M394575 五、新型說明： 【新型所屬之技術領域】 種支木改良結構，尤其係指一種藉由埋入於膠座中的第一 增強部以及第二增強部，達到增強支架與膠座間的固定力，防止 水氣進一步滲入以及提高散熱效率的發光二極體支架改良結構。 【先前技術】 近年來’由於發光一極體（LightEmitting Diode，LED)具有 耗電量低、元件壽命長、無須暖燈時間及反應速度快等優點，加 上其體積小、耐震動、適合量產，因此發光二極體已普遍使用於 資訊、通訊及消費性電子產品的指示燈與顯示裝置上，如行動電 話及個人數位助理（Personal Digital Assistant ’ PDA)螢幕背光源、 各種戶外顯示器、交通號誌燈及車燈等。 通常發光二極體晶片係透過表面黏貼技術（Surface MmmtM394575 V. New description: [New technical field] The improved structure of the branch, especially the first reinforcement and the second reinforcement embedded in the rubber seat, to achieve the fixation between the reinforcement bracket and the rubber seat Improved structure of light-emitting diode support to prevent further infiltration of moisture and improve heat dissipation efficiency. [Prior Art] In recent years, LightEmitting Diode (LED) has the advantages of low power consumption, long component life, no need for warm-up time and fast response speed, plus its small size, vibration resistance and suitable amount. Production, so LEDs have been commonly used in information and communication and consumer electronics indicators and display devices, such as mobile phones and personal digital assistants (PDA) screen backlights, a variety of outdoor displays, traffic Signs and lights, etc. Usually the LED chip is transmissive through surface mount technology (Surface Mmmt)
Device ’ SMD)或是覆晶接合技術（flip chip bonding)固接於具 有凹陷部之膠座内的支架上，請參考「第丨圖」所示，「第丨圖」 繪示為習知的發光二極體支架結構的發光二極體晶片配置侧視剖 面示意圖。 在具有凹陷部72的膠座71中，埋入有至少二支架73，各支 架73部分是分別暴露在膠座71的凹陷部72内，並且各個支架73 部分分別延伸出膠座71的兩側，即可形成電性連接部74,藉由電 性連接部74以便於與其他電子裝置（圖式中未繪示）電性連接。 接著，再透過表面黏貼技術將發光二極體晶片75固接於暴露 在膠座71的凹陷部72内支架73其中之一，以及透過打線接合技 術或是覆晶接合技術使發光二極體晶片75可以透過電性導、線％ 3 M394575 與另一支架73形成電性連接’最後’再於膠座71的凹陷部72上 形成封裝膠體77，封裝膠體77即可以覆蓋於凹陷部72内的發光 二極體晶片75及支架73。 習知的發光二極體支架結構僅為將支架73埋入於膠座71 中，透過支架73與膠座71彼此之間的阻力，來將支架73進行固、 定’但是由於支架73與膠座71彼此之間的阻力會有一定的極限，- 在遇到外力的影響時’當外力大於支架73與膠座71彼此之間的· 阻力，即會造成支架73脫落於膠座71。 另外，習知的發光二極體支架結構在用於具有水氣的環境籲 時，水氣會逐漸的滲入於膠座71中，並無特殊的設計以防止水氣 的進一步滲入，當水氣滲入進一步至膠座71的凹陷部72時，水 氣則會對發光二極體晶片75造成影響，會使得發光二極體晶片75 發光效率下降，甚至會造成發光二極體晶片75的損壞。 . 另外，習知的發光二極體支架結構在發光二極體晶片75的散> 熱上，僅能透過延伸支架73部分分別延伸出膠座71的部分進行 散熱，這種散熱效率是比較差的，並無法適用於高功率的發光二 極體晶片75,勢必需要對習知的發光二極體支架結構進行改良，鲁 猎以改善散熱的問題。 綜上所述，可知先前技術中長期以來一直存在現有的發光二 極體支架結構支架與力不足，無法防止水氣進—步渗^ 入，以及散熱效率不__，因此有必要提纽進的技術手段1 來解決此一問題。 【新型内容】 有赛於先赫術存在财的發光二極體支縣構支架與膠座 4 M394575 題，本=遂進-步滲入，以及散熱效率不佳的問 0種矣忐二極體支架改良結構，其t: 至少二 '作所縣之發光二極體絲 支架以及膠座。 外古笛-別具有埋人部以及延伸部，埋人部的底面周圍 凹設凹陷二广Γ，埋入部設有第二增強部’·自膠座的上表面 口又曰口’里入部是被埋人於朦座内，且第一增強部以及Device ' SMD ) or flip chip bonding is fixed to the bracket in the rubber seat with the recessed part. Please refer to the “Figure ” for illustration. A side view of a light emitting diode arrangement of a light emitting diode support structure. In the rubber seat 71 having the recessed portion 72, at least two brackets 73 are embedded, and the portions of the brackets 73 are respectively exposed in the recessed portions 72 of the rubber seat 71, and the respective brackets 73 are respectively extended from both sides of the rubber seat 71. The electrical connection portion 74 is formed by the electrical connection portion 74 to facilitate electrical connection with other electronic devices (not shown). Then, the LED wafer 75 is fixed to one of the brackets 73 exposed in the recess 72 of the rubber seat 71 by a surface bonding technique, and the LED chip is bonded by a wire bonding technique or a flip chip bonding technique. 75 can be electrically connected to another bracket 73 through the electrical conductor, the wire % 3 M394575, and finally, the encapsulant 77 can be formed on the recess 72 of the rubber seat 71, and the encapsulant 77 can cover the recess 72. Light-emitting diode wafer 75 and bracket 73. The conventional light-emitting diode support structure only buryes the bracket 73 in the rubber seat 71, and the bracket 73 is fixed and fixed by the resistance between the bracket 73 and the rubber seat 71. However, due to the bracket 73 and the glue The resistance of the seats 71 to each other has a certain limit, and when the external force is affected, the external force is greater than the resistance between the bracket 73 and the rubber seat 71, which causes the bracket 73 to fall off the rubber seat 71. In addition, the conventional light-emitting diode support structure is used for the environment with water vapor, the moisture will gradually penetrate into the rubber seat 71, and there is no special design to prevent further infiltration of moisture, when the water vapor When infiltrating further into the recessed portion 72 of the rubber seat 71, the moisture affects the light-emitting diode wafer 75, which causes the luminous efficiency of the light-emitting diode wafer 75 to be lowered, and may even cause damage to the light-emitting diode wafer 75. In addition, the conventional light-emitting diode support structure can dissipate heat only from the portion of the extension bracket 73 that extends out of the plastic holder 71 in the heat dissipation of the LED substrate 75. This heat dissipation efficiency is compared. Poor, and can not be applied to the high-power LED chip 75, it is necessary to improve the structure of the conventional LED package to improve heat dissipation. In summary, it can be seen that in the prior art, there has been a long-standing existing light-emitting diode support structure bracket with insufficient force, which cannot prevent moisture from entering and infiltrating, and the heat dissipation efficiency is not __, so it is necessary to The technical means 1 to solve this problem. [New content] There is a flashlight diode in the game, and there are 4 M394575 questions, such as the intrusion, the infiltration, and the poor heat dissipation efficiency. The improved structure of the bracket, the t: at least two's as the light-emitting diode wire bracket and the rubber seat of the county. The outer flute-there is a buried part and an extension part. The bottom of the buried part is recessed with a wide sag, and the second part of the burial part is provided with a second reinforced part. Buried in the squat, and the first reinforcement and
增強部與膠座形成_，埋人部_面部分暴露於凹陷部，以 P的底面心暴路於膠座的下表面，延伸部延伸於膠座之外以形 成電性連接部。 〃 如上所述之發光二極體支架改良結構，其中第—增強部凹設 於埋入部的底面周圍’且第二增強部凸設或凹設於埋入部，第二 增強部的形狀為V形形狀、凹形形狀或半圓形形狀其中之一的形 狀在第一增強部轉角處形成虹吸現象，藉以將水氣聚集二 增強部轉角處。 一 '一 如上所述之發^二極體支架改良結構，其中部分暴露於凹陷 部的埋入部頂面其中之—用以固定發光二極體晶片，並且發光二 極體晶片與另一部分暴露於凹陷部的埋入部頂面形成電性連接， 凹陷部更錢有封裝賴，用以包光二極體晶片，藉以形成 SMD發光二極體。 本創作所揭露之結構如上，與先前技術之間的差異在於本創 作支架分別具有埋入部以及延伸部，埋入部的底面周圍設有第— 增強部，以及埋入部設有第二增強部，透過將埋入於膠座中的第 一增強部以及第二增強部，用以將支架與膠座增加更強的阻力， 5 M394575 亚且第二增強部可以藉由虹吸現象將水氣聚集，以防止水氣進一 步參入，且埋人部的底面部分暴露_觸下表面，藉以提高對 發光二極體晶片的散熱效率，即可以有效的解決先前技術所產生 的問題。 —透過上述的技術手段，賴作可以達成·支賴膠座間的 固疋力’防止水氣進—步滲人以及提高散熱效率的技術功效。 【實施方式】 以下將配合圖式及實補料細綱本創作之實施方式，藉 ^對本創作如何朗麟手縣解決技術問職達成技術功效的 只現過程能充分理解並據以實施。 以了將說明本創作所揭露之發光二極體支架改諸構，並請 赵第2A圖」所不’「第2A圖」緣示為本創作發光二極體支 槿=結構的第-側視剖面示意圖本創作發光二極體支架改良結 構包含有：至少二支架10以及膠座20。 首先，在金屬板（圖中未繪示）上以沖壓（s’％)方式製 並2二支架⑴’每—支架1G均具有埋人部U以及延伸部12， 周圍沖壓形成凹設的第底面m的 η._β 町^⑽，以及在埋入部1U中壓形成 ^又或疋凹設的第二增強部出，圖式中在埋人部u沖壓 P第二增強部m是呈現出凸起的倒凹形形狀，圖式所^現的 、、-。果僅為舉例說明，並不以此侷限本創作的應用範缚。 倍久f Ϊ ’以埋入射出GnSert⑽㈣）的方式形成膠座20，以 吟架1〇的埋入部11被埋於膠座20内，埋入部U的第一 曰。Ml2以及第二增強部113亦被埋入於膠座20内。而且，自 6 M394575 膠座20的上表面21凹設凹陷部22，埋入部n的頂面叫部分暴 路於凹陷部22，而埋入部u的底面U1暴露於膠座的下表面 23 ’延伸部12延伸於膠座2G之外以形成電性連接部。 纟於埋人部11的第—增強部112以及第二増強部113被埋入 於膠座20 Θ ’藉此即可以使埋入部^的第一增強部以及第 -增強部113與膠座2〇形朗接，即支架1()會藉由埋人部u的 第-增強部112以及第二增強部113與膠座2〇所形成的阻力藉 以避免外力所造成支架10脫落於膠座2〇。 鲁 埋入於勝座20内的第二增強部113除了可以增加支架1〇與 膠座20之間的阻力，藉以避免外力所造成支架1〇脫落於膠座％ 的效果之外’藉由沖壓卿成的第二增強部113更可明加水氣 的行進路徑，以增加水氣所滲入至膠座20凹陷部22的時間，即 可以延長购配置於膠座2Q之凹陷部22内的發光二極體晶片的 使用壽命。 並且更可以在第二增強部113的轉折處形成虹吸現象，由於 φ 產生虹吸現象即可以將水氣聚集於第二增強部113的轉折處，即 可藉由在埋入部11所設置的第二增強部113聚集水氣，可以使得 水氣難以進一步滲入至膠座20的凹陷部22,可以有效的防止後續 ‘ 配置於膠座20之凹陷部22内的發光二極體晶片受到水氣的影響。 接著’請同時配合「第2A圖」以及「第2B圖」所示，「第 2B圖」繪示為本創作發光二極體支架改良結構的第二側視剖面示 意圖；在「第2A圖」是以橫跨整個發光二極體支架改良結構的剖 面線對發光二極體支架改良結構進行剖視，而在「第2B圖」是以 縱向的剖面線對發光二極體支架改良結構進行剖視。 7 MJ94575 在「第2A圖」以及「第2B圖」中埋入部u底面川的周 園沖壓形成凹設的第-增強部112僅為環繞於埋人部u底面⑴ ,的三個側邊’在此僅為舉鑛明之，並从此侷限本創作的應用 範嘴。 〜 接著，請參考「第2C圖」所示，「第2C圖」緣示為本創作 發光二極體支架改良結構的仰視示意圖；在埋人部u的底面⑴ 暴露於膠座20的下絲23，觀可以增加支㈣與外部接觸的 面積’由於增加支$ 10與外部接觸的面積即可有效的增加後續配 置於膠座20之凹陷部22 β的發光二極體晶片的散熱效率之用。 接著，請同時配合「第2Α圖」以及「第2C圖」所示，而延 伸部12延伸於膠座20之外以形成電性連接部，是用以便於與其 他電子裝置（圖式中未繪示）電性連接，即後續配置於膠座2〇之 凹IW22内的發光二極體晶片即是透過支架1〇延伸出膠座加之 電性連接部而與其他電子裝置電性連接。 上述之金屬板可以是銅、鐵或其他導電性佳以及散熱性佳的 金屬板或合金板。也就是說，歧1G的㈣可以是銅、鐵或其他 導電性佳散熱性佳的金屬或合金。此外，膠座Μ的材質則可以是 聚石厌酸醋（PGlyearbGnate，PC )、聚鄰苯二甲祕（Pdyphthalamide， PPA)或其他常用來料SMD發光二極體支架結構之膠座的熱塑 性树月曰，在此僅為舉例說明支架1〇以及膠座2〇的常用材質，並 不以此侷限本創作的應用範_。 接著，请參考「第3A圖」、「第3B圖」以及「第3C圖」所 不’「第3A圖」至「第3C圖」繪示為本創作發光二極體支架改 良結構的第二增強部實施態樣側視放大示意圖。 M394575 在埋入部11所沖壓形成凸設的第二增強部113，第二增強部 Π3的形狀除了為凸起的倒凹形形狀（如「第3A圖」所示）之外， 更可以在埋入部11沖壓形成倒V形形狀（如「第3B圖」所示） 或是沖壓形成凸起半圓形形狀（如「第3C圖」所示）。 . 值得注意的是’在埋入部11所沖壓形成的第二增強部113亦 可沖壓形成凹陷設置，即將上述的「第3A圖」、「第3B圖」以及 「第3C圖」旋轉18〇度，即第二增強部113呈現出沖壓形成凹陷 β又置的增第二增強部113，可以分別形成凹形形狀、v形形狀或是 • 凹陷半圓形形狀。 接著’請參考「第4圖」所示，「第4圖」緣示為本創作發光 -極體支架改良結構的g己置發光二極體晶片側視剖面示意圖；當 完成上述發光二極體支架改良結構的製成之後，即可以透過表面 •黏貼技術（Surface Mount Device，SMD)將發光二極體晶片3〇 固接於部分暴露於凹陷部22的埋入部n頂面114其中之一並 域過打線接合技術（wire bGnding)或晶接合技術（flip c邮 • ^ndmg)與另—部分暴露於凹陷部22的埋入部11頂面m形成 電性連接，圖面所綠示為採用打線接合技術（在此僅為舉例說明， 並砂此侷限本發日㈣制範㈤方式將發光二極體；3〇透過 ^電性導線51與另—埋入部11頂面114形成電性連接，即發光二 極體晶片3〇可分別透過支架1〇獲得不同的電性極性並透過支 木10延伸出膠座20之電性連接部而與其他電子裝置電性連接。 _最後請參考「第5圖」所示，「第5圖」繪示為本發明發光 -極體支架改良結構軸置封裝膠體佩剖面示意圖；於膠座⑴ 的凹陷部11场成封轉體4〇，封裝雜4〇即可吨覆凹陷部 9 M394575 内的lx光一極體a曰片30以及支架10的埋入部11，即可以形成 SMD發光二極體。 上述封裝膠體40可以透過點膠（dispensing)的方式形成， 在此僅為舉例說明’並不以此侷限本發明的應用範缚，且封裝膠 體40中可摻有營光粉（圖式中未緣示），因此當發光二極體晶片- 7所發出的光線照射到縣粉而使其激發出另—種顏色的可見光· 時’發光二極體晶片40所發出的光線即可與榮光粉所激發出來的 光線混合而產生混光效果。 紅上所述，可知本創作與先前技術之間的差異在於本創作支鲁 架分別具有埋人部以及延伸部’埋人部的底面關設有第一增強 部’以及埋入部設有第二增強部’透過將埋入於膠座中的第一增 強部以及第二增強部’用以將支架與膠座增加更強的阻力並且 第二增強部可以藉由虹吸現象將水氣聚集，以防止水氣進一步滲 入’且埋人部的底面部分暴露_座的下表面藉以提高對發光. 二極體“的散熱效率’即可以有效的解決先前技術所產生齡 題。 藉由此-技術手段可絲麟先魏術所存在現有秘光二籲 極體支架結構支架與勝座固定力不足，無法防止水氣進一步渗 入，以及散熱效率不㈣問題，_達成增強支架與膠的固 定力’防止水氣進-步滲入以及提高散熱效率的技術功效。 ^ 雖然本創作所揭露之實施方式如上，惟所述之内容並非用以 直接限定本創作之專利保護範圍。任何本創作所屬技術領域中具 有通常知識者，在不脫離本創作所揭露之精神和範圍的前提下 可以在實蘭形式上及細節上作些許之更動。本創作之專利保護The reinforcing portion is formed with the rubber seat, and the buried portion is exposed to the concave portion, and the bottom surface of the P is violently exposed to the lower surface of the rubber seat, and the extending portion extends outside the rubber seat to form an electrical connection portion.改良 The improved structure of the light-emitting diode support as described above, wherein the first reinforcing portion is recessed around the bottom surface of the embedded portion and the second reinforcing portion is convexly or concavely disposed in the embedded portion, and the shape of the second reinforcing portion is V-shaped The shape of one of the shape, the concave shape, or the semicircular shape forms a siphon phenomenon at the corner of the first reinforcement portion, thereby collecting moisture at the corners of the two reinforcement portions. A modified structure of a diode support as described above, wherein a portion of the top surface of the buried portion of the recess is partially exposed to fix the light emitting diode wafer, and the light emitting diode wafer is exposed to another portion The top surface of the buried portion of the recessed portion is electrically connected, and the recessed portion is further provided with a package for encapsulating the diode chip to form an SMD light emitting diode. The structure disclosed in the present application is as above, and the difference from the prior art is that the creation bracket has a buried portion and an extension portion respectively, a first reinforcement portion is provided around the bottom surface of the buried portion, and a second reinforcement portion is provided through the buried portion. The first reinforcement portion and the second reinforcement portion buried in the rubber seat are used to increase the resistance between the bracket and the rubber seat, and the second reinforcement portion can collect water and moisture by siphon phenomenon. The water vapor is further prevented from entering, and the bottom surface portion of the buried portion is exposed to the touch surface, thereby improving the heat dissipation efficiency of the light emitting diode chip, that is, the problem generated by the prior art can be effectively solved. - Through the above-mentioned technical means, the work can be achieved by relying on the solidity between the rubber seats to prevent the ingress of water and gas, and to improve the efficiency of heat dissipation. [Embodiment] The following is the implementation of the graphic and real-replenishment details, and the implementation process of how to create a technical effect by Langlin County can be fully understood and implemented. In order to explain the light-emitting diode brackets disclosed in this work, please refer to Zhao 2A, "No", "2A", and the origin of the light-emitting diode support = the first side of the structure The schematic structure of the present invention comprises: at least two brackets 10 and a rubber seat 20. Firstly, the metal plate (not shown) is made by stamping (s'%) and the two brackets (1)' each bracket 1G has a buried portion U and an extension portion 12, and the periphery is stamped to form a recessed portion. Η._β machi (10) of the bottom surface m, and a second reinforcement portion formed in the buried portion 1U to form a second or a concave portion, in the figure, the second reinforcement portion m is formed in the buried portion u. The inverted concave shape, the pattern, and -. This is for illustrative purposes only and is not intended to limit the application of this creation. The rubber seat 20 is formed in such a manner that the GnSert (10) (4) is buried, and the embedded portion 11 of the truss 1 is buried in the rubber seat 20 to embed the first turn of the portion U. Ml2 and the second reinforcing portion 113 are also buried in the rubber seat 20. Moreover, the recessed portion 22 is recessed from the upper surface 21 of the 6 M394575 rubber seat 20, and the top surface of the buried portion n is called a portion of the recessed portion 22, and the bottom surface U1 of the buried portion u is exposed to the lower surface 23' of the rubber seat. The portion 12 extends beyond the rubber seat 2G to form an electrical connection. The first reinforcing portion 112 and the second reinforcing portion 113 of the embedded portion 11 are embedded in the rubber seat 20 Θ ', whereby the first reinforcing portion and the first reinforcing portion 113 and the rubber seat 2 of the embedded portion can be made The bracket 1 is detached from the rubber seat 2 by the resistance formed by the first reinforcing portion 112 and the second reinforcing portion 113 of the buried portion u and the rubber seat 2 借 to avoid external force. Hey. The second reinforcing portion 113 embedded in the stalwart 20 can increase the resistance between the bracket 1 〇 and the rubber seat 20, so as to avoid the external force causing the bracket 1 〇 to fall off the effect of the plastic seat. The second reinforcing portion 113 of the qingcheng can further increase the traveling path of the water gas to increase the time when the moisture penetrates into the depressed portion 22 of the rubber seat 20, that is, the light illuminating in the concave portion 22 of the rubber seat 2Q can be extended. The life of a polar body wafer. Moreover, a siphon phenomenon can be formed at the turning point of the second reinforcing portion 113, and the water vapor can be collected at the turning point of the second reinforcing portion 113 due to the siphon phenomenon of φ, that is, the second portion set in the embedding portion 11 The concentrating portion 113 collects moisture, so that it is difficult for the moisture to further penetrate into the recess 22 of the rubber seat 20, which can effectively prevent the subsequent illuminating diode chip disposed in the recess 22 of the rubber seat 20 from being affected by moisture. . Then, please refer to the "2A" and "2B" diagrams, and the "2B" diagram shows the second side cross-sectional view of the improved structure of the light-emitting diode support; in Figure 2A The improved structure of the light-emitting diode support is sectioned by a cross-section line that improves the structure of the entire light-emitting diode support, and in FIG. 2B, the improved structure of the light-emitting diode support is cut in a longitudinal section line. Vision. 7 MJ94575 In the "2A" and "2B", the first-enhanced portion 112 in which the recessed portion is formed by the circumferential surface of the buried surface is only the three sides of the bottom surface (1) of the buried portion u. Here is just a matter of mine, and from this limit the application of this creation. ~ Next, please refer to "2C", "2C" is the bottom view of the improved structure of the creative light-emitting diode support; the bottom surface of the buried part u (1) is exposed to the lower wire of the plastic seat 20 23, the view can increase the branch (4) the area of contact with the outside. By increasing the area of the outer contact of $10, the heat dissipation efficiency of the light-emitting diode wafer which is subsequently disposed in the recess 22 of the rubber seat 20 can be effectively increased. . Next, please cooperate with the "2nd drawing" and "2C", and the extension 12 extends beyond the rubber seat 20 to form an electrical connection portion for facilitating connection with other electronic devices (not shown) An electrical connection, that is, a light-emitting diode chip that is subsequently disposed in the recess IW22 of the plastic seat 2 is electrically connected to other electronic devices through the bracket 1 and extending out of the rubber seat and the electrical connection portion. The above metal plate may be copper, iron or other metal plate or alloy plate which is excellent in electrical conductivity and heat dissipation. That is to say, (4) of the 1G may be copper, iron or other metal or alloy having good conductivity and good heat dissipation. In addition, the material of the rubber seat can be a thermoplastic tree of PGlyearbGnate (PC), Pdyphthalamide (PPA) or other commonly used SMD light-emitting diode structure. Lunar New Year, here is only a common example of the common material of the bracket 1〇 and the plastic seat 2〇, and is not limited to the application of this creation. Next, please refer to "3A", "3B" and "3C", "3A" to "3C", showing the second improved structure of the light-emitting diode support. A side view enlarged view of the embodiment of the reinforcement. M394575 is stamped and formed in the embedded portion 11 to form a convex second reinforcing portion 113. The shape of the second reinforcing portion Π3 can be buried in addition to the convex inverted concave shape (as shown in "Fig. 3A"). The entry portion 11 is stamped to form an inverted V shape (as shown in "Fig. 3B") or stamped to form a convex semicircular shape (as shown in "Fig. 3C"). It should be noted that the second reinforcing portion 113 formed by pressing in the embedding portion 11 may be formed by punching, and the above-mentioned "3A map", "3B map", and "3C map" are rotated by 18 degrees. That is, the second reinforcing portion 113 exhibits a second reinforcing portion 113 which is formed by stamping and forming the recesses β, and may respectively form a concave shape, a v-shaped shape or a concave semi-circular shape. Then, please refer to the "Fig. 4", and the "Fig. 4" is a schematic side view of the g-light emitting diode chip of the improved structure of the illuminating-polar body support; when the above-mentioned light-emitting diode is completed After the improved structure of the stent is formed, the LED device 3 can be fixed to one of the top surfaces 114 of the buried portion n exposed to the recess portion 22 through a surface mount device (SMD). The field b-wire bonding technique (wire bGnding) or the crystal bonding technique (flip c-mail / ^ndmg) is electrically connected to the top surface m of the buried portion 11 which is partially exposed to the depressed portion 22, and the green surface is shown as a line. Bonding technology (herein, for example only, and sanding the limitation of the present invention (4), the method (5) is to form a light-emitting diode; and the third electrical conductor 51 is electrically connected to the top surface 114 of the other-embedded portion 11, That is, the LED chip 3 can be electrically connected to the other electronic device through the electrical connection portion of the plastic substrate 20 through the support member 10 to obtain different electrical polarity. Figure 5 shows "Figure 5" as Inventive illuminating-polar body support improved structure axial packing encapsulation colloidal cross-sectional schematic view; in the recessed portion 11 of the rubber seat (1), the sealing body is turned into a slewing body 4 〇, and the packaged 〇 4 〇 can cover the lx light one body in the depressed portion 9 M394575 The slab 30 and the embedded portion 11 of the bracket 10 can form an SMD light-emitting diode. The above-mentioned encapsulant 40 can be formed by dispensing, which is merely an example of the invention. The application of the package, and the encapsulant 40 can be mixed with camping powder (not shown in the figure), so when the light emitted by the LED chip 7 is irradiated to the county powder, it excites another species. The visible light of the color · the light emitted by the LED chip 40 can be mixed with the light excited by the glory powder to produce a light mixing effect. As described above, it can be seen that the difference between the present creation and the prior art lies in The creative support frame has a buried portion and an extension portion, the bottom surface of the buried portion is provided with a first reinforcement portion, and the buried portion is provided with a second reinforcement portion through a first reinforcement portion to be embedded in the rubber seat and Second reinforcement The bracket and the rubber seat are added with stronger resistance and the second reinforcement can gather water and water by siphoning to prevent the water vapor from further infiltrating and the bottom surface of the buried portion is exposed to the lower surface of the seat to enhance the illumination. The "heat dissipation efficiency" of the diode can effectively solve the problem of the prior art generated by the prior art. By means of this technology, the existing secret light of the two-mirror support structure bracket and the seat fixation force are insufficient. It is impossible to prevent further infiltration of water vapor, and the heat dissipation efficiency is not (4) problem, _achieve the technical effect of enhancing the fixing force of the bracket and the glue 'to prevent the moisture from entering and stepping in and improving the heat dissipation efficiency. ^ Although the embodiment disclosed in the present application is as above, However, the content described above is not intended to directly limit the scope of patent protection of this creation. Anyone having ordinary knowledge in the technical field of the present invention may make some changes in the form and details of the real blue without departing from the spirit and scope disclosed in the present invention. Patent protection of this creation