TWM387373U - Pixel structure - Google Patents
Pixel structureInfo
- Publication number
- TWM387373U TWM387373U TW099200888U TW99200888U TWM387373U TW M387373 U TWM387373 U TW M387373U TW 099200888 U TW099200888 U TW 099200888U TW 99200888 U TW99200888 U TW 99200888U TW M387373 U TWM387373 U TW M387373U
- Authority
- TW
- Taiwan
- Prior art keywords
- disposed
- line
- common
- electrode
- passivation layer
- Prior art date
Links
- 238000002161 passivation Methods 0.000 abstract 5
- 238000009413 insulation Methods 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099200888U TWM387373U (en) | 2010-01-15 | 2010-01-15 | Pixel structure |
US12/732,183 US8164094B2 (en) | 2010-01-15 | 2010-03-25 | Pixel structure and fabricating method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099200888U TWM387373U (en) | 2010-01-15 | 2010-01-15 | Pixel structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM387373U true TWM387373U (en) | 2010-08-21 |
Family
ID=44276924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099200888U TWM387373U (en) | 2010-01-15 | 2010-01-15 | Pixel structure |
Country Status (2)
Country | Link |
---|---|
US (1) | US8164094B2 (zh) |
TW (1) | TWM387373U (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI417966B (zh) * | 2011-05-19 | 2013-12-01 | Chunghwa Picture Tubes Ltd | 畫素結構的製作方法 |
TWI447495B (zh) * | 2010-02-12 | 2014-08-01 | Japan Display West Inc | 具有減少撓曲電效應的液晶顯示器 |
TWI449004B (zh) * | 2010-08-30 | 2014-08-11 | Au Optronics Corp | 畫素結構及其製造方法 |
TWI505004B (zh) * | 2013-09-12 | 2015-10-21 | Au Optronics Corp | 畫素結構 |
TWI575577B (zh) * | 2011-11-15 | 2017-03-21 | 友達光電股份有限公司 | 畫素結構及畫素結構的製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014021449A (ja) * | 2012-07-23 | 2014-02-03 | Panasonic Liquid Crystal Display Co Ltd | 液晶表示装置、および液晶表示装置の製造方法 |
KR20140094880A (ko) | 2013-01-23 | 2014-07-31 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
TWM462429U (zh) | 2013-03-26 | 2013-09-21 | Chunghwa Picture Tubes Ltd | 面板整合掃描驅動電路的電容結構 |
CN104157613B (zh) | 2014-07-31 | 2017-03-08 | 京东方科技集团股份有限公司 | 一种阵列基板的制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3683463B2 (ja) * | 1999-03-11 | 2005-08-17 | シャープ株式会社 | アクティブマトリクス基板、その製造方法、及び、該基板を用いたイメージセンサ |
-
2010
- 2010-01-15 TW TW099200888U patent/TWM387373U/zh not_active IP Right Cessation
- 2010-03-25 US US12/732,183 patent/US8164094B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI447495B (zh) * | 2010-02-12 | 2014-08-01 | Japan Display West Inc | 具有減少撓曲電效應的液晶顯示器 |
TWI449004B (zh) * | 2010-08-30 | 2014-08-11 | Au Optronics Corp | 畫素結構及其製造方法 |
TWI417966B (zh) * | 2011-05-19 | 2013-12-01 | Chunghwa Picture Tubes Ltd | 畫素結構的製作方法 |
TWI575577B (zh) * | 2011-11-15 | 2017-03-21 | 友達光電股份有限公司 | 畫素結構及畫素結構的製造方法 |
TWI505004B (zh) * | 2013-09-12 | 2015-10-21 | Au Optronics Corp | 畫素結構 |
US9329440B2 (en) | 2013-09-12 | 2016-05-03 | Au Optronics Corporation | Pixel structure |
Also Published As
Publication number | Publication date |
---|---|
US8164094B2 (en) | 2012-04-24 |
US20110175093A1 (en) | 2011-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4K | Expiration of patent term of a granted utility model |