TWI508159B - - Google Patents

Info

Publication number
TWI508159B
TWI508159B TW102113576A TW102113576A TWI508159B TW I508159 B TWI508159 B TW I508159B TW 102113576 A TW102113576 A TW 102113576A TW 102113576 A TW102113576 A TW 102113576A TW I508159 B TWI508159 B TW I508159B
Authority
TW
Taiwan
Application number
TW102113576A
Other languages
Chinese (zh)
Other versions
TW201442095A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW102113576A priority Critical patent/TW201442095A/en
Publication of TW201442095A publication Critical patent/TW201442095A/en
Application granted granted Critical
Publication of TWI508159B publication Critical patent/TWI508159B/zh

Links

TW102113576A 2013-04-17 2013-04-17 Uniform-pressure liquid spraying device for wafer processing TW201442095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102113576A TW201442095A (en) 2013-04-17 2013-04-17 Uniform-pressure liquid spraying device for wafer processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102113576A TW201442095A (en) 2013-04-17 2013-04-17 Uniform-pressure liquid spraying device for wafer processing

Publications (2)

Publication Number Publication Date
TW201442095A TW201442095A (en) 2014-11-01
TWI508159B true TWI508159B (en) 2015-11-11

Family

ID=52422986

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102113576A TW201442095A (en) 2013-04-17 2013-04-17 Uniform-pressure liquid spraying device for wafer processing

Country Status (1)

Country Link
TW (1) TW201442095A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080049085A1 (en) * 2006-07-03 2008-02-28 Fuji Xerox Co., Ltd. Liquid droplet ejection head, apparatus for ejecting liquid droplet, and method of producing liquid droplet ejection head
TWM398454U (en) * 2010-08-17 2011-02-21 Ampoc Far East Co Ltd Liquid spraying device for a substrate wet processing
TWI347857B (en) * 2009-03-12 2011-09-01 Au Optronics Corp Liquid crystal sprayer
TWM450057U (en) * 2012-11-05 2013-04-01 Cisom Internat Co Ltd Liquid uniform pressurized spraying device for wafer process

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080049085A1 (en) * 2006-07-03 2008-02-28 Fuji Xerox Co., Ltd. Liquid droplet ejection head, apparatus for ejecting liquid droplet, and method of producing liquid droplet ejection head
TWI347857B (en) * 2009-03-12 2011-09-01 Au Optronics Corp Liquid crystal sprayer
TWM398454U (en) * 2010-08-17 2011-02-21 Ampoc Far East Co Ltd Liquid spraying device for a substrate wet processing
TWM450057U (en) * 2012-11-05 2013-04-01 Cisom Internat Co Ltd Liquid uniform pressurized spraying device for wafer process

Also Published As

Publication number Publication date
TW201442095A (en) 2014-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees