五、新型說明： 【新型所屬之技術領域】 本創作係有關於一種散熱器結構改良，尤指一種經由 塑膠散熱體與熱導管之注塑配合，而熱導管直接接觸於熱 源，以有效增加導熱效率，且達到降低成本與減輕重量效 果者之散熱器結構改良。 【先前技術】 按，電子資訊產品（例如：電腦等）之使用日趨普及 且應用更為廣泛，線冑求帶動電？資訊產紐術發展迅 速促使電子>訊朝執行運鼻速度提升、存取容量增加之 趨勢發展，導致在前述電子資訊產品+之零崎於高速運 作時常有高溫伴隨產生。 而發光二極體（LED)係屬冷發光，其係具有耗電量低、 節忐、7L件壽命長、污染低、無須暖燈時間、反應速度快 和效率高之特性’又由於路燈或其照明裝置需要提高較高 的光線照度’因此，通常制高功率之發光二極體作為光 源，藉由施加較高的電流於發光二極體上，已獲得較高的 光線照度。 然而在光線照度提高的同時，無可避免地提高了其所 產生的熱量。若不即時將其產生的熱量排出，不僅容易造 成發光二極翻®赫缝，而導致發光效率的降低，更 可能影響發光二極體的壽命，触LED為主要光源之電子 設備為數外’但卻f蝻在錄效果不狀制缺點， _導致射LED社要歧之電子設備具有雜燒毀、 光衰加速及哥命減低之缺點。 又.閱第卜2圖所示，係為習用散熱器之立體圖 與剖視圖，錄熱器丨主要係—單—金屬材質經加工 而成之散熱體11 ’林散鍾11敍現為巾空環繞形柱 體，並於其散熱體11外側與_延伸有複數散熱鰭片12, 而其散熱鰭片12係為相同於其散熱體11之單-金屬材 質’且與散鋪11為—體成形，但其散熱體u與散熱錯 片12因係使用金屬材質製成，故其材料成本高，且重量較 重’亦此於使用上具有較多之限制，而其散熱器1使用於 led模組進仃散熱時，係將⑽模組組設於散熱體η 一端 緣’並經由其散熱體11與散熱削12進行散熱，但其散 熱體11與散熱鰭片12所使用之單—金屬材質的導熱率較 低，並無法有效傳導Lm)模組之熱量。 以上所述，習知技術中具有下列之缺點： 1.導熱效率低。 2, 材料成本高。 3. 材料重量重。 是以，要如何解決上述習用之問題與缺失，即為本案 之創作人與從事此行業之_猶所魏研歧善之方向 所在者。 【新型内容】 t此，為有效解決上述之問題，本創作之主要目的， 係減-種_料製成之散熱體吨覆有熱導管，藉達到 具有尚導熱效率之散熱器結構改良。 本創作之★要目的’赌供—觀輕整體 器結構改良。 本創作之次要目的，係提供—種具料钱本之散執 器結構改良。 ”' 為達上述目的’本創作係一種散熱器結構改良，該散 熱減構改良係包括-散熱體及至少一熱導管，述散就 體具有一包覆部，而該包覆部兩端緣分別形成有-第一端 緣與-第二魏，又該包覆部於第1緣與第二端緣間之 侧邊具有複數散麟片，而前述熱導管係包覆於包覆部 内，且該熱導管具有一延伸區段、一第一端緣與一第二端 緣，所述延伸區段係容設於包覆部内其第—端緣及第二 端緣係分別接設於第1面與第二稿，又該散熱體係為 -塑穋材質注塑成形，所述該熱導管係經由注塑而包覆於 該散熱體内，故觀本創作之前述散鐘雜導管之相互 包覆配合的設計’不僅具有高導熱效率，且達到減輕整體 重量與節省成本之效果者。 為了使#審查委員能更進一步瞭解本創作特徵及技 術内容’請參閱以下有關本創作之詳細說明與附圖，然而 M377058 所附圖示僅供參考與說明用，並非用來對本創作加以限制。 【實施方式】 本創作之上述目的及其結構與功能上的特性，將依據 所附圖式之較佳實施例予以說明。 月併參閱第3、4圖所示’本創作係一種散熱器结構 改良，在本創作之實施例中，係包括一散熱體2及一熱導 管3，該散熱體2係經由一塑膠材質所注塑成形，故其散 熱體2外型可依據需求注塑成各種形狀，且其塑膠材質係 為可具有導熱效果者，可包括為乙烯龍（UPE)、塑料鋼 (Ρ0Μ )、PETP、尼龍（NYLON )、聚丙烯（PP )、聚乙烯（PE )、 PVDF、鐵氟龍（PTFE)、氯乙烯（pvc )、ABS、強化玻璃（pc)、 PES、壓克力（PMMA)、聚醚醚酮（peek)、PAI其中任一者， 而於本實施例中，其散熱體2係注塑成中空狀圓柱體，該 散熱體2主要係具有一包覆部21，該包覆部21兩端分別 具有第一端面22與第二端面23，該第一端面22與第二端 面23係為平面狀，且該包覆部21於第一端面22與第二端 面23間之内側與外側可同時形成有複數鰭片24，且其鰭 片24亦係經由塑膠材質所注塑成形，而前述熱導管3則經 由塑膠材料注塑而包覆容設於散熱體2内，所述之熱導管 3係具有一第一端緣31、一延伸區段32與一第二端緣33， 其延伸區段32係設置於第一端緣31與第二端緣33間。 於本實施例中’熱導管3之延伸區段32係以螺旋方式 M377058 分別延伸於第-端緣31與第二端緣33，而該第一端緣3i 與第二端緣33分別接設於前述散熱體2之第一端面22及 第二端面23，且其第-端緣31與第二端緣33係分別外露 於所述第-端面22與第二端面23，並且’前述散熱體2 -係為_材質所注塑成形，而導熱管3係為銅金屬材質所 構成，換言之’也就是說該散鐘2之材質触點溫度只 參 要選擇比所述熱導管3之材質的溶點溫度低，即可使散熱 體2包覆於熱導管3外；在本較佳實施例，概熱體2係 以塑膠材質做，惟本創作實際實施時，並不侷限於此， 合先陳明。 * %-併參閱第5、6、7圖所示，其散紐2係可與 模組4相組接，其LED模組4係可裝設於第一端面以或第 二端面23其t之-者’於本實施例中，係將其⑽模組4 ·. 裝設於第二端面23上，使其LED模組4貼覆於第二端面 23上’而其熱導管3之第二端、緣33係外露於第二端面23， 且令其第二端面23同時係貼覆於LED模組4，而當其LED 模組4產生熱量時，得透過熱導管3之第二端緣33直接將 -熱量吸收’並將其熱量經由其延伸區段32送至第一端緣 31:又該散熱體2係包覆於該第-端緣3卜延伸區段32 及第—端緣33 ’因此’其第二端緣33所吸收且傳導至延 伸區心32與第二端緣33之熱量可迅速經由散熱體2進行 散熱，以達到具有高導熱效率之功效’又雜熱體2係為 7 M377058 塑膠材質注塑成形，而該熱導管3係經由注塑而包覆於該 散熱體2内，故其熱導管3所吸收之熱能更能有效導出， 且同時可達到減輕其整體之重量且同時可節省材料成本。 以上所述，本創作係一種散熱器結構改良，其具有下列 之優點： 1. 導熱效率高。 - 2. 降低材料成本。 · 3. 重量輕。 φ 按’以上所述’僅為本創作的一最佳具體實施例，惟 本創作的特徵並不侷限於此，任何熟悉該項技藝者在本創 作領域内’可輕易思及的變化或修飾，皆應涵蓋在以下本 創作的申請專利範圍中。 8 M377058 【圖式簡單說明】 第1圖係為習用散熱器之立體圖。 第2圖係為習用散熱器之剖視圖。 第3圖係為本創作散熱器之立體圖。 第4圖係為本創作散熱器之剖視圖。 第5圖係為本創作散熱器之實施示意圖。 第6圖係為本創作散熱器之實施示意之剖視圖。 第7圖係為本創作散熱器之實施示意之側視圖。 【主要元件符號說明】 熱導管3 第一端緣31 延伸區段32 第二端緣33 LED模組4 散熱體2 包覆部21 第一端面22 第二端面23 縛片24V. New description: [New technical field] The creation department is related to the improvement of a radiator structure, especially the injection molding of a plastic heat sink and a heat pipe, and the heat pipe directly contacts the heat source to effectively increase the heat conduction efficiency. And the radiator structure improvement of the person who achieves the cost reduction and the weight reduction effect. [Prior Art] According to the use of electronic information products (such as computers), the use of electronic information products (such as computers) is becoming more popular and widely used. The rapid development of information technology has prompted the development of electronic transmission speed and increased access capacity, which has led to the occurrence of high temperatures in the above-mentioned electronic information products + zero-speed operation. The light-emitting diode (LED) is a cold light-emitting device, which has the characteristics of low power consumption, thrift, long life of 7L parts, low pollution, no need for warming time, fast reaction speed and high efficiency. The illuminating device needs to increase the illuminance of the light. Therefore, a high-powered light-emitting diode is usually used as a light source, and a higher illuminance has been obtained by applying a higher current to the light-emitting diode. However, as the illuminance of the light increases, the amount of heat generated is inevitably increased. If the heat generated by the heat is not immediately discharged, it is not only easy to cause the light-emitting diode to sew, but the luminous efficiency is lowered, which is more likely to affect the life of the light-emitting diode. The electronic device that touches the LED as the main light source is a few. However, the flaws in the recording effect are not constrained, and the electronic equipment that causes the LED to be disambiguated has the disadvantages of miscellaneous burning, accelerated light decay, and reduced fate. Also, see the picture shown in Figure 2, which is a perspective view and a cross-sectional view of the conventional heatsink. The heatsink is mainly composed of a single-metal material processed heat sink 11 'Lin Sanzhong 11 is now a towel The cylindrical body has a plurality of heat dissipating fins 12 extending outside the heat dissipating body 11 and the heat dissipating fins 12 are the same as the single metal material of the heat dissipating body 11 and forming a body with the dispersing 11 However, since the heat dissipating body u and the heat dissipating chip 12 are made of a metal material, the material cost is high and the weight is heavy, which is more limited in use, and the heat sink 1 is used in the led mode. When the heat dissipation is performed, the (10) module is disposed on the one end edge of the heat sink η and is dissipated through the heat sink 11 and the heat sink 12, but the heat sink 11 and the heat sink fin 12 are made of a single metal material. The thermal conductivity is low and does not effectively conduct heat from the Lm) module. As described above, the prior art has the following disadvantages: 1. Low thermal conductivity. 2, material costs are high. 3. The material is heavy. Therefore, how to solve the above problems and shortcomings in the past, that is, the creator of the case and the direction of the industry. [New content] In order to effectively solve the above problems, the main purpose of this creation is to reduce the heat sink body made of the material to the heat pipe to improve the heat sink structure with heat conduction efficiency. The purpose of this creation is to gamble for the improvement of the overall structure. The secondary purpose of this creation is to provide a structural improvement of the bulk of the money. "To achieve the above purpose" is a heat sink structure improvement, the heat dissipation reduction improvement system includes a heat sink and at least one heat pipe, and the hollow body has a covering portion, and the two ends of the covering portion are divided into a first end edge and a second Wei are formed, and the covering portion has a plurality of slabs on a side between the first edge and the second end edge, and the heat pipe is wrapped in the covering portion. The heat pipe has an extending portion, a first end edge and a second end edge. The extending portion is received in the covering portion, and the first end edge and the second end edge are respectively connected to the first end edge. On the 1st and the second draft, the heat dissipation system is injection-molded by a plastic material, and the heat pipe is coated in the heat dissipation body by injection molding, so that the above-mentioned scattered bell-shaped conduits of the present invention are mutually coated. The design of the fit 'not only has high thermal conductivity, but also achieves the effect of reducing the overall weight and saving cost. In order to enable the # review committee to further understand the creative features and technical content', please refer to the following detailed description and drawings of this creation. However, the attached figure of M377058 is for reference only. The description and use of the present invention are not intended to limit the present invention. [Embodiment] The above object of the present invention and its structural and functional features will be described in accordance with the preferred embodiments of the drawings. The present invention is a heat sink structure improvement. In the embodiment of the present invention, a heat sink 2 and a heat pipe 3 are formed. The heat sink 2 is injection molded by a plastic material, so the heat sink is formed. 2 The outer shape can be injection molded into various shapes according to the requirements, and the plastic material is heat conductive effect, which can include ethylene dragon (UPE), plastic steel (Ρ0Μ), PETP, nylon (NYLON), polypropylene (PP). , polyethylene (PE), PVDF, Teflon (PTFE), vinyl chloride (PVC), ABS, tempered glass (pc), PES, acrylic (PMMA), polyetheretherketone (peek), PAI In the embodiment, the heat dissipating body 2 is injection molded into a hollow cylinder, and the heat dissipating body 2 mainly has a covering portion 21, and the two ends of the covering portion 21 respectively have a first end surface 22 and a first portion The second end surface 23, the first end surface 22 and the second end surface 23 are planar The cover portion 21 can be formed with a plurality of fins 24 on the inner side and the outer side between the first end surface 22 and the second end surface 23, and the fins 24 are also injection molded by a plastic material, and the heat pipe 3 is The heat pipe 3 has a first end edge 31, an extending portion 32 and a second end edge 33, and the extending portion 32 is disposed. Between the first end edge 31 and the second end edge 33. In the present embodiment, the extension section 32 of the heat pipe 3 extends in the spiral manner M377058 to the first end edge 31 and the second end edge 33, respectively. The first end edge 3i and the second end edge 33 are respectively connected to the first end surface 22 and the second end surface 23 of the heat dissipating body 2, and the first end edge 31 and the second end edge 33 are respectively exposed to the first end edge - end face 22 and second end face 23, and 'the aforementioned heat sink 2 - is formed by injection molding, and the heat pipe 3 is made of copper metal material, in other words 'that is, the material contact temperature of the loose clock 2 It is only necessary to select a temperature lower than the melting point of the material of the heat pipe 3, so that the heat sink 2 can be wrapped around the heat pipe 3; In the preferred embodiment, the heat-generating body 2 is made of a plastic material, but the actual implementation of the creation is not limited thereto. * % - and as shown in Figures 5, 6, and 7, the 2 series can be assembled with the module 4, and the LED module 4 can be mounted on the first end face or the second end face 23 In the present embodiment, the (10) module 4 is mounted on the second end face 23 such that the LED module 4 is attached to the second end face 23 and the heat pipe 3 is The two ends and the edge 33 are exposed on the second end face 23, and the second end face 23 is attached to the LED module 4 at the same time, and when the LED module 4 generates heat, the second end of the heat pipe 3 is transmitted. The edge 33 directly absorbs heat and sends its heat to the first end edge 31 via its extended section 32: the heat sink 2 is wrapped around the first end edge 3 and the extension section 32 and the first end The edge 33 'so the heat absorbed by the second end edge 33 and conducted to the extension core 32 and the second end edge 33 can be quickly dissipated via the heat sink 2 to achieve the effect of high thermal conductivity efficiency. The 2 series is 7 M377058 plastic material injection molding, and the heat pipe 3 is coated in the heat sink 2 by injection molding, so the heat energy absorbed by the heat pipe 3 can be effectively exported, and at the same time, can be reduced. Lighter overall weight while saving material costs. As described above, the present invention is a heat sink structure improvement, which has the following advantages: 1. High heat conduction efficiency. - 2. Reduce material costs. · 3. Light weight. φ according to the above description is only a best embodiment of the present creation, but the features of the creation are not limited thereto, and any one who is familiar with the skill of the artist can easily change or modify in the field of creation. , should be covered in the scope of the patent application below. 8 M377058 [Simple description of the diagram] Figure 1 is a perspective view of a conventional radiator. Figure 2 is a cross-sectional view of a conventional heat sink. The third picture is a perspective view of the creation of the radiator. Figure 4 is a cross-sectional view of the heat sink of the present invention. Figure 5 is a schematic diagram of the implementation of the creation of the heat sink. Figure 6 is a cross-sectional view showing the implementation of the heat sink of the present invention. Figure 7 is a side view of the implementation of the creation of the heat sink. [Main component symbol description] Heat pipe 3 First end edge 31 Extension section 32 Second end edge 33 LED module 4 Heat sink 2 Covering portion 21 First end face 22 Second end face 23 Baffle 24