M384492 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作是有關於一種機械鑽孔板結構及其佈局，特別是 有關於一種減少孔徑及降低製造成本的機械鑽孔結構及 其佈局。 【先前技術】 [〇〇〇2]目前，由於可攜式通訊設備之技術不斷的競爭，除了許 多的功能，如音樂、影片及拍照等’而在於外型方面， 則是以輕巧及簡單為主，更由於目前一般使用者大多隨 身攜帶可攜式通訊設備，因此通㉟設備的外型與 大小非常重要，其中可攜式刷電路板 基本上具有著雙面的電路，鐵孔的話， 此種鑽孔大小無法滿足大部分的可攜式通訊設備需求， 因此需採用雷射鑽孔設計，當然雷射鑽孔的的設計需要 額外的成本，因為一般製造印；;珞板Bf，也會把雷射 :;.;" t ' :; 鑽孔的數目計算其中。 [00〇3]請參閱第1圖，其係為一階雷射鐵孔之架構設計圖。圖中 ’此印刷電路板以一階雷射鑽孔於印刷電路板上實施， 此印刷電路板包括一第一層線路11、一半固化片12、一 第二層線路13、一第三層線路14、一玻璃纖維環氧樹脂 基材15、—第四層線路16 '一第五層線路17及一第六層 線路18、—外部鑽孔19及一貫穿穿孔21，半固化片12與 玻璃纖維環氧樹脂基材15交錯設置於各層線路之間，外 部鑽孔19穿設於第一層線路11及第六層線路18，貫穿鑽 孔2〗則穿過所有線路，因此於製造過程中，需要一次壓 表單编號A0101 第4頁/共15頁 M384492 合及兩次鑽孔，且鑽孔次數及壓合次數亦皆算入製造成 本中。 [0004] 請參閱第2圖，其係為二階雷射鑽孔之架構設計圖。圖中 ，此印刷電路板以一階雷射鑽孔於印刷電路板上實施， 此印刷電路板包括一第一層線路11、一半固化片12、一 第二層線路13、一第三層線路14、一玻璃纖維環氧樹脂 基材15、一第四層線路16、一第五層線路17及一第六層 線路18、一外部鑽孔19、一内部鑽孔20及一貫穿穿孔21 ，半固化片12與玻璃纖維環氧樹脂基材15交錯設置於各 層線路之間，外部鑽孔19穿設於第一層線路11及第六層 線路18，貫穿鑽孔21則穿過辦有線路，因此於製造過程 中，需要兩次壓合及兩次鑽孔，且鑽孔式數及壓合次數 亦皆算入製造成本中。 【新型内容】M384492 V. New description: [New technical field] [0001] This creation is about a mechanical drilling plate structure and its layout, especially regarding a mechanical drilling structure and its layout that reduces the aperture and reduces the manufacturing cost. . [Prior Art] [〇〇〇2] At present, due to the constant competition of the technology of portable communication devices, in addition to many functions, such as music, video and photography, the appearance is light and simple. Mainly, since most of the current users carry portable communication devices with them, the appearance and size of the 35 devices are very important. The portable brush circuit board basically has double-sided circuits, iron holes. The size of the drill hole can not meet the needs of most portable communication equipment, so the laser drilling design is required. Of course, the design of the laser drilling requires extra cost, because the printing is generally made; Take the laser:;.;" t ' :; The number of holes is calculated. [00〇3] Please refer to Figure 1, which is the structural design of the first-order laser iron hole. In the figure, the printed circuit board is implemented by a first-order laser drilling on a printed circuit board. The printed circuit board includes a first layer line 11, a half-cured sheet 12, a second layer line 13, and a third layer line 14. a glass fiber epoxy resin substrate 15, a fourth layer line 16', a fifth layer line 17 and a sixth layer line 18, an outer bore 19 and a through hole 21, a prepreg 12 and a glass fiber epoxy The resin substrate 15 is staggered between the layers of the layers, the outer bore 19 is passed through the first layer line 11 and the sixth layer line 18, and the through hole 2 is passed through all the lines, so that it needs to be once in the manufacturing process. Pressure Form No. A0101 Page 4 / Total 15 pages M384492 Two holes are drilled together, and the number of drill holes and the number of presses are also included in the manufacturing cost. [0004] Please refer to FIG. 2, which is an architectural design diagram of a second-order laser drilling. In the figure, the printed circuit board is implemented by a first-order laser drilling on a printed circuit board. The printed circuit board includes a first layer line 11, a half-cured sheet 12, a second layer line 13, and a third layer line 14. a glass fiber epoxy resin substrate 15, a fourth layer line 16, a fifth layer line 17 and a sixth layer line 18, an outer bore 19, an inner bore 20 and a through hole 21, a prepreg 12 is interlaced with the glass fiber epoxy resin substrate 15 between the layers of the circuit, the external drill hole 19 is disposed through the first layer line 11 and the sixth layer line 18, and the through hole 21 is passed through the line, so In the manufacturing process, two presses and two holes are required, and the number of holes and the number of presses are also included in the manufacturing cost. [New content]
[0005] 有鑑於上述習知技藝之問題，本創作之其中一目的就是 在提供一種機械鑽孔，以解決於製造過程中需要多次鑽 孔及孔徑過大的問題。 [0006] 根據本創作之一目的，提出一種機械鑽孔板，其包括一 印刷電路板、複數個球閘陣列、複數個電子元件及至少 一鑽孔，複數個球閘陣列係焊接於印刷電路板之球焊盤 上，球閘陣列之間距介於一第一間距之間，複數個電子 元件係連接球閘陣列，鑽孔係穿設於該印刷電路板，並 距離各別球閘陣列之間距為一第二間距。 [0007] 其中，第一間距係為0. 5~0. 75mm之間。 表單編號A0101 第5頁/共15頁 M384492 [0008] 其中，第二間距係至少為0. 0762關。 [0009] 其中，鑽孔之直徑介於一第一直徑及一第三直徑之間之 間，第一直徑係為0.4mni且第三直徑係為0.2mm。 [0010] 其中，球閘陣列具有複數個球焊盤，球焊盤之直徑介於 一第二直徑之間，第二直徑係介於0. 35~0. 6mm之間。 [0011] 其中，印刷電路板具有複數層線路層，於此創作中線路 層更可為六層。 [0012] 其中，線路層之間交錯設有一半固化片或一玻璃纖維環 氧樹脂基材。 [0013] 根據本創作之再一目的，再提出鑽fL佈局，其 包括一印刷電路板、複數個第一 個第二遮 罩框及至少一鑽孔，第一遮罩框及第二遮罩框係皆焊接 於印刷電路板上，第一遮罩框及第二遮罩框之間距至少 為一第三間距，鑽孔穿設於電路取上.，與第一遮罩框及 第二遮罩框各別間距介於一第四間距之間。 [0014] 其中，第三間距係為0. 7mm，而第四間距至少為0. 1 mm。 [0015] 其中，第一遮罩框與第二遮罩框各別獨立設置於印刷電 路板，避免互相覆蓋。 [0016] 其中，鑽孔之直徑介於第一直徑及一第三直徑之間，第 一直徑為0. 4mm且第三直徑為0. 2mm。 [0017] 承上所述，因依本創作之一種機械鑽孔板結構及其佈局 ，其可具有一或多個下述優點： 表單編號A0101 第6頁/共15頁 [0018] (1)可減少壓合次數及鑽孔次數，節省製程中所需之成 本。 [0019] (2)可減少鑽孔之孔徑，增加印刷電路板上空間利用的 彈性。 【實施方式】 [0020] 以下將參照相關圖式，說明依本創作之機械鑽孔板之實 施例’為使便於理解，下述實施例中之相同元件係以相 同之符说標不來說明。 [0021] 請參閱第3圖，其係為本創作之機械鑽孔板之實施例一之 示意圖。圖中，印刷電路板中包拿複壤移谭盤3丨、一 機械鑽孔32，球焊盤31分佈板上:，供球閘陣 列（Ball Grid Array，BGf)浲接於盤31上，機 械鑽孔32位於四個球焊盤31之間，於此實施例中，球焊 盤31之間之第一間距34為0. 65mm，鑽孔之第一直徑35為 〇. 4mm，球焊盤31之第二直徑36丨為ϋ. 35mm，且鑽孔之第 二直徑37為〇. 2mm，於鑽孔_，球焊盤31與機械鑽孔32 第二間距33至少可大於〇. 〇762τηιη。 [0022] 請參閱第4圖，其係為本創作之機械鑽孔板之印刷電路板 剖視圖。圖中，印刷電路板包括一第一層線路11、一半 固化片12、一第二層線路！3、一第三層線路14、一玻璃 纖維％乳樹脂基材15、一第四層線路16、一第五層線路 17及一第六層線路18及一貫穿穿孔21，半固化片12設置 於第一層線路11與第二層線路13之間、第三層線路14與 第四層線路16之間及第五層線路17及第六層線路18之間 表單編號Α0101 第7頁/共15頁 M384492 ，玻璃纖維環氧樹脂基材15設置於第二層線路13與第三 層線路14之間及第四層線路1 6與第五層線路1 7之間，貫 穿鑽孔21則穿過所有線路層，如圖所示，因此，只需要 一次壓合及一次鑽孔，可減少製程令之成本。 [0023] 請參閱第5圖，其係為機械鑽孔板之實施例二之示意圖。 圖中，印刷電路板上焊接有第一遮罩框51及第二遮罩框 52，第一遮罩框51與第二遮罩框52之間不互相覆蓋且完 全獨立，於製程中第一遮罩框51與第二遮罩框52之間具 有第三間距54，第三間距54至少為0. 7mm，於第一遮罩 框51與第二遮罩框52之中利用機械鑽孔方式鑽出複數個 機械鑽孔53，此機械鑽孔51_鲁徑介於第1直徑35及第 三直徑37之間，且第一直徑，第含直徑37係 為0. 2mm，而機械鑽孔53之直徑亦介於第一直徑35及第 三直徑37，為0. 2mm〜0. 4mm之間（復請參閱第3圖），機 械鑽孔53與第一遮罩框51及第二遮罩框52之第四間距55 至少為0. lmm，按照此佈局:即可實現機械鑽孔之實作，如 此之成本可節省30%。 [0024] 以上所述僅為舉例性，而非為限制性者。任何未脫離本 創作之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 [0025] 第1圖係為一階雷射鑽孔之架構設計圖； 第2圖係為二階雷射鑽孔之架構設計圖； 第3圖係為本創作之機械鑽孔板之實施例一之示意圖； 第4圖係為本創作之機械鑽孔板之印刷電路板剖視圖；以 表單編號A0101 第8頁/共15頁 M3,84492 及 第5圖係為機械鑽孔板之實施例二之示意圖 【主要元件符號說明】 [0026] 11 :第一層線路； 1 2 :半固化片； 13 :第二層線路； 14 :第三層線路； 15 :玻璃纖維環氧樹脂基材 16 :第四層線路； 17 :第五層線路； 18 :第六層線路； 19 :外部鑽孔； 20 :内部鑽孔； 21 :貫穿穿孔； 31 :球焊盤； 32 :機械鑽孔； 33 :第二間距； 34 :第一間距； 35 :第一直徑； 36 :第二直徑； 37 :第三直徑； 51 :第一遮罩框； 52 :第二遮罩框； 53 :機械鑽孔； 54 :第三間距；以及 表單编號A0101 第9頁/共15頁 M384492 5 5 :第四間距。In view of the above-mentioned problems of the prior art, one of the objects of the present invention is to provide a mechanical drilling to solve the problem of requiring multiple drilling holes and excessive apertures in the manufacturing process. [0006] According to one of the purposes of the present invention, a mechanical drilling plate is proposed, comprising a printed circuit board, a plurality of ball gate arrays, a plurality of electronic components and at least one drill hole, and the plurality of ball gate arrays are soldered to the printed circuit On the ball pad of the board, the distance between the ball grid arrays is between a first spacing, and the plurality of electronic components are connected to the ball grid array, and the drilling holes are disposed on the printed circuit board and are separated from the respective ball gate arrays. The pitch is a second pitch.至之间。 [0007] wherein the first pitch is between 0.5 to 0. 75mm. 0762关。 The second spacing is at least 0. 0762 off. [0009] wherein the diameter of the borehole is between a first diameter and a third diameter, the first diameter is 0.4 mni and the third diameter is 0.2 mm. 5之间之间。 [0010] wherein the ball gate array has a plurality of ball pads, the diameter of the ball pad is between a second diameter, the second diameter is between 0. 35~0. 6mm. [0011] wherein the printed circuit board has a plurality of circuit layers, and the circuit layer may be six layers in this creation. [0012] wherein a half-cured sheet or a glass fiber epoxy resin substrate is interleaved between the circuit layers. [0013] According to still another object of the present invention, a drill fL layout is further provided, comprising a printed circuit board, a plurality of first second mask frames and at least one drilled hole, a first mask frame and a second mask The frame is soldered to the printed circuit board, and the distance between the first mask frame and the second mask frame is at least a third distance, and the hole is bored through the circuit, and the first mask frame and the second cover The mask frames are each spaced between a fourth pitch. 1毫米。 The fourth pitch is at least 0. 1 mm. [0015] wherein the first mask frame and the second mask frame are separately disposed on the printed circuit board to avoid mutual coverage. 2毫米。 The diameter of the first diameter is 0. 4mm and the third diameter is 0. 2mm. [0017] As described above, the mechanical drilling plate structure and its layout according to the present invention may have one or more of the following advantages: Form No. A0101 Page 6 of 15 [0018] (1) It can reduce the number of presses and the number of drills, saving the cost required in the process. [0019] (2) The aperture of the borehole can be reduced, and the flexibility of space utilization on the printed circuit board can be increased. [Embodiment] Hereinafter, the embodiment of the mechanical drilling plate according to the present invention will be described with reference to the related drawings. For the sake of easy understanding, the same components in the following embodiments are denoted by the same symbols. . [0021] Please refer to FIG. 3, which is a schematic view of the first embodiment of the mechanical drilling plate of the present invention. In the figure, the printed circuit board is covered with a slab, a mechanical drill 32, a ball slab 31, and a ball grid array (BGf) is attached to the disk 31. The mechanically drilled hole 32 is located between the four ball pads 31. In this embodiment, the first spacing 34 between the ball pads 31 is 0.65 mm, and the first diameter 35 of the drilling hole is 〇. 4 mm, ball bonding. The second diameter 36丨 of the disk 31 is ϋ35mm, and the second diameter 37 of the drilled hole is 〇. 2mm, and the second spacing 33 of the hole _, the ball pad 31 and the mechanical drill hole 32 may be at least greater than 〇. 〇 762τηιη. [0022] Please refer to FIG. 4, which is a cross-sectional view of a printed circuit board of the mechanical drilling plate of the present invention. In the figure, the printed circuit board includes a first layer of wiring 11, a half of the cured sheet 12, and a second layer of wiring! 3. A third layer line 14, a glass fiber% milk resin substrate 15, a fourth layer line 16, a fifth layer line 17 and a sixth layer line 18, and a through hole 21, the prepreg 12 is disposed on the Form between the first layer line 11 and the second layer line 13, between the third layer line 14 and the fourth layer line 16, and between the fifth layer line 17 and the sixth layer line 18. Form number Α0101 Page 7 of 15 M384492, the glass fiber epoxy substrate 15 is disposed between the second layer line 13 and the third layer line 14 and between the fourth layer line 16 and the fifth layer line 17, and the through hole 21 passes through all The circuit layer, as shown in the figure, therefore, requires only one press and one drill to reduce the cost of the process. [0023] Please refer to FIG. 5, which is a schematic diagram of Embodiment 2 of a mechanical drilling plate. In the figure, the first mask frame 51 and the second mask frame 52 are soldered on the printed circuit board, and the first mask frame 51 and the second mask frame 52 do not overlap each other and are completely independent, and are first in the process. The first mask frame 51 and the second mask frame 52 are mechanically drilled in the first mask frame 51 and the second mask frame 52, with a third spacing 54 between the mask frame 51 and the second mask frame 52. The mechanical diameter of the first diameter 35 and the third diameter 37 is between 0. 2mm, and the mechanical diameter is drilled. The diameter of 53 is also between the first diameter 35 and the third diameter 37, which is between 0. 2mm~0. 4mm (refer to FIG. 3), the mechanical drilling hole 53 and the first mask frame 51 and the second cover. The fourth spacing 55 of the mask frame 52 is at least 0.1 mm. According to this layout, the mechanical drilling can be realized, and the cost can be saved by 30%. [0024] The foregoing is illustrative only and not limiting. Any equivalent modifications or changes made to the spirit and scope of this creation shall be included in the scope of the appended patent application. [Simplified illustration] [0025] Figure 1 is the structural design of the first-order laser drilling; Figure 2 is the structural design of the second-order laser drilling; Figure 3 is the mechanical drilling of the creation Schematic diagram of the first embodiment of the orifice plate; Figure 4 is a cross-sectional view of the printed circuit board of the mechanical drilling plate of the present invention; the mechanical drilling is performed by the form number A0101, page 8 / 15 pages, M3, 84492 and 5 Schematic diagram of the second embodiment of the board [Description of main component symbols] [0026] 11: first layer line; 1 2: prepreg; 13: second layer line; 14: third layer line; 15: glass fiber epoxy resin base Material 16: 4th line; 17: 5th line; 18: 6th line; 19: External hole; 20: Internal hole; 21: Through hole; 31: Ball pad; 33: second pitch; 34: first pitch; 35: first diameter; 36: second diameter; 37: third diameter; 51: first mask frame; 52: second mask frame; Drill hole; 54: third pitch; and form number A0101 page 9 / total 15 pages M384492 5 5 : fourth pitch.
表單編號A0101 第10頁/共15頁Form No. A0101 Page 10 of 15