M404482 五、新型說明： 【新型所屬之技術領域】 一種半導體製程裝置，尤其是在一真空箱内同時進 行晶圓組裝及檢測過程。 【先前技術】 現下的晶圓都須在高度的無塵組裝環境中進行組裝 過程’完成組裝過程後再將以組裝完成的晶圓運送至— 較低度要求的無塵室進行晶圓測試過程，然而無塵式的 設備昂貴且維護管理不易，再者無塵室内的作業人員及 機器皆會造成灰塵的浮動。 此外’在將晶圓從組裝無塵室運送到檢測無塵室的 途中亦有灰塵及懸浮物會造成晶圓不良率升高，且組裝 完的晶圓在經檢測後發現產品不良時，晶圓由於已被組 裝完成，所以要將晶圓拆膠、拆封來進行處理，此拆膠、 拆封的過程，亦有使晶圓的不良率提升的風險。 【新型内容] 本創作的主要目的在提供一種半導體製程裝置，該 半導體製程裝置係包含—真空箱、—晶圓平台、一夾取 裝置以及一光源’該晶圓平台、夾取裝置以及光源皆位 3 M404482 於該真空箱内。 在該半導體製程震置之製造程序為⑷將晶圓置於 '上（B)再使用專用清潔膠來清潔晶圓與一透明 光子另件。（c)然後，利用夹取裝置炎取該玻璃覆蓋於晶 圓上（D)接著，利用該光源打光穿透該透明光學另件至 該晶圓上’用以測試該玻璃與該晶圓岐否有因雜質而 、成场像不良.（E)若檢測到的影像正常，則繼續後 貝點膠封裝等組裝製程。（F)若檢測到的不良影像，則 利用組裝裝置9將翻光學另件22夾起，並重複上述 ⑻、（C)、⑼步驟’剌―晶圓有連續三次影像不良的 記錄’則判定該晶圓為不良品。 此外’辭導體製程裝置可進—步包含皆具有一測 試電路及-探針卡的至少—伽m裝置，其係位於真空 箱内’該探針卡可與晶圓上的電子接點電氣連接用以 對該晶圓做功能性檢測。 此外，該真空箱中亦可包含點膠機等組裝裝置。 在本發明之半導體製程裝置中可對晶圓同時進行組 裳與檢測程序，因此可避免習知方式中因喊過程與檢 測過程分別於獨無塵室巾進行，在運馳妓之^ 4 由於晶圓的檢測過程(如：檢_質及晶圓20功能 =)與組裝過程(如：對晶圓進行點膠封|_皆於真空 箱3中實施，因此可避免f知方式中因組裝過程與檢測 _分別於㈣無塵室中進行，在運送組裝完之晶圓至 執行檢測過程之無赋的射、或作業人員出入時，有 雜質或懸浮物導等雜質致晶率下降。此外，真空箱 體積小巧且價位較便宜，可更進-步節省製作成本。 以上所述者僅為㈣解釋本鑛讀佳實施例，並 非企圖據以對本創作做任何形式上之限制，是以，凡有 在相同之創作精神下所作有關本創作之任何修飾或變 更’皆仍應包括在本創作意圖保護之範脅。 【圖式簡單說明】 參閱第半導體製程裝置示意圖。 【主要元件符號說明】 1半導體製程裝置 3真空箱 M404482 5晶圓平台 7光源 9夾取裝置 11測試裝置 13測試電路 15探針卡 17探針 20晶圓 22透明光學另件M404482 V. New description: [New technology field] A semiconductor process device, especially in the process of wafer assembly and inspection in a vacuum chamber. [Prior Art] The current wafers must be assembled in a high-level dust-free assembly environment. After the assembly process is completed, the assembled wafers are transported to the lower-level clean room for wafer testing. However, dust-free equipment is expensive and maintenance management is not easy. In addition, workers and machines in the clean room can cause dust to float. In addition, dust and suspended matter will increase the wafer defect rate on the way from the assembly of the clean room to the detection of the clean room, and the assembled wafer will be found to be defective after testing. Since the circle has been assembled, the wafer is unpacked and unsealed for processing. The process of unpacking and unpacking also has the risk of increasing the defect rate of the wafer. [New content] The main purpose of the present invention is to provide a semiconductor process device comprising a vacuum chamber, a wafer platform, a clamping device and a light source. The wafer platform, the clamping device and the light source are all Bit 3 M404482 is in the vacuum box. The manufacturing process for the semiconductor process is (4) placing the wafer on 'B (B) and then using a special cleaning gel to clean the wafer and a transparent photonic part. (c) then, using a gripping device, the glass is overlaid on the wafer (D), and then the light source is used to penetrate the transparent optical member onto the wafer to test the glass and the wafer.岐No, there is a defect in the field due to impurities. (E) If the detected image is normal, continue the assembly process such as post-packing. (F) If the defective image is detected, the fluoroscopic member 22 is sandwiched by the assembling device 9, and the above steps (8), (C), and (9) are repeated, and the recording of the wafer has three consecutive image defects is determined. This wafer is a defective product. In addition, the 'transistor process device can further include at least one gamma device having a test circuit and a probe card, which is located in a vacuum box. The probe card can be electrically connected to an electronic contact on the wafer. Used to perform functional testing on the wafer. In addition, the vacuum box may also include an assembly device such as a dispenser. In the semiconductor process device of the present invention, the wafers can be simultaneously assembled and tested, so that the conventional method can be avoided because the shouting process and the detecting process are performed separately in the clean room towel. Wafer inspection process (such as: inspection and wafer 20 function =) and assembly process (such as: dot-sealing the wafer | _ are implemented in the vacuum box 3, so can avoid the assembly of the known way The process and the test are carried out in (4) clean room respectively, and when the assembled wafer is transported to the execution of the test process, or the worker enters or exits, there is a decrease in the crystallizing rate of impurities such as impurities or suspended matter. The vacuum box is small in size and cheaper in price, which can further save production costs. The above is only (4) explaining the best example of the mine reading, and it is not an attempt to impose any formal restrictions on the creation. Any modification or modification of this creation made under the same creative spirit should still be included in the protection of this creation intention. [Simplified illustration] Refer to the schematic diagram of the semiconductor process equipment. DESCRIPTION Number 22 transparent optical semiconductor device manufacturing process of the wafer 3 vacuum box M404482 5 7 internet source 9 the gripping means 11 the test circuit testing apparatus 13 probe 15 probe card 17 of another member of the wafer 20