M398454 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種用以對一基板噴灑液體的基板濕製 程液體喷灑裝置。 ~ 【先前技術】 所謂基板濕製程包含利用蝕刻液對—基板上未設有保 •護層的銅箔部位進行蝕刻，使該基板上的銅箔呈現出電路 .的圖樣，以及利用清洗液洗淨該基板上的蝕刻液…等利用 •液體對該基板加工的程序。 參見圖3所示，為現有技術中用以對一基板喷灑蝕刻 液或清洗液的一喷灑裝置40,其主要是在一基板輸送台上 方架設若干輸液管41,每一輸液管41上間隔設有複數個噴 Y 4 2母喷管4 2的端部穿設有複數個穿孔。藉此設計， 當加壓後的蝕刻液或清洗液由各輸液管41流入各噴管42 後，便可由各噴管42上所設的穿孔以細水柱狀的方式對該 基板進行喷灑。 惟，隨著科技的發展，各式電子裝置不但要求外型要 幸二 濞短小，功成也要多樣化，如此一來，該電子裝 置内所設之基板上的銅箔電路相對的也要越來越精細以 便能夠在同一面積的基板上，佈設出足以符合需求的電 路。而上述現有技術之喷灑裝置4〇對基板喷灑細水柱狀蝕 J液的方式 旦水柱大小、水壓強度或者姓刻液濃度沒 有控制好’都很容易會對該精細的銅箔電路產生過蝕的狀 况，導致該銅箔電路的結構強度不足，以致在之後的加工 3 M398454 以對基板進行钱刻加工時，可有效避免對精細的電路產生 過蝕’確保電路的完整性，讓電路的成型更加確實。 【實施方式】 以下配合圖式及本創作之較佳實施例，進一步閣述本 創作為達成預定創作目的所採取的技術手段》 參見圖1所示，本創作之基板濕製程液體喷麗裝置可 間隔架設在一用以盛裝餘刻液的姓刻槽（圖中未示）上方，今 液體噴灑裝置包括一輸液管10、複數個霧化喷嘴20及複數 鲁 個導氣管30，其中： 輸液管1 0可用以輸送該基板濕製程所使用的液體，在 本較佳實施例中，該輸液管10係用以輸送從該蝕刻槽抽取 並循環使用的蝕刻液； 進一步參見圖2所示 旧j阳π1於該輸液 管1〇上，並與該輸液* 1〇相連通，在本創作的具體實施 方式中’每-霧化喷嘴20内部為中空而形成有一空腔 2〇1，並於該霧化嘴嘴20上設有一氣體輸入口 21、一嘴出 口 22、一液體輸入口 23及一筛網24，該氣體輸入口。與 喷出口 22分別設於該霧化噴嘴2〇的相對兩端部處，該液 體輸入口 23設於該霧化噴嘴2〇的如啟 貝再^的側壁處，並與該輸液管 1 〇相連通，該篩網24設於該霧化喷 %觜20的空腔201内， 且環繞該噴出口 20設置； 各導氣管30的一端分別斑久 口 21沐……” 噴嘴2〇的氣體輸入 口 21相連通’各導氣營3〇的 乃缟則用以連接一高壓翕 體供應裝置（圖中未示）。 门礼 藉此，當高壓氣體經由該導氣 札Β 30且該蝕刻液則經由 5 M398454 泫輸液官10同時導入該霧化噴嘴2〇之空腔2〇1内時，該 问壓氣體會與蝕刻液混合，使該蝕刻液形成液滴狀，並順 著該高壓氣體的吹送方向，先藉由該霧化噴嘴2〇内所設的 筛網24切割該液滴以進一步減小各液滴的體積後，再將該 微粒化後呈霧狀的蝕刻液從該霧化喷嘴2〇的喷出口 22噴 灑而出，以利用對基板噴灑霧狀蝕刻液的方式對基板進行 蝕刻加工，有效避免對精細的電路產生過蝕，確保電路的 完整性，讓電路的成型更加確實。 以上所述僅是本創作的較佳實施例而已，並非對本創 作作任何形式上的限制，雖然本創作已以較佳實施例揭露 如上，然而並非用以限定本創作，任何熟悉本專業的技術 人員，在不脫離本創作技術方案的範圍内，當可利用上述 揭示的技術内容作出些許更動或修飾為等同變化的等效實 施例’但凡是未脫離本創作技術方案的内$，依據本創作 的技術實質對以上實施例所作的任何簡單修改、等同變化 與修飾，均仍屬於本創作技術方案的範圍内。 【圖式簡單說明】 圖1為本創作於實施狀態之立體外觀圖。 圖2為本創作之霧化喷嘴於實施狀態之剖面示意圖。 圖3為現有技術之立體外觀圖。 【主要元件符號說明】 10輸液管 20霧化噴嘴 201空腔 21氣體輪入口 22噴出口 23液體輸入口 6 M398454 24筛網 30導氣管 40喷灑裝置 41輸液管 42噴管M398454 V. New description: [New technical field] This is a substrate wet-process liquid spraying device for spraying liquid on a substrate. [Prior Art] The substrate wet process includes etching a copper foil portion on the substrate without a protective layer by using an etching solution, so that the copper foil on the substrate exhibits a circuit pattern and is washed with a cleaning liquid. A procedure for processing the substrate by using a liquid such as an etchant on the substrate. Referring to FIG. 3, in the prior art, a spraying device 40 for spraying an etching liquid or a cleaning liquid on a substrate is mainly provided with a plurality of infusion tubes 41, one for each infusion tube 41, disposed above a substrate conveying table. The ends of the plurality of sprayed Y 4 2 female nozzles 4 2 are provided with a plurality of perforations. With this design, when the pressurized etching liquid or the cleaning liquid flows into the respective nozzles 42 from the respective infusion tubes 41, the substrate can be sprayed in a fine water column shape by the perforations provided in the respective nozzles 42. However, with the development of science and technology, all kinds of electronic devices not only require the appearance to be short, but also have different functions. Therefore, the copper foil circuit on the substrate provided in the electronic device is relatively more The finer the wiring, the more the circuit can be placed on the same area of the substrate. However, the above-mentioned prior art spraying device 4〇 sprays a fine water column-like etching solution on the substrate, and the water column size, the water pressure strength or the surname engraving concentration are not well controlled, and it is easy to produce the fine copper foil circuit. The condition of over-etching causes the structural strength of the copper foil circuit to be insufficient, so that after processing 3 M398454 for the processing of the substrate, it is possible to effectively avoid over-etching of the fine circuit to ensure the integrity of the circuit. The formation of the circuit is more certain. [Embodiment] In the following, in conjunction with the drawings and the preferred embodiment of the present invention, the technical means adopted by the present invention for achieving the intended purpose of creation are further described. Referring to FIG. 1, the substrate wet process liquid spray device of the present invention can be The spacer is arranged above a surname groove (not shown) for containing the residual liquid. The liquid spraying device comprises an infusion tube 10, a plurality of atomizing nozzles 20 and a plurality of air guiding tubes 30, wherein: the infusion tube 10 can be used to transport the liquid used in the substrate wet process. In the preferred embodiment, the infusion tube 10 is used to transport the etching liquid extracted from the etching bath and recycled; further see FIG. 2 Yang π1 is on the infusion tube 1〇 and is in communication with the infusion solution*1. In the specific embodiment of the present invention, the interior of each atomizing nozzle 20 is hollow to form a cavity 2〇1, and The atomizing nozzle 20 is provided with a gas input port 21, a nozzle outlet 22, a liquid inlet port 23 and a screen 24, the gas inlet port. And the discharge port 22 are respectively disposed at opposite ends of the atomizing nozzle 2〇, and the liquid input port 23 is disposed at a side wall of the atomizing nozzle 2〇, and is connected to the infusion tube 1 In connection, the screen 24 is disposed in the cavity 201 of the atomizing spray port 20 and disposed around the discharge port 20; one end of each air guiding tube 30 is respectively separated by a long mouth 21..." The input port 21 is connected to each other. The 缟 各 各 各 用以 用以 用以 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 。 。 。 When the liquid is simultaneously introduced into the cavity 2〇1 of the atomizing nozzle 2 via the 5 M398454 泫 infusion official 10, the pressure gas is mixed with the etching liquid, so that the etching liquid forms a droplet shape and follows the high pressure gas. In the blowing direction, the droplets are first cut by the screen 24 provided in the atomizing nozzle 2 to further reduce the volume of each droplet, and then the atomized and mist-like etching liquid is sprayed from the mist. The spray port 22 of the nozzle 2 is sprayed out to spray the substrate with a mist etchant The etching process effectively avoids over-etching of the fine circuit, ensures the integrity of the circuit, and makes the formation of the circuit more accurate. The above description is only a preferred embodiment of the present invention, and does not impose any form restrictions on the creation. The present invention has been disclosed in the above preferred embodiments, but is not intended to limit the present invention. Any person skilled in the art can make use of the above disclosed technical contents without departing from the scope of the present technical solution. Equivalent to the equivalent embodiment of the equivalent change, but any simple modification, equivalent change and modification of the above embodiment according to the technical essence of the present invention are still in the present creation. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1 is a perspective view of the creation of the atomizing nozzle in the state of implementation. Fig. 3 is a perspective view of the prior art. [Main component symbol description] 10 infusion tube 20 atomizing nozzle 201 cavity 21 gas wheel inlet 22 spray port 23 Input port body 30 6 M398454 24 mesh airway 40 fogger nozzle 41 of the infusion tube 42