五、新型說明： 【新型所屬之技術領域】 本創作係關於一種照明裝置，尤其關於一種結構簡化的 照明裝置。 【先前技術】 目别市面上的電燈通常使用螢光燈管。然而，為了符合 環保需求的前提下，使用發光二極體的照明光源明顯較螢光 燈官為佳。因此，如何利用發光二極體為照明光源以獲得一 省電、尚売度且符合環保需求的照明裝置，實為一重要課題。 圖1顯示習知使用發光二極體的照明裝置的示意圖。如 圖1所示，照明裝置100包含有一變壓器（transf〇rmer)(未 圖示）、一外殼模組13〇及一光源模組12〇。變壓器及光源模 組120設於外殼模組13〇内。 光源模組120包含一基板122及多個發光二極體121。 基板122可以為印刷電路板。發光二極體121設於基板122 上’為了增加照明裝置的發光亮度，通常使用高瓦數的發光 二極體’例如使用3瓦特的發光二極體。然而，目前發光二 極體（LED)的封裝設計仍以多層次封裝為基礎，造成散熱 路徑上有多個封裝界面而產生的界面熱阻，因此熱容易累積 於印刷電路板上而降低散熱效率。因為散熱效果不佳，發光 一極體121的溫度無法有效降低，會減少發光二極體121的 發光效率及使用壽命。為了對發光二極體121進行散熱，於 習知的發光二極體121會連接於一散熱模組。 更具體而言，外殼模組130包含一連接座π卜基座132 及夕個转片133。多個转片133設於基座132的一端，而連 接座131設於基座132的另一端。多個鰭片133界定—空間， 用以容置光源模組120。多個發光二極體121熱耦接於多個 鰭片133，用以傳導發光二極體121所產生的熱。由於使用 多個鰭片133，能夠增加散熱面積，使熱能從較大的面積被 傳導或輻射至周圍空氣中，藉以有效降低發光二極體121的 溫度。 然而，多個鰭片133通常為金屬材質，且為產生足夠的 散熱效果財厚度鮮且餘實，其材質可械銅或銅合 金、純鋁或鋁合金、或銅與鋁金屬所形成的複合材料，雖然 使用多個則133的散熱效果較好，但其成本較高，且組裝 步驟較為複雜，而增加照明裝置1GG的製造成本。 【新型内容】 依據本i丨作-實施例，提供—種結構簡化的照明裝置。 於一實施例中，提供—種減少製造X時的照明裝置。於-實 施例中，提供-種節省製造成本的照明裝置。 依據本創作一實施例，提供一種照明裝置其包含一光源 模組、一外殼模組及一透光遮蓋。光源模组包含一基板、至 少一發光二極體驅動電路及多個發光二極體。至少_發光二 極體驅動電路設於基板上，用以提供一電流。多個發光二極 體，設於基板上，耦接於發光二極體驅動電路，每—發光二 極體的功率介於G_G5瓦特至G.2瓦特之間，且_鄰之發光 二極體間隔一預定距離，且該預定距離大於約〇 5mm。透光 遮蓋與外殼模組界定出一空間，用以容置光源模組。 於-實施财，外殼模組包含-外殼，且外殼的表面為 —平滑面，沒有形成多個鰭片，而能夠減少組裝步驟及困難 度。 於一實施例中，發光一極體驅動電路為一積體電路，發 光一極體驅動電路的電流的值介於15毫安至1〇〇毫安之 間》較佳的情況是，發光二極體驅動電路的電流的值介於15 毫安至50毫安之間。 於一實施例中，外殼模組包含一外殼，且外殼係以沖壓 方式對一金屬薄板進行沖壓來形成。於一實施例中，光源模 組的該些發光二極體，熱接觸於外殼，藉以使該些發光二極 體所產生的熱透過外殼傳導至外部環境。較佳的情況是，光 源模組的基板的形狀為一長條形、—方形或一長方形。 於一實施例中，透光遮蓋包含一外框及一透光板，且透 光板設於外框内側’透光板之面向該些發光二極體的一表面 上’形成有多個微結構，藉以使該些發光二極體所發出之光 線穿透該些微結構後，改變其行經路徑後再照射至一外部環 境。 於一實施例中，發光二極體驅動電路與該些發光二極體 串聯，且基板直接設於外殼模組上，且該些發光二極體發出 一光線後，光線直接穿過透光遮蓋。 依據本創作一實施例，由於使用多個低瓦數的發光二極 體來替代高瓦數的發光二極體，並使兩相鄰發光二極體間隔 一大於約0.5mm的預定距離，能夠減少熱源聚集在局部的現 象。發光二極體是使用0.05瓦特至0.2瓦特的發光二極體， 能夠減少熱的產生。於一實施例中，發光二極體驅動電路產 生15mA〜100mA (毫安）電流用以配合發光二極體，減少熱 的產生’改善發光二極體的發光效率，因而可以不使用散熱 裝置或鰭片，減少製造成本。 【實施方式】 圖2顯示依本創作一實施例之照明裝置的示意圖。如圖2 所示，本創作一實施例之照明裝置2〇〇包含一光源模組220、 一外殼模組230及一透光遮蓋240。外殼模組230及透光遮 蓋240界定出一空間，光源模組220設於前述空間内。 15mA〜50mA之間。於本實施例中使用提供35mA的發光二 極體驅動電路223。於本實施例中，由於所採用的發光二極 體驅動電路223及發光二極體221，其規格能夠互相匹配， 因此可以省略變壓器，而僅使用由積體電路所構成的發光二 極體驅動電路223，來驅動發光二極體22卜 外殼模組230包含一連接座23卜基座232及一外殼233。 外殼233設於基座232的一端，而連接座231設於基座232 的另一端。外殼233界定一容槽，用以容置光源模組220。 外殼233可以為不包含有用以增加擴散面積的鰭片，而形成 具有一平滑面的外表面。外殼233可以利用一模具鑄造來加 以形成’亦可以由沖壓方式來形成。於本實施例中，外殼233 的外表面為圓弧面。且光源模組220的基板222的形狀為一 圓形。外殼233可以為一金屬薄板用以將發光二極體221所 產生的熱傳導至外部環境。連接座231用以連接至一外部電 源（未圖示），使外部電源提供一交流電給發光二極體驅動 電路223 » 透光遮蓋240覆蓋於外殼233之容槽，用以與外殼模組 230界定出一空間。發光二極體221面向透光遮蓋240。透 光遮蓋240之面向發光二極體221的表面上，形成有微結 構。發光二極體221所發出之光線穿透過透光遮蓋24〇後， 照射至外部環境。更具體而言，發光二極體221所發出之光 線更穿透透光遮盖240的微結構後，改變光行經路徑後再時 射至外部環境，用以使亮度將更為均勻，提高輻射效率。於 本實施例中，透光遮蓋240係為半球形狀，但本創作不限定 透光遮蓋240的形狀，於一實施例中，其亦可以為長條形狀 (未圖示）。 圖3顯示依本創作另一實施例之照明裝置的示意圖。圖3 實施例之照明裝置200a相似於圖2實施例之照明裝置2〇〇， 因此相同的元件使用相同的符號’並將省略其相關說明，而 說明兩者間的相異處。如圖3所示，照明裝置200a包含一光 源模組220、一外殼模組230及一透光遮蓋240〇於本實施 例中，外殼模組230及透光遮蓋240皆係屬於長條形狀。外 殼模組230可以為僅是一外殼233，亦可以更包含有一連接 結構用以裝設於一壁面（未圖示）。於本實施例中係以沖壓 方式對一金屬薄板進行沖壓來形成外殼233，相較於使用鑄 模方式，能夠較減少製造成本。此外，於本實施例中是使發 光二極體驅動電路223與60個低瓦特數的發光二極體221 互相串聯。於一實施例，光源模組220的發光二極體221係 熱連接於外殼233，因此發光二極體221所產生之熱能夠傳 導至外殼233，並透過外殼233傳導至外部環境中。由於發 光二極體221為低瓦數的發光二極體，其所產生之熱較少， 藉由金屬薄板即足以將對發光二極體221進行散熱，使照明 裝置200a得到較佳的照明亮度。 透光遮蓋240包含一外框241及一透光板242。透光板 242係形成一長條形狀’設於外框241内側。透光板242之 面向發光二極體221的表面上，形成有微結構，發光二極體 221所發出之光線穿透透光遮蓋24〇的微結構後，改變光行 經路徑後再照射至外部環境，用以使亮度將更為均勻。此外 於一實施例中’發光二極體121發出光線後，該光線係直接 穿透過透光板242，亦即發光二極體121及透光板242間未 設置其他光學元件，如此能夠減化照明裝置2〇〇a的元件，節 省製造成本。 圖4顯示依本創作另一實施例之照明裝置的示意圖。圖4 實施例之照明裝置200b相似於圖3實施例之照明裝置 200a ’因此相同的元件使用相同的符號，並將省略其相關說 明，而僅說明兩者間的相異處。如圖4所示，照明裝置200b 包含一光源模組220、一外殼模組230及一透光遮蓋240。 於本實施例中，外殼模組230及透光遮蓋240皆係屬於方形 或長方形狀。 依據本創作一實施例，由於使用多個低瓦數的發光二極 體來替代高瓦數的發光二極體，並使兩相鄰發光二極體221 間隔一預定距離，且預定距離大於約0.5mm，能夠減少熱源 聚集在局部的現象，而使發光二極體221所產生的熱較為分 M406686 散。於一實施例中，發光二極體221是使用0.05瓦特至0.2 瓦特的發光二極體，能夠減少熱的產生。於一實施例中，發 光二極體驅動電路223產生15mA〜100mA (毫安）電流用以 配合發光二極體22卜以減少熱的產生，改善發光二極體221 的發光效率，因而可以不使用散熱裝置或鰭片，減少製造成 本。 【圖式簡單說明】 圖1顯示習知使用發光二極體的照明裝置的示意圖。 圖2顯示依本創作一實施例之照明裝置的示意圖。 圖3顯示依本創作另一實施例之照明裝置的示意圖。 圖4顯示依本創作另一實施例之照明裝置的示意圖。 【主要元件符號說明】 100 照明裝置 100 照明裝置 120 光源模組 121 發光二極體 M406686 122 基板 130 外殼模組 131 連接座 132 基座 133 多個鰭片 200 照明裝置 200a 照明裝置 200b 照明裝置 220 光源模組 221 發光二極體 222 基板 223 發光二極體驅動電路 230 外殼模組 231 連接座 232 基座 233 外殼 240 透光遮蓋 241 外框 242 透光板 12V. New description: [New technical field] The present invention relates to a lighting device, in particular to a simplified lighting device. [Prior Art] It is common to use a fluorescent tube for an electric lamp on the market. However, in order to meet the environmental requirements, the illumination source using the LED is significantly better than the fluorescent lamp. Therefore, how to use the light-emitting diode as the illumination source to obtain a lighting device that is energy-saving, and still meets environmental protection requirements is an important issue. Fig. 1 shows a schematic view of a conventional illumination device using a light-emitting diode. As shown in FIG. 1, the illumination device 100 includes a transformer (not shown), a housing module 13A, and a light source module 12A. The transformer and light source module 120 is disposed within the housing module 13A. The light source module 120 includes a substrate 122 and a plurality of light emitting diodes 121. The substrate 122 can be a printed circuit board. The light-emitting diode 121 is provided on the substrate 122. In order to increase the light-emitting luminance of the illumination device, a high-wattage light-emitting diode is usually used, for example, a light-emitting diode of 3 watts is used. However, the current package design of the light-emitting diode (LED) is still based on a multi-layer package, resulting in an interface thermal resistance generated by a plurality of package interfaces on the heat dissipation path, so that heat is easily accumulated on the printed circuit board to reduce heat dissipation efficiency. . Since the heat dissipation effect is not good, the temperature of the light-emitting diode 121 cannot be effectively reduced, and the luminous efficiency and the service life of the light-emitting diode 121 are reduced. In order to dissipate the light-emitting diode 121, the conventional light-emitting diode 121 is connected to a heat-dissipating module. More specifically, the outer casing module 130 includes a connecting base π and a base 133. A plurality of rotors 133 are provided at one end of the base 132, and a connector seat 131 is provided at the other end of the base 132. The plurality of fins 133 define a space for accommodating the light source module 120. The plurality of light emitting diodes 121 are thermally coupled to the plurality of fins 133 for conducting heat generated by the light emitting diodes 121. Since a plurality of fins 133 are used, the heat dissipation area can be increased, and heat energy can be conducted or radiated from the larger area to the surrounding air, thereby effectively lowering the temperature of the light-emitting diode 121. However, the plurality of fins 133 are usually made of a metal material, and have sufficient heat dissipation effect to produce sufficient thickness, and the material is made of copper or copper alloy, pure aluminum or aluminum alloy, or a composite of copper and aluminum metal. Although the heat dissipation effect of the material 133 is good, the cost is high, and the assembly step is complicated, and the manufacturing cost of the lighting device 1GG is increased. [New Content] According to the present invention, a simplified illumination device is provided. In one embodiment, a lighting device that reduces manufacturing X is provided. In the embodiment, a lighting device that saves manufacturing costs is provided. According to an embodiment of the present invention, a lighting device includes a light source module, a housing module, and a light shielding cover. The light source module comprises a substrate, at least one light emitting diode driving circuit and a plurality of light emitting diodes. At least the illuminating diode driving circuit is disposed on the substrate to provide a current. a plurality of light emitting diodes are disposed on the substrate and coupled to the LED driving circuit, and each of the light emitting diodes has a power ranging from G_G5 watts to G.2 watts, and the adjacent light emitting diodes The spacing is a predetermined distance and the predetermined distance is greater than about mm5 mm. The light-transmissive cover and the outer casing module define a space for accommodating the light source module. In the implementation, the outer casing module includes a casing, and the surface of the casing is a smooth surface, and a plurality of fins are not formed, which can reduce assembly steps and difficulties. In one embodiment, the light-emitting one-pole driving circuit is an integrated circuit, and the current value of the light-emitting one-pole driving circuit is between 15 mA and 1 mA. Preferably, the light-emitting diode is The body drive circuit has a current value between 15 mA and 50 mA. In one embodiment, the outer casing module includes a casing, and the outer casing is stamped to form a sheet of metal. In one embodiment, the light emitting diodes of the light source module are in thermal contact with the outer casing, so that heat generated by the light emitting diodes is transmitted through the outer casing to the external environment. Preferably, the substrate of the light source module has a shape of a strip, a square or a rectangle. In one embodiment, the light-transmissive cover comprises an outer frame and a light-transmitting plate, and the light-transmitting plate is disposed on the inner side of the outer frame, and a surface of the light-transmitting plate facing the light-emitting diodes is formed with a plurality of micro- The structure is such that after the light emitted by the light-emitting diodes penetrates the microstructures, the path of the light is changed and then irradiated to an external environment. In one embodiment, the LED driving circuit is connected in series with the LEDs, and the substrate is directly disposed on the housing module, and after the LEDs emit a light, the light directly passes through the transparent cover. . According to an embodiment of the present invention, since a plurality of low wattage light emitting diodes are used instead of the high wattage light emitting diodes, and two adjacent light emitting diodes are spaced apart by a predetermined distance greater than about 0.5 mm, Reduce the localization of heat sources. The light-emitting diode uses a light-emitting diode of 0.05 watts to 0.2 watts to reduce heat generation. In one embodiment, the LED driving circuit generates a current of 15 mA to 100 mA (milliampere) for matching the light emitting diode to reduce heat generation, thereby improving the luminous efficiency of the light emitting diode, thereby eliminating the need for a heat sink or Fins, reducing manufacturing costs. [Embodiment] FIG. 2 is a schematic view showing a lighting device according to an embodiment of the present invention. As shown in FIG. 2, the illumination device 2 of the present embodiment includes a light source module 220, a housing module 230, and a light-transmissive cover 240. The outer casing module 230 and the light-transmissive cover 240 define a space, and the light source module 220 is disposed in the space. Between 15mA and 50mA. A light-emitting diode driving circuit 223 which provides 35 mA is used in the present embodiment. In the present embodiment, since the LED driving circuit 223 and the LED 221 are used, the specifications can be matched with each other, so that the transformer can be omitted and only the LED driving by the integrated circuit can be used. The circuit 223 is configured to drive the LEDs 22. The housing module 230 includes a connecting base 23 and a housing 233. The outer casing 233 is disposed at one end of the base 232, and the connecting base 231 is disposed at the other end of the base 232. The housing 233 defines a receiving slot for receiving the light source module 220. The outer casing 233 may be an outer surface that does not include fins that are useful to increase the diffusion area to form a smooth surface. The outer casing 233 can be formed by casting using a mold, and can also be formed by stamping. In the present embodiment, the outer surface of the outer casing 233 is a circular arc surface. The substrate 222 of the light source module 220 has a circular shape. The outer casing 233 may be a thin metal plate for conducting heat generated by the light-emitting diodes 221 to the external environment. The connector 231 is connected to an external power source (not shown) to provide an external power source to the LED driver circuit 223. The light shielding cover 240 covers the housing of the housing 233 for use with the housing module 230. Define a space. The light emitting diode 221 faces the light transmissive cover 240. On the surface of the light-transmitting cover 240 facing the light-emitting diode 221, a microstructure is formed. The light emitted by the light-emitting diode 221 passes through the light-transmitting cover 24 and is irradiated to the external environment. More specifically, after the light emitted by the LED 221 penetrates the microstructure of the light-transmissive cover 240, the light path is changed and then emitted to the external environment to make the brightness more uniform and improve the radiation efficiency. . In the present embodiment, the light-transmissive cover 240 is in the shape of a hemisphere, but the present invention does not limit the shape of the light-transmitting cover 240. In one embodiment, it may also have a long shape (not shown). Figure 3 shows a schematic view of a lighting device in accordance with another embodiment of the present invention. The illuminating device 200a of the embodiment is similar to the illuminating device 2 of the embodiment of Fig. 2, and therefore the same elements are denoted by the same reference numerals, and the description thereof will be omitted, and the difference between the two will be described. As shown in FIG. 3, the illumination device 200a includes a light source module 220, a housing module 230, and a light-transmissive cover 240. In this embodiment, the outer shell module 230 and the light-transmissive cover 240 are all elongated. The outer casing module 230 may be only a casing 233, and may further include a connecting structure for mounting on a wall surface (not shown). In the present embodiment, a thin metal plate is stamped to form the outer casing 233, which can reduce the manufacturing cost as compared with the use of the casting method. Further, in the present embodiment, the light-emitting diode driving circuit 223 and the 60 low-wattage light-emitting diodes 221 are connected in series with each other. In one embodiment, the light-emitting diode 221 of the light source module 220 is thermally connected to the outer casing 233, so that the heat generated by the light-emitting diode 221 can be transmitted to the outer casing 233 and transmitted to the external environment through the outer casing 233. Since the light-emitting diode 221 is a low-wattage light-emitting diode, the heat generated by the light-emitting diode 221 is less, and the metal thin plate is sufficient to dissipate the light-emitting diode 221, so that the illumination device 200a obtains better illumination brightness. . The light transmissive cover 240 includes an outer frame 241 and a light transmissive plate 242. The light transmissive plate 242 is formed in an elongated shape and is disposed inside the outer frame 241. On the surface of the light-transmitting plate 242 facing the light-emitting diode 221, a microstructure is formed, and the light emitted by the light-emitting diode 221 penetrates the microstructure of the light-transmitting cover 24, and then changes the path of the light path and then irradiates the light to the outside. Environment to make the brightness more uniform. In addition, in an embodiment, after the light-emitting diode 121 emits light, the light directly passes through the light-transmitting plate 242, that is, no other optical components are disposed between the light-emitting diode 121 and the light-transmitting plate 242, so that the light can be reduced. The components of the lighting device 2〇〇a save manufacturing costs. 4 shows a schematic view of a lighting device in accordance with another embodiment of the present invention. The illuminating device 200b of the embodiment is similar to the illuminating device 200a' of the embodiment of Fig. 3, and therefore the same elements are denoted by the same reference numerals, and the related description will be omitted, and only the differences between the two will be described. As shown in FIG. 4, the illumination device 200b includes a light source module 220, a housing module 230, and a light shielding cover 240. In this embodiment, the outer shell module 230 and the light transmissive cover 240 are both square or rectangular. According to an embodiment of the present invention, a plurality of low wattage light emitting diodes are used instead of the high wattage light emitting diodes, and the two adjacent light emitting diodes 221 are spaced apart by a predetermined distance, and the predetermined distance is greater than about 0.5mm can reduce the phenomenon that the heat source gathers locally, and the heat generated by the light-emitting diode 221 is divided into M406686. In one embodiment, the light-emitting diode 221 is a light-emitting diode of 0.05 watts to 0.2 watts, which can reduce heat generation. In one embodiment, the LED driving circuit 223 generates a current of 15 mA to 100 mA (mA) to match the LEDs 22 to reduce heat generation, thereby improving the luminous efficiency of the LED 221, and thus may not Use heat sinks or fins to reduce manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows a schematic view of a conventional illumination device using a light-emitting diode. 2 shows a schematic view of a lighting device in accordance with an embodiment of the present invention. Figure 3 shows a schematic view of a lighting device in accordance with another embodiment of the present invention. 4 shows a schematic view of a lighting device in accordance with another embodiment of the present invention. [Main component symbol description] 100 illuminating device 100 illuminating device 120 light source module 121 light emitting diode M406686 122 substrate 130 outer casing module 131 connecting seat 132 pedestal 133 plurality of fins 200 illuminating device 200a illuminating device 200b illuminating device 220 light source Module 221 LED 222 Substrate 223 LED driver circuit 230 Housing module 231 Connector 232 Base 233 Housing 240 Light-transmissive cover 241 Frame 242 Translucent plate 12