteristics的規範(ETSI-TS-102-221)，而本創作亦可應用 在一般的UICC智慧卡。 M416148 圖1係本創作實施例積體電路貼片100之正反視圖。積 體電路貼片1〇〇包含軟性電路板102、第一組電性接觸墊C卜 •第二組電性接觸墊C2、與積體電路晶片1〇4。軟性電路板 (flexible print circuit board) 102 具有相對之第一面 S1 與第二面 S2 ;第一組電性接觸墊ci係設置於第一面S1，第二組電性 接觸墊C2係設置於第二面S2。在此實施例中，第一面S1之 第一組電性接觸墊C1具有凸點結構，且用於電性連結智慧卡 2〇〇(顯示於圖2與圖3)，而第二面S2之第二組電性接^墊 C2則具有凹點結構，兩者係位於軟性電路板1〇2上相對應的 位置。在此實施例中，積體電路晶片1〇4係設置於軟性電路 ^ 102之第一面S1，並與軟性電路板102之引腳(lead)103接 二(bonding)而形成電性連結。但在其他未圖示的實施例中， '體電路晶片104亦可設置於軟性電路板之第二面幻。 戶斤！但在其他未圖示的實施例中，只要電性接觸塾C1能夠與 般知t的智慧卡進行電性接觸，而電性接齡C2能夠與一 ^日〜-^的存取裝置(未圖示)進行電性接觸，則電性接觸墊 有石η及第Γ組電性接觸塾C2可分別位於不同的位置，或具 5的形狀結構’本創作並魏加以限制。 車交佳地，如圖1如- 係符八ίςη \所不，弟一組電性接觸墊Cl位置與結構 同時i _ 7816-2,藉此電性連結IS07816規範下之智慧卡， 轉此心:”性接觸塾C2位置與結構係、亦符合1S。7816-2， 話中二ςnvi iS〇7816規範下之智慧卡存取裝置(例如行動電 卜的S嶋_卡插槽或智針讀卡機）。 7 48 加以限制 脱由異方性導電膠(ACF)與軟性電路板 合(GGI)盥軟性電路板二2 2者積體電路晶片1〇4藉由金線接 接縣中電板的引腳103接合。在此實施例中， 體，晶片1G4並沒有覆蓋封裝模料__)(例如環氧樹 :’一目對地，積體電路晶片1〇4上可僅塗佈有一層W膠加 強固定的效果，因此可大幅減少積體電路晶片1G4的厚度， 而當貼=於智慧卡2GG時，就不會需要在智慧卡·上進行 挖，或剪卡的步驟。但須說明的是，積體電路晶片1〇4亦可 覆蓋有封裝模料，本創作對此並不欲加以限制，且若積體電 路晶片104覆蓋有封裝模料，則可利用錫球陣列與軟性電路 板102電性導通，而不需使用上述之異方性導電膠(acf)或金 線接合的方式。 圖4顯示本創作實施例中一種行動通訊裝置3〇〇，行動通 机裝置300具有智慧卡插槽302，電池蓋304，以及如圖2與 圖3所示行動通訊裝置300之智慧卡（例如 SIM/USIM/UIM/RUIM/micro SIM) 200 與貼附其上之積體電 路貼片100。智慧卡200與貼附其上之積體電路貼片1〇〇可— 同放入插槽302，而被插槽302所存取；這時經由行動通訊裝 置300中STK選項功能，可使用積體電路貼片100額外提供 的功能或通訊服務。關於積體電路貼片100所提供的功能或 通訊服務，可參考先前技術各文件之說明，在此不加贅述。 圖5係本創作另一實施例積體電路貼片丨5<)之正反视 M416148 圖。積體電路貼片150包含軟性電路板152、第一組電性接觸 墊C卜第二組電性接觸墊C2、與積體電路晶片154。軟性電 路板(flexible print drcuit board) 152具有相對之第一面S1與第 二面S2，此外軟性電路板152亦具有一可撓部s以及位於；可 撓部s兩側之第一部*P1以及第二部分ρ2。第一組電性接 觸墊ci係設置於第一面S1並位於第一部分ρι，第二組電性 接觸墊C2係設置於第二面S2並也位於第一部分ρι，而與 一組電性接觸墊C1相對。 〃 在此實施例中，第-面S1之第—組電性接觸塾ci 凸點結構，且用於電性連結智慧卡25_示於圖6與圖;、 而第二面S2之第二組電性接觸墊C2則具有凹點結構 係位於軟性電路板152上相對應的位置。 在此實施例中’積體電路晶片154係設 152之第一面S1並位於第二部分p2，並與軟性電反= 引腳(lead)153接合(bonding)而形成電性連結。 但在其他未^的實施例中，只要電性 所要貼附的智慧卡進行電性接觸，而_接觸塾。 般智慧卡的雜裝嫩，*)進行電_ ^觸 C1以及第二組電性接觸，C2可分別位於第一部二 的位置’或具有不同的形狀結構，本創作並不欲加以限制 -M土地’如圖5所，R，第—組電性接觸塾「 係符合丨80漏-2，藉此電性連結丨咖叫規範下之^慧^構 M416148 同時第一組電性接觸塾C2位置與結構係亦符合is〇7816-2， 藉此電性連結IS07816規範下之智慧卡存取裝置(例如行動電 話中的SIM/USIM卡插槽或智慧卡讀卡機）。 如圖6與圖7所示，積體電路晶片較佳設置於第一 面S卜也就是朝向智慧卡250之面，並位於第二部分p2，與 第一組電性接觸墊ci以及第二組電性接觸墊C2所在之第一 部分P1透過可撓部F加以分隔。 第一面si係有雙面膠，例如3M薄膜VHB膠帶 F-9460PC，用以貼附於智慧卡25〇之上下表面。且進一步如 圖7所示，軟性電路板152係藉由可撓部F折成c字型，而 第一部分P1與第二部份P2係位於智慧卡25〇之相對兩側， 而為了不影響智慧卡25〇順利地放人插槽(例如圖8之插槽 352)第σ卩分pl與第二部份P2之尺寸皆不大於智慧卡 250，如圖6與圖7所示。 〜M416148 V. New description: [New technical field] - This creation is about the integrated circuit patch attached to the smart card. [Prior Art] The functions or communication services (e.g., mobile banking services) that can be used in the prior art are generally dependent on whether or not the smart card (e.g., SIM/USIM card) used by the mobile phone can be supported. For this purpose, the "Double General Integrated Circuit Card System for Portable Devices" proposed by Taiwan Patent Application No. 94106675, "Double Integrated Circuit Card System" proposed by Taiwan Patent Application No. 94217529, U.S. Patent Application Publication The "Multiple Interface Card in A Mobile Phone" proposed by the US Patent Application Publication No. US2009/0061933, which is proposed by the United States Patent Application Publication No. US2009/0061933, proposes some methods to break through the traditional SIM/ The restrictions imposed by the USIM card. In addition, the SIM/USIM card film used in mobile phones is also available on the market. For example, refer to the Weitong Card launched by Taiwan's Weibo Telecom (http://www.vibo.com.tw/CWS/ Consumer_05—08_08,,,,.html) The Unicom card and such patches are basically a film-type patch that users can attach to a traditional SIM card and simultaneously put it into the phone. The function or application that was not provided by the original SIM card can be used via the mobile phone STK option function. With regard to such a film-type patch, the description of such an integrated circuit patch can also be referred to in U.S. Patent No. 7,1981,99, the disclosure of which is incorporated herein by reference. [New content] One of the characteristics of the slightly crystalline patch is: the gate of the integrated circuit: at least two electrical contacts C on one side of the integrated circuit chip can reduce the area used by the integrated circuit patch. In addition, the product can be subjected to the surrounding electrical connection. The film is affixed == body: r piece has a flexible part, when the integrated circuit is affixed, "on the card", the board of the character is folded by the flexible part The c is located on the opposite side of the chip and the electrical contact pad for connecting to the smart card; the thickness of the day slice used in the circuit on the chip of the secret integrated circuit can have greater elasticity. Body circuit package = ί:: real ri,: the integrated circuit attached to the smart card and the integrated contact pad, the second set of electrical contact 塾, the Chu integrated circuit chip. The flexible circuit board has the opposite ϋSecond side. Person: The group of electrical contact 塾 is set on the first surface, and the first group is electrically connected to the package 3 ^ two electrical contact pads; the second group of electrical contact pads is set on the second side , integrated circuit chip, set on the first side of the flexible circuit board ZTTV1 "niead) #^(b〇nding): pregnant and stunned, a group of electrical contact pads have bumps to be electrically Linking the Zhi Pan card' and its setting is in accordance with IS07816-2. In addition, this creation is another embodiment - the second mobile communication device has a smart card and The integrated circuit patch is described in which the integrated circuit patch is attached to the smart card. For example, the smart card is one of the SIM/USlM/UlM/RUIM/rmcro SIM cards. Ding M416148 is based on Another embodiment of the present invention is for an integrated circuit attached to a smart card. The patch includes a flexible circuit board, a first set of electrical contact pads, a second set of electrical contact pads, and an integrated circuit chip. The circuit board has opposite first and second sides, and has a flexible portion and a first portion and a second portion on both sides of the movable portion, wherein the integrated circuit patch is attached to On the smart card, the flexible circuit board is folded into a c-shape by the flexible portion, and the first portion and the second portion are located on opposite sides of the smart card; the first group of electrical contact pads are disposed on the first side. And being located in the first portion; the second group of electrical contact pads are disposed on the second surface and Φ in the first portion; the integrated circuit chip is disposed on the first surface of the flexible circuit board, and Located in the second part and connected to the pins of the flexible circuit board to form an electrical connection. Refer to the following instructions and These features and advantages of the present invention will become more apparent with reference to the scope of the application or the use of the embodiments of the present invention as described below. [Embodiment] The following embodiments will be used for attaching to a micro SIM card. The integrated circuit patch is used to illustrate the creation. The "Micro SIM Card" is a Mini-UICC smart card with a size of about 12mmX 15mm. For further details about the Mini-UICC card, please refer to the European Telecommunications Standards Association. Institute > ETSI) for Smart Cards; UICC-Terminal interface; Physical and logical characteristics (ETSI-TS-102-221), and this creation can also be applied to general UICC smart cards. M416148 FIG. 1 is a front and back view of the integrated circuit patch 100 of the present embodiment. The integrated circuit chip 1A includes a flexible circuit board 102, a first set of electrical contact pads Cb, a second set of electrical contact pads C2, and an integrated circuit wafer 1〇4. The flexible printed circuit board 102 has a first surface S1 and a second surface S2 opposite to each other; the first group of electrical contact pads ci are disposed on the first surface S1, and the second group of electrical contact pads C2 are disposed on the second surface The second side S2. In this embodiment, the first set of electrical contact pads C1 of the first surface S1 has a bump structure and is used to electrically connect the smart card 2 (shown in FIG. 2 and FIG. 3), and the second side S2 The second set of electrical pads C2 has a pit structure, and the two are located at corresponding positions on the flexible circuit board 1〇2. In this embodiment, the integrated circuit chip 1〇4 is disposed on the first surface S1 of the flexible circuit ^102, and is bonded to the lead 103 of the flexible circuit board 102 to form an electrical connection. However, in other embodiments not shown, the 'body circuit wafer 104 may also be disposed on the second side of the flexible circuit board. Hu Jin! However, in other embodiments not shown, as long as the electrical contact 塾C1 can make electrical contact with the smart card of the general knowledge, the electrical connection age C2 can be connected to the access device of the day (not As shown in the figure), the electrical contact pads have the stone η and the third group electrical contact 塾C2 can be located at different positions, respectively, or have a shape structure of 5 'this creation is limited. The car is handed over to the ground, as shown in Figure 1. If the set of electrical contact pads is in the same position and structure as i _ 7816-2, the smart card under the IS07816 specification is electrically connected. Heart: "Sexual contact 塾 C2 position and structure, also in line with 1S. 7816-2, in the words of the two ς nvi iS 〇 7816 specification of the smart card access device (such as the mobile phone's S嶋_ card slot or wisdom needle Card reader) 7 48 Restricted by anisotropic conductive adhesive (ACF) and flexible circuit board (GGI) 盥 flexible circuit board 2 2 2 integrated circuit chip 1 〇 4 by gold wire connection to the county The pins 103 of the electric board are joined. In this embodiment, the body, the wafer 1G4 is not covered with the package mold __) (for example, epoxy tree: 'one eye to ground, the integrated circuit wafer 1 〇 4 can be coated only There is a layer of W glue to strengthen the fixing effect, so the thickness of the integrated circuit chip 1G4 can be greatly reduced, and when the sticker is applied to the smart card 2GG, the step of digging or cutting the card on the smart card is not required. It should be noted that the integrated circuit chip 1〇4 may also be covered with a package molding material, which is not intended to be limited in this creation, and if the integrated circuit chip 1 is 04 is covered with a package mold, and the solder ball array can be electrically connected to the flexible circuit board 102 without using the above-mentioned anisotropic conductive adhesive (acf) or gold wire bonding. FIG. 4 shows the present embodiment. In a mobile communication device, the mobile device 300 has a smart card slot 302, a battery cover 304, and a smart card of the mobile communication device 300 as shown in FIGS. 2 and 3 (eg, SIM/USIM/UIM/RUIM). /micro SIM) 200 and the integrated circuit chip 100 attached thereto. The smart card 200 and the integrated circuit chip attached thereto can be placed in the slot 302 and placed in the slot 302. Access; at this time, the function or communication service additionally provided by the integrated circuit patch 100 can be used via the STK option function in the mobile communication device 300. For the functions or communication services provided by the integrated circuit patch 100, reference can be made to the prior art. The description of the document is not described here. Fig. 5 is a front view of the integrated circuit chip 丨5<) of the present invention, M416148. The integrated circuit chip 150 includes a flexible circuit board 152, a first group. Electrical contact pad C, second group of electrical contact pads C2, and product The flexible printed circuit board 152 has a first surface S1 and a second surface S2 opposite to each other, and the flexible circuit board 152 also has a flexible portion s and a second portion of the flexible portion s a portion of the *P1 and the second portion ρ2. The first group of electrical contact pads ci are disposed on the first surface S1 and located in the first portion ρι, and the second group of electrical contact pads C2 are disposed on the second surface S2 and are also located in the A portion of ρι is opposed to a set of electrical contact pads C1. 〃 In this embodiment, the first group of the first surface S1 is electrically contacted with the 塾ci bump structure, and is used for electrically connecting the smart card 25_ shown in FIG. 6 and FIG.; and the second surface S2 is second. The group of electrical contact pads C2 has a pit structure located at a corresponding position on the flexible circuit board 152. In this embodiment, the integrated circuit wafer 154 is disposed on the first surface S1 of the 152 and located in the second portion p2, and is bonded to the soft electrical reverse = lead 153 to form an electrical connection. However, in other embodiments, as long as the smart card to be attached is electrically contacted, the contact is made. The wisdom of the card is tender, *) the electricity _ ^ touch C1 and the second set of electrical contacts, C2 can be located in the first part of the second position ' or have a different shape structure, this creation does not want to limit - M land 'as shown in Figure 5, R, the first group of electrical contact 塾 " is in line with 丨 80 leakage -2, by means of electrical connection 丨 丨 规范 规范 ^ ^ 416 416 416 416 416 416 416 M416148 at the same time the first group of electrical contact 塾The C2 position and structure also conforms to the is 7816-2, thereby electrically connecting the smart card access device under the IS07816 specification (such as the SIM/USIM card slot or the smart card reader in the mobile phone). As shown in FIG. 7, the integrated circuit chip is preferably disposed on the first surface S, that is, facing the smart card 250, and located in the second portion p2, and the first group of electrical contact pads ci and the second group of electrical properties. The first portion P1 where the contact pad C2 is located is separated by the flexible portion F. The first surface si is provided with a double-sided tape, such as a 3M film VHB tape F-9460PC, for attaching to the lower surface of the smart card 25〇. Further As shown in FIG. 7, the flexible circuit board 152 is folded into a c-shape by the flexible portion F, and the first portion P1 and the second portion P2 are Located on the opposite sides of the smart card 25〇, and in order not to affect the smart card 25〇 smoothly put the slot (such as slot 352 in Figure 8), the size of the σ 卩 pl and the second part P2 are no more than wisdom Card 250, as shown in Figures 6 and 7.
^積體電路貼片150貼附智慧卡25〇時 i54整體係位於智慧卡謂之表面之外。藉此積體電路晶 154即使沒有封裝模料覆蓋’但亦可利用钱卡25〇 路板152加以保護。 1 積組電路明片丨54藉由異方性導電膠(ACF)與軟 152的引㈣3直接接合，或者積體電路晶片154藉由金= i52 153^^ 〇 t ' 積體4路晶片154並沒有蓋封裝模料(mQ|ding)(例如環氧右 M416.148 強]固^^積體電路以154上可僅㈣有—層uv膠加 而當貼附於知Μ 減少積體電路晶片154的厚度， 挖洞或剪卡’料會需要在智慧卡25G上進行 覆蓋有封奸二明的是，積體電路晶片154亦可 路晶片154 ^右tt作對此並不欲加以限制，且若積體電 板⑸電料道有封裝模料，則可利用錫球陣列與軟性電路 線接合的方式通’料f❹上述之異紐導電膠(ACF)或金 時，in實Γ列中，當積體電路貼片_附智慧卡， 片154與第—組電性接觸塾C1係位於智慧卡 A A側’而智慧卡25G面對積體電路晶片154之這-貝1 :、不#要進行電性接觸’可允許較大的空間，因此對 於，體電路晶片154的厚度可具有較大的寬容度，甚至可能 允δ午積體電路晶片154覆蓋有封裝模料。 圖8顯示本創作實施例中一種行動通訊裝置35〇，行動通 鲁訊裝置350具有智慧卡插槽352，電池蓋354，以及如圖6與 圖7所示行動通訊裝置350之智慧卡（例^ SIM/USIM/UIM/RUIM/micro SIM) 250 與貼附其上之積體電 路貼片100。智慧卡250與貼附其上之積體電路貼片ι5〇可一 同放入插槽352’而被插槽352所存取；這時經由行動通訊裝 置350中STK選項功能，可使用積體電路貼片15〇額外提供 的功能或通訊服務。關於積體電路貼片丨50所提供的功能咬 通訊服務’可參考先前技術各文件之說明，在此不加贅述。 M416148 額外需說明的是，本說明書中智慧卡係包含符合Ι§〇7816 ..規範下之積體電路卡，可參考歐洲電信標準協會(European Telecommunications Standards Institute， ETSI)對於 Smart Cards; UICC-Terminal interface; Physical and logical characteristics的規範(ETSI-TS-102-221)，並不侷限於行動電 話所使用之SIM/USIM/UIM/RUIM/Micro SIM卡；而關於智慧 卡的應用範例’可參考 http://www.smartcardalliance.org，而本 創作並不欲加以限制。 • 在不脫離本創作精神或必要特性的情況下，可以其他特 定形式來體現本創作。應將所述具體實施例各方面僅視為解 說性而非限制性。因此，本創作的範疇如隨附申請專利範圍 所示而非如前述說明所示。所有落在申請專利範圍之等效音 義及範圍内的變更應視為落在申請專利範圍的範疇内。 【圖式簡單說明】 為了立即瞭解本創作的優點，請參考如附圖所示的特定 φ 具體實施例，詳細說明上文簡短敘述的本創作。在瞭解這些 圖示僅描繪本創作的典型具體實施例並因此不將其視為限制 本創作範疇的情況下，參考附圖以額外的明確性及細節來說 明本創作，圖式中： ° 圖1為一種依據本創作一具體實施例之積體電路貼片示 意圖； 、。 圖2為一種依據本創作—具體實施例之積體電路貼片與 智慧卡之示意圖： 圖3為一種依據本創作—具體實施例之積體電路貼片與 M416148 智慧卡之側視圖； 圖4為一種依據本創作一 圖5為一種依據本創作另 示意圖； 具體實施例之行_訊裝置. 一具體實施例之積體電路貼片 圖6為一種依據本創作另一 與智慧卡之示意圖； 具體實施例之積體電路貼片 圖7為一種依據本創作另一 與智慧卡之側視圖； 具體實施例之積體電路貼片 圖8為一種依據本創作另—具體實施例之行動通訊裝置 【主要元件符號說明】 100、150 102 、 152 103 、 153 104 、 154 200 、 250 300 、 350 302 > 352 304 、 354^Integrated circuit patch 150 attached to the smart card 25 i i54 overall is located outside the surface of the smart card. Thereby, the integrated circuit crystal 154 can be protected by the money card 25 〇 152 even if it is not covered by the package mold. 1 The integrated circuit module 54 is directly bonded to the lead (4) 3 of the soft 152 by an anisotropic conductive paste (ACF), or the integrated circuit wafer 154 is formed by a gold=i52 153^^ 〇t 'integrated 4-way wafer 154 There is no cover molding material (mQ|ding) (for example, epoxy right M416.148 strong) solid ^^ integrated circuit with 154 can only be (four) with - layer uv glue and attached to the knowledge base to reduce the integrated circuit The thickness of the wafer 154, the burrowing or the cutting of the card will need to be covered on the smart card 25G. The integrated circuit chip 154 may also be used as a chip 154. And if the integrated circuit board (5) has a package material, the solder ball array and the flexible circuit line can be used to connect the material to the above-mentioned different conductive adhesive (ACF) or gold. When the integrated circuit patch _ with a smart card, the chip 154 and the first group of electrical contacts 塾 C1 are located on the smart card AA side 'and the smart card 25G faces the integrated circuit chip 154 - Bay 1 :, not # To make electrical contact 'allows a large space, so for the thickness of the bulk circuit chip 154 can have a greater tolerance, and may even allow the formation of The circuit chip 154 is covered with a package mold. Fig. 8 shows a mobile communication device 35 in the present embodiment, the mobile communication device 350 has a smart card slot 352, a battery cover 354, and as shown in Figs. The smart card of the mobile communication device 350 (for example, SIM/USIM/UIM/RUIM/micro SIM) 250 and the integrated circuit patch 100 attached thereto. The smart card 250 and the integrated circuit patch ι5 attached thereto The 〇 can be placed in the slot 352' and accessed by the slot 352; at this time, the STK option function in the mobile communication device 350 can be used to provide additional functions or communication services using the integrated circuit patch 15. The functional bite communication service provided by the patch 丨50 can be referred to the descriptions of the prior art documents, and will not be described here. M416148 It should be noted that the smart card in this manual contains the Ι§〇7816.. For the integrated circuit card, refer to the European Telecommunications Standards Institute (ETSI) specification for Smart Cards; UICC-Terminal interface; Physical and logical characteristics (ETSI-TS-102-221). The use of limited mobile phone SIM / USIM / UIM / RUIM / Micro SIM card; and examples of applications on smart cards' can refer to http://www.smartcardalliance.org, and this creation is not intended to be limited. • This creation may be embodied in other specific forms without departing from the spirit of the creation or the necessary characteristics. The various aspects of the described embodiments are considered as illustrative and not restrictive. Therefore, the scope of the present invention is as shown in the attached patent application and is not as shown in the foregoing description. All changes that fall within the meaning and scope of the patent application are deemed to fall within the scope of the patent application. [Simple Description of the Drawings] In order to immediately understand the advantages of the present creation, please refer to the specific φ embodiment as shown in the accompanying drawings, and the present invention briefly described above will be described in detail. In the understanding that these illustrations depict only typical embodiments of the present invention and therefore are not to be considered as limiting the scope of the present invention, the present invention is illustrated with additional clarity and detail with reference to the drawings, in which: 1 is a schematic diagram of an integrated circuit patch according to a specific embodiment of the present invention; 2 is a schematic diagram of an integrated circuit patch and a smart card according to the present invention-specific embodiment: FIG. 3 is a side view of an integrated circuit patch and a M416148 smart card according to the present invention; FIG. 5 is a schematic diagram of a virtual circuit according to the present invention. FIG. 6 is a schematic diagram of an integrated circuit chip according to the present invention. FIG. 6 is a schematic diagram of another smart card according to the present invention; FIG. 7 is a side view of another smart card according to the present invention; FIG. 8 is a mobile communication device according to another embodiment of the present invention. [Description of main component symbols] 100, 150 102 , 152 103 , 153 104 , 154 200 , 250 300 , 350 302 > 352 304 , 354
Cl ' C2、Pin 1-8 SI ' S2 PI ' P2 F 積體電路貼片 軟性電路板 弓I腳 積體電路晶片 智慧卡 行動通訊裝置 智慧卡插槽 電池蓋 電性接觸墊 軟性電路板之面 軟性電路板之部份 軟性電路板之可撓部Cl ' C2 , Pin 1-8 SI ' S2 PI ' P2 F Integrated circuit SMD flexible circuit board bow I foot integrated circuit chip smart card mobile communication device smart card slot battery cover electrical contact pad soft circuit board a flexible portion of a flexible circuit board