、新型說明： 【新型所屬之技術領域】 本創作係有關於一種檢測系統，尤指一種用於檢測多 個電子元件外觀的多軌式檢測裝置。 【先前技術】 、卞个 j 4雨八貝丁展口口兴仃纫逋訊產品皆朝；r 輕薄短小、多功能、高可靠度與低價化的趨勢發展。順應 =固趨勢，在電子產品的電路料中，各式各樣的電子元 須面對著積體整合化的問題。電子元件小型化一直 流，例如隨著傳統僅具純語音通訊功能 曰〕仃動包5舌陸、續消失，消費者對行 、 多元化方向發展，其中包括記事二的需求更趨向於 影音傳輸等附加的應用直接帶動了^、啊傳輸及多媒體 上的變革，也Μ為產品設計勒動電話在產品設計 子元件數目也愈來愈多。 隹，其所使用到的電 電子元件的可靠度及產品的 ，使用上的品質及性能表現。一般而影響到各種產品 完成後均會進行目視檢測的流裎^ s，電子元件在製造 定的品質。在習知技術中，電子元:保電子元件具有一 上，以供多組攝影機擷取電子元件卩玫Ϊ在一大型轉盤 到電子元件底面的影像，、表面影像，但為了得 利攝影機敝電子元件的心鲶透級質，以 【新型内容】 本創作實施例在於提供一種 於檢測·多個電子元件的外觀。New type of description: [New technical field] This creation is about a detection system, especially a multi-track detection device for detecting the appearance of multiple electronic components. [Previous technology], a j 4 rain eight Beiding exhibition mouth Xing 仃 仃 逋 逋 逋 产品 产品 产品 产品 产品 ; ; ; ; ; ; ; ; ; r r r r r r r r r r r r r r r r r; In accordance with the solid trend, in the circuit materials of electronic products, various electronic components have to face the problem of integrated integration. The miniaturization of electronic components has always flowed. For example, with the traditional only pure voice communication function, the smashing of the package has disappeared, and the consumer has been moving in a diversified direction. The demand for Note 2 is more likely to be transmitted to the Internet. Additional applications have directly led to the transformation of ^, ah transmission and multimedia, as well as the product design, the number of components in the product design is increasing.隹, the reliability of the electrical and electronic components used and the quality and performance of the product, use. Generally, it affects all kinds of products. After completion, visual inspection will be performed. The electronic components are manufactured to a certain quality. In the prior art, the electronic component: the electronic component has an upper part for the plurality of cameras to capture the electronic component, the image of the large turntable to the bottom surface of the electronic component, and the surface image, but for the benefit of the camera, the electronic device The core of the component is of a high quality, and the present invention provides a method for detecting the appearance of a plurality of electronic components.
蜊裝置，其可用 本創作實施例提供一蜊 device, which can be provided by the present creative embodiment
其包括：一 3/16 轉=;=模組。轉盤模組包括-旋轉底盤結構及 轉盤結構結構上的中空透明轉盤結構，中空透明 的外圈區域，中n成:内圈區域與-圍繞内圈區域 構所遮罢構的内圈區域被旋轉底盤結 空透明^結‘上^、賴的外_域被裸露在外，中 方的環形料區域、面具有至少兩個位於外圈區域上 至少兩個環形導引區2述多個電子元件依序排列在上述 明轉盤結構的電子元件°，測1包括多個鄰近中空透 檢測，依序圍繞中:=結r上述多個電子元件 其可Ϊ所實施例所提供的多執式檢測裝置， 更創作的 【實:二】_用來對本創作加以限制者。 4參閱圖1至圖7所 裝置，其包括：-轉盤槿1且、1提供一種多軌式檢測 模組3、-校正· 4、：：轉模組2、—無振動 一分類模組7。 ^周拉組5、一檢測模組6、及 首先，配合圖1、圖2盥 _ 1轉底盤結構1G及—巧、^3所*，轉龍組1包括 透明轉盤結構η。舉例來士、轉底盤結構10上的中空 中空的金屬底盤，且中空透兄轉底盤結構10·可為-非 透明轉盤結構】1可為-固定(例 4/16 M413860 如透過多個螺絲的鎖固方“ · 的透明玻璃轉盤。由於:疋)在旋轉底盤結構]0上 結構，因此可大大節省製作盤結構10為-t空的 成本。由於旋轉底盤結構i0 =明轉盤結構】0的材料 二以當轉盤模組1需要進行騎或ίίϋ在ΓΪ轉轴上， 女裝旋轉底盤結構10即，一又Τ /、祐要拆卸或 結構u，以避免中空透明轉盤=需要動到中空透明轉盤 下導致損壞而降低使用壽命。Q 在經常拆卸或安裝 另外’中空透明轉盤結構u 區域no與-圍繞内圈區域⑽可區分成-内圈 明轉盤結構η的内圈區域„〇被:=二中空透 ，直中空透明轉盤結構21的外 -|、、、σ構】〇所遮蓋 空透明轉盤結構u的上表面被裸露在外。中 川上方的環形導引區域11G(如圖立於外圈區域 多個電子元件E可依序排列在 幵,:广)’且上述 如圖3所禾）。 引區域11G上（ 此外，中空透明轉盤結構u 、〆圍繞中空部分ΠΑ的内圈部^ 成—中空部分ΠΑ 分ΠΒ的外圈部分11C。中空透明轉盤結及^圍繞内圈部 nA位於旋轉底盤結構1〇上以形成—晋★的中空部分 透明轉盤結構11的内圈部分】】B於二間11R，中空 上，且中空透明轉盤結構U的外^ ^旋轉底盤結構10 外，中空透明轉盤結構u的内圈區域刀^】C被懸空。另 11B的下表面上，中空透明轉盤結構=於内圈部分 於外圈部分nc的下表面上，且卜圈區域⑴位 於中空透明轉盤結構η的外圈部分區域ug位 的上表面上。 5/16It includes: a 3/16 turn =; = module. The turntable module comprises a rotating chassis structure and a hollow transparent turntable structure on the turntable structure, and a hollow transparent outer ring area, wherein the inner ring area and the inner ring area surrounded by the inner ring area are rotated. The outer surface of the chassis is transparent, and the outer region of the upper and lower sides is exposed. The annular material region and the surface of the middle have at least two annular guiding regions at the outer ring region. Aligning the electronic components of the open turntable structure, the test 1 includes a plurality of adjacent hollow through-detection, sequentially surrounding the middle: = junction r of the plurality of electronic components, which can be provided by the multi-detection device provided by the embodiment, The creation of [real: two] _ used to limit the creation of this creation. 4 Referring to the apparatus of FIG. 1 to FIG. 7, which includes: - a turntable 槿 1 and 1, a multi-track detection module 3, - a correction · 4, a:: a rotary module 2, a vibration-free classification module 7 . ^ Zhou pull group 5, a detection module 6, and first, with the Figure 1, Figure 2 _ 1 turn chassis structure 1G and - Qiao, ^ 3 *, the turn group 1 includes a transparent turntable structure η. For example, a hollow hollow metal chassis on a chassis, a turntable chassis structure 10, and a hollow through-rotary chassis structure 10 can be a - non-transparent turntable structure. 1 can be - fixed (example 4/16 M413860 such as through multiple screws The locking glass "· transparent glass turntable. Because: 疋) structure on the rotating chassis structure 0, so the cost of making the disk structure 10 to -t empty can be greatly saved. Because of the rotating chassis structure i0 = open turntable structure] The second material is that when the turntable module 1 needs to be riding or ί ϋ on the ΓΪ shaft, the women's rotating chassis structure 10, ie, Τ /, 佑 拆 拆 拆 拆 拆 拆 拆 拆 拆 拆 拆 拆 拆The transparent turntable causes damage and reduces the service life. Q is often disassembled or installed in another 'hollow transparent turntable structure u area no and - around the inner ring area (10) can be divided into the inner ring area of the inner ring open turntable structure η = Two hollow, the outer surface of the transparent transparent turntable structure u covered by the outer -|,, σ structure of the straight hollow transparent turntable structure 21 is exposed. The annular guiding region 11G above the Nakagawa (the plurality of electronic components E in the outer ring region are arranged in the order of 幵, 广:) and the above is as shown in Fig. 3). On the lead-in area 11G (in addition, the hollow transparent turntable structure u, the inner ring portion of the hollow portion of the hollow portion is formed into a hollow portion ΠΑ the outer ring portion 11C of the split portion. The hollow transparent turntable knot and the inner ring portion nA are located on the rotating chassis The inner ring portion of the transparent turntable structure 11 of the hollow portion of the structure is formed on the structure 1], and the outer ring portion of the hollow transparent turntable structure U is a hollow transparent turntable. The inner ring area of the structure u is suspended. On the lower surface of the other 11B, the hollow transparent turntable structure = the inner ring portion is on the lower surface of the outer ring portion nc, and the buck region (1) is located in the hollow transparent turntable structure η The outer ring portion of the area is on the upper surface of the ug. 5/16
A JOOU 再者，配合圖1、圖2與圖4所示，進料模組2包括 至少—鄰近中空透明轉盤結構Π且用於導引上述多個電 子元件E的進料單元20，其中進料單元2〇具有至少兩二 =於導弓丨上述多個電子元件E的V形進料槽2〇〇。舉例來 ，’進料單元20可以靠著持續振動的方式，以使得上述 多個電子元件E可在兩個V形進料槽2 0 〇内持續的向前移 動’而不致產生電子元件E卡料的情況。 另外，配合圖1、圖2與圖4所示，無振動模組3包 $至少一鄰近中空透明轉盤結構11且設置於中空透明轉 盤結構11與進料模組2之間的無振動導引塊3〇，其中無 ，動導引塊3Q具有至少兩個分別連通於兩個v形進料槽 弓Π且分別對應於兩個環形導引區域11G的V形無振動i 槽300，且上述多個在兩個V形進料槽2〇〇内的電子元 引=依序被兩個V形無振動導引槽3 〇 〇導引到兩個環形導 =11G上。此外，無振動導引塊3〇與進料單元如彼 弓ulW、於每—個電子元件E長度的距離，且無振動導 兮 /、中工透明轉盤結構11彼此分離一特定距離。換 2^)相塊％麟、輪生振_進料單元 平所以無振動導引塊3。能夠持續處於 穩:二，進而使得每-個電子元件E可以平 相形無振動導⑽3GG導引到每一個 相對應的環形導弓丨區域11G上。 口 至少圖2與圖5所示，校正模組4包括 透明轉盤結構11上方的校正單元仙 校正每_個電二:::包括至少兩·個相互配合以用於 疋件ε的方位(方向及/或位置)的校正元件 6/16 M413860 400，且兩個校正元件400彼此分離一特定距離以形成一 位於兩個校正元件400之間的電子元件導引通道400P。換 言之，每一個從V形無振動導引槽300所導引出的電子元 件E可以先透過每一個相對應的校正單元40來進行粗略 的導引（亦即讓每一個電子元件E通過每一個相對應的電 子元件導引通道400P)，一般稱之為電子元件E的粗導， 以使得每一個電子元件E的位置可以較正確地安置在每一 個相對應的環形導引區域11G上。 此外，配合圖1、圖2與圖5所示，微調模組5包括 至少兩個設置於中空透明轉盤結構11上方且分別鄰近兩 個校正單元40的微調單元50,其中兩個微調單元50分別 位於兩個環形導引區域11G的内侧旁，且每一個微調單元 50具有至少一用於接觸每一個電子元件E的内側表面E1 以微調每一個電子元件E的方位的微調元件500。換言之 ，每一個經過校正單元40進行粗略導引後的電子元件E 可以透過每一個相對應的微調單元50來進行較細微的導 引（亦即透過微調單元50的側邊來輕觸電子元件E的内側 表面E1)，一般稱之為電子元件E的細導，以使得每一個 電子元件E的位置可以更正確地安置在每一個相對應的環 形導引區域11G上。 再者，配合圖1、圖2與圖6所示，檢測模組6包括 多個鄰近中空透明轉盤結構11的電子元件檢測單元60， 其中上述多個電子元件檢測單元60依序圍繞中空透明轉 盤結構11 (例如圖2所示，上述多個電子元件檢測單元60 的圍繞範圍將近5/8個圓周大小）。另夕卜，上述多個電子元 件檢測單元60中的一部分（圖6中顯示其中一個電子元件 7/16 · M41-3860 檢測單元60)設置於容置空間11R内及容置空間11R上方 ，且上述每一個設置於容置空間11R内與容置空間11R上 方的電子元件檢測單元60包括一反射鏡601及一設置於 反射鏡601上方的影像擷取鏡頭602。由於電子元件檢測 單元60可以設置於容置空間11R内，所以本創作透過反 射鏡601與影像擷取鏡頭602的配合，即可正確地擷取到 電子元件E的内側表面E1的正面影像。舉例來說，電子 元件檢測單元60的數量共有12個，其中6個電子元件檢 測單元60負責位於其中一環形導引區域11G上的多個電 子元件E的檢測，且其餘6個電子元件檢測單元60則負 責位於另外一環形導引區域11G上的多個電子元件E的檢 測。 另外，配合圖1、圖2與圖7所示，分類模組7鄰近 中空透明轉盤結構1 ]且設置於進料模組2與上述多個電子 元件檢測單元60中的最後一個之間。此外，上述多個電 子元件E經過上述多個電子元件檢測單元60的檢測而被 分類成多個良好電子元件E’、多個不良電子元件E”、及 多個再測試電子元件E”’。分類模組7包括至少一用於收 集上述多個良好電子元件E’的第一收容單元7A、至少一 用於收集上述多個不良電子元件E”的第二收容單元7B、 及至少一用於收集上述多個再測試電子元件E”’的第三收 容單元7C，且第一收容單元7A、第二收容單元7B、與第 三收容單元7C並非三個獨立的結構，而是被組合成單個 收容結構。 舉例來說，首先，配合β 2與圖7所示，第一收容單 元7Α包括至少兩個第一分類入口 70Α、至少兩個設置於 8/16 職 3860 二述—形導 7〇A內^ — 子7°件E'吹入兩個第一分類入口 於兩個第Ή ^(如圖2所㈤、至少兩個分別連通 ^ 分類入口撤的第-輸送管路72A、及至少— ^ 第—輸送管路72A的第—收集盒W。此外， 早兀7B包括至少兩個第二分類入口 70B、至小 空透明轉盤結構U上方且將上述多個位二 兩=科引區域11G上的不良電子元件£，，吹入兩個第 二通入口 7〇Β内的第二喷嘴7m(如圖2所示）、至少兩 個/刀別連通於兩個第二分類入口地的第二輸送管路观 、及至少一連通於兩個第二輸送管路72Β的第二收鱼各 73Β。另外，第三收容單^ 7C包括至少兩個第三分類= 70C、至少兩個設置於中空透明轉盤結構u上方且將上述 多個位於兩個環形導引區域11G上的再測試電子元件 吹入兩個第三分類入口 70C内的第三噴嘴71C(如圖2所示 )、至少兩個分別連通於兩個弟二分類入口 70C的第二g 送管路72C、及至少一連通於兩個第三輸送管路72C的^ 三收集盒73C。 因此，由於上述多個位於兩個環形導引區域〗丨G上的 良好電子元件E，可以同時被收集在同一個第一收集盒73A 内(如圖7中兩條中心線所經過的路徑所示)，上個位 於兩個環形導引區域11G±的不良電子元件£ ”可以同時 在同：個第二收集t 7犯内(如圖7中兩條中心線 的路#所7^) ’且上述多個位於兩個環形導引區域 - L 元件£;，，可以同時被收集在同一個第 木立73c内（如圖7令兩條虛線所經過的路徑所示）， 9/J6 Γ本創作分嶋7的心物作成本皆可有效降 〔實施例的可能功效〕 其二供的多軌式檢測裝置， 設計，以使得太劍你沾^ 無振動導引槽相互配合，，的 到多個電子元件的外觀檢測裝置可以更正罐地檢測 =應的校正單元來進行粗略=亦=透： ；^件的位置可以較正確地以使付母-個電 導弓I區域上。此外，本創 置在母一個相對應的環形 單元來進行較細微的導引，以:透過每一個相對應的微調 可以更正確地安置在二Γ得每一個電子元件的位置 外，本創作亦可將上述多個 個第-收集盒内，將上述多個不子件:時《在同-一個第二收隼各，日胺L、1、不良电子兀件同時收集在同 在同-個第2收集盒内，=個再測試電子元件同時收集 間及製作成本。"以有效地降低分類模組的使用空 本創行實施例，非_限 :為之等效技術變化；包::==圖式内容 【圖式簡單說明】 州作之乾圍内。 作多轨式檢測震置的立體示意圖； 圖2為本_多轨式檢職置的上 圖3為本創作轉盤模組的側視剖面示意圖、:· ’ 圖4為本創作進料模纟且與無 ^D 一 圖5為本創作校-模組與微調模圖； 10/16 M413860 圖6為本創作其中一電子元件檢測單元的一部分容置於轉 盤模組的容置空間的側視剖面示意圖；以及 圖7為本創作分類模組的側視示意圖。 【主要元件符號說明】A JOOU, in addition, as shown in FIG. 1, FIG. 2 and FIG. 4, the feeding module 2 includes at least a feeding unit 20 adjacent to the hollow transparent rotating structure and for guiding the plurality of electronic components E, wherein The material unit 2 has at least two and two V-shaped feed grooves 2〇〇 for guiding the plurality of electronic components E. For example, the 'feed unit 20 can be continuously vibrated so that the plurality of electronic components E can be continuously moved forward in the two V-shaped feed slots 20 ' without generating an electronic component E card. Material situation. In addition, as shown in FIG. 1 , FIG. 2 and FIG. 4 , the vibration-free module 3 includes at least one vibration-free guide disposed adjacent to the hollow transparent turntable structure 11 and disposed between the hollow transparent turntable structure 11 and the feed module 2 . Block 3〇, wherein none, the movable guiding block 3Q has at least two V-shaped vibration-free i-grooves 300 respectively communicating with the two v-shaped feed groove arches and respectively corresponding to the two annular guiding regions 11G, and the above A plurality of electron elements in the two V-shaped feed slots 2 are sequentially guided by the two V-shaped vibration-free guide grooves 3 to the two annular guides = 11G. Further, the non-vibration guide block 3 is separated from the feed unit by a distance of a length of each electronic component E, and the vibration-free guide / / medium-transparent turntable structure 11 is separated from each other by a specific distance. Change 2^) phase block % lin, wheel vibration _ feed unit flat so no vibration guide block 3. It can be continuously stabilized: two, so that each of the electronic components E can be guided to the corresponding annular guide bow region 11G by the flat phase non-vibration guide (10) 3GG. At least as shown in FIG. 2 and FIG. 5, the correction module 4 includes a correction unit above the transparent turntable structure 11 for correcting each _ electric two::: including at least two mutual cooperation for the orientation of the element ε (direction) And/or position correction element 6/16 M413860 400, and the two correction elements 400 are separated from one another by a specific distance to form an electronic component guiding channel 400P between the two correction elements 400. In other words, each of the electronic components E guided from the V-shaped vibration-free guiding groove 300 can be roughly guided through each of the corresponding correcting units 40 (that is, each electronic component E is passed through each of them). The corresponding electronic component guiding passages 400P), generally referred to as the thick guides of the electronic components E, are such that the position of each of the electronic components E can be relatively correctly placed on each of the corresponding annular guiding regions 11G. In addition, as shown in FIG. 1 , FIG. 2 and FIG. 5 , the fine adjustment module 5 includes at least two fine adjustment units 50 disposed above the hollow transparent turntable structure 11 and adjacent to the two correction units 40 respectively, wherein the two fine adjustment units 50 respectively Located on the inner side of the two annular guiding regions 11G, and each trimming unit 50 has at least one fine tuning element 500 for contacting the inner side surface E1 of each electronic component E to finely adjust the orientation of each electronic component E. In other words, each of the electronic components E that have been roughly guided by the correction unit 40 can be finely guided through each of the corresponding fine adjustment units 50 (ie, through the sides of the fine adjustment unit 50 to lightly touch the electronic components E). The inner side surface E1), generally referred to as the fine guide of the electronic component E, is such that the position of each electronic component E can be more correctly placed on each of the corresponding annular guide regions 11G. Furthermore, as shown in FIG. 1 , FIG. 2 and FIG. 6 , the detecting module 6 includes a plurality of electronic component detecting units 60 adjacent to the hollow transparent turntable structure 11 , wherein the plurality of electronic component detecting units 60 sequentially surround the hollow transparent turntable. Structure 11 (for example, as shown in FIG. 2, the surrounding range of the plurality of electronic component detecting units 60 is approximately 5/8 circumferential sizes). In addition, a part of the plurality of electronic component detecting units 60 (one of the electronic components 7/16 · M41-3860 detecting unit 60 is shown in FIG. 6) is disposed in the accommodating space 11R and above the accommodating space 11R, and Each of the electronic component detecting units 60 disposed in the accommodating space 11R and above the accommodating space 11R includes a mirror 601 and an image capturing lens 602 disposed above the mirror 601. Since the electronic component detecting unit 60 can be disposed in the accommodating space 11R, the original image of the inner surface E1 of the electronic component E can be accurately captured by the cooperation of the mirror 601 and the image capturing lens 602. For example, there are a total of 12 electronic component detecting units 60, wherein 6 electronic component detecting units 60 are responsible for detecting a plurality of electronic components E located on one of the annular guiding regions 11G, and the remaining 6 electronic component detecting units 60 is responsible for the detection of a plurality of electronic components E located on the other annular guiding region 11G. Further, as shown in Figs. 1, 2 and 7, the sorting module 7 is disposed adjacent to the hollow transparent turntable structure 1 and between the feed module 2 and the last one of the plurality of electronic component detecting units 60. Further, the plurality of electronic components E are classified into a plurality of good electronic components E', a plurality of defective electronic components E", and a plurality of retest electronic components E"' by the detection of the plurality of electronic component detecting means 60. The classification module 7 includes at least one first storage unit 7A for collecting the plurality of good electronic components E', at least one second storage unit 7B for collecting the plurality of defective electronic components E", and at least one for The third storage unit 7C of the plurality of retest electronic components E"' is collected, and the first storage unit 7A, the second storage unit 7B, and the third storage unit 7C are not three separate structures, but are combined into a single unit. Containment structure. For example, first, in conjunction with β 2 and FIG. 7 , the first receiving unit 7Α includes at least two first sorting inlets 70Α, and at least two are disposed in 8/16 positions 3860. — The sub 7° piece E' is blown into the two first classification inlets in two Ή ^ (as shown in Figure 2 (five), at least two separate communication lines - the first delivery line 72A, and at least - ^ - a first collection box W of the delivery line 72A. Further, the early stage 7B includes at least two second sorting inlets 70B, above the small empty transparent turntable structure U and on the plurality of bits two on the reference area 11G a defective electronic component £, a second nozzle 7m (shown in FIG. 2) blown into the two second inlets 7〇Β, and a second delivery of at least two/knifes connected to the two second sorting inlets The pipeline view and the at least one second fish receiving the two second conveying pipes 72Β are each 73. In addition, the third receiving unit 7C includes at least two third categories=70C, at least two are arranged in the hollow transparent Above the turntable structure u and blowing the plurality of retest electronic components located on the two annular guiding regions 11G into two a third nozzle 71C (shown in FIG. 2) in the three-class inlet 70C, at least two second g-feed lines 72C respectively connected to the two second-class inlets 70C, and at least one connected to the two third transports The collecting box 73C of the line 72C. Therefore, since the plurality of good electronic components E located on the two annular guiding areas 丨G can be simultaneously collected in the same first collecting box 73A (Fig. 7) In the path through which the two centerlines pass, the last bad electronic component in the two annular guiding areas 11G± can be simultaneously in the same: a second collection t 7 (as shown in Figure 7 The center line of the road #7)) 'and the above multiple located in the two annular guiding areas - L element £;,, can be collected simultaneously in the same first wooden stand 73c (as shown in Figure 7 by two dashed lines According to the path), 9/J6 Γ 创作 创作 嶋 的 的 的 的 的 的 的 的 的 嶋 嶋 嶋 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 〔 The vibration guiding grooves cooperate with each other, and the appearance detecting device to the plurality of electronic components can correct the can Detect = the correcting unit should be used to make the rough = also = transparent: ; ^ The position of the piece can be more correctly to make the mother-inductive bow I area. In addition, the present is created in the corresponding ring unit of the mother. More subtle guidance: through each corresponding fine-tuning can be more correctly placed in the position of each electronic component of the second, the creation can also be more than the above-mentioned multiple-collection box No sub-pieces: When in the same - a second collection, the daily amine L, 1, the bad electronic components are collected in the same - the second collection box, = re-test electronic components at the same time And production costs. " to effectively reduce the use of classification modules, the implementation of the example, non-limit: for its equivalent technical changes; package::== schema content [schematic description] state made Inside the dry fence. A three-dimensional schematic diagram of a multi-track detection shock; Figure 2 is a schematic view of a side view of the creation of the turntable module in the above-mentioned multi-track inspection service: [Fig. 4 is a creative feed module And FIG. 5 is a creative school-module and fine-tuning mode; 10/16 M413860 FIG. 6 is a side view of a part of an electronic component detecting unit accommodated in the housing space of the turntable module. A schematic cross-sectional view; and Figure 7 is a side view of the authoring classification module. [Main component symbol description]
電子元件 E 内側表面 E1 良好電子元件 E， 不良電子元件 E，， 再測試電子元件 E，，， 轉盤模組 1 旋轉底盤結構 10 中空透明轉盤結構 11 内圈區域 110 外圈區域 111 中空部分 11A 内圈部分 11B 外圈部分 11C 容置空間 11R 環形導引區域 11G 進料模組 2 進料單元 20 V形進料槽 200 無振動模組 3 無振動導引塊 30 V形無振動導引槽 300 校正模組 4 校正單元 40 校正元件 400 電子元件導引通道 400P 微調模組 •5 微調單元 50 微調元件 500 11/16 M413860 檢測模組 分類模組Electronic component E inner surface E1 good electronic component E, defective electronic component E, retest electronic component E,, turntable module 1 rotating chassis structure 10 hollow transparent turntable structure 11 inner ring region 110 outer ring region 111 hollow portion 11A Ring portion 11B Outer ring portion 11C Housing space 11R Annular guiding region 11G Feeding module 2 Feeding unit 20 V-shaped feeding slot 200 Vibration-free module 3 Vibration-free guiding block 30 V-shaped vibration-free guiding groove 300 Correction module 4 Correction unit 40 Correction component 400 Electronic component guide channel 400P Fine-tuning module • 5 Fine-tuning unit 50 Fine-tuning component 500 11/16 M413860 Detection module classification module
電子元件檢測單元 60 反射鏡 601 影像擷取鏡頭 602 第一收容單元 7A 第二收容單元 7B 第三收容單元 7C 第一分類入口 70A 第二分類入口 70B 第三分類入口 70C 第一噴嘴 71A 第二噴嘴 71B 第三喷嘴 71C 第一輸送管路 72A 第二輸送管路 72B 第三輸送管路 72C 第一收集盒 73A 第二收集盒 73B 第三收集盒 73C 12/16Electronic component detecting unit 60 mirror 601 image capturing lens 602 first housing unit 7A second housing unit 7B third housing unit 7C first sorting inlet 70A second sorting inlet 70B third sorting inlet 70C first nozzle 71A second nozzle 71B third nozzle 71C first delivery line 72A second delivery line 72B third delivery line 72C first collection box 73A second collection box 73B third collection box 73C 12/16