CN105718987B - The implementation method and realization system and SIM card of one card two - Google Patents
The implementation method and realization system and SIM card of one card two Download PDFInfo
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- CN105718987B CN105718987B CN201610027596.3A CN201610027596A CN105718987B CN 105718987 B CN105718987 B CN 105718987B CN 201610027596 A CN201610027596 A CN 201610027596A CN 105718987 B CN105718987 B CN 105718987B
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- contact surface
- function contact
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- pin
- chip
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Telephone Function (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses the implementation method of one card two of one kind and realize system and SIM card, wherein, the implementation method of one card two includes the following steps: to cut the first SIM card with the active component for the golden finger part for obtaining the first SIM card, and active component includes the key security information of the first operator.The encapsulating material of active component is removed to obtain SIM card chip module.A chip is designed, chip includes the key security information of the second operator, and the first operator and the second operator are identical or different.A circuit board is designed, the front of circuit board is equipped with multiple function contact surfaces, and the back side of circuit board is set there are two pad position, and a pad position is for carrying SIM card chip module, another is for carrying chip.Electricity connection function contact surface, SIM card chip module and chip.Dimensional packaged circuit board, SIM card chip module and chip obtain supporting the second SIM card of a card two.
Description
Technical field
The present invention relates to mobile communication technology field, more particularly to one card two of one kind implementation method and realize system with
And SIM card.
Background technique
Common SIM card is all one number of a card on the market at present.If the user desired that using new number, he is just not
It obtains and does not unload original SIM card.Accordingly, there exist the operators of user's SIM card inconvenient for use and new to develop new user not
Just the problem of.
In response to this problem, there is film SIM card.But the thickness of film SIM card is higher than the thickness of existing SIM card
Compare more.Therefore, the film SIM card can not be inserted by causing the card slot of many trendy mobile phones now.In addition, film SIM card
Chip is arranged on the surface of original SIM card, and the chip of damage film SIM card is easy to during plug, leads to film
The irreversible damage of SIM card.It is bonded in addition, film SIM card carries out surface with original SIM card using double-sided adhesive form.Due to patch
It is too small to close area, is easy to fall off in use, causes film SIM card to shift, gently then poor contact causes mobile phone cannot
Identification card, contact flat spring that is heavy then leading to mobile phone card slot damage.
In order to solve the problems, such as that the thickness of film SIM card causes, occur decrypting the SIM card of the one-card multi-number of formula.This one
The SIM card for blocking more numbers in application process, needs to decrypt the original SIM card security key of Liang Ge operator using improper means
Information is to realize the function of a card two.But the original SIM card secure cryptographic key information of each operator is not easy to obtain.
Even so, it is assumed that the secure cryptographic key information of the original SIM card of each operator can be obtained, this will be present for a user
Serious security risk.
In conclusion both having solved the problems, such as SIM thickness when realizing No. two functions of card, also solves SIM card safety and ask
Topic is current technical problem urgently to be resolved.
Summary of the invention
In view of this, both having solved the problems, such as SIM thickness when it is really necessary to provide a kind of one No. two functions of card of realization, also having solved
The certainly implementation method of a card two of SIM card safety issue implements the realization system of the implementation method of a card two, and
The SIM card obtained using the implementation method of a card two.
A kind of implementation method of a card two, includes the following steps:
The first SIM card is cut to obtain the active component of the golden finger part of the first SIM card, active component includes the first fortune
Seek the key security information of quotient.
The encapsulating material of active component is removed to obtain SIM card chip module.
A chip is designed, chip includes the key security information of the second operator, the first operator and the second operator
It is identical or different.
Design a circuit board, the front of circuit board is equipped with multiple function contact surfaces, and the back side of circuit board sets that there are two welderings
Disk position, a pad position is for carrying SIM card chip module, another is for carrying chip.
Electricity connection function contact surface, SIM card chip module and chip.
Dimensional packaged circuit board, SIM card chip module and chip obtain supporting the second SIM card of a card two.
Preferably, function contact surface connects including the first VCC function contact surface, the first GND function contact surface, the first I O function
Contacting surface, the first CLK function contact surface and the first RST function contact surface.Chip includes VCC pin, GND pin, I/O pin, CLK
Pin, RST pin and IO1Pin.SIM card chip module includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the
Two I O function contact surfaces, the 2nd CLK function contact surface and the 2nd RST function contact surface.Electricity connection function contact surface, SIM core
The step of piece module and chip includes:
VCC pin, the 2nd VCC function contact surface are electrically connected with the first VCC function contact surface respectively.GND pin, second
GND function contact surface is electrically connected with the first GND function contact surface respectively.CLK pin, the 2nd CLK function contact surface respectively with
First CLK function contact surface is electrically connected.RST pin, the 2nd RST function contact surface are electric with the first RST function contact surface respectively
Property connection.
First I O function contact surface and I/O pin are electrically connected, IO1Pin and the second I O function contact surface are electrically connected.
A kind of realization system of a card two, comprising:
Cutting module obtains the active component of the golden finger part of the first SIM card for cutting the first SIM card, effectively
Position includes the key security information of the first operator.
Module is removed, for removing the encapsulating material of active component to obtain SIM card chip module.
First design module, for designing a chip, chip includes the key security information of the second operator, the first fortune
It seeks quotient and the second operator is identical or different.
Second design module, for designing a circuit board, the front of circuit board is equipped with multiple function contact surfaces, circuit board
The back side set there are two pad position, a pad position is for carrying SIM card chip module, another is for carrying chip.
Link block is used for electricity connection function contact surface, SIM card chip module and chip.
Package module obtains supporting the 2nd SIM of a card two for dimensional packaged circuit board, SIM card chip module and chip
Card.
Preferably, function contact surface connects including the first VCC function contact surface, the first GND function contact surface, the first I O function
Contacting surface, the first CLK function contact surface and the first RST function contact surface.Chip includes VCC pin, GND pin, I/O pin, CLK
Pin, RST pin and IO1Pin.SIM card chip module includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the
Two I O function contact surfaces, the 2nd CLK function contact surface and the 2nd RST function contact surface.Link block includes:
Parallel units electrically connect with the first VCC function contact surface respectively for VCC pin, the 2nd VCC function contact surface
It connects.GND pin, the 2nd GND function contact surface are electrically connected with the first GND function contact surface respectively.CLK pin, the 2nd CLK function
Energy contact surface is electrically connected with the first CLK function contact surface respectively.RST pin, the 2nd RST function contact surface are respectively with first
RST function contact surface is electrically connected.
Series unit is electrically connected, IO for the first I O function contact surface and I/O pin1Pin is contacted with the second I O function
Face is electrically connected.
A kind of SIM card, including circuit board, SIM card chip module and chip.SIM card chip module includes the first operator
Key security information, chip includes the key security information of the second operator, the first operator it is identical as the second operator or
It is different.The front of circuit board is provided with multiple function contact surfaces, and there are two pad position, a pad positions for the back side setting of circuit board
For carrying SIM card chip module, another pad position for carrying chip, SIM card chip module, chip respectively with each
Function contact surface is electrically connected.
Preferably, function contact surface connects including the first VCC function contact surface, the first GND function contact surface, the first I O function
Contacting surface, the first CLK function contact surface and the first RST function contact surface.Chip includes VCC pin, GND pin, I/O pin, CLK
Pin, RST pin and IO1Pin.SIM card chip module includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the
Two I O function contact surfaces, the 2nd CLK function contact surface and the 2nd RST function contact surface.VCC pin, the 2nd VCC function contact surface
It is electrically connected respectively with the first VCC function contact surface.GND pin, the 2nd GND function contact surface connect with the first GND function respectively
Contacting surface is electrically connected.CLK pin, the 2nd CLK function contact surface are electrically connected with the first CLK function contact surface respectively.RST pipe
Foot, the 2nd RST function contact surface are electrically connected with the first RST function contact surface respectively.First I O function contact surface and I/O pin
It is electrically connected, IO1Pin and the second I O function contact surface are electrically connected.
Preferably, including standard SIM card, Micro-SIM card or Nano-SIM card.
Preferably, the size range of SIM card chip module is 3.83*2.78mm~7.65*5.55mm, with a thickness of
0.42mm。
Preferably, chip with a thickness of 0.2mm.
Preferably, the size of circuit board be 10.8*8.0mm, circuit board with a thickness of 0.1~0.16mm.
The invention has the benefit that SIM chip module and chip possess respective key security information, it is therefore not necessary to
Obtaining key security information can be realized a card two so that improving safety.In addition, multiple shared functions are arranged in front
The pad position of contact surface, back side setting accommodating SIM chip module and chip is so that reduce the thickness of the SIM card of a card two.
Detailed description of the invention
Fig. 1 is a kind of frame structure schematic diagram of embodiment of SIM card of the present invention.
Fig. 2 is a kind of structural schematic diagram of embodiment of active component of the first SIM card.
Fig. 3 is the electrical connection schematic diagram of function contact surface, SIM card chip module and a kind of embodiment of chip.
Fig. 4 is a kind of flow diagram of embodiment of implementation method of one card two of the present invention.
Fig. 5 is a kind of the functional block diagram of embodiment of realization system of one card two of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used to limit the present invention.
FIG. 1 to FIG. 3 illustrates a kind of embodiment of SIM card of the present invention.In the present embodiment, referring to Fig. 1, the SIM card packet
Include circuit board 1, SIM card chip module 3 and chip 2.
Wherein, the front of circuit board 1 is provided with multiple function contact surfaces, and the back side of circuit board 1 is arranged there are two pad position,
One pad position is for carrying SIM card chip module 3, another pad position is for carrying chip 2.The function contact surface includes the
One VCC function contact surface, the first GND function contact surface, the first I O function contact surface, the first CLK function contact surface and the first RST
Function contact surface.It should be noted that the function contact surface in the present embodiment further includes VPP function contact surface (hanging).In addition,
The size of the circuit board 1 be 10.8*8.0mm, circuit board 1 with a thickness of 0.1~0.16mm.Circuit board 1 one in the present embodiment
Multiple function contact surfaces of face setting are shared by SIM card chip module 3, chip 2, and pad position is arranged so that SIM card core in another side
Piece module 3 and chip 2 are bonded with circuit board 1, by such structure cause the thickness of the SIM of the present embodiment with it is existing
The otherness very little of the thickness of SIM.In addition, the present embodiment causes to be less prone to chip 2 or SIM card chip dies by pad structure
The situation that block 3 falls off.
Wherein, SIM card chip module 3 is to cut to obtain through first SIM card.Referring to fig. 2, first in the present embodiment
SIM card includes standard SIM card 4, Micro-SIM card 5 or Nano-SIM card 6.Therefore, the present embodiment is suitable for existing all
SIM card.Specifically, the first step cuts the first SIM card to obtain the active component 7 of the golden finger part of the first SIM card, effectively
Position 7 includes the key security information of the first operator.In order to further guarantee the precision of cutting, the present embodiment uses laser
The mode of cutting.In addition, the size of the active component 7 of different SIM cards is different, the present embodiment can be according to SIM to be cut
The property of card is cut into various sizes of active component 7.The size range of the active component 7 is 3.83*2.78mm~7.65*
5.55mm.Second step removes the encapsulating material of active component 7 to obtain SIM card chip module 3.The present embodiment passes through removal behaviour
Reduce the thickness of active component 7.For example: the SIM card chip module 3 thickness after removal operation becomes 0.42mm.SIM card
Chip module 3 includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the second I O function contact surface, the 2nd CLK function
Contact surface and the 2nd RST function contact surface.Referring to Fig. 3, the 2nd VCC function contact surface electrically connects with the first VCC function contact surface
It connects.2nd GND function contact surface and the first GND function contact surface are electrically connected.2nd CLK function contact surface and the first CLK function
It can contact surface electric connection.2nd RST function contact surface and the first RST function contact surface are electrically connected.The contact of second I O function
Face and chip 2 are electrically connected.
Wherein, chip 2 is a kind of special chip 2.The chip 2 can be designed as different sizes according to demand.For example: 3*
3mm.In addition, chip 2 with a thickness of 0.2mm.The key security information of the chip 2 including the second operator, the first operator with
Second operator is identical or different.In addition, the chip 2 include VCC pin, GND pin, I/O pin, CLK pin, RST pin and
IO1Pin.Referring to Fig. 3, VCC pin and the first VCC function contact surface are electrically connected.GND pin and the first GND function contact surface
It is electrically connected.CLK pin and the first CLK function contact surface are electrically connected.RST pin electrically connects with the first RST function contact surface
It connects.First I O function contact surface and I/O pin are electrically connected, and IO1 pin and the second I O function contact surface are electrically connected.
In conjunction with Fig. 1 and Fig. 3, using the present embodiment SIM card when, firstly, the SIM card of the present embodiment is inserted into some hand
When machine, when user executes the number of operator's offer of SIM card chip module 3 by the menu item selection of mobile phone, data flow
Flow direction are as follows: the first I O function contact surface of circuit board 1, the I/O pin of chip 2, chip 2 IO1Pin, SIM card chip module 3
The second I O function contact surface bidirectional data transfers.Secondly, user executes the operation of chip 2 by the menu item selection of mobile phone
When the number that quotient provides, the flow direction of data flow are as follows: the two-way number of the first I O function contact surface of circuit board 1, the I/O pin of chip 2
According to transmission.
Fig. 4 illustrates a kind of embodiment of the implementation method of one card two of the present invention.In the present embodiment, a card two
Implementation method include the following steps:
Step S1 cuts the first SIM card to obtain the active component of the golden finger part of the first SIM card, active component packet
Include the key security information of the first operator.
It should be noted that the first SIM card in the present embodiment includes standard SIM card, Micro-SIM card or Nano-SIM
Card.Therefore, the present embodiment is suitable for existing all SIM cards.The purpose of the present embodiment is that being obtained by way of cutting
The active component of first SIM card.Specifically, by the way of laser cutting, it can further guarantee the precision of cutting.This reality
Various sizes of active component can be cut into according to the property of the first SIM card by applying example.The size range of the active component is
3.83*2.78mm~7.65*5.55mm.
Step S2 removes the encapsulating material of active component to obtain SIM card chip module.
The present embodiment reduces the thickness of active component by removing operation.
Step S3, designs a chip, and chip includes the key security information of the second operator, the first operator and second
Operator is identical or different.
The present embodiment can both support different two number of same operator, can also support different operators not
Two same numbers.
Step S4 designs a circuit board, and the front of circuit board is equipped with multiple function contact surfaces, and the back side of circuit board is equipped with
Two pad positions, a pad position is for carrying SIM card chip module, another is for carrying chip.The present embodiment uses STM
Surface patch technique, the corresponding pad locations in the back side that SIM card chip module, chip are affixed on circuit board, melts by high temperature tin
It closes, formation has complete physical circuit and connects novel SIM card chip module.
Multiple function contact surfaces of circuit board one side setting in the present embodiment are shared by SIM card chip module, chip, separately
Pad position is set so that SIM card chip module and chip are bonded with circuit board on one side, is less prone to chip or SIM card chip
The situation that module falls off.
Step S5, electricity connection function contact surface, SIM card chip module and chip.
Specifically, which includes the first VCC function contact surface, the first GND function contact surface, the first I O function
Contact surface, the first CLK function contact surface and the first RST function contact surface.Chip include VCC pin, GND pin, I/O pin,
CLK pin, RST pin and IO1Pin.SIM card chip module includes the 2nd VCC function contact surface, the contact of the 2nd GND function
Face, the second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface.VCC pin, the 2nd VCC function
Contact surface is electrically connected with the first VCC function contact surface respectively.GND pin, the 2nd GND function contact surface respectively with the first GND
Function contact surface is electrically connected.CLK pin, the 2nd CLK function contact surface are electrically connected with the first CLK function contact surface respectively.
RST pin, the 2nd RST function contact surface are electrically connected with the first RST function contact surface respectively.First I O function contact surface and IO
Pin is electrically connected, IO1Pin and the second I O function contact surface are electrically connected.
Step S6, dimensional packaged circuit board, SIM card chip module and chip obtain supporting the second SIM card of a card two.
The present embodiment uses high temperature tin dimensional packaged circuit board, SIM card chip module and chip so that obtained the second SIM card
Electric property is more preferably.In addition, the present embodiment uses pvc packaging technology, the novel SIM card chip module that step S4 is obtained is encapsulated
For the SIM card of a standard, thickness is up to 0.9mm, finally by punching pvc, can make and obtain standard SIM card, Micro-SIM card
Or Nano-SIM card.
Fig. 5 illustrates a kind of embodiment of the realization system of one card two of the present invention.In the present embodiment, a card two
Realization system include cutting module 10, removal module 11, first design module 12, second design module 13, link block 14
With package module 15.
Wherein, cutting module 10 obtain effective portion of the golden finger part of the first SIM card for cutting the first SIM card
Position, active component includes the key security information of the first operator.It should be noted that the essence in order to further guarantee cutting
Degree, the present embodiment is by the way of laser cutting.Module 11 is removed, for removing the encapsulating material of active component to obtain SIM
Card chip module.It should be noted that SIM card chip module include the 2nd VCC function contact surface, the 2nd GND function contact surface,
Second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface.First design module 12, for designing
One chip, chip include the key security information of the second operator, and the first operator and the second operator are identical or different.It needs
It is noted that the chip includes VCC pin, GND pin, I/O pin, CLK pin, RST pin and IO1Pin.Second design
Module 13, for designing a circuit board, the front of circuit board is equipped with multiple function contact surfaces, there are two the back side of circuit board is set
Pad position, a pad position is for carrying SIM card chip module, another is for carrying chip.It should be noted that function connects
Contacting surface includes the first VCC function contact surface, the first GND function contact surface, the first I O function contact surface, the contact of the first CLK function
Face and the first RST function contact surface.Link block 14 is used for electricity connection function contact surface, SIM card chip module and chip.
It should be noted that the link block 14 includes parallel units and series unit.Wherein, parallel units, for VCC pin, the
Two VCC function contact surfaces are electrically connected with the first VCC function contact surface respectively.GND pin, the 2nd GND function contact surface difference
It is electrically connected with the first GND function contact surface.CLK pin, the 2nd CLK function contact surface respectively with the first CLK function contact surface
It is electrically connected.RST pin, the 2nd RST function contact surface are electrically connected with the first RST function contact surface respectively.Series unit is used
It is electrically connected in the first I O function contact surface and I/O pin, IO1Pin and the second I O function contact surface are electrically connected.Package module
15, obtain supporting the second SIM card of a card two for dimensional packaged circuit board, SIM card chip module and chip.The present embodiment uses
PVC packaging technology, dimensional packaged circuit board, SIM card chip module and chip are the SIM card of a standard, and thickness is up to 0.9mm,
Finally by punching pvc, it can make and obtain standard SIM card, Micro-SIM card or Nano-SIM card.
The specific embodiment of invention is described in detail above, but it is only used as example, the present invention is not intended to limit
With specific embodiments described above.For a person skilled in the art, any equivalent modifications that the invention is carried out
Or substitute also all among scope of the invention, therefore, the made equalization in the case where not departing from the spirit and principles in the present invention range
Transformation and modification, improvement etc., all should be contained within the scope of the invention.
Claims (6)
1. the implementation method of one card two of one kind, which comprises the steps of:
The first SIM card is cut to obtain the active component of the golden finger part of first SIM card, the active component includes the
The key security information of one operator；
The encapsulating material of the active component is removed to obtain SIM card chip module；
Design a chip, the chip includes the key security information of the second operator, first operator and described the
Two operators are identical or different；
A circuit board is designed, the front of the circuit board is equipped with multiple function contact surfaces, and the back side of the circuit board is equipped with two
A pad position, a pad position is for carrying the SIM card chip module, another is for carrying the chip；
It is electrically connected the function contact surface, the SIM card chip module and the chip；
Encapsulate the second SIM card that the circuit board, the SIM card chip module and the chip obtain supporting a card two；
Wherein, the function contact surface includes the first VCC function contact surface, the first GND function contact surface, the contact of the first I O function
Face, the first CLK function contact surface and the first RST function contact surface；The chip include VCC pin, GND pin, I/O pin,
CLK pin, RST pin and IO1Pin；The SIM card chip module connects including the 2nd VCC function contact surface, the 2nd GND function
Contacting surface, the second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface；The function is electrically connected to connect
The step of contacting surface, the SIM chip module and chip includes:
The VCC pin, the 2nd VCC function contact surface are electrically connected with the first VCC function contact surface respectively；It is described
GND pin, the 2nd GND function contact surface are electrically connected with the first GND function contact surface respectively；The CLK pin,
The 2nd CLK function contact surface is electrically connected with the first CLK function contact surface respectively；The RST pin, described second
RST function contact surface is electrically connected with the first RST function contact surface respectively；
The first I O function contact surface and the I/O pin are electrically connected, the IO1Pin and the second I O function contact surface
It is electrically connected.
2. the realization system of one card two of one kind characterized by comprising
Cutting module obtains the active component of the golden finger part of first SIM card for cutting the first SIM card, described
Active component includes the key security information of the first operator；
Module is removed, for removing the encapsulating material of the active component to obtain SIM card chip module；
First design module, for designing a chip, the chip includes the key security information of the second operator, and described the
One operator and second operator are identical or different；
Second design module, for designing a circuit board, the front of the circuit board is equipped with multiple function contact surfaces, the electricity
The back side of road plate is set there are two pad position, and a pad position is for carrying the SIM card chip module, another is for carrying institute
State chip；
Link block, for being electrically connected the function contact surface, the SIM card chip module and the chip；
Package module obtains supporting a card two for encapsulating the circuit board, the SIM card chip module and the chip
Second SIM card；
Wherein, the function contact surface includes the first VCC function contact surface, the first GND function contact surface, the contact of the first I O function
Face, the first CLK function contact surface and the first RST function contact surface；The chip include VCC pin, GND pin, I/O pin,
CLK pin, RST pin and IO1Pin；The SIM card chip module connects including the 2nd VCC function contact surface, the 2nd GND function
Contacting surface, the second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface；The link block includes:
Parallel units, for the VCC pin, the 2nd VCC function contact surface respectively with the first VCC function contact surface
It is electrically connected；The GND pin, the 2nd GND function contact surface electrically connect with the first GND function contact surface respectively
It connects；The CLK pin, the 2nd CLK function contact surface are electrically connected with the first CLK function contact surface respectively；It is described
RST pin, the 2nd RST function contact surface are electrically connected with the first RST function contact surface respectively；
Series unit is electrically connected, the IO for the first I O function contact surface and the I/O pin1Pin and described the
Two I O function contact surfaces are electrically connected.
3. a kind of SIM card, which is characterized in that the SIM card includes standard SIM card, Micro-SIM card or Nano-SIM card,
It include circuit board, SIM card chip module and chip, the SIM card chip module includes that the key of the first operator is believed safely
Breath, the chip include the key security information of the second operator, first operator it is identical as second operator or
It is different；The front of the circuit board is provided with multiple function contact surfaces, and the back side setting of the circuit board is there are two pad position, and one
A pad position is for carrying the SIM card chip module, another pad position is for carrying the chip, the SIM card chip
Module, the chip are electrically connected with function contact surface described in each respectively；
The function contact surface includes the first VCC function contact surface, the first GND function contact surface, the first I O function contact surface, the
One CLK function contact surface and the first RST function contact surface；The chip includes VCC pin, GND pin, I/O pin, CLK pipe
Foot, RST pin and IO1Pin；The SIM card chip module include the 2nd VCC function contact surface, the 2nd GND function contact surface,
Second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface；The VCC pin, the 2nd VCC
Function contact surface is electrically connected with the first VCC function contact surface respectively；The GND pin, the 2nd GND function contact
Face is electrically connected with the first GND function contact surface respectively；The CLK pin, the 2nd CLK function contact surface respectively with
The first CLK function contact surface is electrically connected；The RST pin, the 2nd RST function contact surface are respectively with described first
RST function contact surface is electrically connected；The first I O function contact surface and the I/O pin are electrically connected, the IO1Pin with
The second I O function contact surface is electrically connected.
4. SIM card according to claim 3, which is characterized in that the size range of the SIM card chip module is 3.83*
2.78mm~7.65*5.55mm, with a thickness of 0.42mm.
5. SIM card according to claim 3, which is characterized in that the chip with a thickness of 0.2mm.
6. SIM card according to claim 3, which is characterized in that the size of the circuit board is 10.8*8.0mm, the electricity
Road plate with a thickness of 0.1~0.16mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610027596.3A CN105718987B (en) | 2016-01-15 | 2016-01-15 | The implementation method and realization system and SIM card of one card two |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1952959A (en) * | 2006-11-22 | 2007-04-25 | 凤凰微电子（中国）有限公司 | Smart card and method for integrating multiple customer identification module on smart card |
| CN201289917Y (en) * | 2008-09-10 | 2009-08-12 | 宇龙计算机通信科技(深圳)有限公司 | User discrimination card seat and mobile terminal |
| CN201289649Y (en) * | 2008-10-22 | 2009-08-12 | 拓讯资讯股份有限公司 | Extension device of IC chip |
| CN202058194U (en) * | 2011-04-06 | 2011-11-30 | 东莞宇龙通信科技有限公司 | Mobile terminal subscriber identify module (SIM) card packaging structure thereof |
| EP2621244A1 (en) * | 2010-09-26 | 2013-07-31 | China Mobile Communications Corporation | User identification card, terminal, and related processing method |
| CN205486218U (en) * | 2016-01-15 | 2016-08-17 | 张惠芳 | Sim card |
-
2016
- 2016-01-15 CN CN201610027596.3A patent/CN105718987B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1952959A (en) * | 2006-11-22 | 2007-04-25 | 凤凰微电子（中国）有限公司 | Smart card and method for integrating multiple customer identification module on smart card |
| CN201289917Y (en) * | 2008-09-10 | 2009-08-12 | 宇龙计算机通信科技(深圳)有限公司 | User discrimination card seat and mobile terminal |
| CN201289649Y (en) * | 2008-10-22 | 2009-08-12 | 拓讯资讯股份有限公司 | Extension device of IC chip |
| EP2621244A1 (en) * | 2010-09-26 | 2013-07-31 | China Mobile Communications Corporation | User identification card, terminal, and related processing method |
| CN202058194U (en) * | 2011-04-06 | 2011-11-30 | 东莞宇龙通信科技有限公司 | Mobile terminal subscriber identify module (SIM) card packaging structure thereof |
| CN205486218U (en) * | 2016-01-15 | 2016-08-17 | 张惠芳 | Sim card |
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