、新型說明： 【新型所屬之技術領域】 一種多層式陣列型發光二極體之封裝結構，尤其是一種 完全阻絕水氣進入、堅固耐用及長期維持光學元件效能的一 種南強度氣密型多層式陣列型發光二極體之封裝結構。 【先前技術】 按，led的發光原理是利用半導體固有特性，它不同於以 往的白熾燈管的放電、發熱發光原理，而是將電流順向流入 半導體的PN接面時便會發出光線，所以LED被稱為冷光源 (cold light)。由於LED系具有高耐久性、壽命長、輕巧、 耗電里低且不含水銀等有害物質等之優點，故可廣泛應用於 照明設備產業中，且其通常以LED陣列封裝方式應用在電子 看板、交通號誌等商業領域。 請參閱台灣新型專利公告號M387375,其係關於一種多層 式陣列型發光二極體的封裝結構，主要包含有一金屬基板、θ 一封裝模塊、一導線架及一罩體，該金屬基板設於該封裝結 構之最下層，該封裝模塊用以分別將該金屬基板與該導線架 封固而組成一體，該金屬基板上裝設有為陣列排列之發光二 極體晶粒且金屬基板為金屬材質，發光二極體與該導線架並 形成電性連接，該罩體則罩蓋於該封裝模塊之令。 然而習知技點在於無法長期使用於水、濕氣含量高的環 境’以及如_、太空或軍事等險惡的環境，其侧為封较 結構中各層結構並非被確實地密封接合，如此則導致氣密^ 逐漸劣化，内部溼氣量加重，致使封裝結構的各元件可能相 M398686 互分離甚至燒毀，因此無法使用於潮濕環境，況且也會導致 結構強度亦越來越差，可預見剛剛設置好的LED在短期間就 必須重新更換，然而於如此惡劣的環境中如果時不時就得進 行維修安裝作業，不僅耗時耗力，更給人身安全造成莫大威 脅，因此必須對此加以改進，提供一種完全阻絕水氣進入、 並堅固耐用及長期維持光學元件效能的一種發光二極體封裝 結構。 【新型内容】 本創作的主要目的在於提供一種氣密型多層式陣列型發 光一極體之封裝結構，其結合強度高及氣密性優異可使用 於如海中等濕氣重的環境，並且本創作的金屬基板係以一體 成型，讓整體強度遠足以應付各種極端環境條件中，有助於 延長光學元件的使用壽命，並使光學元件的效能不易退化。 為達上述目的，本創作的具體技術手段包含一金屬基板 及兩個導線架，該金屬基板上形成有具有一容置空間的一氣 在金屬框體，该容置空間係灌注有一氮氣，該氣密框體頂面 上形成有一氣密封合框槽，且該氣密金屬框體頂面的外緣往 上垂直延設有一封合框架，另該氣密金屬框體係貫設有兩組 封合孔對，而每一個導線架係由一連接板及一導桿對組成， 每一組的封合孔對係供每一個導桿對穿設，該導桿對的内側 端與該連接板相連結，該導桿對的外侧端則連接到電源，每 一個封合孔之空隙並利用一封合材料予以封閉，又該容置空 間之底面上貼附有複數個LED晶粒，該等LE：D晶粒之間係相 打線接合並藉由複數個導線與該連接板構成電性連接，該等 4 LED晶粒之上形成有一晶粒保護層，該晶粒保護層之上再形 成有一螢光層，該螢光層之上形成一矽膠層，該矽膠層係覆 蓋保護該螢光層，其中該兩組封合孔對之空隙皆以一封合材 料封填起來，該氣密金屬框體頂面上放置有一矽玻璃罩，該 矽玻璃罩並與該封合框架相接合密封，該矽玻璃罩與該螢光 層之間的空間充滿該氮氣。 【實施方式】 以下配合圖式及元件符號對本創作之實施方式做更詳細 的說明，俾使熟習該項技藝者在研讀本說明書後能據以實施。 現今LED的應用已經擴大到各個領域，包含了深海用 途、太空用途、惡劣工業用途、或甚至於軍事用途的環 境中，LE：D如欲使用於上述的高壓、衝擊力大、溼氣量大 或溫度變化急遽等惡劣條件的環境中，必須提升封裳結 構的密合度，以求於上述環境中穩定且長久的運作，本 創作所提供的多層式陣列型發光二極體即為一種氣密型 封裝結構的多層式陣列型發光二極體。 參閱第一圖’本創作之氣密型多層式陣列型發光二極 體之封裝結構的立體分解圖，參閱第二圖，本創作之氣 密型多層斜_發光二極體之封裝結構的剖面示意、 圖。本創作係有關一種氣密型多層式陣列型發光二^體 之封裝結構’其包含有-金屬基板i、兩個導X線架3、複 數個LED (發光二極體）晶粒5 ’該金屬基板i上形成有 具有一容置空間111的一氣密金屬框體u，該金屬基板 1與該氣密金屬框體11為-體成型，且該氣密金屬^體 M398686 11的今置空間111中具有氮氣9〇，該氣密金屬框體Η 内部可封裝有複數個絲單元、光學構件或封裝用材料 等，其_該金屬基板1可藉由金屬鎊造（Casting)或機 械模具(Tooling)等加卫技術製作域，該金屬基板i的 材質可以是如ig、銅、銅合金或其他熱料性良好的金 屬材料，藉以快速有效地讓熱能排散出去。 該氣密金屬框體11的内壁面上可再鑛上一反光保護 層（圖面未顯不）’藉以提升其對光線的反射性及對環境 的抗壓性，該反光保護層的材質可以是銀（Ag)、鎳（Ni) 或具有良好反光性的金屬材質。 该氣畨金屬框體11係貫設有兩組封合孔對13,該氣密金 屬框體11底部係可以形成有一出光槽15，該出光槽15的側 壁面皆呈一反光斜面’該反光斜面與該出光槽15的底面具有 一父角，但要注意的是，雖然該兩組封合孔對13在本實施例 中係分別設置於該氣密金屬框體U的兩相對側壁中，但封合 孔對11的配置位置視實際需要而定，在此僅是說明用的實例 而已，並非用以限制本創作的範圍。 該氣密金屬框體11頂面上形成有一氣密封合框槽 17，並且在該氣密金屬框體丨丨頂面的外緣往上垂直延設 有一封合框架19,其中該出光槽15的側壁面上可進一步 設置貼設有一第一反光罩1〇〇’該第一反光罩1〇〇係用以 將其所接收光線再反射出去，該氣密金屬框體η内並可 進一步設置有一具有反光窗板201的第二反光罩200,該 第二反光罩200的外部係靠貼於該氣密金屬框體u的内 壁面’該第二反光罩2〇〇的反光窗板201係用以使其所 接收到光線再反射出去。 6 M398686 —每導線架3係由一連接板31及一導桿對33組成， 每組的封合孔對13係供每一個導桿對犯穿設，該導 桿對33的内侧端與該連接板31相連結，該導桿對犯的 外側鳊則連接到電源，其中該兩組封合孔對13之空隙皆 以-封合材料4完全封填起來，以阻絕水份經該兩^且封 合孔對13而滲入於内，其中該封合材料4可以是一玻 璃、一陶究、-玻璃或其他適當材質，該封合材料4 2於高溫環境下填封該封合孔對13，當冷卻固化後即可 凡全封合而不留下任何讓水氣得以進入的管道。 該等LED晶粒5係貼附於該容置空間U1的底面上，或 如本實把例所示該等LED晶粒5也可貼附於該出光槽15的底 面上，因此當該等LED晶粒5發光b夺，發出的光線可藉由第 =反光罩100與第二反光罩2〇〇再反射出去，有效增加發光 效率，έ亥等LED晶粒5較佳地g己置型態係為陣列型的排列方 式’其中該f LED晶粒5之間相打、線接合並藉由複數個導線 6與連接板31構成電性連接以形成一電路，而導 外側端則連接到電源。 ^ 該等LED晶粒5之上則形成有一晶粒保護層7，該晶 粒保護層7係包覆保護該等led晶粒5與該等導線6,該 晶粒保護層7上形成有一螢光層8,該螢光層8之材料為 一^4光&彳或其他適當材質，該螢光層8之上並形成有二’ 矽膠層9，該矽膠層9係用以保護該螢光層8，該矽膠層 9係以射出成型方式而覆蓋於該螢光層8之上，或者直接 射出成型在該晶粒保護層7之上。 氣密金屬框體11頂面上設置有一矽玻璃罩〗〇，該矽 玻璃罩10並與該封合框架19相接合，其中可透過一雷 7 M398686 • % 4f 射絲接合对、-細接合方H接接合方式、 -溶接接合方式或其他適當方式使該石夕玻璃罩 ‘ 合框架19相互接合，財财玻群财以呈:^封 狀、一凹面狀及一凸面狀的形式之至少其中之一。 由於該氣密金屬框體U内的容置空間係灌注有氮氣 90，因此該矽玻璃罩1〇與矽膠層9之間的空間最後只留 J 存有氮氣90，如此LED晶粒5、該晶粒保護層7與螢光 層8皆密封於乾燥氮氣9〇中。 、 • 在外面環境之水氣無法滲入到已密合的矽玻璃罩1〇 與氣密金屬框體之中，且内部具有乾燥的氮氣可避免溫 度驟變而生成水氣，因此可有效防止該螢光層8、晶粒保 護層7及LED晶粒5因水氣影響而劣化，因此適用於如 深海中、或濕度重之工業環境下，且該氣密金屬框體u 係與該金屬基板1為一體成型，使本封裝結構強度更為 強化，還可滿足各種如太空中或軍事上等高衝擊力極高 壓力的環境中。 φ 參閱第三圖，本創作之第一實施例的剖面示意圖。其主 要包含有一金屬基板500、一封裝模塊60.0及一導線架7〇〇 , 或封裝模塊600用以將該金屬基板500與該導線架封梦 成一體，該金屬基板500上裝設有為陣列排列之led晶粒5， LED晶粒5與該導線架700並形成電性連接，該等led晶粒5 之上依序形成有晶粒保護層7及螢光層8，螢光層8上方形 成有可保護螢光層8免受水氣影響而變質的石夕膠層9，其中 該封裝模塊600内壁面上設置有氣密封合框槽6〇〇1，封裝模 塊600内壁面上放置有石夕玻璃罩10，該石夕破璃罩並與該 封裝模塊600相接合，矽膠層9與矽玻璃罩10並灌注有氮氣 8 90，透過第-實施例可印證，本解可制於其他封裝結構 上，助原本無法防止水氣滲入之封裝結構轉變成可使用在 水濕氣重的環境下’免受水氣料而導致騎變質或元件劣 化短路的問題’進而確使各光學單元魏率地運作。 參閱第四圖至第六圖，在本創作的第一實施例中，該 兩、且封&孔對1 3係分別貫設該容置空間1 1 1下方的底座 的兩側，該兩個導線架3分別藉各自的導桿對33以垂直 方向穿設於該兩組封合孔對13之中，該兩組封合孔對13 中的空隙並以-封合材料4予以封死，如圖六所示，其 中該螢光層8亦可直接預設於财賴罩1〇内。 本創作的封裝結構中充填有氮氣，以使内部保持 完全乾燥及防止氣泡或濕氣的產生，且在本封裝結構 中，其分別在内、外層皆形成全密閉式的密封空間，形 成種7G全氣岔且具有高強度的結構，如此水氣無法侵 入’經久_且使光學元件可發揮其最倾能，非常適 用於嚴酷的環境條件下。 以上所述者僅為用以解釋本創作之較佳實施例，並非企 圖據以對本猶齡何形式上之限制，是以，凡有在相同之 創作精神下所作有關本創作之任何修飾或變更，皆仍應包括 在本創作意圖保護之範疇。 M398686 【圖式簡單說明】 第一圖為本創作之氣密型多層式陣列型發光二極體之封 裝結構的立體分解圖。 第二圖為本創作之氣密型多層式陣列型發光二極體之封 裝結構的剖面示意圖。 第三圖為本創作之第一實施例的剖面示意圖。 第四圖為本創作之第二實施例的分解示意圖。 第五圖為本創作之第二實施例的剖面示意圖。 第六圖為本創作之第三實施例的剖面示意圖。 Μ39δ686 【主要元件符號說明】 卜500 金屬基板 11氣密金屬框體 13封合孔對 15出光槽 17、6001 氣密封合框槽 19封合框架 111容置空間 3、700 導線架 31連接板 33導桿對 4 封合材料 5 LED晶粒 6 導線 7 晶粒保護層 8 螢光層 9 梦膠層 10矽玻璃罩 90氮氣 100第一反光罩 200第二反光罩 201反光窗板 600封裝模塊New type of description: [New technical field] A multi-layer array type LED package structure, especially a south-intensity airtight multi-layer type that completely blocks moisture ingress, robustness and long-term maintenance of optical components. The package structure of the array type light emitting diode. [Prior Art] According to the principle of LED illumination, the inherent characteristics of the semiconductor are utilized, which is different from the discharge and heat emission principle of the conventional incandescent lamp, but emits light when the current flows in the PN junction of the semiconductor. The LED is called a cold light. LEDs are widely used in the lighting industry because of their high durability, long life, light weight, low power consumption, and no harmful substances such as mercury. They are usually applied to electronic boards in LED array packages. Business areas such as traffic signs. Please refer to Taiwan New Patent Publication No. M387375, which relates to a package structure of a multilayer array type light emitting diode, which mainly comprises a metal substrate, a θ-package module, a lead frame and a cover, wherein the metal substrate is disposed on the The lowermost layer of the package structure is configured to integrally form the metal substrate and the lead frame, wherein the metal substrate is provided with an array of light emitting diodes and the metal substrate is made of metal. The light-emitting diode is electrically connected to the lead frame, and the cover is covered by the package module. However, the conventional technique lies in the inability to use it for a long time in an environment with high water and moisture content, and in a sinister environment such as _, space or military, on the side of which the layers in the structure are not reliably sealed and joined, thus resulting in The airtightness is gradually degraded, and the internal moisture is aggravated, so that the components of the package structure may be separated or even burned out by the M398686, so that it cannot be used in a humid environment, and the structural strength is also worse and worse, and it is foreseen that the structure is just set. LEDs must be replaced in a short period of time. However, in such a harsh environment, it is necessary to carry out maintenance and installation work from time to time. It is not only time-consuming and labor-intensive, but also poses a great threat to personal safety. Therefore, it must be improved to provide a complete blockage. A light-emitting diode package with moisture ingress and robustness and long-term maintenance of optical components. [New content] The main purpose of this creation is to provide a hermetic multi-layer array type light-emitting diode package structure, which has high bonding strength and excellent air tightness, and can be used in an environment such as a sea and a humid atmosphere, and The created metal substrate is integrally formed, allowing the overall strength to be hike to cope with extreme environmental conditions, helping to extend the life of the optical components and making the optical components less susceptible to degradation. In order to achieve the above object, the specific technical means of the present invention comprises a metal substrate and two lead frames, wherein the metal substrate is formed with a gas-containing metal frame having an accommodating space, and the accommodating space is filled with a nitrogen gas. A gas sealing frame groove is formed on the top surface of the dense frame body, and a sealing frame is vertically extended on the outer edge of the top surface of the airtight metal frame body, and the airtight metal frame system is provided with two sets of sealing a pair of holes, and each lead frame is composed of a connecting plate and a pair of guiding rods, each pair of sealing holes is provided for each pair of guiding rods, and the inner end of the pair of guiding rods is opposite to the connecting plate The outer end of the pair of guide rods is connected to the power source, and the gap between each of the sealing holes is closed by a composite material, and a plurality of LED dies are attached to the bottom surface of the accommodating space. The D-die is bonded by a wire and is electrically connected to the connecting plate by a plurality of wires. A protective layer of a die is formed on the four LED chips, and a die is formed on the die. a phosphor layer on which a layer of silicone is formed. The silicone layer covers and protects the fluorescent layer, wherein the gaps of the two sets of sealing holes are sealed by a bonding material, and a glass cover is placed on the top surface of the airtight metal frame, and the glass cover is The sealing frame is sealed and sealed, and a space between the glass cover and the phosphor layer is filled with the nitrogen gas. [Embodiment] The embodiments of the present invention will be described in more detail below with reference to the drawings and the component symbols, so that those skilled in the art can implement the present specification after studying the present specification. Today's LED applications have expanded to include a wide range of applications, including deep sea applications, space applications, harsh industrial applications, or even military applications. LE:D is intended for use in high pressure applications, high impact, high moisture or In an environment with severe temperature changes and imperfections, it is necessary to improve the tightness of the sealing structure in order to achieve stable and long-term operation in the above environment. The multi-layer array type LED of the present invention is a gas-tight type. A multilayer array type light emitting diode of a package structure. Referring to the first figure, a perspective exploded view of the package structure of the hermetic multi-layer array type light-emitting diode of the present invention, referring to the second figure, the profile of the hermetic multi-layer oblique-light emitting diode package structure Schematic, figure. The present invention relates to a hermetic multi-layer array type light-emitting diode package structure comprising a metal substrate i, two lead frames 3, and a plurality of LEDs (light emitting diodes) 5' An airtight metal frame u having an accommodating space 111 is formed on the metal substrate i. The metal substrate 1 and the hermetic metal frame 11 are formed in a body, and the space of the airtight metal body M398686 11 is formed. In the 111, there is a nitrogen gas of 9 〇, and the gas-tight metal frame Η can be internally packaged with a plurality of wire units, optical members or packaging materials, etc., the metal substrate 1 can be made of metal Casting or mechanical mold ( Tooling) and other technical fields, the metal substrate i may be made of ig, copper, copper alloy or other hot metal materials to quickly and efficiently dissipate heat. The inner wall surface of the airtight metal frame 11 can be further polished with a reflective protective layer (not shown) to enhance the reflectivity of the light and the resistance to the environment. The material of the reflective protective layer can be It is silver (Ag), nickel (Ni) or a metal material with good light reflectivity. The gas metal frame 11 is provided with two pairs of sealing holes 13 . The bottom of the airtight metal frame 11 can be formed with a light-emitting groove 15 . The side walls of the light-emitting groove 15 each have a reflective slope. The inclined surface has a parent angle with the bottom surface of the light exiting groove 15, but it should be noted that although the two sets of sealing hole pairs 13 are respectively disposed in the opposite side walls of the airtight metal frame U in this embodiment, However, the position of the sealing hole pair 11 is determined according to actual needs, and is merely an example for illustration, and is not intended to limit the scope of the present invention. A gas sealing frame groove 17 is formed on the top surface of the airtight metal frame 11, and a frame 19 is vertically extended upwardly on the outer edge of the top surface of the airtight metal frame, wherein the light exit groove 15 The first side reflector 1 is further disposed on the side wall surface for aligning the first reflector 1 for re-reflecting the received light, and the airtight metal frame η can be further disposed There is a second reflector 200 having a reflective window 201. The exterior of the second reflector 200 is attached to the inner wall surface of the airtight metal frame u. The reflective window 201 of the second reflector 2 is attached. It is used to reflect the light it receives. 6 M398686 - Each lead frame 3 is composed of a connecting plate 31 and a pair of guiding rods 33, and each pair of sealing holes 13 is provided for each guiding rod pair, and the inner end of the pair of guiding rods 33 is The connecting plates 31 are connected, and the outer side of the guiding rod is connected to the power source, wherein the gaps of the two sets of sealing hole pairs 13 are completely sealed with the sealing material 4 to block the water from passing through the two The sealing material 4 is infiltrated into the sealing hole, and the sealing material 4 may be a glass, a ceramic, a glass or other suitable material. The sealing material 42 is filled with the sealing hole in a high temperature environment. 13, when cooled and solidified, it can be completely sealed without leaving any pipes for water to enter. The LED dies 5 are attached to the bottom surface of the accommodating space U1, or the LED dies 5 may be attached to the bottom surface of the illuminating groove 15 as shown in the example. The LED die 5 emits light, and the emitted light can be reflected back by the second reflector 100 and the second reflector 2, thereby effectively increasing the luminous efficiency, and the LED die 5 such as the LED is preferably placed. The state is an array type arrangement in which the f LED dies 5 are connected to each other, wire bonded and electrically connected to the connection plate 31 by a plurality of wires 6 to form a circuit, and the outer side of the guide is connected to power supply. A die protection layer 7 is formed on the LED dies 5, and the die protection layer 7 is coated to protect the LED dies 5 and the wires 6. The GaAs layer is formed with a blaze. The light layer 8, the material of the phosphor layer 8 is a ^4 light & 彳 or other suitable material, the phosphor layer 8 is formed with a two 'silicone layer 9, which is used to protect the firefly The light layer 8 is coated on the phosphor layer 8 by injection molding, or is directly injection molded on the crystal grain protection layer 7. The top surface of the gas-tight metal frame 11 is provided with a glass cover 〇, which is joined to the sealing frame 19, and is permeable to a Ray 7 M398686 • % 4f wire bonding pair, - fine joint The square H-joining method, the fusion bonding method or other suitable means allows the stone-glass cover's frame 19 to be joined to each other, and the wealthy group is at least in the form of a seal, a concave shape and a convex shape. one of them. Since the accommodating space in the hermetic metal frame U is filled with the nitrogen gas 90, the space between the enamel glass cover 1 and the silicone layer 9 is finally left with only the nitrogen gas 90, so the LED dies 5, the Both the grain protection layer 7 and the phosphor layer 8 are sealed in a dry nitrogen gas. • The water in the outside environment cannot penetrate into the closed glass cover 1〇 and the airtight metal frame, and the inside has dry nitrogen to avoid sudden changes in temperature to generate moisture, so it can effectively prevent this. The phosphor layer 8, the die protection layer 7, and the LED die 5 are deteriorated by the influence of moisture, and are therefore suitable for use in an industrial environment such as deep sea or heavy humidity, and the gas-tight metal frame u and the metal substrate 1 is one-piece molding, which makes the structure of the package more intensive, and can also meet various high-impact environments such as space or military. φ Referring to the third figure, a schematic cross-sectional view of the first embodiment of the present invention. The main assembly includes a metal substrate 500, a package module 60.0, and a lead frame 7A, or the package module 600 is used to integrate the metal substrate 500 with the lead frame. The metal substrate 500 is mounted on the array. The LED die 5 is arranged, and the LED die 5 is electrically connected to the lead frame 700. The L-shaped protective layer 7 and the phosphor layer 8 are sequentially formed on the LED die 5, and the phosphor layer 8 is arranged above. The glaze layer 9 is formed on the inner wall surface of the package module 600, and the inner wall surface of the package module 600 is placed on the inner wall surface of the package module 600. Shishi glass cover 10, the stone glazing cover is joined with the package module 600, the silicone layer 9 and the glass cover 10 are filled with nitrogen gas 8 90, which can be confirmed by the first embodiment, the solution can be made into other In the package structure, the package structure that could not prevent moisture from infiltrating is converted into a problem that can be used in the environment of heavy moisture and moisture, which is caused by water and gas, which causes deterioration of the rider or deterioration of the component. Operating at a rate. Referring to the fourth to sixth figures, in the first embodiment of the present invention, the two and the sealing pair 1 3 are respectively disposed on two sides of the base below the accommodating space 1 1 1 , the two The lead frames 3 are respectively disposed in the vertical direction of the two sets of sealing holes 13 by the respective pair of guiding rods 3, and the gaps in the pair of sealing holes 13 are sealed by the sealing material 4. As shown in FIG. 6, the fluorescent layer 8 can also be directly preset in the financial enclosure 1〇. The package structure of the present invention is filled with nitrogen gas to keep the inside completely dry and prevent the generation of bubbles or moisture, and in the package structure, the inner and outer layers respectively form a completely closed sealed space to form a seed 7G. It is completely airy and has a high-strength structure, so that water vapor cannot penetrate into the 'long-lasting' and the optical components can exert their maximum energy, which is very suitable for harsh environmental conditions. The above description is only for the purpose of explaining the preferred embodiment of the present invention, and is not intended to be a limitation on the form of the present invention, so that any modification or alteration of the creation made under the same creative spirit. , should still be included in the scope of protection of this creative intent. M398686 [Simple description of the diagram] The first figure is an exploded perspective view of the sealed structure of the hermetic multi-layer array type LED. The second figure is a schematic cross-sectional view of the encapsulation structure of the hermetic multi-layer array type light-emitting diode. The third figure is a schematic cross-sectional view of the first embodiment of the creation. The fourth figure is an exploded schematic view of the second embodiment of the creation. The fifth drawing is a schematic cross-sectional view of a second embodiment of the creation. Figure 6 is a schematic cross-sectional view showing a third embodiment of the creation. Μ39δ686 [Description of main component symbols] Bu 500 Metal substrate 11 Hermetic metal frame 13 Sealing hole pair 15 Light-emitting groove 17, 6001 Air-tight sealing frame groove 19 Sealing frame 111 accommodating space 3, 700 Lead frame 31 connecting plate 33 Guide rod pair 4 sealing material 5 LED die 6 wire 7 grain protection layer 8 fluorescent layer 9 dream layer 10 矽 glass cover 90 nitrogen 100 first reflector 200 second reflector 201 reflective window 600 package module