TWI559423B - Die image capture device - Google Patents
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本發明係關於一種晶粒攝影裝置，特別是關於一種用於狹長形晶粒的晶粒攝影裝置。 The present invention relates to a die attaching apparatus, and more particularly to a die attaching apparatus for elongated die.
在半導體製程中，晶圓被切割成晶粒(Die)後，會經過各項測試，並依據各晶粒的良窳、外觀等特性而分類別，然後據以將同一類別的晶粒整齊的排列到彈性貼膜或料盤(Tray)上，以方便後續製程設備(如：固晶機(Die Bonder))之作業。 In the semiconductor process, after the wafer is cut into die, it will pass various tests and be classified according to the characteristics of each die, such as the shape and appearance of the die, and then the crystal grains of the same category will be neatly arranged. Arranged on a flexible film or tray to facilitate subsequent processing of the process equipment (eg Die Bonder).
在檢測、挑揀、排列等過程中，會需要利用晶粒攝影裝置對晶粒進行拍攝並做視覺辨識，以確實了解晶粒外觀良窳及位置誤差以準確地完成後續各項動作並減少錯誤的情況產生。特別是，對於非屬正方形的狹長形晶粒而言，些微的偏轉便會造成極大的位置誤差，而造成晶粒置放失敗。因此，利用晶粒攝影裝置進行晶粒高解析度的拍攝並校正十分重要。 In the process of detection, picking, arranging, etc., it is necessary to use a die-photographing device to take a picture of the die and visually recognize it, so as to accurately understand the appearance of the grain and the position error to accurately complete the subsequent actions and reduce the error. The situation arises. In particular, for a non-square-shaped elongated die, slight deflection causes a large positional error, which causes die placement failure. Therefore, it is important to perform high-resolution filming and correction of the grain using a die attaching device.
習知晶粒攝影裝置主要分為面掃描(Area-scan)與線掃描(Line-scan)兩種架構。面掃描架構主要包括單一個高解析度鏡頭及一高解析度攝影機，鏡頭的視野範圍將晶粒整體納入而進行拍攝。因此，面掃描架構所得的影像解析度完全受限於鏡頭和攝影機的解析度，故當視野範圍越大，影像解析度越差。線掃描架構主要包括一高解析度鏡頭及一線掃描攝影機，其搭配一移動平台使晶粒相對於鏡頭沿著掃描路徑移動而進行多次拍攝。然而，線掃描攝影機的造價不菲，移動平台的設置則會拉長整體產線和增加成本以及多次拍攝也 會增加製程時間，而降低整體製程速度。 Conventional grain photographic devices are mainly divided into two types of area scanning (Area-scan) and line scanning (Line-scan). The surface scanning architecture mainly includes a single high-resolution lens and a high-resolution camera. The field of view of the lens is integrated into the lens for shooting. Therefore, the image resolution obtained by the area scanning architecture is completely limited by the resolution of the lens and the camera, so the larger the field of view, the worse the image resolution. The line scan architecture mainly includes a high-resolution lens and a line scan camera, which is combined with a moving platform to move the die relative to the lens along the scan path for multiple shots. However, the cost of line-scan cameras is high, and the setting of mobile platforms will lengthen the overall production line and increase costs as well as multiple shots. Will increase the processing time, and reduce the overall process speed.
鑒於以上所述，習知晶粒攝影裝置在影像解析度、設置成本、執行速度上難以兼顧，而無法充分滿足現今半導體產業所追求的高品質低成本需求。 In view of the above, the conventional grain photographic apparatus is difficult to achieve in terms of image resolution, installation cost, and execution speed, and cannot sufficiently satisfy the high quality and low cost demand pursued by the semiconductor industry today.
緣此，本發明之一目的在於提供一種晶粒攝影裝置，能夠兼顧高的影像辨識效能、執行速度快、及低成本等需求。 Accordingly, it is an object of the present invention to provide a die imaging apparatus capable of achieving both high image recognition performance, fast execution speed, and low cost.
本發明為解決習知技術之問題所採用之技術手段係提供一種晶粒攝影裝置，用於拍攝一狹長形晶粒，該晶粒攝影裝置包含：複數個攝影鏡頭，每個該攝影鏡頭具有對應於該狹長形晶粒的一視野範圍，該複數個攝影鏡頭經配置而使每個該視野範圍之寬度係為小於該狹長形晶粒之長度，該複數個視野範圍係沿著該狹長形晶粒的長度方向排列，且該複數個視野範圍之聯集係涵蓋該狹長形晶粒之長度的全部；複數個攝影機，各個攝影機連接該一個攝影鏡頭，而藉由該複數個攝影鏡頭拍攝該狹長形晶粒的各別位置的影像；以及一影像處理單元，連接該複數個攝影機，而對該複數個攝影機所拍攝的該狹長形晶粒的影像予以處理。 The technical means adopted by the present invention to solve the problems of the prior art provides a die photographic apparatus for photographing a long and narrow die. The die photographic apparatus includes: a plurality of photographic lenses, each of which has a corresponding In a field of view of the elongated die, the plurality of photographic lenses are configured such that a width of each of the fields of view is less than a length of the elongated die, the plurality of fields of view being along the elongated die The lengthwise direction of the particles is arranged, and the plurality of fields of view of the plurality of fields of view cover all of the length of the elongated die; the plurality of cameras, each camera is connected to the one photographic lens, and the plurality of photographic lenses are used to capture the elongated length An image of a respective position of the shaped die; and an image processing unit that connects the plurality of cameras and processes the image of the elongated die captured by the plurality of cameras.
依據本發明的一實施例，該複數個攝影鏡頭之視野範圍的中心點係為排列成一直線。 According to an embodiment of the invention, the center points of the field of view of the plurality of photographic lenses are arranged in a line.
依據本發明的一實施例，該複數個攝影鏡頭之視野範圍的中心點係為等間距排列。 According to an embodiment of the invention, the center points of the field of view of the plurality of photographic lenses are arranged at equal intervals.
依據本發明的一實施例，相鄰的該視野範圍之間係具有一交集視野範圍，該交集視野範圍之寬度係小於單個該視野範圍之寬度的一半。 According to an embodiment of the invention, adjacent fields of view have an intersection field of view, the width of the intersection field of view being less than half the width of a single field of view.
依據本發明的一實施例，該複數個攝影鏡頭之視野範圍之中心點係位於該狹長形晶粒上。 According to an embodiment of the invention, the center point of the field of view of the plurality of photographic lenses is located on the elongated die.
依據本發明的一實施例，該複數個攝影鏡頭之視野範圍之聯集之寬度與該狹長形晶粒之長度之間的差距，係不大於單個該視野範圍之寬度的一半。 According to an embodiment of the invention, the difference between the width of the combination of the field of view of the plurality of photographic lenses and the length of the elongated die is no more than half of the width of the single field of view.
依據本發明的一實施例，該複數個攝影鏡頭之視野範圍係為相同大小。 According to an embodiment of the invention, the field of view of the plurality of photographic lenses is the same size.
依據本發明的一實施例，該複數個攝影機係具有相同的拍攝解析度。 According to an embodiment of the invention, the plurality of cameras have the same resolution.
經由本發明所採用之技術手段，單個鏡頭的視野範圍整體用於涵蓋狹長形晶粒沿著長度方向上的單一位置，因各別視野範圍較小，使得狹長形晶粒的各別位置的影像解析度提升，整體狹長形晶粒的影像解析度也因此大幅提升。再者，本發明的晶粒攝影裝置係以同步拍攝影像的方式配置，單次拍攝即能夠取得狹長形晶粒的整體影像，執行效率高，不會影響到整體製程的速度。並且，相較於習知線掃描架構，本發明的晶粒攝影裝置的結構不須大空間且各構件的造價平實，而能夠更方便地套用在現有的晶粒攝影裝置中。 Through the technical means adopted by the present invention, the field of view of a single lens is generally used to cover a single position along the length direction of the elongated die, and the image of each position of the elongated die is small because the respective fields of view are small. As the resolution increases, the image resolution of the overall elongated die is greatly improved. Furthermore, the die imaging apparatus of the present invention is arranged such that images are captured simultaneously, and a single image of the elongated die can be obtained in a single shot, and the execution efficiency is high without affecting the speed of the overall process. Moreover, compared with the conventional line scanning architecture, the structure of the die attaching apparatus of the present invention does not require a large space and the cost of each component is flat, and can be more conveniently applied to the existing die attaching apparatus.
100‧‧‧晶粒攝影裝置 100‧‧‧Grade photographic device
1a‧‧‧攝影鏡頭 1a‧‧‧Photographic lens
11a‧‧‧視野範圍 11a‧‧ Scope of view
111a‧‧‧中心點 111a‧‧‧Center
1b‧‧‧攝影鏡頭 1b‧‧‧Photographic lens
11b‧‧‧視野範圍 11b‧‧‧ Field of view
111b‧‧‧中心點 111b‧‧‧Center
1c‧‧‧攝影鏡頭 1c‧‧‧Photographic lens
11c‧‧‧視野範圍 11c‧‧ Scope of view
111c‧‧‧中心點 111c‧‧‧ center point
2a‧‧‧攝影機 2a‧‧‧ camera
2b‧‧‧攝影機 2b‧‧‧ camera
2c‧‧‧攝影機 2c‧‧‧ camera
3‧‧‧影像處理單元 3‧‧‧Image Processing Unit
I1‧‧‧交集視野範圍 I1‧‧‧ intersection field of vision
I2‧‧‧交集視野範圍 I2‧‧‧ intersection field of vision
D‧‧‧狹長形晶粒 D‧‧‧Rough and long grain
Dab‧‧‧間距 Dab‧‧‧ spacing
Dbc‧‧‧間距 Dbc‧‧‧ spacing
L‧‧‧長度方向 L‧‧‧ Length direction
Ld‧‧‧長度 Ld‧‧‧ length
Wa‧‧‧寬度 Wa‧‧‧Width
Wb‧‧‧寬度 Wb‧‧‧Width
Wc‧‧‧寬度 Wc‧‧‧Width
Wab‧‧‧寬度 Wab‧‧‧Width
Wbc‧‧‧寬度 Wbc‧‧‧Width
Wu‧‧‧寬度 Wu‧‧‧Width
第1圖係顯示依據本發明的一實施例的一晶粒攝影裝置的示意圖；第2圖係顯示依據本發明的實施例的晶粒攝影裝置的鏡頭視野範圍的示意圖。 1 is a schematic view showing a die imaging apparatus according to an embodiment of the present invention; and FIG. 2 is a schematic view showing a lens field of view of a die imaging apparatus according to an embodiment of the present invention.
以下根據第1圖及第2圖，而說明本發明的實施方式。該說明並非為限制本發明的實施方式，而為本發明之實施例的一種。 Hereinafter, embodiments of the present invention will be described with reference to Figs. 1 and 2 . This description is not intended to limit the embodiments of the invention, but is an embodiment of the invention.
如第1圖及第2圖所示，根據本發明的一實施例的一晶粒攝影裝置100，用於拍攝一狹長形晶粒D，該晶粒攝影裝置100包含：複數個攝影鏡 頭1a、1b、1c，每個該攝影鏡頭1a、1b、1c具有對應於該狹長形晶粒D的一視野範圍11a、11b、11c，該複數個攝影鏡頭1a、1b、1c經配置而使每個該視野範圍11a、11b、11c之寬度Wa、Wb、Wc係為小於該狹長形晶粒D之長度Ld，該複數個視野範圍11a、11b、11c係沿著該狹長形晶粒D的長度方向L排列，且該複數個視野範圍11a、11b、11c之聯集係涵蓋該狹長形晶粒D之長度Ld的全部；複數個攝影機2a、2b、2c，各個攝影機2a、2b、2c連接該一個攝影鏡頭1a、1b、1c，而藉由該複數個攝影鏡頭1a、1b、1c拍攝該狹長形晶粒D的各別位置的影像；以及一影像處理單元3，連接該複數個攝影機2a、2b、2c，而對該複數個攝影機2a、2b、2c所拍攝的該狹長形晶粒D的影像予以處理。 As shown in FIG. 1 and FIG. 2, a die imaging apparatus 100 according to an embodiment of the present invention is configured to capture an elongated die D. The die imaging apparatus 100 includes: a plurality of photographic mirrors The heads 1a, 1b, 1c, each of the photographic lenses 1a, 1b, 1c have a field of view 11a, 11b, 11c corresponding to the elongated die D, the plurality of photographic lenses 1a, 1b, 1c being configured to The widths Wa, Wb, and Wc of each of the field of view ranges 11a, 11b, and 11c are smaller than the length Ld of the elongated die D, and the plurality of fields of view 11a, 11b, and 11c are along the elongated die D. The longitudinal direction L is arranged, and the combination of the plurality of visual field ranges 11a, 11b, 11c covers all of the length Ld of the elongated die D; the plurality of cameras 2a, 2b, 2c, and the respective cameras 2a, 2b, 2c are connected The photographic lens 1a, 1b, 1c, and the images of the respective positions of the elongated die D are captured by the plurality of photographic lenses 1a, 1b, 1c; and an image processing unit 3 connecting the plurality of cameras 2a 2b, 2c, and the image of the elongated die D captured by the plurality of cameras 2a, 2b, 2c is processed.
應注意的是，雖然在本實施例中，攝影鏡頭的數量為三個，但本發明並不以此為限，攝影鏡頭的數量可為二個以上的任意數，攝影機的數量則對應於攝影鏡頭。 It should be noted that although in the present embodiment, the number of photographic lenses is three, the present invention is not limited thereto, the number of photographic lenses may be two or more arbitrary numbers, and the number of cameras corresponds to photography. Lens.
藉由上述結構，單個攝影鏡頭1a、1b、1c的整體視野範圍11a、11b、11c涵蓋狹長形晶粒D沿著長度方向L上的單一位置，使得狹長形晶粒D的各別位置便充分使用單個攝影鏡頭1a、1b、1c所擁有的解析度能力，讓整體狹長形晶粒D的影像解析度大幅提升。再者，各攝影鏡頭1a、1b、1c的配置方式能夠同步對狹長形晶粒D進行拍攝，晶粒攝影裝置100進行單次拍攝即能夠取得狹長形晶粒D的整體影像，執行效率高，不會影響到整體製程的速度。並且，本發明的晶粒攝影裝置100在架設上免去習知線掃描架構中的佔空間的移動平台以及昂貴的線掃描攝影機，設置方便且成本低，而能夠更方便地套用在現有的晶粒攝影裝置中。 With the above configuration, the entire field of view 11a, 11b, 11c of the single photographic lenses 1a, 1b, 1c covers a single position of the elongated die D along the length direction L, so that the respective positions of the elongated die D are sufficient Using the resolution capability possessed by the single photographic lenses 1a, 1b, 1c, the image resolution of the overall elongated die D is greatly improved. Further, the arrangement of the respective photographic lenses 1a, 1b, and 1c can simultaneously capture the elongated die D, and the die imaging apparatus 100 can obtain the entire image of the elongated die D in a single shot, and the execution efficiency is high. Will not affect the speed of the overall process. Moreover, the die photographic apparatus 100 of the present invention eliminates the space-consuming mobile platform and the expensive line scan camera in the conventional line scanning architecture, and is convenient to set up and low in cost, and can be more conveniently applied to the existing crystal. In the particle photography device.
如第1圖及第2圖所示，在本實施例中，該複數個攝影鏡頭1a、1b、1c之視野範圍11a、11b、11c的中心點111a、111b、111c係為排列成一直線，較佳地，該直線平行於該狹長形晶粒D的長度方向L。藉此，該複 數個攝影鏡頭1a、1b、1c所拍攝的該狹長形晶粒D的各別位置的影像具有一致的參考基準(即，排列成一直線的中心點111a、111b、111c)，而方便於後續該影像處理單元3之影像處理。 As shown in FIG. 1 and FIG. 2, in the present embodiment, the center points 111a, 111b, and 111c of the field of view of the plurality of photographic lenses 1a, 1b, and 1c are arranged in a straight line. Preferably, the line is parallel to the length direction L of the elongated die D. Taking this The images of the respective positions of the elongated die D taken by the plurality of photographic lenses 1a, 1b, 1c have a uniform reference datum (ie, center points 111a, 111b, 111c arranged in a line), which is convenient for subsequent Image processing by image processing unit 3.
較佳地，為了更為方便影像處理，該複數個攝影鏡頭1a、1b、1c之視野範圍11a、11b、11c係為相同大小，以及該複數個攝影機2a、2b、2c係具有相同的拍攝解析度。如此一來，在合併各影像時，能夠簡化影像縮放、解析度調整等處理。 Preferably, for more convenient image processing, the plurality of photographic lenses 1a, 1b, 1c have the same size range of view fields 11a, 11b, 11c, and the plurality of cameras 2a, 2b, 2c have the same imaging resolution. degree. In this way, when the respective images are combined, processing such as image scaling and resolution adjustment can be simplified.
再者，該複數個攝影鏡頭1a、1b、1c之視野範圍11a、11b、11c的中心點111a、111b、111c較佳地為等間距排列，即相鄰的中心點111a與中心點111b之間距Dab以及相鄰的中心點111b與中心點111c之間距Dbc為相等。藉此，該複數個攝影鏡頭1a、1b、1c所拍攝的該狹長形晶粒D的各別位置的影像具有一致的水平間距為基準，方便於後續該影像處理單元3之影像處理。 Furthermore, the center points 111a, 111b, 111c of the field of view 11a, 11b, 11c of the plurality of photographic lenses 1a, 1b, 1c are preferably equally spaced, that is, the distance between the adjacent center point 111a and the center point 111b. The distance Dbc between Dab and the adjacent center point 111b and the center point 111c is equal. Thereby, the images of the respective positions of the elongated die D captured by the plurality of photographic lenses 1a, 1b, and 1c have a uniform horizontal pitch as a reference, which facilitates subsequent image processing of the image processing unit 3.
此外，該複數個攝影鏡頭1a、1b、1c之視野範圍11a、11b、11c之中心點111a、111b、111c較佳地為位於該狹長形晶粒D上，藉此更能確保該狹長形晶粒D位在該視野範圍11a、11b、11c內。 In addition, the center points 111a, 111b, and 111c of the field of view of the plurality of photographic lenses 1a, 1b, and 1c are preferably located on the elongated die D, thereby ensuring the elongated crystal. The particle D is located within the field of view 11a, 11b, 11c.
如第1圖及第2圖所示，在本實施例中，相鄰的該視野範圍(即，該視野範圍11a及11b，以及該視野範圍11b及11c)之間係具有一交集視野範圍I1、I2。藉由在相鄰的視野範圍之間產生交集視野範圍I1、I2的配置，可防止在相鄰的視野範圍之交界處餘留有拍攝範圍外的「空區」，以避免該狹長形晶粒D位在該空區的部分無法被拍攝到而有缺漏影像的問題產生。再者，該交集視野範圍I1、I2之寬度Wab、Wbc係小於單個該視野範圍11a、11b、11c之寬度Wa、Wb、Wc的一半，以避免影像重複部分過多，造成攝影資源浪費。同樣為了避免攝影資源之浪費，在本實施例中，該複數個攝影鏡頭1a、1b、1c之視野範圍11a、11b、11c之聯集之寬度Wu與該狹長形晶粒D之長度Ld之間的差距， 係不大於單個該視野範圍11a、11b、11c之寬度Wa、Wb、Wc的一半。 As shown in FIG. 1 and FIG. 2, in the present embodiment, the adjacent field of view range (ie, the field of view ranges 11a and 11b, and the field of view ranges 11b and 11c) has an intersection field of view I1. , I2. By creating an arrangement of the intersection field of view I1, I2 between adjacent fields of view, it is possible to prevent an "empty area" outside the shooting range from remaining at the boundary of the adjacent field of view to avoid the elongated die The problem that the D bit is not captured in the empty area and there is a missing image occurs. Furthermore, the widths Wab and Wbc of the intersection field of view I1 and I2 are less than half of the widths Wa, Wb, and Wc of the single field of view 11a, 11b, and 11c, so as to avoid excessive image duplication and waste of photographic resources. Also in order to avoid waste of photographic resources, in the present embodiment, between the width Wu of the combination of the fields of view 11a, 11b, 11c of the plurality of photographic lenses 1a, 1b, 1c and the length Ld of the elongated die D difference, It is not more than half of the widths Wa, Wb, Wc of a single field of view 11a, 11b, 11c.
以上之敘述僅為本發明之較佳實施例說明，凡精於此項技藝者當可依據上述之說明而作其它種種之改良，惟這些改變仍屬於本發明之發明精神及以下所界定之專利範圍中。 The above description is only for the preferred embodiment of the present invention, and those skilled in the art can make other improvements according to the above description, but these changes still belong to the inventive spirit of the present invention and the patents defined below. In the scope.
100‧‧‧晶粒攝影裝置 100‧‧‧Grade photographic device
1a‧‧‧攝影鏡頭 1a‧‧‧Photographic lens
11a‧‧‧視野範圍 11a‧‧ Scope of view
1b‧‧‧攝影鏡頭 1b‧‧‧Photographic lens
11b‧‧‧視野範圍 11b‧‧‧ Field of view
1c‧‧‧攝影鏡頭 1c‧‧‧Photographic lens
11c‧‧‧視野範圍 11c‧‧ Scope of view
2a‧‧‧攝影機 2a‧‧‧ camera
2b‧‧‧攝影機 2b‧‧‧ camera
2c‧‧‧攝影機 2c‧‧‧ camera
3‧‧‧影像處理單元 3‧‧‧Image Processing Unit
D‧‧‧狹長形晶粒 D‧‧‧Rough and long grain
Claims (8)
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| JP2002350118A (en) * | 2001-05-30 | 2002-12-04 | Shinkawa Ltd | Image processing method, method for processing detection object, image processing apparatus and bonding apparatus |
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| JP2002350118A (en) * | 2001-05-30 | 2002-12-04 | Shinkawa Ltd | Image processing method, method for processing detection object, image processing apparatus and bonding apparatus |
| TW201201314A (en) * | 2010-05-25 | 2012-01-01 | Hanmi Semiconductor Co Ltd | Wafer conveying device and location sensing system and vision inspecting system having the same |
| TW201227536A (en) * | 2010-12-17 | 2012-07-01 | Univ Nat Taiwan Science Tech | Method of obtaining panoramic micrograph and apparatus thereof |
| US20140142740A1 (en) * | 2011-06-15 | 2014-05-22 | Uladimir Prakapenka | Apparatus and method for positioning an electronic component and/or a carrier relative to a discharging device |
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