M3777.03 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關一種發光二極體封裝結構，尤指一種在框 架上方設置一結合有螢光層之透光板，使框架内形成一 真空的封閉空間，以保護發光二極體晶片不受外力或水 氣而影響其發光效率者。 【先前技術】 [0002] 目前市場上具有多個LED (發光二極體）晶片的大功率 LED光源模組中，該等LED晶片之間的間隔距離約在1mm 左右，並以固態封裝的方式，利用自動點膠機將螢光粉 與矽膠或環氧樹脂混合物充填在指定的封裝區域，如第3 、4圖所示，該混合物al於固化後包覆LED晶片a2及焊接 LED晶片a2的金線a3或金球等導體，並防止LED晶片a2因 長時間暴露在大氣中，受到水氣或其他環境中的化學物 質影響而老化衰退。 [0003] LED光源模組在提高輸入功率及照明亮度的同時，將伴隨 產生更多的熱能。然而，當上述採固態封裝方式的大功 率LED光源模組在低溫環境中使用時，LED晶片在電源導 通的狀態下會將電能轉換為熱能並產生高溫，使包覆LED 晶片的矽膠因高溫而膨脹，並在電源切斷時使矽膠因溫 度降低而縮小，造成矽膠所包覆的金線及金球在矽膠多 次的熱漲冷縮後開始鬆動，最後造成金線及金球斷裂， 讓LED光源模組無法正常作動。 [0004] 另外，由於上述螢光粉與矽膠混合物係直接與LED晶片接 表單编號A0101 第3頁/共10頁 M377703 觸，使螢光粉及矽膠因直接受到LED晶片所產生的高溫影 響而老化變質，不但影響到led光源模組的發光特性，也 引發LED的亮度衰減。再者’上述螢光粉與矽膠混合物 在烘烤固化後，其中的矽膠並未完全的硬化，而仍保有 相當的柔軟度，因此在使用及組裝的過程中，容易因外 來的碰撞而受損。 [0005] 因此，為了改善上述之缺點，使發光二極體封震結構中 的金線及金球不受螢光粉及矽膠混合物的熱漲冷缩而景多 響使用壽命，並防止螢光粉及矽膠混合物老化變質而提 高其光學特性，創作人積多年的經驗及不斷的研發改進 ，遂有本創作之產生》 【新型内容】 [0006] 本創作之主要目的在提供一種發光二極體封裝結構，藉 由在基板的框架頂部設置一具有營光層的透光板，使框 架内形成真空的封閉空間，俾能於LED晶片發光發熱時， 保護LED晶片不受空氣及濕氣的影響而降低其發光效率， 並防止螢光層與LED晶片直接接觸而老化變質，以增加其 使用壽命及發光特性。 [0007] 本創作之次要目的在提供一種發光二極體封裝結構，藉 由將螢光層均勻塗覆於框架頂部的透光板上，俾能於框 架内的LED晶片發光時，使光線均勻散射出透光板，以得 到穩定的發光特性。 [0008] 為達上述之目的，本創作所設之發光二極體封裝結構係 包括一基板、至少一發光二極體晶片、一透光板及—螢 表單编號A0101 第4頁/共1〇頁 M3777.03 光層，其中該基板上設有一框架，該至少一發光二極體 晶片係於該框架内結合在基板上，而該透光板係設置於 上述框架的頂部，使框架内形成一封閉空間，且該螢光 層係設置於透光板遠離封閉空間的一側。 [0009] 實施時，該螢光層係包括矽膠及螢光粉。 [0010] 實施時，該螢光層係以印刷的方式塗覆於該透光板上。 [0011] 實施時，該封閉空間内係呈真空狀態。 [0012] 實施時，該透光板係為一光學玻璃或一透鏡。 [0013] 實施時，該基板係由銅合金或陶瓷製成。 [0014] 實施時，該框架係由鋁合金製成。 [0015] 為進一步了解本創作，以下舉較佳之實施例，配合圖式 、圖號，將本創作之具體構成内容及其所達成的功效詳 細說明如后： 【實施方式】 [0016] 請參閱第1、2圖，其為本創作發光二極體封裝結構之一 實施例，包括一基板11、複數個發光二極體晶片12、一 透光板13及一螢光層14。 [0017] 該基板11係由銅合金或陶瓷所製成，該基板11的上方設 有一鋁合金製成的框架111，供該等發光二極體晶片12於 該框架111内結合在基板11上，且該等發光二極體晶片12 係藉由金線121而與一電路板的封裝管腳相連接（圖中未 示）。 表單編號A0101 第5頁/共10頁 tools] 該框架in的頂部内緣設有一容置槽，供該透光板13嵌置 於該容置槽内，使該透光板13、框架111及基板11共同形 成一封閉空間15。 [〇〇19] 該螢光層14係為矽膠及螢光粉所組成之混合物，其以絲 網印刷的方式塗覆於該透光板13的一侧面上，於該透光 板13嵌置在鋁合金框架111的頂部時，該螢光層14係設置 於透光板13的頂面，以隔離螢光層14與該等發光二極體 晶片12。 [0020] 實施時’該透光板13係為一光學玻璃或透鏡’且透光板 13、框架111及基板11所共同形成的封閉空間15内係呈 真空狀態，使該等發光二極體晶片12及金線121可完全受 到透光板13的保護而與外界隔離。 [0021] 因此，本創作具有以下之優點： [0022] 本創作之螢光層係設置於透光板遠離真空封閉空間的一 ... · 側’以完全與發光二極體晶片隔離開，避免螢光粉及石夕 膠直接接觸到高溫的發光二極體晶片而老化或變質，以 維持發光二極體於封裝後的發光特性。 [0023] 本創作之螢光層係以絲網印刷的方式塗覆於透光板上， 以在透光板上得到一厚度均勻的螢光層，使發光二極體 晶片的光線更均勻的散射出透光板’且營光層的熱張冷 縮並不會影響到金線或其他導體的正常運作，以得到穩 定的發光特性，並維持成品良率。 [〇〇24]本創作之發光二極體晶片、金線或其他與發光二極體晶 片連結的導體係完全受到高透光率的透光板的保護而與 表單編號A0101 第6頁/共10頁 M377703 [0025]M3777.03 V. New Description: [New Technology Field] [0001] This creation relates to a light-emitting diode package structure, especially a light-transmitting plate with a fluorescent layer disposed above the frame to make the frame A vacuum enclosed space is formed to protect the light-emitting diode chip from external force or moisture to affect its luminous efficiency. [Prior Art] [0002] In the high-power LED light source module having a plurality of LED (light-emitting diode) wafers on the market, the distance between the LED chips is about 1 mm, and the package is solid-state. Filling the phosphor powder with the silicone or epoxy resin mixture in a specified package area by using an automatic dispenser, as shown in Figures 3 and 4, the mixture a is coated with the LED wafer a2 and the LED chip a2 after curing. A conductor such as a gold wire a3 or a gold ball prevents the LED chip a2 from being exposed to the atmosphere for a long time, and is aged and deteriorated by the influence of chemicals in water vapor or other environments. [0003] The LED light source module will generate more thermal energy while increasing input power and illumination brightness. However, when the high-power LED light source module adopting the solid-state packaging method is used in a low-temperature environment, the LED chip converts the electric energy into heat energy and generates a high temperature when the power source is turned on, so that the silicone coated with the LED chip is high in temperature. Swelling, and when the power is cut off, the silicone rubber shrinks due to the temperature drop, causing the gold wire and the gold ball covered by the silicone rubber to loosen after the heat expansion and contraction of the silicone rubber, and finally causing the gold wire and the gold ball to break, let The LED light source module cannot be operated normally. [0004] In addition, since the above-mentioned phosphor powder and silicone mixture are directly contacted with the LED chip, Form No. A0101, Page 3 of 10, M377703, so that the phosphor powder and the silicone rubber are directly affected by the high temperature generated by the LED chip. Aging deterioration, not only affects the lighting characteristics of the LED light source module, but also causes the brightness of the LED to decay. Furthermore, after the above-mentioned mixture of the phosphor powder and the silicone rubber is cured, the silicone rubber is not completely hardened, and still has considerable softness, so that it is easily damaged by external collision during use and assembly. . [0005] Therefore, in order to improve the above-mentioned shortcomings, the gold wire and the gold ball in the light-emitting diode sealing structure are not subjected to the thermal expansion and contraction of the phosphor powder and the silicone rubber mixture, and the service life is increased, and the fluorescence is prevented. The aging and deterioration of the powder and tannin mixture enhances its optical properties. The creator has accumulated many years of experience and continuous research and development, and the creation of this creation. [New content] [0006] The main purpose of this creation is to provide a light-emitting diode. The package structure, by providing a light-transmitting plate with a camping layer on the top of the frame of the substrate, forming a closed space in the frame, and protecting the LED chip from air and moisture when the LED chip emits heat. The luminous efficiency is lowered, and the fluorescent layer is prevented from being directly contacted with the LED wafer to deteriorate and deteriorate, thereby increasing the service life and the luminescent property. [0007] A secondary object of the present invention is to provide a light emitting diode package structure, by uniformly coating a phosphor layer on a light transmissive plate at the top of the frame, and enabling light to be emitted when the LED chip in the frame emits light. The light-transmitting plate is uniformly scattered to obtain stable light-emitting characteristics. [0008] For the above purposes, the LED package structure of the present invention comprises a substrate, at least one LED chip, a light-transmissive plate, and a flashing form number A0101. The light layer of the front page M3777.03, wherein the substrate is provided with a frame, the at least one light emitting diode chip is coupled to the substrate in the frame, and the light transmissive plate is disposed on the top of the frame to make the frame A closed space is formed, and the fluorescent layer is disposed on a side of the light-transmitting plate away from the closed space. [0009] In implementation, the phosphor layer comprises silicone and phosphor powder. [0010] When implemented, the phosphor layer is applied to the light transmissive plate in a printed manner. [0011] When implemented, the enclosed space is in a vacuum state. [0012] When implemented, the light transmissive plate is an optical glass or a lens. [0013] When implemented, the substrate is made of a copper alloy or ceramic. [0014] When implemented, the frame is made of an aluminum alloy. [0015] In order to further understand the present invention, the following detailed embodiments, together with the drawings and figure numbers, detail the specific constituent contents of the present creation and the functions achieved by the present invention as follows: [Embodiment] [0016] Please refer to The first and second embodiments are an embodiment of the LED package structure, including a substrate 11, a plurality of LED chips 12, a light-transmitting plate 13, and a phosphor layer 14. [0017] The substrate 11 is made of a copper alloy or a ceramic. The substrate 11 is provided with a frame 111 made of an aluminum alloy, and the LEDs 12 are bonded to the substrate 11 in the frame 111. The LED chips 12 are connected to the package pins of a circuit board by gold wires 121 (not shown). Form No. A0101 Page 5 of 10 tools] The top inner edge of the frame is provided with a receiving groove for the light-transmitting plate 13 to be embedded in the receiving groove, so that the light-transmitting plate 13, the frame 111 and The substrates 11 together form a closed space 15. [〇〇19] The phosphor layer 14 is a mixture of silicone and phosphor powder, which is applied to one side of the light-transmitting plate 13 by screen printing, and is embedded in the light-transmitting plate 13 At the top of the aluminum alloy frame 111, the phosphor layer 14 is disposed on the top surface of the light-transmitting plate 13 to isolate the phosphor layer 14 from the light-emitting diode chips 12. [0020] In the implementation, the light-transmissive plate 13 is an optical glass or a lens, and the closed space 15 formed by the light-transmitting plate 13, the frame 111 and the substrate 11 is in a vacuum state, so that the light-emitting diodes are The wafer 12 and the gold wire 121 can be completely protected from the outside by the protection of the light-transmitting plate 13. [0021] Therefore, the present invention has the following advantages: [0022] The fluorescent layer of the present invention is disposed on the light-transmitting plate away from the vacuum enclosed space... the side is completely separated from the light-emitting diode wafer. It is avoided that the phosphor powder and the Shiqi gum are directly contacted with the high-temperature LED chip to deteriorate or deteriorate, so as to maintain the light-emitting characteristics of the LED after packaging. [0023] The fluorescent layer of the present invention is applied to the light-transmitting plate by screen printing to obtain a uniform thickness of the fluorescent layer on the light-transmitting plate, so that the light of the light-emitting diode wafer is more uniform. The scattering of the light-transmitting plate' and the thermal stretching of the camping layer do not affect the normal operation of the gold wire or other conductors to obtain stable light-emitting characteristics and maintain the yield of the finished product. [〇〇24] The light-emitting diode chip, gold wire or other guiding system connected to the light-emitting diode chip of the present invention is completely protected by the light-transmitting plate with high light transmittance and the form number A0101 page 6 / total 10 pages M377703 [0025]
[0026] [0027] [0028] [0029][0029] [0029] [0029]
[0030] [0031] [0032] [0033] [0034] 外界隔離，且該框架内呈真空狀態的封閉空間可避免發 光二極體晶片受潮濕、靜電或腐蝕而影響其發光效率， 並保護發光二極體晶片及相關導體不受外力撞擊而損壞 〇 綜上所述，依上文所揭示之内容，本創作確可達到創作 之預期目的，提供一種可保護發光二極體晶片及金線不 受外力或水氣的影響，並可使發光二極體晶片發出穩定 均勻的光線之發光二極體封裝結構，以增進發光二極體 封裝結構的發光效率及使用壽命，極具產業上利用之價 值，爰依法提出新型專利申請。 【圖式簡單說明】 第1圖係為本創作發光二極體封裝結構之上視外觀圖。 第2圖係為第1圖之實施例沿直線a-a’之剖面示意圖。 第3圖係為習知LED光源模組之上視外觀圖。 第4圖係為第3圖沿直線b-b’之剖面示意圖。 【主要元件符號說明】 基板11框架111 發光二極體晶片12金線121 透光板13螢光層14 封閉空間15混合物al LED晶片a2金線a3 表單编號A0101 第7頁/共10頁[0033] [0034] [0034] The external isolation, and the enclosed space in the vacuum state of the frame can prevent the light-emitting diode wafer from being affected by moisture, static electricity or corrosion, and the luminous efficiency is protected, and the light-emitting efficiency is protected. The diode chip and related conductors are not damaged by external impact. In view of the above, the creation can achieve the intended purpose of creation, and provide a protection for the LED chip and the gold wire. A light-emitting diode package structure that is exposed to external force or moisture, and which can emit stable and uniform light of the light-emitting diode chip, to improve the luminous efficiency and service life of the light-emitting diode package structure, and is highly utilized in the industry. Value, 提出Proposed new patent applications in accordance with the law. [Simple description of the figure] The first picture is a top view of the above-mentioned light-emitting diode package structure. Fig. 2 is a schematic cross-sectional view of the embodiment of Fig. 1 taken along line a-a'. Figure 3 is a top view of a conventional LED light source module. Fig. 4 is a schematic cross-sectional view taken along line b-b' of Fig. 3. [Main component symbol description] Substrate 11 frame 111 Light-emitting diode wafer 12 Gold wire 121 Light-transmissive plate 13 Fluorescent layer 14 Closed space 15 mixture al LED wafer a2 Gold wire a3 Form number A0101 Page 7 of 10