五、新型說明： 【新型所屬之技術領域】 一種散熱鰭片結構及其散熱模組’尤指一種得強化自然對 流效果的散熱韓片結構及其散熱模組。 【先前技術】 按，隨著半導體技術的進步，積體電路的體積亦逐漸縮 小’而為了使積體電路能處理更多的資料，相同體積下的積體 电路’已終以容齡雜多上數倍以上的元件，當積體電路 内的元件數量越來越多時，元件工作時所產生的熱量亦越來越 大，以常見的中央處理器為例，在高滿載的工作量時，中央處 理器的散發出的熱度，足以使中央處理器整個燒毀，因此，積 體電路的散熱裝置變成為重要的課題。 而一般的散熱器大多透過高導熱係數的金屬材質來製造 並以平面的則型態來增加触面積，且同時為了提高散熱效 果則會透過熱導管來加速齡熱量’峨止積體電路產品燒 燬。 凊參閱第1圖所示，係為習知散熱模組之立體組合圖，如 s斤示所述放熱模組具有複數熱導管η、複數散熱籍片 u及一基座13,該等熱導管u具有一吸熱端U1及一散熱端 112 ’而該等散熱鰭片12整體係呈現為水平之片體狀，且各散 熱鰭片12由熱導管u之散熱端112串接並使各散熱縛片12 相互間隔堆4 ’而於其間隔處形成有-水平散熱流道m，且 該熱導管11之吸熱端111係嵌設於所述基座13 ; 進而經由其吸熱端111吸收基座13由一發熱元件所產生 之熱量，且其吸熱端111將其吸收之熱量傳送至散熱端112， 再由其散細4 12魏其散熱端112之熱量並由水平散熱流 道121向外導出，藉以達到散熱之目的； 所述散熱鰭片12進行自然冷卻導出熱量時，其僅分別 位於頂部與底狀散熱則12散熱效果最佳，其次則為各散 熱鰭片12之最外侧侧邊可進行較佳之散纽果，但其大部分 之熱里則是囤積於該水平散熱流道12丨内，尤其在所述熱導管 1串接所述政熱鰭片12位置處，其熱囤積之情況是更佳嚴 重’因此，該習知之散熱模組10在自然冷卻效率差且散熱效 能大幅降低’欲達_同之散姐細必須增加其散熱轉片使 用之表面面積與散熱風扇之設置，進而造成散熱模組1〇重量 增加與材料成本提高之問題；故習知技術具有下列缺點： 1. 自然冷卻效率差； 2. 散熱效率低且容易積熱； 3. 使用重量增加； 4. 材料成本高。 是以，要如何解決上述習用之問題與缺失，即為本案之創 作人與從事此行業之相關廠商所亟欲研究改善之方向 【新型内容】 爰此，為有效解決上述之問題，本創作之主要目的，係提 供種強化自然對流效果的散熱鰭片結構。 自然對流效果的散 本創作另-目的，係提供—種具有加強 熱籍片結構之散熱模組。 為達上述之目的，本創作係提供—種散熱則結構及並散 …、輪，·且，所述散熱鰭月結構，其包含 別且古_哲τ 八匕3本體，該本體兩側分 ” -平面及二平Φ，且該本體 伸有至少一第一上升導流部及 +面側延 主夕¥—上升導流部，該第- 树導流料第二上料流部與第二平_相具有一第一 =角及第一夾角，所述散熱模組係由至少一熱導管以一散熱 端串接所述散熱n>{ ’独—吸熱端容置於—基座之一容置孔 所2形’其中，各相鄰之散熱㈣間於第-平面與第二平面間 界定有至少-水平流道，與於相鄰的第一上升導流部及相鄰的 第'上升料部間具有至少—第—上升流収第二上升流 道’猎此’其散熱‘鰭片導出熱量時，其熱量可透過第一上升流 道及弟二上升流道產生有自然對流，進而提升其散熱模組之自 然冷卻效率與避免積熱’並可減少其散熱則使狀表面面積 以降低重量與材料成本；故本創作具有下列優點： 1.自然冷卻效率提高； 2.散熱效率高且避免積熱； 3·降低使用重量； 4·降低材料成本。 【實施方式】 本幻作之上述目的及其結構與功能上的特性，將依據所附 圖式之較佳實施例予以說明。 明參閱第2A、2B、2C圖所示’係為本創作之散熱鰭片結 構第-實施例之立體示意圖及平面示意圖，所述散_片2〇 具有-本體30，該本體3〇上側及下侧分別具有—第__平面& 及-第二平面32，且該本體30兩端往第—平面Μ方向一侧 。又有至第—上升導流部33及—第二上料流部私，且該 第-上升導流部33與第二平面32之水平線間具有—第一夹角 33卜而該第二上升導流部34與第二平面％之水平線間具有 一第二夾角34卜該第-夾角331及第二夾角341可為3〇度 角至80度角之間，更佳的角度為45度角至即度角之間。 請同時參閱第2Α、3Α及期所示，係為本創作之散熱模 組第一實施例之立體示意圖及平面示意圖，所述散熱模組4〇 具有至少—熱導f 50、複數散熱鰭片20及-基座6〇,該等熱 導管50兩端分別具有一散熱端51及一吸熱端52，該等散熱 …片〇刀另】具有所述本體30，a玄本體3〇兩側具有所述第一 平面31及一第二平面32與兩端具有所述第一上升導流部犯 及第二上升導流部34，且該本體30於第一平面31與第二面 位置處穿透有至少一穿孔35,該等穿孔35係供所述熱導管5〇 之散熱端51穿設，而該基座60具有至少一容置孔61，該容 置孔61係供所述熱導管5〇之吸熱端52容置； 其中所述各相鄰之散熱鰭片20間於第一平面31與第二平 面32間界定有至少一水平流道41，與於相鄰的第一上升導流 部33及相鄰的第二上升導流部34間具有至少—第—上升流道 42及第二上升流道43 ’藉此’其熱導管5〇之吸熱端52吸收 基座60由-發熱元件（财未表示）所產生之熱量後，其吸 熱端52將其吸收之熱量傳送至散熱端5卜再由其散熱端51 貫穿的散熱韓片20吸收其散熱端51之熱量，且其散熱鰭月 20接收其熱量後將其熱量散發至所述水平散熱流道，且其散 發出之熱量便因熱线上升的顧而由兩端之第—上升流道 42與第二上升流道43產生之效應強化自然對流而向外排出， 進而可大幅提升其散熱模組4〇之自然冷卻效率且可避免熱能 囤積在水平散熱流道，並可減少其散熱籍片2〇使用之表面面 積以降低重量與材料成本。 再請參閱第4A、4B及4C圖所示，係為本創作散熱鰭片結 構及散熱模組另一實施例之立體示意圖及平面示意圖，其中所 述散熱韓片20於本體30兩端分別具有所述第一上升導流部 33及第二上料流部34，而該第—上料流部與第二上升 綠部34分別具有複數第一延伸區段微與複數第二延伸區 段342，該等第一延伸區段332相互延伸連接且構成所述第一 上升導流部33，而該等第二延伸區段⑽同樣相互延伸連接 且構成所述第二上升導流部34，使其第一上升導流部犯及第 二上升導流部34呈現弧狀； 而所述熱導管50之散熱端51貫穿有所述複數散熱鰭片 ^40806^- s 51經由熱導管邠之吸慈端52容置於所述基座卯，該等 敖熱鑌片20由所述散熱端^貫穿後界定有所述水平流道仆 亚其相鄰且呈現弧狀之第一上升導流部33間則界定有至現孤 狀之第-上升流道42,而該相鄰且呈現弧狀之第二上升導流 部34間則界定有呈現弧狀之第二上升流道招，其第一上升^ 道犯與第二上升流道43係延伸於所述水平流道41兩端，進 而使所述散鍵組4G可透舰狀之第—上韻道42與第二上 升流道43形成有自然對流空間，同樣可提高其自然冷卻效和 再請參閱第5A及5B圖所示，係為本創作散熱鰭片結構及 散熱模组再-實施例之立體示意圖，本實施例之部分結構及技 術特徵係與前述第-實施術目同故在此將不膽述，惟本實施 例與第-實施例之不同處係為本實施例所述散熱趙片2〇之本 體30兩端分別具有所述第一上升導流部33及第二上升導流部 34外，其本體30另外兩端更可具有一第三上升導流部36及 -第四上升導流部37，並於相_第三上升導流部％及相鄰 的第四上升導流部37間具有至少一第三上升流道似第四上 升流道45 ’藉此’其散熱則2G接收其熱量後熱量散發 至所述水平机道4卜且其散發出之熱量便因熱空氣上升的原 理而由四端之第-上升流道42、第二上升流道43、第三上升 流道44及第四上升流道45強化自然對流排出，進而提升其散 熱模組40之自然冷較率且可避免熱能關在水平散熱流 道’並可減少其散熱韓片20使用之表面面積以降低重量與材V. New description: [New technology field] A heat sink fin structure and its heat dissipation module ‘especially a heat sink Korean structure and a heat dissipation module that enhance the natural convection effect. [Prior Art] According to the advancement of semiconductor technology, the volume of the integrated circuit is gradually reduced. And in order to enable the integrated circuit to process more data, the integrated circuit under the same volume has been mixed. When the number of components in the integrated circuit is more than several times, the amount of heat generated during the operation of the component is also increasing. Taking a common CPU as an example, at a high load. The heat generated by the central processing unit is enough to cause the central processing unit to burn out. Therefore, the heat sink of the integrated circuit becomes an important issue. The general heat sinks are mostly made of metal materials with high thermal conductivity and increase the contact area in a flat pattern. At the same time, in order to improve the heat dissipation effect, the heat of the age is accelerated through the heat pipe. . Referring to FIG. 1 , it is a three-dimensional combination diagram of a conventional heat dissipation module. For example, the heat release module has a plurality of heat pipes η, a plurality of heat-dissipating pieces u and a pedestal 13 , and the heat pipes u has a heat absorbing end U1 and a heat dissipating end 112', and the heat dissipating fins 12 are generally horizontally shaped, and the heat dissipating fins 12 are connected in series by the heat dissipating end 112 of the heat pipe u and each heat dissipating The sheets 12 are spaced apart from each other by a stack 4', and a horizontal heat dissipating flow path m is formed at the interval thereof, and the heat absorbing end 111 of the heat pipe 11 is embedded in the susceptor 13; and the susceptor 13 is absorbed through the heat absorbing end 111 thereof. The heat generated by a heat generating component, and the heat absorbing end 111 transmits the heat absorbed by the heat radiating end to the heat radiating end 112, and then the heat of the heat radiating end 112 is dispersed and outwardly led out by the horizontal heat radiating channel 121. In order to achieve the purpose of heat dissipation; when the heat dissipation fins 12 are naturally cooled and heat are extracted, the heat dissipation effect is best only when the heat dissipation fins 12 are respectively located at the top and the bottom, and the outermost side of each of the heat dissipation fins 12 can be performed. a better dip, but most of it is hoarded in In the horizontal heat dissipation channel 12, especially in the position where the heat pipe 1 is connected in series with the political fin 12, the heat accumulation is more serious. Therefore, the conventional heat dissipation module 10 has a natural cooling efficiency. Poor and heat dissipation performance is greatly reduced. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The technology has the following disadvantages: 1. The natural cooling efficiency is poor; 2. The heat dissipation efficiency is low and it is easy to accumulate heat; 3. The weight is increased; 4. The material cost is high. Therefore, how to solve the above problems and shortcomings, that is, the creators of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement [new content] ,, in order to effectively solve the above problems, this creation The main purpose is to provide a fin structure that enhances the natural convection effect. The purpose of the natural convection effect is to provide a heat-dissipating module with a strengthened thermal film structure. In order to achieve the above purpose, the present invention provides a heat dissipation structure and a dispersion, a wheel, and the heat dissipation fin structure, which includes an ancient and a _ _ τ 匕 匕 3 body, the body is divided into two sides - a plane and a second flat Φ, and the body has at least one first ascending diversion portion and a + surface side extension main ¥ ¥ - ascending diversion portion, the first sap flow material second upper stream portion and The two-level _ phase has a first = angle and a first angle, and the heat dissipation module is connected to the heat dissipation by a heat-dissipating end by at least one heat pipe; the single heat-absorbing end is placed on the pedestal. a accommodating hole 2' wherein each adjacent heat dissipation (four) defines at least a horizontal flow path between the first plane and the second plane, and adjacent first first riser and adjacent 'The at least one of the ascending material portions has at least the first - ascending flow to receive the second ascending flow channel, and the heat is transmitted through the first ascending flow channel and the second rising channel to generate natural convection. , thereby improving the natural cooling efficiency of the heat dissipation module and avoiding heat accumulation, and reducing the heat dissipation to reduce the surface area Weight and material cost; therefore, the creation has the following advantages: 1. The natural cooling efficiency is improved; 2. The heat dissipation efficiency is high and heat accumulation is avoided; 3. The use weight is reduced; 4. The material cost is reduced. [Embodiment] The purpose and the structural and functional characteristics thereof will be described in accordance with the preferred embodiments of the drawings. See FIGS. 2A, 2B, and 2C for the first embodiment of the present invention. A schematic view and a plan view, the scatter sheet 2 has a body 30, and the upper side and the lower side of the body 3 have a __ plane & and a second plane 32, respectively, and the body 30 has two ends - one side of the plane Μ direction. The first to the rising flow guiding portion 33 and the second upper flow portion are private, and the first angle between the horizontal line of the first rising guide portion 33 and the second flat surface 32 is - the first angle And a second angle 34 between the horizontal line of the second rising flow guiding portion 34 and the second plane %, the first angle 331 and the second angle 341 may be between 3 degrees and 80 degrees, and more The best angle is between 45 degrees and the angle of the degree. Please also refer to the 2nd, 3rd and 3rd periods. The schematic diagram and the plan view of the first embodiment of the heat dissipation module of the present invention, the heat dissipation module 4 has at least a thermal conductivity f 50 , a plurality of heat dissipation fins 20 and a pedestal 6 〇, the heat Each of the two ends of the conduit 50 has a heat dissipating end 51 and a heat absorbing end 52, and the heat dissipating dies have a body 30, and the first body 31 has a first plane 31 and a second plane on both sides. 32 and the two ends have the first rising flow guiding portion and the second rising guiding portion 34, and the body 30 penetrates at least one through hole 35 at the first plane 31 and the second surface position, and the through holes 35 The heat dissipation end 51 of the heat pipe 5 is provided, and the base 60 has at least one receiving hole 61 for receiving the heat absorbing end 52 of the heat pipe 5; Between each of the adjacent heat dissipation fins 20, at least one horizontal flow path 41 is defined between the first plane 31 and the second plane 32, and the adjacent first rising flow guiding portion 33 and the adjacent second rising guide The flow portion 34 has at least a first ascending flow channel 42 and a second ascending flow channel 43'. Thereby, the heat absorbing end 52 of the heat pipe 5 吸收 absorbs the susceptor 60. - after the heat generated by the heating element (not shown), the heat absorbing end 52 transmits the absorbed heat to the heat dissipating end 5, and the heat dissipating film 20 penetrated by the heat dissipating end 51 absorbs the heat of the heat dissipating end 51, and The heat-dissipating fin 20 receives its heat and then dissipates its heat to the horizontal heat-dissipating flow path, and the heat radiated by the heat-dissipating fins is increased by the hot-line of the first-upward flow channel 42 and the second upward flow. The effect produced by the channel 43 enhances the natural convection and discharges outward, thereby greatly improving the natural cooling efficiency of the heat dissipation module 4 and avoiding the accumulation of heat energy in the horizontal heat dissipation flow path, and reducing the surface of the heat dissipation film 2 Area to reduce weight and material costs. 4A, 4B, and 4C are schematic perspective and plan views of another embodiment of the heat dissipation fin structure and the heat dissipation module, wherein the heat dissipation film 20 has two ends on the body 30 respectively. The first rising flow guiding portion 33 and the second upper flow portion 34, and the first upper flow portion and the second rising green portion 34 respectively have a plurality of first extending segments and a plurality of second extending portions 342 The first extension sections 332 are connected to each other and constitute the first rising flow guiding portion 33, and the second extending sections (10) are also connected to each other and constitute the second rising flow guiding portion 34, so that The first rising flow guiding portion and the second rising flow guiding portion 34 are arcuate; and the heat radiating end 51 of the heat pipe 50 penetrates through the plurality of heat radiating fins 4080806--s 51 through the heat pipe The pedestal 52 is placed on the pedestal raft, and the enthalpy of the enthalpy 22 is defined by the heat dissipating end to define a first rising diversion portion of the horizontal flow channel adjacent to the arc. The 33rd defines a first-upward flow channel 42 to the solitude, and the adjacent and arc-shaped second ascending guide A portion of the portion 34 defines an arc-shaped second ascending flow path, and the first ascending channel and the second ascending channel 43 extend across the horizontal channel 41, thereby causing the scatter group The 4G can be permeable to the ship--the upper symmetry channel 42 and the second ascending flow channel 43 form a natural convection space, which can also improve its natural cooling effect and then refer to the 5A and 5B drawings. The structure and technical features of the embodiment and the technical features of the present embodiment are the same as those of the first embodiment, but the present embodiment and the first embodiment are not described here. The two parts of the main body 30 of the heat dissipating slabs of the present embodiment have the first rising flow guiding portion 33 and the second rising flow guiding portion 34 respectively, and the other ends of the main body 30 may have one more The third ascending diversion portion 36 and the fourth ascending diversion portion 37 have at least one third ascending flow path between the phase_third ascending diversion portion % and the adjacent fourth ascending diversion portion 37 Four ascending flow paths 45 'by this', the heat dissipation is 2G after receiving its heat, and the heat is dissipated to the horizontal path 4 The emitted heat is enhanced by the four-end first-upflow passage 42, the second ascending flow passage 43, the third ascending flow passage 44, and the fourth ascending flow passage 45 by the principle of the rising of the hot air, thereby enhancing the natural convection discharge. The heat dissipation module 40 has a natural cold ratio and can prevent thermal energy from being shut off in the horizontal heat dissipation flow path' and can reduce the surface area of the heat sink 40 used to reduce the weight and material.