M383814 五、新型說明： 【新型所屬之技術領域】 本創作係涉及一種晶圓載盤，特別是指一種具多爪式 壓制構件之晶圓載盤創新結構型態設計者。 【先前技術】 按’半導體或發光二極體（Light Emitting Diode, LED) 製程中’晶圓必須歷經多道不同流程方可製程表面具有電 晶體之成品態樣，所述流程包括如加熱氧化（Oxidation ) 、化學氣相沈積（Chemical Vapor Deposition ; CVD )、微影 (Lithography )、蝕刻（Etching )等等；為了加速晶圓製程 的效率，業界通常是將多數晶圓片事先放置定位於一晶圓 载盤上’以達到一次處理一批量晶圓片之目的。 本創 計加以改 基盤上設 一放置其 體’以將 载盤於實 的晶圓片 一定位框 根螺栓方 體之全數 方得以取 ’必須耗費 作效率而 作所欲 良，習 置有多 中，接 所放置 際應用 往往多 體之設 可穩固 螺栓均 出，如 相當冗 延宕製 探討的 知晶圓 數間隔 著，各 的晶圓 經驗中 達一、 即是針對所述晶圓 ，典型常 容置槽， 方再各別 載盤之型態 排列分佈的 該容置槽上 片限位固定 發現，由於 十片 因 計，因為單一定位 定位， 拆解然 此一來 長工作 程。 且欲拆除晶 後再拆除該 ’造成晶圓 時間方可達 ;惟查， 單一晶圓 此其單一 框體通常 圓片時， 定位框體 片之組裝 成之問題 載盤之結構設 見者，係於一 以供晶圓片一 鎖組一定位框 此種習知晶圓 载盤上所放置 容置槽即鎖組 即必須鎖付數 必須將定位框 之後，晶圓片 、拆除作業均 點’實欠缺工 再者，習知晶圓載盤更 由於晶圓片在歷經一段加工 ’而晶圓片的高溫必須獲得 生形變而影響其表面平坦度 面臨散熱效果不佳之問題點； $程後’會產生吸熱溫升現象 適當的冷卻抑制，否則將會產 ，然而，習知晶圓載盤容置槽 3 上鎖組之定位框，通常會大面積 響其冷卻散熱效率。 益住曰曰圓片，進而嚴重影 如何：：一 圓载盤結構所存在之問題點， 者再加以努力研發突=者。性之創新結構，實有待相關業 有鑑於此，創作人本於 與設計經驗，針對上述之目，事相關產品之製造開發 終得一確具實用性之本創作p詳加設計與審慎評估後， 【新型内容】 本創作之主要目的，传為栏抑 之晶圓載盤，其所欲解決之3-種具多爪式壓制構件 結構設計上仍舊存在之門印問碭點，係針對習知晶圓載盤 本創作解決問題之技g：良突破； 係包括：一基盤，=^特點，主要在於所述晶圓載盤 面包括間隔分佈的多數！=所構成之盤體型態，其盤 ，各該晶圓片承置槽=:置槽以供晶圓片置放限位 數多爪式壓制構件，為輕二：：形成有間隔緣面；多 構件包括一裝設定位座：2構成，各該多爪式壓制 位座邊緣之多數壓制凸爪=隔狀橫向凸設於該裝設定 位部以供組裝定位於該：：構成’所述裝設定位座具有定 可橫伸至該基盤晶圓片隔緣面，戶斤述壓制凸爪則 之作用；#此創新獨特=槽：太而能達到厘制該晶圓片 ，大致可達到如下功效?&+ ’使本創作對照先前技術而言 其一、ΐ =定位於晶圓載盤之構件能夠精簡化， 作業效率能夠大幅提昇。 其二、令晶圓片之冷卻散熱效率能夠大幅提昇。 【實施方式】 M383814 請參閱第1 、2 、3圖 構件之晶圓載盤之較佳實施 用，在專利申請上並不受此 係包括下述構成： ~ $ ’係本創作具多爪式壓制M383814 V. New Description: [New Technology Field] This creation relates to a wafer carrier, especially to a wafer carrier innovative structure type designer with multi-claw pressing members. [Prior Art] According to the 'Semiconductor or Light Emitting Diode (LED) process, the wafer must go through a number of different processes to have a finished surface of the transistor, such as heating oxidation ( Oxidation), Chemical Vapor Deposition (CVD), Lithography, Etching, etc. In order to speed up the efficiency of wafer processing, the industry usually places a plurality of wafers in advance in a crystal. On the round tray, the purpose of processing a batch of wafers at a time is achieved. The creation of the project is based on the provision of a body on the base plate to position the disk in the real wafer, and to locate the entire body of the frame bolt. It must be cost-effective and do a good job. In the middle, the application of the placement is often multi-body, and the stable bolts are all distributed. For example, the number of known wafers is quite intermittent, and each wafer experience is one, that is, for the wafer, typical Usually, the slot is fixed, and the position of the splicing slot of the type of the respective carrier is fixed. Since the ten pieces are counted, because of the single positioning and positioning, the disassembly is long and the working process is long. And if you want to remove the crystal and then remove it, the wafer time is up; but if the single wafer is usually a wafer, the assembly of the positioning frame is a problem with the structure of the carrier. Attached to the wafer, a lock group, a positioning frame, the storage tray placed on the conventional wafer carrier, that is, the lock group, that is, the lock number must be locked, and the wafer and the removal operation are both In the absence of work, the conventional wafer carrier is more problematic because the wafer has undergone a process of processing, and the high temperature of the wafer must be deformed to affect the surface flatness, and the heat dissipation effect is not good. Appropriate cooling suppression of the liter phenomenon, otherwise it will be produced. However, the positioning frame of the lock group of the wafer carrier accommodating groove 3 usually has a large area to cool its cooling efficiency. Benefiting from the round disc, and then serious shadow How to:: A problem with the existence of a circular carrier structure, and then work hard to develop the sudden =. The innovative structure of sex, in view of the relevant industry, in view of this, the creator and design experience, for the above-mentioned purposes, the manufacture of related products has finally become a practical and practical design. [New Content] The main purpose of this creation is to pass on the wafer carrier of the column, and the three types of multi-claw pressing members are still designed to solve the problem. The idea of solving the problem in the creation of the book: a good breakthrough; the system includes: a base plate, = ^ features, mainly in the wafer carrier surface including the majority of the interval distribution! = the shape of the disk body, the disk, each of the wafer receiving grooves =: groove for the wafer to place the limit number multi-claw pressing member, for the light two:: formed with a marginal surface The multi-component comprises a mounting position base: 2, and a plurality of pressing claws at the edges of each of the multi-claw pressing seats are laterally protruded from the mounting position portion for assembly and positioning: The description setting seat has a function of extending to the partition surface of the base wafer wafer, and the function of pressing the pressing claw is used; #This innovative unique=slot: too, can achieve the wafer, which is roughly The following effects can be achieved? &+ 'This design makes it possible to simplify the components of the wafer carrier according to the prior art, and the work efficiency can be greatly improved. Second, the cooling efficiency of the wafer can be greatly improved. [Embodiment] M383814 Please refer to the preferred implementation of the wafer carrier of the components of Figures 1, 2 and 3, and the patent application does not include the following structure: ~ $ ′ This is a multi-claw suppression
$ ’惟此等實施例僅供說明之 、’。構之限制。所述晶圓載盤A 成之盤體型態，其盤面 槽12以供晶圓片〇5置放 相對界定形成有間隔緣 置槽12之間的間隔緣面 示箭號所揭），藉以供$ ’Only these examples are for illustrative purposes only. Construction restrictions. The wafer carrier A is in the form of a disk, and the disk groove 12 is provided for the wafer cassette 5 to be disposed oppositely to define an interval between the spacer grooves 12 (arrow)
一基盤10，為輕質散熱材所構 11包括間隔分佈的多數晶圓片承置 限位’各該晶圓片承置槽12之間則 面13，其中呈相鄰狀態之晶圓片承 13係呈等寬狀態者（如第6圖所標 壓制凸爪22相對位壓制配合狀態； 為輕質散熱材構成，各該多 位座21以及呈間隔狀橫向凸 數壓制凸爪22所構成，所述 供組裝定位於該基盤10之間 可橫伸至該基盤10晶圓片承 圓片05之作用；其中該基盤 多數多爪式壓制構件20， 爪式壓制構件20包括一裝設定 設於該裝設定位座21邊緣之多 裝設定位座21具有定位部23以 隔緣面13，所述壓制凸爪22則 置槽12中，而能達到壓制該晶 10、多爪式壓制構件20均為鋁材所構成，藉由鋁材取得成 本較低且兼具極佳導熱特性，以令該基盤1〇以及多爪式壓 制構件20具有極佳散熱效果。 其中’所述多爪式壓制構件2〇之裝設定位座21所設定 位部23係為至少一螺栓穿設孔231所構成。 其中’所述多爪式壓制構件2〇，係包括數組三爪式壓 塊24以及數組三爪式壓板25所構成；所述三爪式壓塊24具 有二個壓制凸爪22互呈120 。夾角設置犁態，且令該三個 壓制凸爪22能夠分別橫伸至該基盤1〇晶圓片〇5的三個不同 承置槽12中，所述三爪式壓板25具有一平直狀内側邊251 以及一形狀配合該基盤1〇周邊形狀之外側邊252 ，該平直 狀内側邊251具有間隔設置的三個壓制凸爪253 ，且該三 個壓制凸爪253能夠分別橫伸至該基盤忉晶圓片的三個不 5 M383814 同承置槽12中。 其中，所述晶圓片承置槽I2為具有一平切緣部121之 圓形態樣者。 其中’如第4圖所揭，戶斤述晶圓片承置槽12之底壁周 邊並設有一凹環溝122 ，|於該凹環溝122中置入一彈性 環123 ’當晶圓片〇5置放於該晶圓片承置槽12上時，該彈 性環123會被晶圓片〇5底面所壓迫而產生彈性反作用力抵 緊該晶圓片05，而能夠令晶圓片05定位狀態更穩固。 其中，如第4圖所示，所述晶圓片承置槽12並設有至 _少一立向貫穿之通氣孔124 ，藉由所述通氣孔124的設置 ’以令該晶圓片承置槽12所置晶圓片05與晶圓載盤a下方 冷卻氣體（係指加工製程設備中所灌入的惰性氣體）能夠 相導通接觸’而更利於熱氣之排散及晶圓片〇5熱溫之冷卻 〇 其中’如第5圖所揭，所述多爪式壓制構件20與基盤 10間隔緣面13之間並設有定向嵌合構件30，以限定該多爪 式壓制構件20之組設方向，藉此而能達到防呆、快速準確 定位之作用；至於所述定向嵌合構件3〇之具體實施型態， _可為一凸塊31與一凹槽32所構成之型態者。 其中’該基盤10上至少二晶圓片承置槽12係構成一單 元，且相鄰的每個單元間隔尺寸等距一致且為同等方向之 排列型態者；藉此，係能夠在面積有限的盤面11上排列出 最佳化與高密度之晶圓片承置槽12。 藉由上述結構組成設計，本創作所述晶圓載盤A用以 容置定位晶圓片05時，如第2圖所示，係將晶圓片05置放 於該承置槽12中，接著旋轉該三爪式壓塊24將三個壓制凸 爪22能夠分別橫伸至該基盤1〇晶圓片的三個不同承置槽 12中，而抵壓於該晶圓片05頂面，令該晶圓片05獲得穩固 定位狀態（如第3圖所示）。 6 多爪式壓制構件之結 件即可同時將多數晶 位之目的，藉此相較 言，能夠大幅降低鎖 體積，且拆裝所須作 片裝設定位於晶圓載 構件可進一步精簡化 較佳產業利用效益。 式壓制構件均為散熱 通氣孔之結構整合設 夠透過該基盤及多爪 效率，且其晶圓片承 夠顯著而有效地增進 指加工製程設備中所 更利於熱氣之排散以 令晶圓片冷卻散熱效 步性與較佳產業利用A substrate 10, which is a lightweight heat-dissipating material, includes a plurality of wafer-receiving limits, and a surface 13 between the wafer-receiving grooves 12, wherein the wafers are adjacent to each other. The 13 series is in a state of equal width (as shown in Fig. 6 is a pressing engagement state of the pressing claws 22; a light heat dissipating material, each of the plurality of seats 21 and the spacer-shaped lateral convex pressing claws 22 The assembly is positioned between the substrates 10 and extends to the wafer 10 wafer 50 of the substrate 10; wherein the substrate has a plurality of multi-claw pressing members 20, and the claw pressing members 20 include a mounting setting The multi-mounting seat 21 at the edge of the mounting seat 21 has a positioning portion 23 with a rim surface 13, and the pressing claw 22 is placed in the groove 12, so that the pressing of the crystal 10 and the multi-claw pressing member can be achieved. 20 is composed of aluminum material, and the aluminum material is low in cost and has excellent heat conduction characteristics, so that the base plate 1 and the multi-claw pressing member 20 have excellent heat dissipation effect. The set position 23 of the pressing member 2 is set to at least one bolt through The multi-claw pressing member 2 is composed of an array of three-jaw pressing blocks 24 and an array of three-jaw pressing plates 25; the three-jaw pressing block 24 has two pressing claws 22 mutually 120. The angle is set to the plow state, and the three pressing claws 22 can be respectively extended into the three different receiving grooves 12 of the substrate 1 〇 wafer 〇 5, the three-jaw pressing plate 25 The utility model has a flat inner side edge 251 and a side edge 252 shaped to fit the peripheral shape of the base plate 1 . The flat inner side edge 251 has three pressing protrusions 253 spaced apart, and the three pressing protrusions The claws 253 can be respectively extended into the three non-5 M383814 and the receiving grooves 12 of the base 忉 wafer. The wafer receiving groove I2 is a circular shape having a flat cutting edge portion 121. Wherein, as disclosed in FIG. 4, the periphery of the bottom wall of the wafer receiving groove 12 is provided with a concave ring groove 122, and an elastic ring 123' is placed in the concave ring groove 122. When the crucible 5 is placed on the wafer receiving groove 12, the elastic ring 123 is pressed by the bottom surface of the wafer crucible 5 to generate an elastic reaction. Abutting the wafer 05, the positioning state of the wafer 05 can be made more stable. As shown in FIG. 4, the wafer receiving groove 12 is provided with a _ less than one vertical through. The air hole 124 is disposed by the vent hole 124 to make the wafer 05 disposed on the wafer receiving groove 12 and the cooling gas under the wafer carrier a (refer to the inert gas poured in the processing device) The ability to conduct a conductive contact is more advantageous for the evacuation of the hot gas and the cooling of the heat of the wafer 〇 5, wherein the multi-claw pressing member 20 is spaced from the peripheral edge 13 of the substrate 10 as disclosed in FIG. And an orientation fitting member 30 is provided to define the assembly direction of the multi-claw pressing member 20, thereby achieving the function of preventing foolproof, fast and accurate positioning; and the specific implementation type of the orientation fitting member 3 The state _ can be a type formed by a bump 31 and a groove 32. Wherein at least two wafer receiving grooves 12 on the base plate 10 constitute a unit, and each adjacent unit is equally spaced and equally aligned in the same direction; thereby, the area can be limited The optimized and high-density wafer receiving groove 12 is arranged on the disk surface 11. With the above-mentioned structural composition design, when the wafer carrier A of the present invention is used to accommodate the positioning wafer 05, as shown in FIG. 2, the wafer 05 is placed in the receiving groove 12, and then Rotating the three-jaw clamp 24 to extend the three pressing claws 22 into the three different receiving slots 12 of the wafer 1 〇 wafer, respectively, against the top surface of the wafer 05, The wafer 05 is in a stable fixed state (as shown in Figure 3). 6 The multi-claw pressing member can achieve the purpose of most crystal positions at the same time, so that the lock volume can be greatly reduced, and the wafer mounting member can be further simplified and simplified. Industrial utilization benefits. The pressing members are all configured to integrate the heat dissipation vent holes through the substrate and the multi-claw efficiency, and the wafers are capable of significantly and effectively improving the heat dissipation in the finger processing equipment to make the wafers Cooling heat dissipation and better industrial utilization
M383814 功效說明： 1 、藉由該基盤上組設有 透過該多爪式壓制構 位’達到整合鎖付定 術】所提習知結構而 用數量以及定位構件 短，進而達到令晶圓 率可大幅提昇、定位 成本之實用進步性與 2 、藉由該基盤以及多爪 其晶圓片承置槽具有 晶圓片所產生的熱能 加以吸收而加速散熱 氣孔型態之設計，能 與周遭冷卻氣體（係 氣體）之接觸面積， 溫之冷卻，藉此達到 、增進成品品質之進M383814 Efficacy Description: 1. With the conventional structure proposed by the multi-claw pressing configuration 'to achieve the integrated lock payment method', the number and positioning components are short, and the wafer rate can be achieved. The practical improvement of the substantial increase and positioning cost and the acceleration of the heat dissipation pore pattern by the heat absorption generated by the wafer and the multi-ply wafer receiving groove having the wafer can be combined with the surrounding cooling gas Contact area of (gas), cooling of temperature, thereby achieving and improving the quality of finished products
雖 上迷實施例所揭示者係藉以具體說明本創 < 過特定的術語進行說明，當不能以此限定 之 利範圍；熟悉此項技術領域之人士當可在 & #神與原則後對其進行變更與修改而達到等 ~等變更與修改，皆應涵蓋於如后所述申請專 疋之範疇中。 構設計，俾 圓片抵壓定 於【先前技 付螺栓的使 業時間可縮 盤之作業效 而降低製造 材構成’且 計，俾可令 式壓制構件 置槽具有通 各該晶圓片 灌入的惰性 及晶圓片熱 率大幅提昇 效益。 作，且文中 本新型創作 瞭解本創作 效目的，而 利範圍所界 7 M383814 【圖式簡單說明】Although the embodiments disclosed in the above embodiments are specifically described in terms of specific terms, the scope cannot be limited thereto; those skilled in the art can use the &#神与原理Changes and modifications, such as changes and modifications, should be included in the scope of the application for special purposes as described later. The design of the wafer is set to [the manufacturing time of the prior art retractable bolts to reduce the manufacturing material composition], and the pressing member can be grooved to have the wafer filling The inertness of the inlet and the heat rate of the wafer greatly increase the efficiency. The work of this novel is to understand the purpose of this creation, and the scope of the benefit is 7 M383814 [Simple description]
第 1 圖 本創 作 之 組 合 立 體 圖 0 第 2 圖 本創 作 之 分 解 立 體 圖 〇 第 3 圖 本創 作 之 組 合 平 面 圖 〇 第 4 圖 本創 作 之 組 合 剖 視 圖 〇 第 5 圖 本創 作 之 局 部 構 件 放 大 示 意 圖。 第 6 圖 本創 作 相 鄰 之 晶 圓 片 承 置 槽 之間 的間 隔 緣 面 呈 等 寬狀 態 局 部 示 意 圖 〇 [ 主 要元件符 號 說明 ] 0 5 晶 圓 片 A 晶 圓 載 盤 1 0 基 盤 1 1 盤 面 1 2 承 置 槽 1 2 1 平 切 緣 部 1 2 2 凹 環 溝 1 2 3 彈 性 環 1 2 4 通 氣 孔 1 3 間 隔 緣 面 2 0 多 爪 式 壓 制 構 件 2 1 裝 設 定 位 座 2 2 壓 制 凸 爪 2 3 定 位 部 2 3 1 螺 栓 穿 設 孔 2 4 二 爪 式 壓 塊 2 5 二 爪 式 壓 板 2 5 1 平 直 狀 内 側 邊 2 5 2 外 侧 邊 2 5 3 壓 制 凸 爪 3 0 定 向 嵌 合 構件 3 1 凸 塊 3 2 凹 槽 8Figure 1 Combination of the creation of the vertical figure 0 Figure 2 The decomposition of the creation Figure 〇 Figure 3 The combination of the creation of the plan 〇 Figure 4 The combination of the creation of the 〇 Figure 5 This section of the creation of the local component enlargement. Fig. 6 is a partial schematic view showing the interval between the adjacent wafer receiving grooves. [Main component symbol description] 0 5 Wafer A Wafer carrier 1 0 Base plate 1 1 Disk surface 1 2 Bearing groove 1 2 1 Flat cutting edge 1 2 2 concave ring groove 1 2 3 Elastic ring 1 2 4 Vent hole 1 3 Interval face 2 0 Multi-claw pressing member 2 1 Mounting seat 2 2 Pressing claw 2 3 Positioning part 2 3 1 Bolt hole 2 2 Two-jaw type clamp 2 5 Two-jaw type plate 2 5 1 Straight inner side 2 5 2 Outer side 2 5 3 Pressing claw 3 0 Orienting fitting 3 1 bump 3 2 groove 8