五、新型說明： 【新型所屬之技術領域】 本創作係關於一種半導體設備，特別是一種用於黏晶((11613011(11哗) 製程的半導體元件封裝設備。 【先前技術】 在半導體元件的封裝製程中，晶圓經切割機切割形成獨立的晶粒 後，由取放機構自晶圓上取下晶粒放置於導線架或印刷電路板上，再經 黏合與壓合製程後即完成黏晶製程。 請參閱第1A圖，係一種半導體元件封裝設備的先前技術的主要元 件示意圖，基板90由進料匣12進入基板傳輸機構n，基板傳輸機構 11 S史置有軌道111並藉由軌道111將基板90傳送至預熱區丨3，並在預 熱區13中加熱至一定溫度後傳送至預壓區14，預壓區14設置有預壓 機構14卜視覺裝置142及承載台15，視覺裝置142用以檢視基板90 上之標示碼及基板90與預壓機構141之對位，承載台15用以承接第一 晶粒取放頭181或第二晶粒取放頭182所抓取之晶粒91〇此外，晶圓 承載機構93上之取放機構π依不同之晶粒91特性，將晶粒91自晶圓 承載機構93上取放置緩衝區19中的第一晶粒放置區191或第二晶粒放 置區192 ’當預壓區14之視覺裝置142檢視基板90上之標示碼顯示為 有問題之基板’即由第二晶粒取放頭182自第二晶粒放置區192抓取有 問題的晶粒放置於承載台15上，再透過承載台15移動至預壓區14之 基板90下方後將晶粒由下往上黏合至基板9〇。同樣地，當預壓區14 之視覺裝置142檢視基板90上之標示碼顯示為正常之基板時，即由第 一晶粒取放頭181自第一晶粒放置區191抓取正常的晶粒放置於承載台 15上’再透過承載台15移動至預壓區14之基板9〇下方後將晶粒由下 往上黏合至基板90 ’完成預壓之基板9〇藉由基板傳輸機構u移動至 壓合區16以完成黏晶製程。 在先前技術中，基板90透過預壓區14的視覺裝置142檢測後，根 據基板90結果再由不同的晶粒取放頭至緩衝區19抓取晶粒，故當基板 9〇進入預壓區14時，需等待視覺裝置142檢測及晶粒取放頭之動作， 使得製程時間延長造成機台產能無法提升。V. New description: [New technology field] This is a semiconductor device, especially a semiconductor device package for die bonding (11613011 (11哗) process. [Prior Art] Package in semiconductor components In the process, after the wafer is cut by the cutter to form independent dies, the die is removed from the wafer by the pick-and-place mechanism and placed on the lead frame or the printed circuit board, and then bonded and pressed to complete the die bond. Please refer to FIG. 1A, which is a schematic diagram of the main components of the prior art of a semiconductor component packaging device. The substrate 90 enters the substrate transfer mechanism n from the feed cassette 12, and the substrate transfer mechanism 11 S is provided with a track 111 and is provided by the track 111. The substrate 90 is transferred to the preheating zone 丨3, and is heated to a certain temperature in the preheating zone 13 and then transferred to the preloading zone 14. The preloading zone 14 is provided with a preloading mechanism 14 and a visual device 142 and a carrying platform 15, visual The device 142 is configured to view the marking code on the substrate 90 and the alignment between the substrate 90 and the pre-pressing mechanism 141. The loading platform 15 is configured to receive the first die pick-and-place head 181 or the second die pick-and-place head 182. Grain 91 In addition, the pick-and-place mechanism π on the wafer carrier mechanism 93 takes the die 91 from the wafer carrier mechanism 93 into the first die placement region 191 or the second crystal in the buffer region 19 according to the characteristics of the die 91. The particle placement zone 192' when the visual device 142 of the pre-compression zone 14 inspects the substrate on the substrate 90 as a problematic substrate, i.e., the second die pick-and-place head 182 grabs the second die placement zone 192. The die is placed on the carrier 15 and then moved through the carrier 15 to the underside of the substrate 90 of the pre-compression zone 14 to bond the die from bottom to top to the substrate 9. Similarly, the visual device of the pre-compression zone 14 When the marking code on the substrate 90 is displayed as a normal substrate, the first die picking and placing head 181 grabs the normal die from the first die placing area 191 and places it on the carrying platform 15 're-transmitting the carrying platform. After moving to the lower surface of the substrate 9 of the pre-pressing region 14, the die is bonded from the bottom to the top of the substrate 90'. The pre-pressed substrate 9 is moved to the nip 16 by the substrate transfer mechanism u to complete the die bonding process. In the prior art, after the substrate 90 is detected by the visual device 142 of the pre-compression zone 14, The result of the board 90 is further grabbed by the different die pick-and-place heads to the buffer zone 19, so that when the substrate 9 turns into the pre-pressing zone 14, it is necessary to wait for the visual device 142 to detect and remove the die pick-up head, so that the process The extension of time will not increase the capacity of the machine.
此外，由於在一片晶圓94裡，有問題的晶粒比例並不高，因此在 製程過程中’若單片晶圓94中有問題的晶粒已被抓取完畢，而視覺裝 置142又檢測到有問題的基板時，必須將另外一片晶圓裝載至晶圓承載 機構93上以抓取有問題的晶粒，之後將該片晶圓卸載再將原本的晶圓 94重新裝載至晶圓承載機構93以繼續抓取其餘正常的晶粒，如此反覆 進仃晶圓94的裝載需要花費大量時間，因此對產能造成極大的影響。 睛參閲第1B圖，係習知技術軌道調整示意圖，由於各種晶粒所適 用的基板大小不同，因此需調整基板傳輸機構上之軌道111寬度，在習 技術中軌道111寬度之基準設置於兩執道之中央，故在調整軌道111 之寬度時需同時調整兩軌道之位置(如第lc圖所示)，因此承載台15移 2的行^需同步進行調整’造成每當不同大小之基板90要上機前，需 *費大s的時間進行機台的調校，使得機台利用率降低。In addition, since the problematic grain ratio is not high in one wafer 94, if the problematic die in the single wafer 94 has been captured during the process, the visual device 142 detects When the problematic substrate is reached, another wafer must be loaded onto the wafer carrier 93 to capture the problematic die, after which the wafer is unloaded and the original wafer 94 is reloaded to the wafer carrier. The mechanism 93 continues to capture the remaining normal dies, so that it takes a lot of time to reload the wafer 94 and thus has a great impact on throughput. Referring to FIG. 1B, it is a schematic diagram of the conventional track adjustment. Since the size of the substrate to which the various crystal grains are applied is different, the width of the track 111 on the substrate transfer mechanism needs to be adjusted. In the prior art, the reference of the width of the track 111 is set to two. In the center of the obedience, when adjusting the width of the track 111, it is necessary to adjust the position of the two tracks at the same time (as shown in Figure lc), so the rows of the transfer table 15 need to be adjusted synchronously 'caused each time a different size of the substrate Before going to the machine, it is necessary to adjust the time of the machine to make the utilization of the machine lower.
絡-、# 續射半導體元件封裝設射尚設置有赫模組(: 設置於在遠離晶圓承載機構93之—側，用以清潔晶粒細 二^ 嫩_，網要將_ 增加以致雜均料雜，㈣也使維修啦 4 CS ] 【新型内容】 為克服上述缺點，本創作提供一種半導體元件封裝設備，包含有控 制模組及基板輸送機構’其中基板輸送機構包含有預熱區、預檢區、預 壓(pre-bond)區與壓合區(main-bond)等區段。基板輸送機構用以承載基 板沿該等區段移動，各基板上的適當位置設有標示碼，標示基板的第一 特性與第二特性。預熱裝置設置於預熱區，當基板被輸送至預熱區時， 將基板加熱至一預設之溫度；基板預檢機構設置於預檢區，當基板被輸 送至預檢區時，用以檢出基板的標示碼，並將標示碼傳輸至控制模組。 承載台，可承接一晶粒並移動至預壓區之該基板傳輸機構下方。晶粒預 壓機構設置於預壓區，當基板被輸送至預壓區時，承載台將晶粒向上移 送並黏合至基板的下方且持續一預設之預壓時間，使晶粒暫時性地黏合 於基板。至少一晶粒壓合機構設置於壓合區，當基板被輸送至該壓合^ 時’用以同時壓合晶粒與基板且持續一預設的壓合時間。晶圓承載機構 用以承載包含有複數個晶粒的晶圓，其中無標示碼之晶粒具有第一特 性’有標示碼之晶粒具有第二特性。晶粒備載機構用以承載複數個具有 第二特性的晶粒。晶粒取放機構用以將—晶粒自該晶圓承載機構或自、 粒備載機構觀至承載台’當麵區·板具#第—雜時，控制模組 操控晶粒取放機構自晶圓承載機構取得具有第一特性的晶粒，再移送至 承載。田預壓區的基板具有第二特性時，控麵組操控晶粒取放機構 自晶圓承載機構或自晶粒備載機構取得具有第二特性的晶粒，再移送至 承載台。上述第-躲與第二特性侧以表達各種特性或用途例如第 -特性代表良品、第二特性代表不良品；第—特性代表某一種用途、第 二特性代表另一種用途等。 此外’本創狀半導件職設财基缝秘翁—步包含有 第-執道、第二軌道、複數個滚輪組以及至少—個驅動裝置，第一軌道 及第二執道之_可絲从小物輕，翻紅基料帛二軌 M381173 道為準。 再者，本創作之半導體元件封裝設備憎 -側進-步設置有細清潔晶粒壓合機構^承載機構之 因此，本創作之主要目的，係提供一種半 壓區之前設置有絲膽顧呵册級上讀=、福，在預 組，由晶粒取放機構自晶圓承載台抓取可對雜板广②至控制模 節省麵區所花費的操作時間。 …土板上“碼之晶粒’以 本創作之另一目的，係提供一種半導 載機構，用以放置具有特定特性之晶粒，使得當晶有2粒備 之晶粒抓取完畢後，不需重新裝載另—片晶‘二日粒備 取具有特定特性之晶粒，以節省麵區所花費的操作^間。構中抓 本創作之又-目的，係提供-種半導體元件封 機構中進-步包含有第-軌道及第二軌道 = 二軌道為準，.以節省承載台移動行程及移動時間而執道調整之基準以第 作之再-目的，係提供一種半導體元件封裝設備，於壓合區 罪近晶圓承載機構之一側進一步設置有&冑 護更加方便《。 你痛組，使得機台維修或維络-, #Continuously, the semiconductor component package is also provided with a Hee module (: set on the side away from the wafer carrier 93), used to clean the grain fine ^ ^ _, the network will increase _ to the miscellaneous In order to overcome the above shortcomings, the present invention provides a semiconductor component packaging device including a control module and a substrate transport mechanism, wherein the substrate transport mechanism includes a preheating zone, a pre-detection zone, a pre-bond zone and a main-bond section, etc. The substrate transport mechanism is configured to carry the substrate along the sections, and an appropriate position on each substrate is provided with an identification code. The first characteristic and the second characteristic of the substrate are marked. The preheating device is disposed in the preheating zone, and when the substrate is transported to the preheating zone, the substrate is heated to a preset temperature; the substrate pre-inspection mechanism is disposed in the pre-inspection zone, When the substrate is transported to the pre-detection area, the identification code of the substrate is detected, and the identification code is transmitted to the control module. The carrying platform can receive a die and move to the underlying substrate transport mechanism of the pre-pressing zone. The grain preloading mechanism is disposed in the preloading zone, When the substrate is transported to the pre-pressing zone, the carrier moves the die up and adheres to the underside of the substrate for a predetermined pre-pressing time to temporarily bond the die to the substrate. At least one die press mechanism Provided in the nip area, when the substrate is transported to the pressing, to simultaneously press the die and the substrate for a predetermined pressing time. The wafer carrying mechanism is configured to carry a plurality of crystal grains. a wafer in which the unmarked die has a first characteristic. The die having the identification code has a second characteristic. The die backup mechanism is configured to carry a plurality of crystal grains having the second characteristic. The control module manipulates the die pick-and-place mechanism from the wafer carrier mechanism to view the die from the wafer carrier or the self-grain loading mechanism to the carrying surface. The die having the first characteristic is transferred to the carrier. When the substrate of the field pre-pressing zone has the second characteristic, the control panel handles the die pick-and-place mechanism from the wafer carrying mechanism or the self-grain loading mechanism has the second The characteristic crystal grains are transferred to the carrying table. The second characteristic side is hidden to express various characteristics or uses, for example, the first characteristic represents a good product, the second characteristic represents a defective product, the first characteristic represents a certain use, the second characteristic represents another use, etc. In addition, the present invention is semi-conductive. The stipulations of the stipulations include the first-executive track, the second track, the plurality of roller sets, and at least one driving device. The first track and the second ruling wire are light and red. The base material is the second rail M381173. In addition, the semiconductor component packaging equipment of the present invention is provided with a fine-grained die pressing mechanism and a load-bearing mechanism. Therefore, the main purpose of the present invention is to provide a Before the half-pressure zone is set up with the thread-level reading on the level=, Fu, in the pre-group, the chip pick-and-place mechanism grabs the wafer carrier from the wafer carrier to save the area of the control panel. Operation time. ... "The grain of the code" on the soil plate for the other purpose of the present invention is to provide a semi-conductive mechanism for placing crystal grains with specific characteristics, so that when the crystal has 2 grains of grain After the acquisition is completed, there is no need to reload the other piece. '2nd take tablets prepared with specific characteristics of the crystal grains, the operation in order to save surface area between ^ spent. In order to save the movement and movement time of the carrying platform, the step-by-step includes the first track and the second track = the second track. The basis of the adjustment is to provide a semiconductor component packaging device, which is further provided with a "protection in the nip area on the side of the wafer carrier. You hurt the group, making the machine repair or maintenance
【實施方式】 田於尽劁1 乍係揭露. ......- , π祖卞蚵装設備，其中所利用半導體封 農製程技術’已為侧技術賴具有财域者所能日膽，故以下 之說明’不再作完整描述。同時，町文中所制之圖式，係表達與本 創作特徵有關之示意，並未亦不需要依據實際情形完整繪製，合先敛明。 請同時參考第2鼠第3圖’分別為本創作半導航件封裝設備之 不意圖及局㈣賴。本創作之半導體元件觀設備包含有控制模电 20及基板輸送機構21，基板輸送機構21包含有預熱區22、預檢區η、 6 [S ] M381173 預壓區24與壓合區26等區段，基板ι〇可藉由基板輸送機構21沿該等 區段移動，各基板10上的適當位置設有標示碼(圖巾未示），標示基板 10的第-特性與第二特性’此第—特性與第二特性係贱表達各種特 性或用途’例如第-特性代表良品、第二特性代表不良品；第一特性代 表某種用帛__特性代表;^-種用途等。此基板1〇可為印刷電路 板或導線架’配合其封裝形式及技術之不同選用。預熱裝置221設置於 預熱區22，當基板10被輸送至預熱區22時，將基板1〇加熱至一預設 之溫度》基板預檢機構231設置於預檢區23，當基板1〇被輸送至預檢 區23時，用以檢出基板1〇的標示碼，基板預檢機構231可為一種視覺 檢測裝置或絲檢置，在此並;^加以限定，其主要魏制以檢測 基板10上位於基板1〇邊緣之標示碼或位於基板1〇内部之標示碼，以 判別基板1G之雛，再將卿之結果回傳至測歡2()。承載台25 可承接一晶粒311並移動至預壓區23之該基板傳輸機構21下方。晶粒 預壓機構241設置於讎區24，當基板1〇賭送至預壓區24時，承 載台25將晶粒311向上移送並黏合至基板⑴的下方且持續__預設之預 壓時間，使晶粒311暫時性地黏合於基板1〇 ;預壓區24進一步包含有 第-定位檢測裝置242，第-定位檢測裝置242鄰設於晶粒預檢機構 24卜用錢行晶粒預檢機構241與基板1〇之對位。晶粒壓合機構加 設置於麼合區26，具有至少一壓合模組261及第二定位檢測裝置262， 第二定位檢測裝置262鄰設於壓合模組261，當基板⑴被輸送至該壓 合區26時’第二定位檢測裝置262進行晶粒壓合機構261與基板之 對位，之後晶粒壓合機構261壓合晶粒311與基板1〇且持續一預設的 壓合時間’且使壓合時間大於預壓時間，使晶粒311永久性地點合於基 板10。晶圓承載機構3〇用以承載包含有複數個晶粒3丨丨的晶圓31，各 曰曰粒311具有其對應之標示碼，代表該晶粒3丨1的第一特性與第二特 性’此第-特性與第二特性制以表達滅雜或用途，例如第一特性 7 2良…第—特性代表不良品；第―特性代表某—種用途、第二特性 另-種用途等。晶粒備載麟29用以承載複數個具有帛二特 粗借哉I粒取放機構32，用以將一晶粒311自晶圓承載機構30或自晶 載機構29移送至承載台25，#預龍24的基板1G具有第—特性 一控制模，組20操控晶粒取放機構32自晶圓承載機構3〇取得具有第 一特性的晶粒，再移送至承載台25，當預壓區24的基板⑴具^第二 特叫’控制模組20操控晶粒取放機構32自晶圓承載機構3〇或自晶 粒備載機構29取得具有第u·生的晶粒，再移送至承載台25。此外， 在本創作半導體元件封裝設射之基補倾構^可進—步在兩端設 置進料區(Loader)27及出料區(Uni〇ader)28。 上述半導體元件封裝設備進一步包含有清潔模組4，設置於壓合區 26靠近晶圓承載機構3〇之一側，以便於維修或更換清潔模組‘此外， 晶粒壓合機構261進一步可設置加熱裝置(未圖示），當壓合晶粒311與 基板10時，可同時加熱晶粒311與基板10，使晶粒311與基板1〇間有 更好的黏合效果；再者，在本創作所述之半導體元件設備中之控制模組 20 ’可讀取晶圓31經測試後所得晶圓31中各晶粒311之晶粒特性，再 藉由控制模組20控制晶粒取放機構32抓取配合基板1〇特性之晶粒 31卜 請繼續參考第4圖、第5A圖及第5B圖，係本創作半導體元件封 裝設備局部結構圖及軌道調整示意圖，基板傳輸機構21尚包含第一軌 道210、第二軌道211、複數個滾輪組212及至少一驅動裝置213，其 中第一轨道210與第二軌道211之間距可依基板10之寬度不同而調 整，其調整之基準以第二執道211為準，即第二軌道211為不動、第— 軌道210為可動，故可使承載台25在第一轨道210調整後，仍具有最 小之移動行程。各滾輪組212及驅動裝置213設置於第一軌道210處， 滚輪組212包含有一主動輪2121及一被動輪2122上下相對設置，各主 馬達 利紛僅4本創作實補耐’並糾⑽林辦申請專 施，因此上的也述對於熟知本技術領域之專門人士應可明瞭與實 之精神下所完成的等效改變或修飾， 均應包3於下述之申請專利範圍。 【圖式簡單說明】 ^ 1R =係先讀辨導體元件封1設備主要結構示意圖。 Γ係先前技術半導體元件封裝設備軌道調整前示意圖 前技術半導體元件封奴備軌道調整後示意圖 ==，係袖解物树域轉結構示意圖。 ^ =:係賴料導體轉魄賴娜示意圖。 第5Α F1係本1j作半物$件概賴之減示意圖。 第5BHI ^本創作半導體^件封驗備之紐調整前示意圖 圖，縣_轉紅件封奴備之誠罐後示意圖 【主要元件符號說明】 基板傳輪機構 轨道 進料區 預熱區 預壓區 預壓機構 視覺裝置 11 (先前技術） 111 (先前技術） 12 (先前技術） 13 (先前技術) 14 (先前技術) 141 (先前技術) 142 (先前技％ M381173 承載台 壓合區 壓合機構 取放機構 第一晶粒取放頭 第二晶粒取放頭 緩衝區 第·一晶粒放置區 第二晶粒放置區 控制模組 基板傳輸機構 第一軌道 第二軌道 滾輪組 主動輪 被動輪 驅動裝置 預熱區 預熱裝置 預檢區 基板預檢機構 預壓區 15 (先前技術) 16 (先前技術) 161 (先前技術) 17 (先前技術) 181 (先前技術) 182 (先前技術) 19 (先前技術) 191 (先前技術) 192 (先前技術) 20 21 210 211 212 2121 2122 213 22 221 23 231 24 基板預壓機構 241 第一定位檢測裝置242 承載台 25 壓合區 26 M381173 晶粒壓合機構 261 第二定位檢測裝置262 進料區 27 出料區 28 晶粒備載機構 29 晶圓承載機構 30 晶圓 31 晶粒 311 晶粒取放機構 32 清潔模組 4 基板 90 (先前技術) 晶粒 91 (先前技術) 晶圓承載機構 93 (先前技術) 晶圓 94 (先前技術) 11[Embodiment] Tian Yuxuan 1 乍 system revealed. ......-, π ancestral equipment, which uses the semiconductor sealing technology technology has been the side technology to have the financial domain can be daring Therefore, the following description 'will not be fully described. At the same time, the schemas produced in the towns are expressed in terms of the characteristics of the creations, and they are not required to be completely drawn according to the actual situation. Please also refer to the second mouse, Figure 3, respectively, for the purpose of creating a semi-navigation device packaging device. The semiconductor component device of the present invention comprises a control die 20 and a substrate transport mechanism 21, and the substrate transport mechanism 21 includes a preheating zone 22, a pre-detection zone η, 6 [S] M381173 pre-compression zone 24 and a nip zone 26, etc. The segments, the substrate ι can be moved along the segments by the substrate transport mechanism 21, and an appropriate mark on the substrate 10 is provided with an identification code (not shown) indicating the first-characteristic and second characteristics of the substrate 10. The first characteristic and the second characteristic system express various characteristics or uses, for example, the first characteristic represents a good product, the second characteristic represents a defective product, the first characteristic represents a certain 帛__ characteristic, and the like. The substrate 1 can be a printed circuit board or a lead frame, which is selected in accordance with the package form and technology. The preheating device 221 is disposed in the preheating zone 22, and when the substrate 10 is transported to the preheating zone 22, the substrate 1 is heated to a predetermined temperature. The substrate pre-inspection mechanism 231 is disposed in the pre-detection zone 23, when the substrate 1 is When the crucible is conveyed to the pre-test area 23, the identification code for detecting the substrate 1〇, the substrate pre-inspection mechanism 231 can be a visual inspection device or a wire inspection, and is limited thereto, and the main system is The identification code on the edge of the substrate 1 or the identification code located inside the substrate 1 is detected on the substrate 10 to discriminate the substrate 1G, and the result of the Qing is returned to the test 2 (). The carrier 25 can receive a die 311 and move below the substrate transfer mechanism 21 of the pre-nip 23 . The grain pre-pressing mechanism 241 is disposed in the crotch region 24, and when the substrate 1 is smashed to the pre-pressing region 24, the carrying platform 25 transfers the die 311 upward and adheres to the lower side of the substrate (1) and continues to pre-press Time, the die 311 is temporarily bonded to the substrate 1; the pre-pressing region 24 further includes a first-position detecting device 242, and the first-position detecting device 242 is adjacent to the grain pre-inspection mechanism 24 The pre-inspection mechanism 241 is aligned with the substrate 1A. The die pressing mechanism is disposed on the merging area 26, and has at least one pressing module 261 and a second positioning detecting device 262. The second positioning detecting device 262 is adjacent to the pressing module 261, and when the substrate (1) is transported to The second positioning detecting device 262 performs the alignment of the die pressing mechanism 261 with the substrate, and then the die pressing mechanism 261 presses the die 311 and the substrate 1 and continues for a predetermined pressing. The time 'and the pressing time is greater than the pre-pressing time causes the die 311 to be permanently positioned on the substrate 10. The wafer carrier mechanism 3 is configured to carry a wafer 31 including a plurality of crystal grains 3, each of which has its corresponding identification code, and represents a first characteristic and a second characteristic of the crystal 3? 'The first-characteristic and second-characteristics are used to express miscellaneous or use, for example, the first characteristic 7 2 is good... the first characteristic represents a defective product; the first characteristic represents a certain use, the second characteristic is another use, and the like. The die-loading lining 29 is configured to carry a plurality of pick-and-place gantry pick-and-place mechanisms 32 for transporting a die 311 from the wafer carrier mechanism 30 or the wafer carrier mechanism 29 to the carrier 25 #预龙24's substrate 1G has a first-characteristic-control mode, and the group 20 manipulates the die-pick-and-place mechanism 32 to obtain a die having a first characteristic from the wafer carrier mechanism 3, and then transfers it to the carrier 25 for preloading. The substrate (1) of the area 24 has a second control unit 20 that controls the die pick-and-place mechanism 32 to obtain the dies having the utmost generation from the wafer carrier mechanism 3 or from the die-mounting mechanism 29. To the carrying platform 25. In addition, a loader 27 and a discharge area 28 are disposed at both ends of the substrate assembly of the present invention. The semiconductor component packaging device further includes a cleaning module 4 disposed on the side of the nip area 26 adjacent to the wafer carrier mechanism 3 to facilitate repair or replacement of the cleaning module. Further, the die pressing mechanism 261 can be further configured. The heating device (not shown) can simultaneously heat the crystal grains 311 and the substrate 10 when the crystal grains 311 and the substrate 10 are pressed together, so that the crystal grains 311 and the substrate 1 have a better bonding effect; The control module 20' in the semiconductor device of the present invention can read the grain characteristics of each die 311 in the wafer 31 after the wafer 31 is tested, and then control the die pick-and-place mechanism by the control module 20. 32 Grab the die 31 with the characteristics of the substrate. Please refer to FIG. 4, FIG. 5A and FIG. 5B for the partial structure diagram and track adjustment diagram of the semiconductor device packaging device. The substrate transfer mechanism 21 still includes a track 210, a second track 211, a plurality of roller sets 212, and at least one driving device 213, wherein the distance between the first track 210 and the second track 211 can be adjusted according to the width of the substrate 10, and the reference of the adjustment is second. Obey 211 is subject to I.e., the second rail 211 is fixed, - of the movable rail 210, it keeps the carrying table 25 after the first adjusting rail 210, still has a minimum of moving stroke. Each of the roller sets 212 and the driving device 213 is disposed at the first track 210. The roller set 212 includes a driving wheel 2121 and a passive wheel 2122 arranged up and down. Each main motor has only 4 pieces of creation and is resistant to the '10' forest. The application for special application, therefore, the equivalent changes or modifications made by the experts who are familiar with the technical field in the spirit of the present invention should be included in the scope of the following patent application. [Simple description of the diagram] ^ 1R = Schematic diagram of the main structure of the device for reading and identifying the conductor component. Γ 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前^ =: The schematic diagram of the conductor is transferred to Lai Na. The fifth ΑF1 is a schematic diagram of the reduction of the cost of the item. 5BHI ^This is a schematic diagram of the adjustment of the semiconductor component seal inspection, the county _ turn red seal seal slaves after the cans schematic diagram [main component symbol description] substrate transfer mechanism track feed zone preheating zone preload Zone Preloading Mechanism Vision Device 11 (Prior Art) 111 (Prior Art) 12 (Prior Art) 13 (Prior Art) 14 (Prior Art) 141 (Prior Art) 142 (Previous Technology % M381173 Bearing Table Pressing Area Pressing Mechanism Pick-and-place mechanism first die pick-and-place head second die pick-up head buffer first die placement zone second die placement zone control module substrate transfer mechanism first track second track roller set drive wheel passive wheel Drive preheating zone preheating device preflight zone substrate pre-inspection mechanism pre-compression zone 15 (prior art) 16 (prior art) 161 (prior art) 17 (prior art) 181 (prior art) 182 (prior art) 19 ( Prior Art) 191 (Prior Art) 192 (Prior Art) 20 21 210 211 212 2121 2122 213 22 221 23 231 24 Substrate Preloading Mechanism 241 First Positioning Detection Device 242 Carrier Table 25 Pressing Area 26 M381173 Die Pressing Mechanism 2 61 Second Position Detection Device 262 Feed Area 27 Drain Area 28 Die Backup Mechanism 29 Wafer Carrier 30 Wafer 31 Die 311 Die Pick and Place Mechanism 32 Cleaning Module 4 Substrate 90 (Prior Art) Grain 91 (Prior Art) Wafer Carrier 93 (Prior Art) Wafer 94 (Prior Art) 11