M395908 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作是有關於一種立體電路元件，特別是指設置有導 電接點及引電接點，用以輔助電鍍電流平均分配的立體 電路元件。 【先前技術】 [0002] 基於大眾對於3C產品的便利性及可攜帶性的講究，驅使 電子產品朝向微小化、輕量化及多功能化的方向發展， 同時促使了 1C設計及電路設計朝向立體3D設計的方向進 展。藉由電路元件設計的立體化，可以在有限體積的電 • ' · 弋-,'v 路元件上形成複雜的電路，讓電子產.品-在不影響其功能 • ,\\···. ·,:ί ·?:>.' 下，可以縮小外觀體積。換句話說，立體北的電路元件 設計，促使電子產品在微小的體積下，也能保有複雜的 電路，因此電路元件的立體化設計，確實具有讓電子產 品微小化、輕量化及多功能化的潛力，並被廣泛的應用 在各種層面上，如手機、汽車電路、提款機及助聽器等 電子產品。 [0003] 目前，用於製作立體電路元件的方式有模制互連元件 (MID，molded interconnect device)-雙料射出製程 。此方法是藉由雙料射出方式，先以非導電性材料射出 成型形成元件載體，再以另一材料經由射出成型形成電 路圖樣於元件載體上，最後使用化學鍍方式在電路圖樣 上生成金屬導電線路。此外，製作立體電路元件的方式 尚有模制互連元件-雷射直接成型法（MID-LDS，Molded Interconnect device-Laser Direct Structur- 表單編號A0101 第3頁/共31頁 M395908 ing)，此方式是將含有觸媒的非導電性塑料經由射出成 型形成元件載體，再以雷射激光活化載體上的觸媒，使 觸媒轉變為觸媒核，藉由觸媒核和預鍍金屬離子進行化 學鍍反應，而形成金屬導電線路。 [0004] 上述習知的立體電路元件的製作方法，可以有效率的製 作出立體電路元件，但卻受限於電路圖樣的設計常是由 互不相連接的多個線路所組成，且作為立體電路元件的 金屬導電線路其金屬鍍層厚度的均勻度都有極高的要求 。因此，由於化學鍍是在不施加電力的情況下，藉由電 路元件上欲形成電路圖樣的部分其表面所附著的金屬觸 媒，對化學鍍液中存在的預_金虞離子進好一催化反應 • t'-·· 以將預鍍金屬離子還原於電略·元:件上故形成嚅路圖樣的 部分的表面，因此化學鍍相較於電鍍具有不存在電力線 分佈不均勻的影響及對幾何形狀複雜的鍍件也能獲得厚 度均勻的鍍層的優點。所以習知方式多採用化學鍍方式 製作立體電路元件的導電線路。 [0005] 化學鍍是在不施加電力的情況下，藉由電路元件上欲形 成電路圖樣的部分其表面所附著的金屬觸媒，對化學鍍 液中存在的預鍍金屬離子進行一催化反應，以將預鍍金 屬離子還原於電路元件上欲形成電路圖樣的部分的表面 。因此，化學鍍法可以於電路元件上欲形成電路圖樣的 部分的表面形成厚度均勻的金屬鍍層。但由於化學鍍是 在不外加能量下所進行的化學還原反應，因此其反應時 間長、析出速度慢，且易產生大量廢液。例如，以化學 鍍形成銅厚度10微米及鎳厚度3微米時，就必須耗費長達 表單編號A0101 第4頁/共31頁 M395908 3、4小時的反應時間。此外，化學鍍需使用大量的鍍液 及還原劑，亦造成高成本的問題。 [0006] 但若以電鍍方式形成相同厚度的銅或鎳金屬層時，電鍍 不僅可以有效地降低反應時間，增加生產效率外，由於 鍍液的使用量相較於化學鍍法少很多且不需使用大量的 還原劑，因此，亦可達到降低生產成本的效果。此外， 化學鍍與電鍍相比，所用的溶液穩定性較差，且溶液的 維護、調整和再生都比較麻煩，因此材料成本費也較電 鍍較高。有鑑於化學鍍法所衍生的反應時間慢及高成本 的問題，若能有效的將電鍍方式應用在立體電路元件的 製作，使其非但能夠形成各^丨不同的立體艇路圖樣，亦 .s- f 可以產生厚度均勻的金屬鍍層，則將可取代:化學鍍法應 • - … 用於電路的製作，以達到提高生產效率、降低生產成本 及減少廢液產生量的目的。 【新型内容】 [0007] 有鑑於上述習知技藝之問題，本創作之目的就是在提供 '' .. ' 一種立體電路元件，其可利用丨電鍍的方式產生厚度均勻 的金屬導電線路。 [0008] 根據本創作之目的提出一種立體電路元件，其包含有： 一基座，是由一第一非導電性材料所形成；一電路圖樣 部，是根據一圖樣設置於基座上，且電路圖樣部是由至 少一線路所組成；一金屬鍍層，是覆蓋於電路圖樣部上 ;以及至少一導電接點，是設置於基座上，用以連接基 座的邊緣和電路圖樣部。其中，電路圖樣部及至少一導 電接點是由一第二非導電性材料所形成。 表單編號A0101 第5頁/共31頁 M395908 [0009] 其中，金屬鍍層是以電鍍方式形成於電路圖樣部上。 [0010] 其中，更包含至少一引電接點，是設置於基座上之至少 一線路之間，用以連接至少一線路。 [0011] 其中，更包含至少一第一料骨連接於基座上，且至少一 第一料骨是由第二非導電性材料所形成。 [0012] 其中，更包含至少一第二料骨連接於基座上，且至少一 第二料骨是由第一非導電性材料所形成。 [0013] 其中，至少一導電接點是用以連接電路圖樣部、棊座邊 緣與至少一第一料骨。 [0014] 其中，電路圖樣部與金屬鍍?|5^谓更.七有一介面層。 *擧' [0015] 承上所述，依本創作之立體ΐ路:元件其可具有一或多個 下述優點： [0016] (1)金屬線路是由電鍍方式形成，因此不需大量使用化學 鍍液且電鍍法之鍍層析出_度快，具有可以降低生產成 本、提昇生產效率、減少廢液產生量及減少污染等優點 〇 [0017] (2)依據各線路的導電路徑長短、線路圖樣的面積或幾何 形狀等，將導電接點及引電接點平均分配設置在各線路 間，讓電鍍電流均勻分配在線路圖樣的各個部份，進而 可得到厚度均勻的金屬線路層。 【實施方式】 [0018] 以下將參照相關圖示，說明依本創作較佳實施例之立體 電路元。為了便於理解，下述實施例之相同元件係以相 表單編號Α0101 第6頁/共31頁 M395908 同符號標示說明。 [_本創作提ϋ立體電路元件。駿更加清楚本創作之 立體電路元件的特點，首將介紹糊作之立體電路元件 的製作方法。 圆請參閱第i圖及第2圖，其分別係為本創作之立體電路元 件之製作方法的步驟流程圖及本創作之立體電路元件之 實施例1示意圖。 圆h第1圖所示，本創作之立體電路元件之製作方法主要步 驟包括：步驟SU，將一第一非導電性材料射出成型形成 基座。步驟S12，將-第二非導電,性材料射出成型形成 至少-第-料骨、—電路圖樣部及:至品—夸電接點於基 座上，使至少一第一料骨及至少一導電&與電路圖樣 部形成相通的線路。步驟S13，形成一介面層覆蓋於至少 一第-料骨、電路圖樣部及至少—導電接點上。步驟叫 ，形成-絕緣層覆蓋於至少一導電接之介面層上。步 驟S15，形成-金屬鑛層覆蓋於電路f圖樣部之介面層上。 #則16，移除覆蓋於至少—導電接點上之介面層及絕緣 層。以及步驟S17，移除至少一第一料骨，以得到一立體 電路元件。 _]纟中，第—非導電性材料可以為任何非導電性的塑料， 而第二非導電性材料是非導電性且適用於進行化學鍵的 塑料》 剛其中，步驟S15中是藉由電鑛法於電路圖樣部上形成金屬 鑛層，且電路圖樣部是由至少—線路所組成。 表單編號A0I01 第7頁/共31頁 [0024]M395908 [0025] 其中’至少-導電接點是用來連接至少一第一料骨和電 路圖樣部，以作為電路圖樣部於電鍍時的電流導通點。 其中，在步驟S12中，更可包括形成至少—引電接點以 用來連接此至少一線路，並於電鍍時，將電鍍電流平均' 的導引至各線路。 [0026] [0027] 如第2圖所示，其係藉由上述製作過程而得到之本創作之 立體電路元件之實施例!示意圖，其包含有：一基座; 一電路圖樣部20，是根據一圖樣設置於基座1〇上；一金 屬鑛層，是覆蓋於電路圖樣部20上，圖中利用黑色區塊 表示金屬鑛層的部份；至少痛義，，是設置於基 座10上，用以連接基座1()，♦電麵樣部2〇。 並請參閱第3®，其係本㈣if㈣路元件之實施例i 於完成步驟SU及步驟S12的—態樣示意圖。如圖所示， 其包含有在步驟S11巾，藉由第—非導魏材料射出成型 形成之基座10，及在步職2中;，;藉由第二非導電性材料 射出成型形成之至少一第一料骨2办3、至少一導電接點 201及電路圖樣部2〇。 [0028] [0029] 其中’在步驟Silt，藉由第-非導電性材料射出成型形 成基座1G時，更可同時形成至少一第二料骨⑻連接於基 座10上，如第4圖所示，其係本創作之立體電路元件之實 施例1於完成步驟S11及步驟S12的另一態樣示意圖，此時 在步驟S11中所形成之至少—第二料骨1〇1，最後會在步 驟S17中連同至少-第—料骨2()3 —併於基座1Q上移除。 此外’在步驟S12中’藉由第二非導電性材料射出成型形 表單編號A0101 M395908 成至少一第一料骨203、一電路圖樣部20及至少一導電接 點201於基座10上時，更可同時形成至少一引電接點2〇2 於基座10上’而最後形成如第5圖所示之本創作之立體電 路元件之實施例2示意圖。如圖所示其包含有—基座1〇、 一電路圖樣部20、一金屬鍍層，是覆蓋於電路圖樣部上 ，圖中利用黑色區塊表示金屬鍍層的部份、至少一導電 接點201及至少一引電接點202，是設置於基座1〇上，用 以連接基座10的邊緣和電路圖樣部20。 [0030] 此時所形成之至少一引電接點202，是設置於基座1〇上， 用以連接電路圖樣部20。且若於步驟S12中同時形成有至 少一引電接點202時，則在步驟幻3中所形成覆蓋於至少 ：；>·· ；.· ·". ,... ί- 一導電接點201的介面層，同樣會形成並覆^於至少一引 電接點202上。而步驟S14中所形成覆蓋~於至少一導電接 點201上的絕緣層，同樣會形成並覆蓋於至少一引電接點 202上。而覆蓋於至少一引電接點2〇2上的介面層及絕緣 層，最後會於步驟S16中移除。 [0031] 此外在實施例2中，於步驟S11中，藉由第一非導電性材 料射出成型形成基座10時，同樣的也可同時形成如第4圖 所示之至少一第二料骨101。 [0032] 以下為便於更進一步方便說明本創作之立體電路元件的 製作方法，將藉由包含有至少一引電接點的實施例2為例 說明，並以實施例2在步驟S11中形成有至少一第二料骨 的不同態樣來說明本創作之立體電路元件及其製作方法 。並將會比較其他包含有至少一引電接點之各實施例的 差異及各實施例於製作過程中至少一第一料骨及至少一 表單編號Α0101 帛9頁/共31頁 M395908 第二料骨設計的差異。 [0033] 請參閱第6圖至第11圖，其分別是本創作之立體電路元件 之實施例2於完成各步驟S1卜S17之第1態樣示意圖，在 實施例2的第1態樣中，實施例2的立體電路元件在步驟 S11中形成有至少一第二料骨。 [0034] 首先請參閱第6圖所示，其係為本創作之立體電路元件於 完成步驟S11及步驟S12的第1態樣示意圖。在S11步驟中 將第一非導電性材料射出成型形成一基座10。並在步驟 S12中藉由第二非導電性材料形成電路圖樣部20、至少一 導電接點201及至少一第一料骨203於基座上10，且導電 接點201、引電接點202接點:及電路圓椽部2·0構成相互連 -； ...» . ,. ...·：： 結的線路。其中，在此實施例2的第1態樣中，步驟S11更 包括將第一非導電性材料射出成型形成至少一第二料骨 101於基座10上，且在步驟S12中更包括將第二非導電性 材料射出成型形成至少一引電接點202於基座10上，且此 第一料骨203和導電接點201相連接，並透過導電接點 2 01和電路圖樣部2 0相連，而引電接點2 0 2是位在組成電 路圖樣部20的線路之間，用來縮短電鍍時的線路的導電 路徑，以平衡電鍍電流。此外，當電路圖樣部20的設計 為多條不互相連接的線路所組成時，引電接點202除了可 以縮短各線路在電鍍過程的導電路徑外，同時又可讓原 本不互相連接的線路彼此相互連接。 [0035] 而第一非導電性材料可以為任何非導電性的塑料，第二 非導電性材料則是非導電性且適用於進行化學鍍的塑料 。此外，藉由計算各線路的導電路徑長短、幾何形狀及 表單編號Α0101 第10頁/共31頁 M395908 面積等，導電接點201及引電接點202可以依據計算結果 及為均衡各線路部份導電電流的目的，而任意的分配設 置在各線路間，以避免電鍍時電力線分佈不均勻對於所 形成之金屬敍層之厚度的影響。 [0036]接著請參閱第7圖，其係本創作之立體電路元件之實施例 2於元成步驟S13的第1態樣示意圖。如圖所示，在步驟 S13中，形成一介面層3〇覆蓋於第一料骨2〇3和電路圖樣 部20相連的一面上、電路圖樣部2〇、至少一導電接點2〇ι 及至少一引電接點2〇2上，於第7圖中，以點的方式表示 ® 出形成介面層30的部份。其中介面層30必需具有導電性 ，可由多種方式形成，於本創作令是藉由也學鍍形成介 面層30 ,為具有導電性且厚度約為〇 j微米至2微米的金 屬層，且其最佳厚度為0.2微米至i微米，並為銅或錄等 具導電性的金屬。其中由於第二非導電性材料是非導電 性且適用於進行化學鍍的塑料，因此介面層可形成於由 第二非導電性材料所形成的.份。 • [0037]介面層30是為了讓第一料骨2〇3、電路圖樣部20、導電接 點201及引電接點2〇2彼此間成為可相互導通的導線，如 此在步驟S15進行電鍍時，藉由將第一料骨2〇3和電源的 負極相接，即可讓和第一料骨203之間有電導通性的電路 圖樣部在電鍍過程中作為負極，並讓電源的正極和預鍍 金屬固體相接，當將電路元件浸泡於含有預鍍金屬離子 的電鍍液時，預鍍金屬離子便在作為負極的電路圖樣部 20之介面層30表面上接收電子而還原析出預鍍金屬於電 路圖樣部上，形成所要的金屬線路。其中，預電鍍的金 表單編號A0101 第11頁/共31頁 [0038]M395908 屬可以為銅、鎳、鉻'錫、銀或金等金屬。 再來請參閱第8圖，其係本創作之立體電路元件之實施例 2於完成步驟S14的第1態樣示意圖。在S14步驟中，形成 一絕緣層31覆蓋於至少一導電接點201及至少一引電接點 201之介面層3〇上’圖中利用斜線區塊表示絕緣層31所在 位置。其中’絕緣層31可以使用油墨或塗料以印刷、喷 墨等方式加工而成、而油墨可以為溶劑型之耐酸油墨、 水性之耐酸油墨、耐酸不耐鹼之油墨或UV硬化型之油墨 、抗電鍍之油墨或塗料等，亦可以貼上絕緣膠帶作為絕 緣層。 [0039] 於S14步驟中，形成一絕緣層為丨^萃矜導電接電2〇1及引 電接點202的介面層30上之^^^為* 了讓專電接點2〇1 及引電接點202在步驟S15中進行電鐘時，僅僅只是藉由 介面層30的存在而可以和電路圖樣部2〇及第一料骨2〇3相 直導通，並不會形成金屬鍍層丨夺赛電接點20!及引電接點 202上，造成對欲形成的電丨路圖樣巧:改變。換句話說，絕 緣層31讓讓導電接點2〇1及弓丨電接點202純粹只是用來導 電而不會於步驟S15中的電鍍過程增加膜厚。 [0040] 請參閱第9圖’其係本創作之立體電路元件之實施例2於 完成步驟S15的第1態樣示意圖。圖中以黑色區塊表示在 電鑛過程形成金屬鑛層的部份，可以看出，導電接電2〇1 及引電接點202上並未形成金屬鍍層，金屬鍍層僅形成於 電路圖樣部20及第一料骨2〇3上》 [0041] 請參閱第10圖，其係本創作之立體電路元件之實施例2於 表單編號A0101 第丨2頁/共31頁 M395908 完成步驟SI 6的第1態樣示意圖。形成金屬鍍層後，在步 驟S16中，移除導電接點201及引電接點202上的絕緣層 31及介面層30，使導電接點201及引電接點202和電路圖 樣部20恢復為不導通的狀態，避免影響金屬鍍層的電路 圖樣。如圖所示，移除覆蓋於各接點上的絕緣層31及介 面層30後，即裸露出導電接點201及引電接點202原本的 第二非導電性材料表面，圖中，以白色區塊表示原本的 第二非導電性材料表面。 [0042] 其中，移除覆蓋於導電接點2 01及引電接點20 2的絕緣層 31及介面層30的方法可以使用乾式的移除法，如利用雷 射同時移除絕緣層及介面層。或可使用濕式的移除法， 例如利用鹼性液體或剝離劑，&己合超，音波設備或利用電 解的方式先將絕緣層去除，再利用酸性液體或微蝕劑等 將介面層去除。且若使用雷射剝除，則可以僅針對導電 接點201及引電接點202和電路圖檨部20有相連的部份剝 除即可，以導電接點201及引電接點202之具有導電性的 介面層30為不改變電路圖樣部2 0爲原則。 [0043] 最後請參閱第11圖，其係本創作之立體電路元件之實施 例2於完成步驟S1 7的第1態樣示意圖。在步驟S17中，移 除第一料骨203與第二料骨101於基座10，以得到如第5 圖所示之立體電路元件。其中，將第一料骨及第二料骨 移除分離於基座，以避免影響立體電路元件外觀及其上 金屬線路的圖樣及功能。 [0044] 而在移除步驟中，為了確保在電鍍過程中，同樣具有介 面層30的第一料骨203，在和電路圖樣部20鄰近接觸的部 表單编號A0101 第13頁/共31頁 M395908 份不會形成金屬鍍層，造成在移除步驟時，影響到和其 相鄰近的電路圖樣部20，可以在第一料骨203和基底10的 連接處有不同的設計。如第9圖所示，在此實施例2之完 成步驟S15的第1態樣中，第一料骨203和基座10相連的 一端即移除時的去除端，並不直接觸及電路圖樣部20， 而保有一段距離，此段距離是為導電接點201所在的位置 ，並藉由導電接點201的介面層30上覆蓋有絕緣層31，使 第一料骨203和電路圖樣部20之間在電鍍過程不會有金屬 鍍層產生，以確保移除第一料骨203時，不會影響到原有 的電路圖樣設計，其中，由圖更可看出覆蓋於導電接點 201上的絕緣層31也會稍微的j主彡少一：第#料骨203與延 伸，如此可以在將至少一第‘料丨移除於基座1〇時， 不會在至少一第一料骨203和導電接點201相連處的邊緣 留下金屬毛邊。 [0045] 此外，由第9圖可看出，此樣態中更藉由將第一非導電性 材料形成的第二料骨101，包覆於第一料骨203和基座10 相連接的去除端周圍，僅露出弟一料骨203和導電接點 201相接的一面，以避免電鍍過程中，在第一料骨203和 基座10之相連處周圍形成金屬鍍層，造成移除第一料骨 203於基座後，產生金屬層毛邊殘留在基座10，影響立體 電路元件的設計。其中，由第一非導電性材料所形成的 第二料骨在步驟S13的化學鍍過程中不會形成介面層覆蓋 在其表面，因此可以確保在電鍍過程時，不會形成金屬 鍍層。 [0046] 如上所述，實施例2中在各步驟流程的第1樣態中，第一 表單編號Α0101 第14頁/共31頁 M395908 料骨203和基座10連接方式的設計，可以確保在移除第一 料骨203於基座10時，不會影響到原有天線的電路圖樣20 設計，且不會殘留金屬層毛邊於元件基座10上。 [0047] 請參閱第12圖至第13圖，其分別係本創作之立體電路之 實施例3之立體電路元件於完成步驟S1 5的態樣示意圖及 實施例2之立體電路元件於完成步驟S15的第2態樣示意圖 。由圖可看出，實施例2與實施例3具有相同的電路圖樣 部20設計、相同的導電接點201配置及相同的引電接點 202配置，且由於各實施例的立體電路元件的製作方法皆 如上所述，故在此便不再詳述。 [0048] 而可看出實施例2在完成步驟S15的第1:態樣、實施例2在 完成步驟S1 5的第2態樣及實施例3在完成步驟S1 5的一態 樣，三者最大的差異在於第一料骨203和基座10的連接方 式的設計。 [0049] 如第12圖所示，實施例3的一態樣中，元件於製作過程產 生的第一料骨203的設計為第一料务203移除於基座10的 去除端是緊連於電路圖樣20部上，造成在移除時，需很 小心仔細的移除，才不致於破壞緊連的電路圖樣部20。 此外，實施例3的一樣態中中，第一料骨203和基座10相 接處的周圍並未有第一非導電性材料的包覆，造成第一 料骨203移除於基座10後，易在第一料骨203與基座10相 連處的周圍部分殘留金屬層毛邊。此金屬層毛邊需視其 需求再給予加工去除。 [0050] 而第13圖所示，實施例2於完成步驟S15後的第2樣態中， 表單編號A0101 第15頁/共31頁 M395908 第一料骨203雖然未緊連電路圖樣部20，並如同實施例2 的第1樣態中，藉由導電接點201和電路圖樣部20相連， 但由於第一料骨203和基座10相接處的周圍並未有第一非 導電性材料的包覆，因此在移除時，容易在和基座1 0相 連處的周圍部分殘留金屬層毛邊。此金屬層毛邊需視其 需求再給予加工去除。 [0051] 可以參閱第14圖，其係本創作之立體電路元件之實施例2 於完成步驟S1 5的第2態樣於移除第一料骨203於基座10 後，在基座10上殘留金屬層毛邊2031的示意圖，由第14 圖可以看出金屬層毛邊20 31會殘留在第一料骨203和基座 10相連處的周圍。此金屬層毛，邊需揭丨_.:索求再給予加工 去除。 • < [0052] 請參閱第15圖至第17圖，其分別係本創作之立體電路元 件之實施例4於完成步驟S1 5的第1態樣示意圖及第2態樣 示意圖與實施例5於完成步驟S15的一態樣示意圖。由圖 可以觀察出三者最大的差異在於其中之一第一料骨203和 ' - > 基座1 0相連處的設計不相阕口且其個別的差異與影響已 於上述比較實施例2於完成步驟S15的第1態樣、第2態樣 及、實施例3於完成步驟S15的一態樣的差異時以詳述過 ，故在此不再詳述比較。 [0053] 此外，實施例4、實施例5與實施例2及實施例3之立體電 路元件最大的差別在於實施例4、實施例5中，設置有兩 個導電接點201，而導電接點201所設置的位置如同前面 所述及，是設置於第一料骨203和電路圖樣部20之間，以 連接第一料骨203和電路圖樣部20。並於電鍍過程時，藉 表單編號A0101 第16頁/共31頁 M395908 [0054] [0055]M395908 V. New description: [New technical field] [0001] This creation is about a three-dimensional circuit component, especially a three-dimensional circuit provided with conductive contacts and conductive contacts to assist the even distribution of plating current. element. [Prior Art] [0002] Based on the public's attention to the convenience and portability of 3C products, it has driven the development of electronic products toward miniaturization, light weight and multi-function, and promoted 1C design and circuit design toward stereoscopic 3D. The direction of the design is progressing. By the three-dimensional design of the circuit components, complex circuits can be formed on a limited volume of electrical components, and the electronic products can be made without affecting their functions. \\···. ·,: ί ·?:>.', you can reduce the appearance volume. In other words, the design of the circuit components of the three-dimensional north promotes the complicated circuit of the electronic products in a small volume. Therefore, the three-dimensional design of the circuit components does have the miniaturization, weight reduction and multi-function of the electronic products. Potential, and is widely used in various levels, such as mobile phones, automotive circuits, cash machines and hearing aids and other electronic products. [0003] Currently, a method for fabricating a three-dimensional circuit component is a molded interconnect device (MID)-two-shot injection process. In this method, a two-material injection method is adopted, in which a non-conductive material is first injection-molded to form a component carrier, and another material is formed by injection molding to form a circuit pattern on the component carrier, and finally a metal plating circuit is formed on the circuit pattern by electroless plating. . In addition, the method of fabricating the three-dimensional circuit component is also a molded interconnect component - MID-LDS, Molded Interconnect device - Laser Direct Structur - Form No. A0101 Page 3 / 31 M395908 ing, this method The non-conductive plastic containing the catalyst is formed into a component carrier by injection molding, and the catalyst on the carrier is activated by a laser to convert the catalyst into a catalyst core, and the catalyst core and the pre-plated metal ions are used for chemistry. The plating reaction forms a metal conductive line. [0004] The above-mentioned conventional method for fabricating a three-dimensional circuit component can efficiently produce a three-dimensional circuit component, but is limited by the design of the circuit pattern, which is usually composed of a plurality of lines that are not connected to each other, and is used as a three-dimensional The metal conductive lines of circuit components have extremely high requirements for the uniformity of the thickness of the metal plating. Therefore, since the electroless plating is a metal catalyst attached to the surface of the portion of the circuit component on which the circuit pattern is to be formed, the electroless plating is preferably catalyzed by the pre-metal ions present in the electroless plating solution. Reaction • t'-·· to reduce the pre-plated metal ions to the surface of the part of the circuit, so that the electroless plating has no influence on the uneven distribution of the power line. Plated parts with complex geometries can also achieve the advantage of a uniform thickness coating. Therefore, the conventional method uses electroless plating to form a conductive line of a three-dimensional circuit component. [0005] Electroless plating is a catalytic reaction of pre-plated metal ions present in an electroless plating solution by a metal catalyst attached to a surface of a circuit component on which a circuit pattern is to be formed without applying electric power. The pre-plated metal ions are reduced to the surface of the portion of the circuit component where the circuit pattern is to be formed. Therefore, the electroless plating method can form a metal plating layer having a uniform thickness on the surface of the portion of the circuit component on which the circuit pattern is to be formed. However, since electroless plating is a chemical reduction reaction carried out without applying energy, the reaction time is long, the precipitation rate is slow, and a large amount of waste liquid is easily generated. For example, when electroless plating is used to form a copper thickness of 10 μm and a nickel thickness of 3 μm, it takes a long time. Form No. A0101 Page 4 / Total 31 M395908 3, 4 hours of reaction time. In addition, electroless plating requires the use of a large amount of plating solution and reducing agent, which also causes a high cost problem. [0006] However, if a copper or nickel metal layer of the same thickness is formed by electroplating, electroplating can not only effectively reduce the reaction time, but also increase the production efficiency, since the amount of the plating solution is much less than that of the electroless plating method and is not required. The use of a large amount of reducing agent can also achieve the effect of reducing production costs. In addition, compared with electroplating, the solution used is less stable, and the maintenance, adjustment and regeneration of the solution are troublesome, so the material cost is higher than that of electroplating. In view of the slow reaction time and high cost of electroless plating, if the electroplating method can be effectively applied to the fabrication of three-dimensional circuit components, it can not only form different three-dimensional boat road patterns, but also - f can produce a metal coating of uniform thickness, which will replace: electroless plating should be used for the production of circuits to improve production efficiency, reduce production costs and reduce the amount of waste generated. [New Content] [0007] In view of the above-mentioned problems of the prior art, the purpose of the present invention is to provide a ''..'' a three-dimensional circuit component which can be used to produce a metal conductive circuit having a uniform thickness by means of erbium plating. [0008] According to the purpose of the present invention, a three-dimensional circuit component is provided, comprising: a pedestal formed by a first non-conductive material; and a circuit pattern portion disposed on the pedestal according to a pattern, and The circuit pattern portion is composed of at least one circuit; a metal plating layer covers the circuit pattern portion; and at least one conductive contact portion is disposed on the base for connecting the edge of the base and the circuit pattern portion. The circuit pattern portion and the at least one conductive contact are formed by a second non-conductive material. Form No. A0101 Page 5 of 31 M395908 [0009] Among them, the metal plating is formed on the circuit pattern by electroplating. [0010] wherein, at least one of the lead contacts is disposed between the at least one line on the base for connecting at least one line. [0011] wherein, at least one first bone material is connected to the base, and at least one first bone material is formed by the second non-conductive material. [0012] wherein, the at least one second bone material is further connected to the base, and the at least one second bone material is formed by the first non-conductive material. [0013] wherein at least one conductive contact is used to connect the circuit pattern portion, the rim edge and the at least one first material bone. [0014] wherein, the circuit pattern portion and the metal plating ? | 5 ^ said more. Seven has a surface layer. * [0015] As described above, the three-dimensional circuit created by the present invention: the component may have one or more of the following advantages: [0016] (1) The metal circuit is formed by electroplating, so that it does not need to be used in a large amount. The electroless plating solution and the plating method of the electroplating method have a fast _ degree, which has the advantages of reducing production cost, improving production efficiency, reducing waste liquid generation and reducing pollution. [0017] (2) According to the length of the conductive path of each line, the circuit pattern The area or geometry, etc., the conductive contacts and the conductive contacts are evenly distributed between the lines, so that the plating current is evenly distributed in each part of the circuit pattern, and a metal circuit layer having a uniform thickness can be obtained. [Embodiment] A stereo circuit element according to a preferred embodiment of the present invention will be described below with reference to the related drawings. For ease of understanding, the same components of the following embodiments are labeled with the form number Α0101, page 6/31, M395908, with the same symbol. [_ This creation enhances the three-dimensional circuit components. Jun is more aware of the characteristics of the three-dimensional circuit components of this creation, and will first introduce the method of making the three-dimensional circuit components. For the circle, please refer to the first and second figures, which are respectively a flow chart of the steps of the method for fabricating the three-dimensional circuit element of the present invention and a schematic diagram of the first embodiment of the three-dimensional circuit component of the present invention. As shown in Fig. 1 of the circle h, the main steps of the method for fabricating the three-dimensional circuit component of the present invention include the step SU, in which a first non-conductive material is injection molded to form a susceptor. In step S12, the second non-conductive material is injection-molded to form at least a first-material bone, a circuit pattern portion, and a product-exaggeration contact point on the base, so that at least one first bone material and at least one Conductive & A line that forms a communication with the circuit pattern portion. In step S13, an interface layer is formed to cover at least one of the first bone, the circuit pattern portion and at least the conductive contact. The step is such that the formation-insulating layer covers the at least one electrically conductive interface layer. In step S15, a metallization layer is formed to cover the interface layer of the circuit portion of the circuit. #则16, remove the interface layer and the insulating layer covering at least the conductive contacts. And in step S17, removing at least one first bone material to obtain a three-dimensional circuit component. _] 纟, the first non-conductive material may be any non-conductive plastic, and the second non-conductive material is non-conductive and suitable for chemical bonding of plastics, just in step S15 by electro-mine method A metal ore layer is formed on the circuit pattern portion, and the circuit pattern portion is composed of at least a line. Form No. A0I01 Page 7 of 31 [0024] M395908 [0025] wherein 'at least the conductive contact is used to connect at least one of the first bone and the circuit pattern portion to serve as a circuit pattern for current conduction during plating point. Wherein, in step S12, it may further comprise forming at least a conductive contact for connecting the at least one line, and guiding the plating current to the respective lines during electroplating. [0027] As shown in FIG. 2, which is an embodiment of a three-dimensional circuit component of the present invention obtained by the above-described manufacturing process, a schematic diagram includes: a susceptor; a circuit pattern portion 20, According to a pattern, it is disposed on the pedestal 1; a metal ore layer is overlaid on the circuit pattern portion 20, and the portion of the metal ore layer is represented by a black block in the figure; at least the pain is set on the pedestal 10 Upper, used to connect the base 1 (), ♦ electrical surface sample 2 〇. Please refer to Section 3®, which is a schematic diagram of the embodiment of the fourth (if) if (four) way component in the completion of step SU and step S12. As shown, it comprises a susceptor 10 formed by injection molding of a first non-conductive material in step S11, and in step 2; and formed by injection molding of a second non-conductive material. At least one first bone material 2, at least one conductive contact 201 and a circuit pattern portion 2〇. [0029] wherein, in the step Silt, when the susceptor 1G is formed by injection molding of the first non-conductive material, at least one second bone (8) can be simultaneously formed on the susceptor 10, as shown in FIG. 4 As shown in the first embodiment of the three-dimensional circuit component of the present invention, in another step S11 and step S12, at least the second bone 1〇1 formed in step S11 will be In step S17 together with at least - the first bone 2 () 3 - and removed on the base 1Q. In addition, in the step S12, when the second non-conductive material is molded into the form number A0101 M395908 into at least one first bone 203, a circuit pattern portion 20 and at least one conductive contact 201 on the base 10, Further, a schematic diagram of Embodiment 2 in which at least one of the lead contacts 2 〇 2 is formed on the susceptor 10 and the three-dimensional circuit component of the present invention as shown in FIG. 5 is finally formed is formed. As shown in the figure, it comprises a susceptor 1 〇, a circuit pattern portion 20, and a metal plating layer covering the circuit pattern portion. The black block indicates a portion of the metal plating layer, and at least one conductive contact 201 And at least one of the lead contacts 202 is disposed on the base 1 to connect the edge of the base 10 and the circuit pattern portion 20. [0030] At least one of the conductive contacts 202 formed at this time is disposed on the pedestal 1 , for connecting the circuit pattern portion 20. And if at least one of the galvanic contacts 202 is simultaneously formed in step S12, then the coverage formed in step illusion 3 is at least:;>··;.··".,... ί- The interface layer of the contact 201 is also formed and overlaid on at least one of the conductive contacts 202. The insulating layer formed on the at least one conductive contact 201 formed in the step S14 is also formed and covered on the at least one conductive contact 202. The interface layer and the insulating layer covering at least one of the conductive contacts 2〇2 are finally removed in step S16. [0031] Further, in the second embodiment, in the step S11, when the susceptor 10 is formed by injection molding of the first non-conductive material, at least one second bone as shown in FIG. 4 may be simultaneously formed. 101. [0032] The following is a description of a method for fabricating a three-dimensional circuit component of the present invention, which will be described by way of example, including Embodiment 2 in which at least one conductive contact is included, and Form 2 is formed in Step S11. At least one different aspect of the second bone material is used to illustrate the three-dimensional circuit component of the present invention and a method of fabricating the same. And the differences between the other embodiments including at least one of the conductive contacts and the at least one first bone and at least one form number in the production process are Α0101 帛9 pages/31 pages total M395908 second material Differences in bone design. [0033] Please refer to FIG. 6 to FIG. 11 , which are schematic diagrams showing the first aspect of the second embodiment of the three-dimensional circuit component of the present invention in the completion of each step S1 and S17, in the first aspect of the second embodiment. The three-dimensional circuit component of the second embodiment is formed with at least one second material bone in step S11. [0034] First, referring to FIG. 6, it is a schematic diagram of the first aspect of the present invention for completing the step S11 and the step S12. The first non-conductive material is injection molded into a susceptor 10 in the step S11. And forming a circuit pattern portion 20, at least one conductive contact 201 and at least one first material bone 203 on the pedestal 10 by the second non-conductive material, and the conductive contact 201 and the conductive contact 202 are formed in the step S12. Contact: and the circuit circle 2·0 constitutes the interconnection-; ...» . , . . . In the first aspect of the second embodiment, the step S11 further includes: ejecting the first non-conductive material to form at least one second bone 101 on the base 10, and further including the first step in the step S12. The second non-conductive material is injection-molded to form at least one conductive contact 202 on the base 10, and the first material bone 203 is connected to the conductive contact 201, and is connected to the circuit pattern portion 20 through the conductive contact 201. The galvanic contact 2 0 2 is located between the lines constituting the circuit pattern portion 20 for shortening the conductive path of the wiring during plating to balance the plating current. In addition, when the circuit pattern portion 20 is designed to be composed of a plurality of lines that are not connected to each other, the lead-in contact 202 can shorten the conductive paths of the lines in the electroplating process, and at the same time allow the lines that are not connected to each other to each other. Connected to each other. [0035] The first non-conductive material may be any non-conductive plastic, and the second non-conductive material is non-conductive and suitable for electroless plating. In addition, by calculating the length of the conductive path of each line, the geometry and the form number Α0101, page 10/31, M395908 area, etc., the conductive contact 201 and the galvanic contact 202 can be based on the calculation result and equalize each line part. The purpose of the conduction current, and any distribution is set between the lines to avoid the influence of the uneven distribution of the power lines on the thickness of the formed metal layer during plating. [0036] Next, please refer to Fig. 7, which is a schematic view of the first aspect of the embodiment of the three-dimensional circuit component of the present invention. As shown in the figure, in step S13, an interface layer 3 is formed covering one side of the first material element 2〇3 and the circuit pattern portion 20, the circuit pattern portion 2〇, at least one conductive contact 2〇ι and At least one of the galvanic contacts 2 〇 2, in Fig. 7, is a dot representation of the portion forming the interface layer 30. The interface layer 30 must have electrical conductivity and can be formed by various methods. The present invention is formed by forming the interface layer 30 by electroplating, and is a metal layer having conductivity and a thickness of about 微米j to 2 μm, and the most The thickness is from 0.2 micron to i micron and is a conductive metal such as copper or copper. Wherein the second non-conductive material is non-conductive and is suitable for electroless plating, the interface layer may be formed in a portion formed of the second non-conductive material. [0037] The interface layer 30 is for the first material bone 2〇3, the circuit pattern portion 20, the conductive contact 201 and the conductive contact 2〇2 to be mutually conductive wires, so that plating is performed in step S15. When the first material bone 2〇3 is connected to the negative electrode of the power source, the circuit pattern portion having electrical continuity between the first material bone 203 and the first material bone 203 can be used as a negative electrode during the electroplating process, and the positive electrode of the power source is allowed. When the circuit component is immersed in the plating solution containing the pre-plated metal ions, the pre-plated metal ions receive electrons on the surface of the interface layer 30 of the circuit pattern portion 20 as the negative electrode to reduce precipitation pre-gold plating. It belongs to the circuit pattern part and forms the desired metal line. Among them, pre-plated gold form No. A0101 Page 11 of 31 [0038] M395908 can be copper, nickel, chromium 'tin, silver or gold metal. Referring to Fig. 8, a second embodiment of the three-dimensional circuit component of the present invention is completed in the first aspect of the step S14. In the step S14, an insulating layer 31 is formed over the interface layer 3 of at least one of the conductive contacts 201 and the at least one of the conductive contacts 201. The position of the insulating layer 31 is indicated by a diagonal block in the figure. The 'insulating layer 31 can be processed by printing or inkjet using ink or paint, and the ink can be solvent-type acid-resistant ink, water-based acid-resistant ink, acid-resistant and alkali-resistant ink or UV-curable ink, and anti-ink. For electroplating inks or coatings, insulating tape can also be applied as an insulating layer. [0039] In step S14, an insulating layer is formed on the interface layer 30 of the conductive connection 2〇1 and the conductive contact 202. When the electric contact 202 performs the electric clock in step S15, it can be directly connected to the circuit pattern portion 2 and the first material bone 2〇3 only by the presence of the interface layer 30, and the metal plating layer is not formed. The match point 20! and the lead-in contact 202 cause a pattern of the electric circuit to be formed: change. In other words, the insulating layer 31 allows the conductive contacts 2〇1 and the bow electrical contacts 202 to be used solely for conduction without increasing the film thickness in the plating process in step S15. [0040] Please refer to FIG. 9 for a first aspect of the second embodiment of the three-dimensional circuit component of the present invention. In the figure, the black metal block indicates the part of the metal ore layer formed during the electric ore process. It can be seen that the conductive plating 2〇1 and the conductive contact 202 do not form a metal plating layer, and the metal plating layer is formed only in the circuit pattern portion. 20 and the first material bone 2〇3" [0041] Please refer to FIG. 10, which is the embodiment 3 of the three-dimensional circuit component of the present invention. The form number A0101, page 2, page 31, M395908, completes the step SI 6 The first aspect is a schematic diagram. After forming the metal plating layer, in step S16, the insulating layer 31 and the dielectric layer 31 and the interface layer 30 on the conductive contact 201 and the dielectric contact 202 are removed, so that the conductive contact 201 and the conductive contact 202 and the circuit pattern portion 20 are restored to Non-conducting state, avoiding the circuit pattern that affects the metal plating. As shown in the figure, after the insulating layer 31 and the interface layer 30 covering the contacts are removed, the surface of the second non-conductive material of the conductive contact 201 and the conductive contact 202 is exposed, in the figure, The white block represents the original surface of the second non-conductive material. [0042] wherein the method of removing the insulating layer 31 and the interface layer 30 covering the conductive contact 201 and the conductive contact 20 2 may use a dry removal method, such as using a laser to simultaneously remove the insulating layer and the interface. Floor. Alternatively, a wet removal method may be used, for example, using an alkaline liquid or a stripping agent, & super, ultrasonic equipment, or electrolysis to remove the insulating layer, and then using an acidic liquid or a micro-etching agent to interface the layer. Remove. And if the laser stripping is used, the conductive contacts 201 and the conductive contacts 202 and the circuit portion 20 can be stripped together, and the conductive contacts 201 and the conductive contacts 202 have The conductive interface layer 30 is based on the principle that the circuit pattern portion 20 is not changed. [0043] Finally, please refer to FIG. 11, which is a schematic diagram of the first aspect of the second embodiment of the three-dimensional circuit component of the present invention. In step S17, the first bone 203 and the second bone 101 are removed from the base 10 to obtain a three-dimensional circuit component as shown in Fig. 5. Wherein, the first bone material and the second bone material are removed and separated from the base to avoid affecting the appearance of the three-dimensional circuit component and the pattern and function of the metal circuit thereon. [0044] In the removing step, in order to ensure that the first bone 203 having the interface layer 30 during the plating process is in contact with the circuit pattern portion 20, the part number A0101 is 13 pages/total 31 pages. The M395908 portion does not form a metal plating, resulting in a circuit pattern portion 20 that is adjacent to it during the removal step, and may have a different design at the junction of the first material bone 203 and the substrate 10. As shown in FIG. 9, in the first aspect of the completion step S15 of the second embodiment, the end of the first bone 203 and the base 10 is removed, and the removed end is not in direct contact with the circuit pattern portion. 20, while maintaining a distance, the distance is the position of the conductive contact 201, and the interface layer 30 of the conductive contact 201 is covered with the insulating layer 31, so that the first bone 203 and the circuit pattern portion 20 There is no metal plating generated during the electroplating process to ensure that the original material pattern 203 is removed without affecting the original circuit pattern design. The insulation covering the conductive contacts 201 can be seen from the figure. The layer 31 will also be slightly less than one: the #material bone 203 and the extension, so that when at least one of the first material is removed from the base 1 ,, it will not be at least one first bone 203 and The edges at which the conductive contacts 201 are joined leave a metal burr. [0045] Furthermore, as can be seen from FIG. 9, in this aspect, the second bone 101 formed by the first non-conductive material is coated on the first bone 203 and the base 10 Around the removal end, only the side where the first bone 203 and the conductive contact 201 meet are exposed to avoid the formation of a metal plating around the junction of the first bone 203 and the susceptor 10 during the electroplating process, resulting in removal of the first After the material bone 203 is on the pedestal, a metal layer burr remains on the susceptor 10, which affects the design of the three-dimensional circuit component. Here, the second bone material formed of the first non-conductive material does not form an interface layer covering the surface thereof during the electroless plating process of the step S13, so that it is ensured that the metal plating layer is not formed during the electroplating process. [0046] As described above, in the first aspect of each step flow in Embodiment 2, the first form number Α0101, page 14/31, M395908, the design of the connection mode of the bone 203 and the susceptor 10 can ensure When the first bone 203 is removed from the base 10, the circuit pattern 20 design of the original antenna is not affected, and the metal layer is not burred on the component base 10. [0047] Please refer to FIG. 12 to FIG. 13 , which are schematic diagrams of the three-dimensional circuit component of the third embodiment of the present invention, which are completed in step S15 and the three-dimensional circuit component of the second embodiment, in step S15. A schematic diagram of the second aspect. As can be seen from the figure, the second embodiment and the third embodiment have the same circuit pattern portion 20 design, the same conductive contact 201 arrangement and the same conductive contact 202 arrangement, and the fabrication of the three-dimensional circuit elements of the embodiments. The methods are as described above, and therefore will not be described in detail herein. [0048] It can be seen that the second embodiment of step 2 is completed in the second embodiment of step S15, the second aspect of step 2 is completed in embodiment 2, and the third embodiment is completed in step S1. The biggest difference is in the design of the connection of the first bone 203 and the susceptor 10. [0049] As shown in FIG. 12, in an aspect of Embodiment 3, the first material bone 203 produced by the component during the manufacturing process is designed such that the first material 203 is removed from the removal end of the susceptor 10 is closely connected. On the 20th part of the circuit pattern, it is necessary to carefully remove it when removing, so as not to damage the closely connected circuit pattern portion 20. In addition, in the same state of Embodiment 3, the periphery of the first bone 203 and the susceptor 10 is not covered with the first non-conductive material, so that the first bone 203 is removed from the susceptor 10. Thereafter, the metal layer burrs are easily left in the peripheral portion where the first material bone 203 is connected to the susceptor 10. The burrs of this metal layer are processed and removed according to their needs. [0050] As shown in FIG. 13, in the second aspect after the completion of step S15 in Embodiment 2, the form number A0101 page 15/31 page M395908, although the first bone 203 is not closely connected to the circuit pattern portion 20, And in the first aspect of the second embodiment, the conductive contact 201 is connected to the circuit pattern portion 20, but since the first material bone 203 and the susceptor 10 are adjacent to each other, there is no first non-conductive material. The coating is so that, when removed, the metal layer burrs are easily left in the peripheral portion where the susceptor 10 is connected. The burrs of this metal layer are processed and removed according to their needs. [0051] Referring to FIG. 14, which is the second embodiment of the three-dimensional circuit component of the present invention, after completing the second aspect of step S15, after removing the first bone 203 on the susceptor 10, on the susceptor 10. A schematic view of the residual metal layer burrs 2031, as seen in Fig. 14, shows that the metal layer burrs 20 31 remain around the junction of the first bone 203 and the susceptor 10. This metal layer of wool, need to be uncovered _.: request for processing and removal. • [0052] Please refer to FIG. 15 to FIG. 17 , which are respectively a first aspect schematic diagram and a second aspect schematic diagram and Embodiment 5 of the fourth embodiment of the three-dimensional circuit component of the present invention. A schematic diagram of a state of step S15 is completed. It can be observed from the figure that the biggest difference between the three is that the design of one of the first bone 203 and the '-> pedestal 10 is not inconsistent and its individual differences and effects have been compared to the above Comparative Example 2 The details of the first aspect, the second aspect, and the third embodiment of the step S15 are completed in detail, and the comparison is not described in detail herein. [0053] In addition, the maximum difference between the embodiment 3, the embodiment 5, and the stereo circuit elements of the embodiment 2 and the embodiment 3 is that in the embodiment 4 and the embodiment 5, two conductive contacts 201 are provided, and the conductive contacts are provided. The position set by 201 is disposed between the first bone 203 and the circuit pattern portion 20 as described above to connect the first bone 203 and the circuit pattern portion 20. And during the electroplating process, borrow form number A0101, page 16 of 31 M395908 [0054] [0055]
[0056] 由將電源負極以電極夹挾持在如圖所示，在和各導電接 點201相連的第一料骨203上，使和第一料骨203之間有 電導通性的電路圖樣部2 0於電鍍過程中，作為負極而析 鍍出預鍍金屬於電路圖樣部20上形成金屬線路。 其中，將多個導電接點201結合多個第一料骨203分布於 基座10之電路圖樣部20上，讓基座10上的電路圖樣部20 可以多點的方式和電源負極相連接，使電源端可以平均 分配在電路圖樣部20，以助於分散原本集中於靠近單一 導電接點的線路的兩電流’讓電鐘電流更平均的分散在 電路圖樣部20上，避免形成厚度不均勻之金屬鍍層。 請參閱第18圖，其係本創作之實施例6之立體電路元件於 完成步驟S15的一態樣示意圖。實施例5，為將本創作之 立體電路元件之製作方法應用於圓柱狀的立體電路元件 ，其中，實施例7的此態樣如第18圖所示，為在完成步驟 S15後，包含有非導電性基底40、電路圖樣部50、導電接 ,' ' ' 1 ' 點501及引電接點502。其中在導電捲點501及引電接點 502上，各覆蓋有一介面層30及絕緣層31，由於其形成及 製作方式如同前述之步驟，故於此不另重覆描述。 實施例7中圓柱狀的立體電路元件，其電路圖樣部50為纏 繞於圓柱狀體上的連續的螺旋線圈狀，並設置有兩個導 電接點501。各導電接點501分別位在圓柱體電路元件兩 端的第二料骨503上，用來連接第二料骨503及螺旋狀的 電路圖樣部50，以作為電鍍步驟時和電源負極相接的通 電點。如圖所示，將導電接點501分別設置在圓柱狀立體 電路元件的兩端，有助於讓電鍍電流平均的分配在.圓柱 表單編號A0101 第17頁/共31頁 狀立體電路元件上的電路圖樣部50上，讓電鍍電流不會 大部分集中在比較靠近任一導電接點501附近的線路上， 而造成電鍵生成的金屬層較厚，或在比較遠離任一導電 接點501附近的線路上，造成電鍍生成的金屬層較薄。因 此，如圖所示的導電接點501的設計，具有平衡電路圖樣 部之各線路的電鍍電流的效果，進而達到平衡金屬鍍層 厚度的目的。 [0057] 此外，如第18圖中所示，更可以藉由多個引電接點502的 設置，以縮小連續的螺旋線圈線路其各線圈之間的連接 路徑，達到於電鍛時縮小導電路徑的目的。藉由縮小導 電路徑讓電鍍電流能夠更均|的分布-樣上，以 避免造成電路圖樣部上的金疲層、厚k.H勻。 [0058] 當電鍍完成後，移除導電接點501及引電接點502上的絕 緣層和介面層，而圓柱體兩端呈現T字型的第二料骨503 及第二料骨401將會移除於圓柱體電路元件本體，而保留 原有電路圖樣及元件本體，各步驟已詳述如上，故於此 不另重覆描述。 ：! [0059] 以上所述僅為舉例性，而非為限制性者。任何未脫離本 創作之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 [0060] 第1圖其係本創作體電路之製作方法的步驟流程圖。 第2圖其係本創作電路元件之實施例1示意圖。 第3圖其係本創作之立體電路元件之實施例1於完成步驟 表單編號Α0101 第18頁/共31頁 S11及步驟S12的一態樣示意圖。 第4圖其係本創作之立體電路元件之實施例1於完成步驟 S11及步驟S12的另一態樣示意圖。 第5圖其係本創作之立體電路元件之實施例2示意圖》 第6圖其係本創作之立體電路元件之實施例2於完成步驟 S11及步驟S12的第1態樣示意圖。 第7圖其係本創作之立體電路元件之實施例2於完成步驟 S13的第1態樣示意圖。 第8圖其係本創作之立體電路元件之實施例2於完成步驟 S14的第1態樣示意圖》 第9圖其係本創作之立體電路元件之實施例2於完成步驟 S15的第1態樣示意圖。 . V rf-d ' 第10圖其係本創作之立體電路元件#乏實；ίϋ】2於完成步驟 S1 6的第1態樣示意圖。 第11圖其係本創作之立體電路元件之實施例2於完成步驟 S17的第1態樣示意圖。 第12圖其係本創作之立體電路乏實施铡3之立體電路元件 於完成步驟S15的態樣示意圖 第13圖其係本創作之立體電路元之實施例2於完成步驟 S15的第2態樣示意圖。 第14圖其係本創作之立體電路元件之實施例2於完成步驟 S15的第2態樣於移除第一料骨於基座後，在基座上殘留 金屬層毛邊的示意圖。 第15圖其係本創作之立體電路元件之實施例4於完成步驟 S15的第1態樣示意圖。 第16圖其係本創作之立體電路元件之實施例4於完成步驟 表單编號Α0101 第丨9頁/共31頁 M395908 S15的第2態樣示意圖。 第17圖其係本創作之立體電路元件之實施例5於完成步驟 S15的一態樣示意圖。 第18圖其係本創作之實施例6之立體電路元件於完成步驟 S15的一態樣示意圖。 【主要元件符號說明】 [0061] 10、40 :基座 101、401 :第二料骨 20 ' 50 :電路圖樣部 501、 201 :導電接點[0056] The circuit pattern portion having electrical continuity between the first material element 203 and the first material bone 203 is held by the electrode holder with the electrode holder as shown in the figure, on the first material bone 203 connected to each of the conductive contacts 201. In the electroplating process, a pre-plated metal is deposited as a negative electrode on the circuit pattern portion 20 to form a metal line. The plurality of conductive contacts 201 are combined with the plurality of first bones 203 on the circuit pattern portion 20 of the susceptor 10, so that the circuit pattern portion 20 on the susceptor 10 can be connected to the negative pole of the power source in a multi-point manner. The power supply terminal can be evenly distributed in the circuit pattern portion 20 to help disperse the two currents originally concentrated on the line close to the single conductive contact, so that the electric clock current is more evenly distributed on the circuit pattern portion 20, thereby avoiding uneven thickness formation. Metal plating. Referring to Fig. 18, it is a schematic diagram of a state in which the three-dimensional circuit component of the sixth embodiment of the present invention is completed in step S15. In the fifth embodiment, the method for fabricating the three-dimensional circuit component of the present invention is applied to a cylindrical three-dimensional circuit component. The aspect of the seventh embodiment is as shown in FIG. 18, and is included after the completion of step S15. The conductive substrate 40, the circuit pattern portion 50, the conductive connection, the '''1' point 501 and the galvanic contact 502. The conductive layer 501 and the conductive contact 502 are each covered with an interface layer 30 and an insulating layer 31. Since they are formed and fabricated in the same manner as the foregoing steps, they are not repeatedly described herein. In the cylindrical three-dimensional circuit element of the seventh embodiment, the circuit pattern portion 50 is formed in a continuous spiral coil shape wound around the cylindrical body, and two conductive contacts 501 are provided. Each of the conductive contacts 501 is respectively located on the second material bone 503 at both ends of the cylindrical circuit component for connecting the second material bone 503 and the spiral circuit pattern portion 50 to be connected to the negative pole of the power supply during the plating step. point. As shown in the figure, the conductive contacts 501 are respectively disposed at the two ends of the cylindrical three-dimensional circuit component, which helps to distribute the plating current evenly on the cylindrical form No. A0101, page 17 / total 31-page three-dimensional circuit components. On the circuit pattern portion 50, the plating current is not mostly concentrated on the line near the vicinity of any of the conductive contacts 501, and the metal layer generated by the key is thicker, or is relatively far from any of the conductive contacts 501. On the line, the metal layer generated by electroplating is thin. Therefore, the design of the conductive contact 501 as shown in the figure has the effect of balancing the plating current of each line of the circuit pattern portion, thereby achieving the purpose of balancing the thickness of the metal plating layer. [0057] In addition, as shown in FIG. 18, the connection paths between the coils of the continuous spiral coil circuit can be reduced by the arrangement of the plurality of the galvanic contacts 502, so as to reduce the conduction during the electric forging. The purpose of the path. By reducing the conduction path, the plating current can be more evenly distributed-like to avoid causing the gold layer and the thickness k.H on the circuit pattern. [0058] After the plating is completed, the insulating layer and the interface layer on the conductive contact 501 and the conductive contact 502 are removed, and the second material 503 and the second bone 401 having a T-shape at both ends of the cylinder are It will be removed from the body of the cylindrical circuit component, while retaining the original circuit pattern and the component body. The steps have been detailed above, so it will not be repeated. The above description is by way of example only and not as a limitation. Any equivalent modifications or changes made to the spirit and scope of this creation shall be included in the scope of the appended patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0060] Fig. 1 is a flow chart showing the steps of a method for fabricating a circuit of the present invention. Figure 2 is a schematic view of Embodiment 1 of the circuit component of the present invention. Fig. 3 is a schematic diagram of an embodiment 1 of the three-dimensional circuit component of the present invention. Form No. Α0101 Page 18 of 31 S11 and step S12. Fig. 4 is a schematic view showing another embodiment of the first embodiment of the three-dimensional circuit component of the present invention in which steps S11 and S12 are completed. Fig. 5 is a schematic view showing the second embodiment of the three-dimensional circuit component of the present invention. Fig. 6 is a schematic view showing the first aspect of the second embodiment of the three-dimensional circuit component of the present invention in the step S11 and the step S12. Fig. 7 is a schematic view showing the first aspect of the step S13 in the second embodiment of the three-dimensional circuit component of the present invention. Fig. 8 is a first perspective view of the second embodiment of the three-dimensional circuit component of the present invention, in which the second embodiment of the three-dimensional circuit component of the present invention is completed, and the first aspect of the step S15 is completed. schematic diagram. V rf-d ' Fig. 10 is a three-dimensional circuit component of the present invention #无实; ϋ 2 2 in the completion of the first aspect of the step S1 6 schematic. Fig. 11 is a schematic view showing the first aspect of the step S17 in the second embodiment of the three-dimensional circuit component of the present invention. FIG. 12 is a schematic diagram of the stereo circuit of the present invention in the third embodiment of the present invention. FIG. 13 is a schematic diagram of the third embodiment of the stereoscopic circuit element of the present invention, and the second aspect of the step S15 is completed. schematic diagram. Fig. 14 is a schematic view showing the second embodiment of the three-dimensional circuit component of the present invention after the second aspect of the step S15 is completed, after the first material bone is removed from the susceptor, and the metal layer burrs remain on the susceptor. Fig. 15 is a view showing a first aspect of the step S15 in the fourth embodiment of the three-dimensional circuit component of the present invention. Figure 16 is a fourth embodiment of the three-dimensional circuit component of the present invention. Form number Α0101 Page 9 of 31 M395908 S15 second aspect diagram. Fig. 17 is a schematic view showing an embodiment of the three-dimensional circuit component of the present invention in a step S15. Fig. 18 is a view showing a state in which the three-dimensional circuit component of the sixth embodiment of the present invention is completed in step S15. [Main component symbol description] [0061] 10, 40: pedestal 101, 401: second bone 20 ' 50 : circuit pattern portion 501, 201: conductive contact
502、 202 :引電接點 503、 203 :第一料骨 2031 :金屬層毛邊 3 0 :介面層 31 :絕緣層 S11~S17 :步驟502, 202: electric contact 503, 203: first bone 2031: metal layer burr 3 0: interface layer 31: insulating layer S11~S17: steps
表單編號A0101 第20頁/共31頁Form No. A0101 Page 20 of 31