M404495 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種發光二極體支架結構，尤指一種令 支架之基部底面呈現顯露之狀態，而除了可電性連接於電 路板做為接腳使用之外’亦可將發光晶片之發光熱能直接 向下傳導至電路板之設計者。 【先前技術】 按’如第一、二圖所示之習知發光二極體（1〇)，包括 一座體（11)、兩支架（12、13)、一發光晶片（14)及一封裝 膠（15)，該座體（11)之一端面形成一内凹之出光區（ill)， β亥兩支架（12、13)各具有包覆於該座趙（11)内部之基部 (121、131)，而該基部（121、131)僅了頁面顯露於該出光區 (111)，俾供該發光晶片（14)電性連接，再由該基部（121、 131)延伸出穿過該座體（1丨）之接腳部（122、132)，而該接 腳部（122、132)至少彎折成型於該座體（11)之兩側面（圖示 為成型於该座體（11)之底側面及兩長側面）；藉此，因該座 體（π)至少有兩侧面彎折成型有接腳部（122、132)，致使 該發光二極體（10 )可利用不同之側面電性連接於電路板 (70)，從而造成不同之出光方向，增加該發光二極體（1〇) 之可利用性。 次按’由於發光二極體在將電能轉換成光能之同時， 亦有一部分會被轉換成熱能，但此發光同時所產生之熱 能，若未予以散除，乃會縮短發光二極體之使用壽命，並 影響光轉換之效率及演色性；然而，一般之發光二極體支 -3- M404495 架結構’除了提供發光晶片電性連接之功能外，尚兼具將 發光晶片之發光熱能予以散除之功能；但是，前述之習知 發光二極键（10)，該支架（12)散熱路徑乃先藉包覆於該座 趙（11)内部之基部（121)，再經由延伸穿出該座體（丨丨）之接 腳部（122) ’才可將廢熱傳遞至該電路板（7〇)散熱，故其散 熱路徑甚長且熱傳導面積甚小，不易將該發光晶片（14)之 發光熱能釋出。 【新型内容】 本創作之主要目的，係欲解決先前技術不易將發光晶 片之發光熱能釋出之問題，而具有大幅提升散熱效能之功 效。 本創作之另一目的’則具有增加結構強度之功效。 為達上述功效，本創作之結構特徵，係包括有： 第一支架’由基部延伸出且彎折成型有接腳部，而於 該基部底面周緣形成有包覆凹槽； 第二支架，由基部延伸出且彎折成型有接腳部，而於 該基部底面周緣形成有包覆凹槽； 一發光晶片，設置於第一支架之基部頂面，並將其電 極電性連接至第一與第二支架之基部；以及 一座體，下半部將第一與第二支架之基部包覆定位， 且々第與第一支架之基部頂面與底面以及接腳部皆呈現 顯露之狀態，上半部則環繞於該發光晶片之周圍而成為出 光區者。 此外，第一與第二支架於該基部側面形成有定位凹 槽。又，該座體於第一與第二支架基部鄰接處之頂面形成 M404495 有壓制凸緣。3 ’該接腳料折成型於該座體之至少一側 面或/及頂面。再者，該發光晶片料線將其電 :第一與第二支架之基部’且進-步設置-透光體於該座 體之出光區。 【實施方式】 首先’請參Μ第三〜七圖所示’本創作係包括有：M404495 V. New description: [New technical field] This creation is related to a light-emitting diode support structure, especially a state in which the bottom surface of the base of the bracket is exposed, and in addition to being electrically connected to the circuit board as a connection In addition to the use of the foot, the light-emitting thermal energy of the light-emitting chip can also be directly transmitted downward to the designer of the circuit board. [Prior Art] According to the conventional light-emitting diode (1〇) as shown in the first and second figures, including a body (11), two brackets (12, 13), a light-emitting chip (14) and a package The glue (15), one end surface of the seat body (11) forms a concave light exiting area (ill), and the βHai two brackets (12, 13) each have a base covering the inside of the seat (11) (121) , 131), and the base (121, 131) only exposes the page to the light exiting area (111), and the light emitting chip (14) is electrically connected, and then the base (121, 131) extends through the a pin portion (122, 132) of the base body (1), and the pin portion (122, 132) is at least bent and formed on both sides of the seat body (11) (shown as being formed on the seat body ( 11) a bottom side and two long sides); thereby, the base body (π) is bent at least on two sides to form a pin portion (122, 132), so that the light emitting diode (10) can be utilized differently The side surface is electrically connected to the circuit board (70), thereby causing different light-emitting directions, and increasing the availability of the light-emitting diode (1〇). Pressing 'Because the light-emitting diode converts electrical energy into light energy, some of it will be converted into heat energy, but the heat energy generated by the light-emitting diode will shorten the light-emitting diode if it is not dissipated. The service life affects the efficiency and color rendering of the light conversion; however, the general LED diode -3- M404495 frame structure 'in addition to providing the function of the electrical connection of the light-emitting chip, the light-emitting heat energy of the light-emitting chip is also The function of dispersing; however, the conventional light-emitting diode (10), the heat dissipation path of the bracket (12) is first wrapped around the base (121) inside the seat (11), and then extended through the extension The pin portion (122) of the body (丨丨) can transfer the waste heat to the circuit board (7〇) to dissipate heat, so the heat dissipation path is very long and the heat conduction area is very small, and the light-emitting chip is difficult to be used (14). The luminescence heat is released. [New content] The main purpose of this creation is to solve the problem that the prior art is not easy to release the radiant heat of the luminescent film, and the effect of greatly improving the heat dissipation performance is obtained. Another purpose of this creation is to increase the structural strength. In order to achieve the above effects, the structural features of the present invention include: the first bracket 'extends from the base and is bent and formed with a foot portion, and a covering groove is formed on a periphery of the bottom surface of the base; The base portion is extended and bent to form a pin portion, and a covering groove is formed on a periphery of the bottom surface of the base portion; an illuminating chip is disposed on the top surface of the base portion of the first bracket, and electrically connects the electrode thereof to the first portion a base of the second bracket; and a body, the lower half of the base portion of the first and second brackets are covered, and the top surface, the bottom surface and the foot portion of the base portion of the first bracket and the first bracket are exposed, The half is surrounded by the periphery of the light-emitting chip to become a light-emitting area. Further, the first and second brackets are formed with positioning recesses on the side of the base. Further, the seat body forms a M404495 pressed flange on the top surface of the first and second bracket base abutments. 3' The foot material is folded and formed on at least one side or/and the top side of the seat body. Furthermore, the illuminating wafer strand electrically charges: the base of the first and second brackets and is disposed in a step-wise manner in the light exiting region of the housing. [Embodiment] First, please refer to the third to seventh figures. 'This creative department includes:
第-支架（20)，由基部（21)延伸出且彎折成型有接腳 部（22)，而於該基部（21)底面周緣形成有包覆凹槽（211)， 且於該基部（21)側面形成有定位凹槽（212); 第二支架（30)，由基部（31)延伸出且彎折成型有接腳 部（32)，而於該基部（31)底面周緣形成有包覆凹槽（3ιι)， 且於該基部（31)側面形成有定位凹槽（312); 一發光晶片（40)，設置於第一支架（2〇)之基部（21)頂 面，並藉導線（41)將其電極電性連接至第一與第二支架 (20)、（30)之基部（21)、（31);The first bracket (20) extends from the base portion (21) and is bent and formed with a pin portion (22), and a covering groove (211) is formed on a periphery of the bottom surface of the base portion (21), and at the base portion ( 21) a positioning groove (212) is formed on the side surface; the second bracket (30) extends from the base portion (31) and is bent and formed with a pin portion (32), and a bag is formed on the periphery of the bottom surface of the base portion (31). a groove (3 ιι), and a positioning groove (312) is formed on a side of the base (31); a light-emitting chip (40) is disposed on a top surface of the base (21) of the first bracket (2), and The wire (41) electrically connects the electrode to the bases (21), (31) of the first and second brackets (20), (30);
一座體（50)，下半部藉成型於第一與第二支架（20)、 (30)基部（21)、（31)之包覆凹槽（211)、（311)與定位凹槽 (212)、（312)，而將第一與第二支架（20)、（30)包覆定位， 且令第一與第二支架（20)、（30)之基部（21)、（31)頂面與 底面以及接腳部（22)、（32)皆呈現顯露之狀態，上半部則 環繞於該發光晶片（40)之周圍而成為出光區（51)，並於第 一與第二支架（20)、（30)基部（21)、（31)鄰接處之頂面形 成有壓制凸緣（52)，用以將第一與第二支架（20)、（30)更 牢固地包覆定位；以及 M404495 一透光體（60)，設置於該座體（50)之出光區（51)而將 該發光晶片（40)與導線（41)封固保護者。 基於如是之構成，本創作係令第一與第二支架（2〇)、 (30)之基部（21)、（31)底面呈現顯露之狀態，而除了可電 性連接於電路板（70)做為接腳使用之外，該發光晶片（4〇) 之發光熱能亦可藉第一支架（20)之基部（21)直接向下傳導 (如第八圖（A)所示）至電路板（70)，不但散熱路徑短且其熱 傳導面積大；因此’該發光晶片（4〇)之發光熱能可迅速地 釋出，而使其光轉換效率及操作功率得以提升，且增長使 用壽命’乃具有大幅提升散熱效能之功效；此外，由基部 (21)、（31)延伸出且彎折成型之接腳部（22)、（32)，係f 折成型於該座體（50)之至少一側面或/及頂面（如圖示為成 型於該座體（50)之一端側面及一長側面），而若使用該接腳 部（22)、（32)做為接腳使用’其散熱路徑雖與先前技術等 長’但因第一支架（20)之基部（21)斷面積仍較先前技術大 (如第八圖（B)所示），故其熱傳導面積亦較先前技術大，還 是具有提升散熱效能之功效。 再者，第一與第二支架（20)、（30)基部（21)、（31)之 包覆凹槽（211)、（311)與定位凹槽（212)、（312)以及壓制 凸緣（52)，均得以令該座體（50)之包覆定位產生卡扣之效 果，可增加整體之結構強度》 是以，本創作之座體（50)下半部將第一與第二支架 (20)、（30)之基部（21)、（31)包覆定位，且令第一與第二 支架（20)、（30)之基部（21)、（31)底面顯露之設計，乃對 設置於第一支架（20)頂面之發光晶片（40)，建構出一條路 M404495 徑短且熱傳導面積大之散熱路徑，致使發光熱能可迅速地 釋出，並可增加整體之結構強度，而具有大幅提升散熱效 能及增加結構強度之功效。 綜上所述，本創作所揭示之構造，為昔所無，且確能 達到功效之增進，並具可供產業利用性，完全符合新型= 利要件，祈請貴審查委員核賜專利，以勵創新，無任徒感。 惟’上述所揭露之圖式、說明，僅為本創作之較:實 施例，大凡熟悉此項技藝人士，依本案精神糾所作 飾或等效變化’仍應包括在本案巾請專利範圍内。 M404495 【圖式簡單說明】 第一圖係習知發光二極體之結構立體圖。 第二圖係習知發光二極體之結構剖示圖。 第三圖係本創作之支架結構立體圖。 第四圖係本創作之整體結構立體圖。 第五圖係本創作之整體結構仰視圖。 第六圖係本創作之整體結構剖示圖。 第七圖係本創作之整體結構俯視圖。 第八圖（A)、（B)係第七圖中8-8斷面剖示圖（分別說明 使用基部與接腳部做為接腳使用）。 【主要元件符號說明】 (10)發光二極體 (211)、（311)包覆凹槽 (11)座體 (212)、（312)定位凹槽 (111)出光區 (22)、（32)接腳部 (12、13)支架 (40)發光晶片 (121、131)基部 (41)導線 (122、132)接腳部 (50)座體 (14)發光晶片 (51)出光區 (15)封裝膠 (52)壓制凸緣 (20)第一支架 (60)透光體 (30)第二支架 (21)、（31)基部 (70)電路板a body (50), the lower half is formed by the first and second brackets (20), (30) bases (21), (31) covering grooves (211), (311) and positioning grooves ( 212), (312), and the first and second brackets (20), (30) are overlaid, and the bases (21), (31) of the first and second brackets (20), (30) The top surface and the bottom surface and the pin portions (22) and (32) are exposed, and the upper portion surrounds the periphery of the light-emitting chip (40) to become the light-emitting region (51), and is first and second. A top surface of the brackets (20), (30) adjacent to the base portions (21), (31) is formed with a pressing flange (52) for more securely wrapping the first and second brackets (20), (30) And the M404495 light transmissive body (60) is disposed on the light exiting area (51) of the base body (50) to seal the light emitting chip (40) and the wire (41). Based on the constitution, the bottom of the bases (21) and (31) of the first and second brackets (2), (30) are exposed, and the electrical connection is electrically connected to the circuit board (70). As the pin is used, the radiant heat of the illuminating chip (4 〇) can also be directly conducted downward (as shown in FIG. 8(A)) to the circuit board by the base (21) of the first bracket (20). (70), not only the heat dissipation path is short, but also the heat conduction area is large; therefore, the luminescence heat energy of the luminescent wafer (4 〇) can be quickly released, and the light conversion efficiency and operating power are improved, and the service life is increased. The utility model has the effects of greatly improving the heat dissipation performance; furthermore, the bent portions (22) and (32) extending from the base portions (21) and (31) are folded and formed on the seat body (50) at least a side or/and a top surface (shown as one end side and one long side formed on the seat body (50)), and if the pin portions (22), (32) are used as pins, Although the heat dissipation path is as long as the prior art, the area of the base (21) of the first bracket (20) is still larger than the prior art (such as the eighth (B),), so the heat transfer area large Yijiao prior art, but also it is having the effect to enhance the cooling efficiency. Furthermore, the first and second brackets (20), (30) bases (21), (31) covering grooves (211), (311) and positioning grooves (212), (312) and pressing convex The edge (52) can make the positioning of the seat (50) to produce a buckle effect, which can increase the overall structural strength. Therefore, the lower part of the seat (50) of the present creation will be the first and the first The bases (21) and (31) of the two brackets (20) and (30) are coated and positioned, and the bottom surfaces of the bases (21) and (31) of the first and second brackets (20) and (30) are exposed. For the illuminating wafer (40) disposed on the top surface of the first bracket (20), a heat dissipation path with a short diameter and a large heat conduction area is constructed, so that the radiant heat energy can be quickly released, and the overall structure can be increased. Strength, but has the effect of greatly improving heat dissipation and increasing structural strength. In summary, the structure revealed by this creation is unprecedented, and it can achieve the improvement of efficacy, and it can be used for industrial utilization. It fully conforms to the new type = the essential element, and asks the review committee to grant the patent. Encourage innovation, no sense of arbitrariness. However, the above-mentioned drawings and descriptions are only for the comparison of the creations: the examples, those who are familiar with the skill of the art, and the decoration or equivalent changes according to the spirit of the case shall still be included in the patent scope of this case. M404495 [Simple description of the diagram] The first diagram is a perspective view of the structure of a conventional light-emitting diode. The second figure is a structural sectional view of a conventional light-emitting diode. The third picture is a perspective view of the bracket structure of the present creation. The fourth picture is a perspective view of the overall structure of the creation. The fifth picture is a bottom view of the overall structure of the creation. The sixth figure is a cross-sectional view of the overall structure of the present creation. The seventh picture is a top view of the overall structure of the creation. Figure 8 (A) and (B) are cross-sectional views of the 8-8 section in the seventh diagram (the use of the base and the pin as the pins, respectively). [Description of main component symbols] (10) Light-emitting diode (211), (311) covering groove (11) Seat body (212), (312) Positioning groove (111) light-emitting area (22), (32) ) pin (12, 13) bracket (40) light-emitting chip (121, 131) base (41) wire (122, 132) pin (50) body (14) light-emitting chip (51) light-emitting area (15 Encapsulating glue (52) pressing flange (20) first bracket (60) light transmitting body (30) second bracket (21), (31) base (70) circuit board