4908 五、新型說明： 【新型所屬之技術領域】 本創作係提供一種可使定位治具與移料架作相對位移，以縮 ，移料架頂升電子元件之位移行程，進而生產效 件定位裝置。 【先前技術】 ，，現今，攜帶方便且可供儲存資料之記憶卡（Mem〇ry Cards) ' 概刀為 CF 卡（CompactFlash Card) ’ SD 記憶卡（Secure Digital Card) ’ MS 記憶卡（MemoryStick)，多媒體卡（MultiMediaCard)， • ^及SM記憶卡（SmartMedia Card)等數種，並依其使用功能而 廣泛1用於相容之電子產品中，例如數位相機、個人數位助理 (PDA)等；然而’記憶卡於完成製作後係經過多道如油墨壓印、雷 射打印或測試等各項加工作業，以油墨壓印作業而言，傳統之作 業^式係先製作-整片之記憶卡，然後再壓印所需之文字或圖形 於記憶卡之預設位置上，接著再進行切割的步驟，而將記憶卡分 割成所需之既定尺寸，惟此種方式在進行切割的步驟時，將會造 成記憶卡表面之文字或圖形的損傷，因此即有業者改變加工步 驟，先將記憶卡分割成所需之既定尺寸後，再進行油墨壓印作業， 此種加工步驟係需先將分割後之記憶卡排放於料盤（Tray)上， • 再以自動化設備將料盤（Tray)上之各記憶卡一一取置於壓印台 上壓印’完成後再移載回料盤（Tray)上，如此的作業方式亦將 造成來回移載時間上的過度耗費；為了有效改善前述的問題，更 - 有業者設計出於料盤上直接對記憶卡進行壓印作業，然而此一方 式必須先克服記憶卡定位之問題。 請參閱第1圖，目前使用之料盤（Tray) 1 〇其外框係為規 範之尺寸，其内則陣列開設有複數個穿孔1 〇 1，並於該料盤 1 0各穿孔1〇1之旁側凸設有限位框1〇 2，而使得料盤1〇 形成陣列之承置槽1〇 3，以供承置電子元件丄丄，然而由於電 子元件1 1與承置槽10 3間均具有相當大之間隙，因此如欲於 3 M394908 較佳之加卫精度。 子轉11任思移動’如此才能獲致 「广/^閱弟2 3、4圖’其係為台灣專利申請第9 「壓板上物立機構」新_ 2 2於預設位置處^板2 2，該定位壓板 而工作機台2 0於下下而上漸縮設計之導槽22 1 ’ 2 3上部設有數個具有吸嘴功===冓2 3 ’該升降機構 32 4進入升降機構2 3與定位壓板2 2 2 2之導槽2 2 1，由於42 °2 定蝴反 此可逐步導引頂記憶卡24對位^ 上，縮设計’因 頭（圖中未示）即可4於確實定位後，壓印 作業，於完成壓印作業後，推頂憶卡2 4進行麼印 並關閉吸嘴功能，即可將記恃卡1 ▼著記憶卡2 4下降 位屢板2 2係固設於工作機f置放回托盤2 1内，·惟該定 業時，僅定位作 移，而頂推記憶卡2 4進入於定位屢板/ 3 ^乍^向^升位 位，致使推頂元件2 3 i之頂升位之，2 2 1内定 憶卡f 4定位ί作業時間，造成降低生產ϋί之ί失而增加移載記 棼之電子元狀位裝置’即=者二^:間’以 上設^之件定位裝置，係於機台 導斜面之定位孔，用4;定:電; 4 M394908 有升降機構之移料架，該移料架之頂面相對4908 V. New description: [New technical field] This creation system provides a kind of displacement that can make the positioning fixture and the moving frame relative to each other, to reduce the displacement stroke of the electronic component of the loading frame, and then to produce the displacement of the effective component. Device. [Prior Art], nowadays, Mem〇ry Cards, which are easy to carry and can store data, 'The CompactFlash Card' is a Compact Card (Secure Digital Card) 'MS Memory Card (MemoryStick) , MultiMediaCard, • ^ and SM Memory Card (SmartMedia Card), etc., and widely used in compatible electronic products, such as digital cameras, personal digital assistants (PDAs), etc. However, after the completion of the production, the memory card is subjected to various processing operations such as ink embossing, laser printing or testing. In terms of ink embossing, the traditional operation is first made - the whole memory card And then imprinting the desired text or graphics on the predetermined position of the memory card, and then performing the cutting step, and dividing the memory card into a desired size, but in the manner of performing the cutting step, It will cause damage to the text or graphics on the surface of the memory card. Therefore, if the manufacturer changes the processing steps, the memory card is first divided into the required size, and then the ink imprinting operation is performed. The process steps are to first discharge the divided memory card onto the tray (Tray), and then use the automated device to place the memory cards on the tray (on the tray) on the stamping table. On the transfer tray (Tray), such operation will also cause excessive consumption of the transfer time; in order to effectively improve the aforementioned problems, more manufacturers have designed to imprint the memory card directly on the tray. Homework, however, this approach must first overcome the problem of memory card positioning. Please refer to Fig. 1. The tray (Tray) 1 currently used is the size of the specification, and the array is provided with a plurality of perforations 1 〇1, and each of the trays 10 is perforated 1〇1 A limiting frame 1〇2 is protruded from the side surface, so that the tray 1〇 forms an array of receiving grooves 1〇3 for receiving the electronic component 丄丄, however, due to the electronic component 11 and the receiving groove 10 3 Both have considerable gaps, so it is better to use 3 M394908 to improve the accuracy. Sub-turn 11 Ren Si Mobile 'so can get the "Guang / ^ reading brother 2 3, 4 map" is the Taiwan patent application 9 "pressing board on the body" new _ 2 2 at the preset position ^ board 2 2 , the positioning platen and the working machine 20 in the lower and upper tapered design guide groove 22 1 ' 2 3 upper part is provided with a nozzle function ===冓2 3 'the lifting mechanism 32 4 enters the lifting mechanism 2 3 and the positioning plate 2 2 2 2 guide groove 2 2 1, due to 42 °2 fixed butterfly, this can gradually guide the top memory card 24 alignment ^, shrink design 'in the head (not shown) 4 After the actual positioning, the embossing operation, after the completion of the embossing operation, push the top memory card to perform the printing and close the nozzle function, then the memory card 1 ▼ the memory card 2 4 drop position 2 The 2 series is fixed on the working machine f and placed back in the tray 2 1 . · In the case of the business, only the positioning is moved, and the push memory card 24 enters the positioning board / 3 ^ 乍 ^ ^ ^ position , causing the top of the ejector element 2 3 i to rise, 2 2 1 internal memory card f 4 positioning ί operation time, resulting in lowering the production ϋ ί ί ί ί ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ Two ^: between ^ Member positioning means is provided, the machine based on the positioning holes of the guiding face, with 4; reference: electric; 4 M394908 with a rack lift mechanism of shift, shifting the top surface of the rack opposite
Tf料件，用以頂升電子元件，當盛裝電子 移至疋位/口具與移料架間之預設作業位置時，定位治且魅 可分別利用二升降機構驅動作2軸向相 。斗二;.： 頂料件頂升料盤内之電子元件進入定位治具j各 T兀件3位孔之導斜面導引而準確定位於加工作業。使| 二可使疋絲具與移料架作補位移 ^ ^ 而迅速將電子元件準確定位，：= 具之掀件定μ置’該定位治 導斜面之定位:，另於;板^二複3具 k二;ίί=執行清潔、修護探針卡等作業，達到 【實施方式】 實施:2配:口=作有更進-步之瞭解，兹舉-較佳 具3 1係於底面設有升降機構’該升 ‘ =3 2，用以驅動定位治具3 J: 1可直接開設至少-具導斜面之定位孔 板，並於承板上開設至少一具導斜實二承 凹設有承置槽‘； Q 1 P：工—丁0丄4，6亥叙鍊3 1 3係用以樞 並跨置於定位治具31之承置槽川内，ίί;面位 5 M394908 治具31之下方，另於承板315上開設有至少一定位孔31 ’於本實施例中’該承板315上開設有複數個貫通頂、底面 定位孔316，各定位孔316具有呈斜錐狀之導斜面3 i 7之 又該定位裝置3 0係於機台4 0之上方設有一具升降機構之移料 架3 3 ’於本實施例中，該移料架3 3係於底面設有升降機構— 該升降機構於機台4 0之下方以機架3 4裝配有一為馬達3 5 ’ 驅動源，該馬達3 5以一為螺桿螺套組之傳動組；3 6驅動移 3 3作Z軸向位移，該移料架3 3之頂面係設有至少一 3 7，於本實施例中，該移料架3 3係於頂面相對應承杯= 各定位孔3 i 6之位置設有具吸嘴3 7 i之頂料件7，再^ 5 ，機台4 0另配置有輸送架5 0 ’該輸送架5 〇係位於定位户且 J1與移㈣3 3之間，用讀送_電子元件之料盤至預言= ί —裝配於機台4 〇上方之加工1置，該加工裝置可^ Γίί板315上裝配有_之^^ 〇， 位i針卡60之各探針61對位於承板315之定位孔3 i 6 係於之;數個容置槽η之料盤70， 裝待測之“元件8 並以各容置槽7 1盛 治具：3 !與移料架3 3間5 〇輸送至定位 7 2對位於移料_ 乍業位置’使料盤7 〇之各穿孔 測試作業時，3 7 ;請參閱则，於執行 具31及移料架3 3 升降機構分別驅動定位治 驅動作Z軸向向下位移，：二，疋位，3 1即由壓缸3 2 上，使得定位治且3 ]可册由^探針卡6 0係裝配於承板3 1 5 該移料架3 3則由馬卡6 0同步下降位移，此時， 移，使各頂料件3 7"士動組3 6而驅動作Z軸向向上位 以：料3 7二===7子。7 2巾，各頂料件 、、m上升時，其頂料件 、電子π件8 0，於移料架3 3繼 Ρ頂升待測之電子元件8 0脫離料盤 6 uo 2位=:=33==之定位孔316中，由 頂升待測電子元件8 對=移，而可縮減移料架3 3 進入於歧孔3 i 6内_ 使制之電子元件8 0迅速 閱第9圖，於定位治具3 ;及移=3 效能;請參 6之導斜面3 χ 7導引而定位於加工 具2定位孔3 1 件8 0定位後，該摸斜+ β n 乍業位置，於待測之電子元 8 0進行戦作冑.铁夫難^針6 1即可對待測之電子元件 位治具3 i =====猶_後，該定 3 3則由馬達3 5經傳3動 m向向上位移復位，移料架 測 H，各元件8。移載置人料盤7 ◦之容置槽 5 0妗出餘i 7再退出料盤7 Q之穿孔72，使輸送架 電件80之料盤70 ;請參閱第11圖， ;且ί Ϊ、修護探針卡6 Q之探針61時，係可開啟定 二^ η 1i之疋位件314，並將承板315向上掀啟，使探 針6 1位於粒治具3 1之上方，以供工作人員? 便利，订>以、修護作業，達到提升使用便利性之實用效益。 本創作定位裝置可縮短頂升電子元件之作業時間，而 k尚生產效能’以及可提升清潔修護作業之便利性’實為一深且 實用严及進步性之設計，絲見有相同之產品及.公開，從^ 允符新型專利申請要件，爰依法提出申請。 【圖式簡單說明】 第1圖：料盤承置電子元件之示意圖。 第2圖：台灣專利申請第95204953號專利案之立體示意圖。 第3圖··台灣專利申請第95204953號專利案之動作示意圖（一）。 第4圖：台灣專利申請第95204953號專利案之動作示意圖（二）。 第5圖：本創作配置於機台上之示意圖。 第6圖：本創作定位裝置之示意圖。 本創作定位裝置之使用示意圖（一）。 本創作定位裝置之使用示意圖（二）。 本創作定位裝置之使用示意圖（三）。 fi〇圖：本創作定位裝置之使用示意圖（四） 第11圖：本創作定位裝置之使用示意圖（五）The Tf material is used to lift the electronic component. When the electronic device is moved to the preset working position between the clamp/porture and the transfer rack, the positioning and the charm can be respectively driven by the two lifting mechanisms as the two axial phases.斗二;.: The electronic components in the top lifting plate of the top material are guided into the positioning jig of each of the three-position holes of the T-piece, and are accurately positioned in the processing operation. The second can make the electronic component accurately position the 疋 具 与 移 移 移 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 3 sets of k 2; ίί=Perform cleaning, repairing probe card, etc., to achieve [Embodiment] Implementation: 2: Port: For more advanced steps, it is better to use 3 1 The bottom surface is provided with a lifting mechanism 'this rising' = 3 2, which is used to drive the positioning fixture 3 J: 1 to directly open at least a positioning hole plate with a guiding bevel, and to open at least one guiding oblique two bearing on the bearing plate The recess is provided with a receiving groove'; Q 1 P: Gong-Ding 0丄4, 6 Haixu chain 3 1 3 is used to pivot and straddle the positioning groove of the positioning fixture 31, ίί; face position 5 M394908 In the present embodiment, at least one positioning hole 31 ′ is formed in the receiving plate 315. In the embodiment, the plurality of through-top and bottom positioning holes 316 are formed on the receiving plate 315, and each positioning hole 316 has a slope. In the present embodiment, the shifting frame 3 3 is attached to the bottom surface of the tapered guiding surface 3 i 7 and the positioning device 30 is disposed above the machine 40 . There is a lifting mechanism - the lifting mechanism is mounted below the machine 40 with a frame 3 4 as a driving source for the motor 3 5 ', the motor 35 is a transmission group of a screw threaded set; 3 6 is driven to move 3 3 For the Z-axis displacement, the top surface of the loading rack 3 3 is provided with at least one 3 7 . In the embodiment, the loading rack 3 3 is attached to the top surface corresponding to the receiving cup = each positioning hole 3 i 6 The position is provided with a top piece 7 with a nozzle 3 7 i, and then the machine table 40 is further provided with a transport frame 50. The transport frame 5 is located between the positioning household and the J1 and the moving (four) 3 3 Read _Electronic component tray to prophecy = ί —Assembled on the top of the machine 4 加工1, the processing device can be equipped with _^^ 〇 on the board 315, the position of the needle card 60 The needle 61 is attached to the positioning hole 3 i 6 of the receiving plate 315; the tray 70 of the plurality of receiving grooves η is mounted with the component 8 to be tested and the holding groove 7 1 is used to support the fixture: 3! The racks 3 3 5 〇 are transported to the positioning 7 2 pairs in the shifting _ 位置 位置 position 'to make the tray 7 〇 each perforation test operation, 3 7; see, in the implementation of the 31 and the shifting rack 3 3 Lifting mechanism drives the positioning drive For the Z-axis downward displacement, two: 疋 position, 3 1 is from the pressure cylinder 3 2, so that the positioning process and 3] can be booked by the ^ probe card 60 system is assembled on the carrier plate 3 1 5 The frame 3 3 is synchronously descended by the Maca 60, and at this time, the top member 3 7 " the swaying group 3 6 is driven to the Z-axis upward position to: 3 7 ==== 7 7 2 towel, each top material, when m rises, its top material, electronic π piece 80, in the material transfer frame 3 3 after the top rises the electronic component to be tested 80 off the tray 6 uo 2 position In the positioning hole 316 of =:=33==, the electronic component 8 to be tested is lifted by the jacking, and the shifting carriage 3 3 is entered into the recess 3 i 6 to make the electronic component 80 quickly read. Figure 9, in the positioning fixture 3; and shift = 3 performance; please refer to the guide bevel 3 χ 7 guide and position the tool 2 positioning hole 3 1 piece 80 positioning, the touch + β n 乍The position of the industry, in the electronic unit to be tested 80 to perform 胄 胄. Tiefu difficult ^ pin 6 1 can be measured electronic component fixture 3 i ===== _ _, the third 3 The motor 3 5 is displaced by an upward movement of 3 m, and the moving frame is measured by H, and each element 8 is measured. Transfer the loading tray 7 容 容 槽 妗 妗 i i i i i i i i i i i i i i i i Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q 穿孔 穿孔When the probe 61 of the probe card 6 Q is repaired, the clamp 314 of the fixed 2 η 1i can be opened, and the support plate 315 is opened upward, so that the probe 6 1 is located above the granular fixture 3 1 . For the staff? Convenience, ordering, repairing, and achieving practical benefits of improving the convenience of use. The creation positioning device can shorten the working time of the jacking electronic components, and the k-production performance 'and the convenience of improving the cleaning and repairing work' is a deep and practical and progressive design, and the same product is seen. And. Open, from ^ to meet the requirements of new patent applications, 提出 apply in accordance with the law. [Simple description of the diagram] Figure 1: Schematic diagram of the tray holding electronic components. Fig. 2 is a perspective view showing the patent application of Taiwan Patent Application No. 95204953. Fig. 3 is a schematic view showing the operation of the patent application No. 95204953 of Taiwan Patent (1). Figure 4: Schematic diagram of the action of the patent application No. 95204953 of Taiwan Patent (2). Figure 5: Schematic diagram of the creation of the creation on the machine. Figure 6: Schematic diagram of the creation positioning device. The schematic diagram of the use of the creation positioning device (1). The schematic diagram of the use of the creation positioning device (2). Schematic diagram of the use of the creation positioning device (3). Fi〇 diagram: the use of the creation of the positioning device (4) Figure 11: the use of the creation of the positioning device (5)
穿孔：101 承置槽：1〇 3 托盤：2 1 導槽：2 2 1 推頂元件：2 31Perforation: 101 Supporting groove: 1〇 3 Tray: 2 1 Guide groove: 2 2 1 Pushing element: 2 31
第7圖 第8圖 第9圖 【主要元件符號說明】 〔習式〕 料盤：1 〇 限位框：1〇 2 工作機台：2 0 定位壓板：2 2 升降機構：2 3 記憶卡：2 4 〔本創作〕 定位裝置：3 0 承置槽：311 鉸鍊：313 承板：315 導斜面：317 移料架：3 3 馬達：3 5 頂料件：3 7 機台：4 0 輸送架：5 0 探針卡：6 0 料盤·· 7 0 穿孔：7 2 電子元件：8 0 定位治具：31 通孔：312 定位件：314 $位孔：316 壓虹：3 2 機架：3 4 傳動組：3 6 吸嘴：3 7 1 探針：6 1 容置槽：71 8Fig. 7 Fig. 8 Fig. 9 [Explanation of main component symbols] [Literature] Tray: 1 〇 Limiting frame: 1〇2 Working machine: 2 0 Positioning platen: 2 2 Lifting mechanism: 2 3 Memory card: 2 4 [This creation] Positioning device: 3 0 Supporting groove: 311 Hinge: 313 Carrier plate: 315 Guide bevel: 317 Transfer bin: 3 3 Motor: 3 5 Top piece: 3 7 Machine: 4 0 Conveyor :5 0 Probe card: 6 0 tray ·· 7 0 Perforation: 7 2 Electronic components: 8 0 Positioning fixture: 31 Through hole: 312 Positioning member: 314 $ Position hole: 316 Pressure rainbow: 3 2 Rack: 3 4 Drive set: 3 6 Nozzle: 3 7 1 Probe: 6 1 accommodating groove: 71 8