JP3121676U - Liquid-cooled heat dissipation device - Google Patents

Abstract

Provided is a liquid-cooled heat radiating device that is small and thin in shape, can save space occupied, and solves the problem that a water pipe is effectively pressed during installation and use.
A heat dissipating piece B, a substrate C, and a plurality of screws D are mainly included. Of these, the heat dissipating piece is used to absorb the heat of the heat generating member, and one of the concave shapes is formed on the surface of one side. Or, it is provided with one or more communicating tank parts B2, a plurality of screw holes B1 are opened on the surface, a substrate is installed on the heat dissipation piece, and a plurality of screw holes corresponding to the positions of the plurality of screw holes of the heat dissipation piece A through hole C1 is opened, and a water inlet connector C2 and a water outlet connector C3 communicated with the tank portion of the heat dissipating piece are installed, and a plurality of screws are drilled into the plurality of through holes of the substrate, and a plurality of the heat dissipating pieces are provided on the heat dissipating piece. The substrate and the heat dissipation piece are fixed by being screwed into the screw holes.
[Selection] Figure 2

Description

The present invention relates to a liquid-cooled heat radiating device, and more particularly, to a liquid-cooled heat radiating device used for cooling a heat generating member, whose shape is small and thin, and can save space for occupation. The present invention relates to a liquid-cooled heat dissipation device that solves the problem of being pressed during installation and use.

The current technology is advancing steadily, and integrated circuits and CPUs (Central Processing Unit Central Processing Units) are all progressing with the main goal of high-speed arithmetic processing, but high heat is inevitably generated under the circumstances of high-speed arithmetic processing. Since the temperature rise due to heat is directly proportional to the calculation processing speed of the CPU, the heat dissipation effect of a general conventional fan heat radiating device cannot keep up with the speed of the temperature rise generated under high-speed calculation processing.

Also, most of the general liquid-cooled heat dissipation devices use heat dissipation devices that have a liquid storage space inside them, and the shape of the heat dissipation device becomes larger and thicker due to the installation of the liquid storage space, and it is used with a water pipe connected. When this happens, the water pipe is pressed against the surrounding equipment, causing poor contact, and water leakage is likely to occur from the connector part of the water pipe.

For this reason, how to eliminate the above-mentioned problem is a technical problem solved by the present invention.

An object of the present invention is to provide a liquid-cooled heat radiating device that is small and thin in shape, can save space for use, and solves the problem that the water pipe is effectively pressed during installation and use. is there.

The liquid-cooled heat dissipation device of the present invention mainly includes a heat dissipation piece, a substrate, and a plurality of screws, of which the heat dissipation piece is used to absorb the heat of the heat generating member and is depressed on one surface. A plurality of threaded holes are formed on the surface, the substrate is installed on the heat dissipating piece, and the positions of the plurality of screw holes of the heat dissipating piece are provided. A plurality of through-holes corresponding to the heat-dissipating piece, a water inlet connector and a water outlet connector communicating with the tank portion of the heat dissipating piece are installed, and the plurality of screws are drilled into the plurality of through-holes of the substrate. The substrate and the heat dissipating piece are fixed by being screwed into a plurality of screw holes provided on the piece.

In order to clearly show the inventive step and practicality of the present invention, the analysis will be made in comparison with the conventional product.
《Disadvantages of conventional products》
First, the heat radiation device of the liquid cooling type heat radiation device occupies a space easily.
Second, receiving the first point, the connected water pipe is easily pressed against the peripheral equipment and easily causes poor contact.
Third, receiving the second point, the water pipe tends to leak from the connector part.
<Advantages of the present invention>
1. This heat radiating device uses the tank portion of the heat radiating piece as a space for heat exchange of the liquid, can reduce the shape of the heat radiating device, and can effectively save the use of space.
Second, receiving the first point, the connected water pipe is difficult to be pressed to the peripheral equipment.
Third, receiving the second point, can effectively prevent the leakage of water pipe.
Fourth, it has inventive step and practicality.
5. Improve industrial competitiveness.

Hereinafter, the present invention will be described in detail based on the drawings, symbols, and embodiments. As shown in FIGS. 1 and 2, the structure of the liquid-cooled heat dissipating device of the present invention is that the heat dissipating device A is mainly composed of a heat dissipating piece B, a substrate C and a plurality of screws D. Screw hole B1 is formed, and one or more recessed tank parts B2 are provided on one surface, and a substrate C is installed on the heat dissipation piece B. A plurality of through holes C1 are opened and correspond to the positions of the plurality of screw holes B1, and screws D are respectively inserted into the plurality of through holes C1 and screwed into the plurality of screw holes B1. Among them, a water inlet connector C2 and a water outlet connector C3 are further installed on the substrate C, and the water inlet connector C2 and the water outlet connector C3 are respectively communicated with the tank portion B2 of the heat radiating piece B. .

A pad ring B3 is further disposed between the heat dissipation piece B of the heat dissipation device A and the substrate C to increase the sealing property between the heat dissipation piece B and the substrate C, and the heat dissipation piece B is used to absorb heat of the heat generating member. The basin B2 provided in a concave shape on the surface is used as a space for heat exchange of liquid between the water inlet connector C2 and the water outlet connector C3, and the shape of the heat dissipation device A can be formed small and thin, Space can be saved.

As shown in FIGS. 3, 4, and 5, the method of implementing the liquid-cooled heat radiating device of the present invention causes the heat radiating device A to adhere to the heat generating member E. The heat generating member E is an integrated circuit, a CPU (Central Processing Unit), a storage device, a light emitting device, a transformer, and a related heat generating device. A water pipe F is connected to each of the water inlet connector C2 and the water outlet connector C3 of the heat radiating device A, and the water pipe F is further connected to the motor equipment G, the tank equipment H, and the heat radiating equipment I to form one connected path. . As a result, when the motor equipment G is driven to start operation, the liquid in the tank equipment H circulates and flows through this path.

The heat radiating device A absorbs heat generated by the heat generating member E, the liquid flowing in from the water inlet connector C2 cools in the tank B2 of the heat radiating piece B, and then the heated liquid radiates heat from the water outlet connector C3. It is discharged to the facility I to dissipate heat. Thus, while repeatedly circulating, the heat absorbed by the heat radiating piece B is carried and the temperature of the heat generating member E is quickly lowered. Among these, the heat dissipation facility I performs a heat dissipation operation by combining the heat dissipation piece I1 and the heat dissipation fan I2.

Further, the heat dissipation piece B can be made of copper, aluminum, alloy, ceramic and related thermal conductivity, and can be made of a material having an excellent heat dissipation effect.

The description given above is based on the best embodiment of the present invention, and does not limit the patent scope of the present invention. The structure for obtaining the equivalent effect by using the contents of the specification and drawings of the present invention is directly described. Anything indirectly applied to other related technical fields is considered to be included in the scope of the gist of the present invention.

As described above, the present invention can achieve the effect of surely enhancing the structure under a structure that breaks down the prior art, and can be easily understood even by a person who is not familiar with the related art, Furthermore, since the present invention has never been published before its filing, and its inventive step and practicality satisfy the requirements for a utility model registration application, a utility model registration application is filed here under the law.

It is a three-dimensional view of the present invention. It is a three-dimensional exploded view of the present invention. It is the solid figure 1 which shows the state at the time of use of this invention. It is the three-dimensional view 2 which shows the state at the time of use of this invention. It is the three-dimensional view 3 which shows the state at the time of use of this invention.

Explanation of symbols

A Heat dissipation device B Heat dissipation piece B1 Screw hole
B2 Tank B3 Pad ring C Substrate
C1 Through hole
C2 Water inlet connector C3 Water outlet connector D Screw E Heat generation member F Water pipe G Motor equipment H Tank equipment I Heat radiation equipment I1 Heat radiation piece I2 Heat radiation fan

Claims (5)

It mainly includes a heat dissipating piece, a substrate, and a plurality of screws. Among them, the heat dissipating piece is used to absorb the heat of the heat generating member, and one or more communication parts that are depressed on the surface of one side. A plurality of screw holes are formed on the surface, the substrate is installed on the heat radiating piece, and a plurality of through holes corresponding to positions of the plurality of screw holes of the heat radiating piece are formed. In addition, a water inlet connector and a water outlet connector communicated with the tank portion of the heat dissipating piece are installed, and the plurality of screws are drilled in the plurality of through holes of the substrate, and in the plurality of screw holes provided on the heat dissipating piece. A liquid-cooled heat radiating device that is screwed to fix the substrate and the heat radiating piece. The heat dissipation device further includes a pad ring, and the pad ring is disposed between the heat dissipating piece and the substrate to increase a sealing property between the heat dissipating piece and the substrate. Liquid cooling type heat dissipation device. The liquid-cooled heat radiating device according to claim 1, wherein a water inlet connector of the substrate is configured to communicate with the water outlet connector through a tank portion of the heat radiating piece. The liquid-cooled heat radiating device according to claim 1, wherein the heat radiating piece is made of copper, aluminum, alloy, ceramic and a material having high heat conductivity and an excellent heat radiating effect. 2. The liquid cooling type heat radiation according to claim 1, wherein the heat generating member is an integrated circuit, a CPU (Central Processing Unit), a storage device, a light emitting device, a transformer, and a related heat generating device. apparatus.

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