TWM553442U - Heat dissipation structure applying Venturi chimney effect - Google Patents

Description

Heat dissipation structure using cypress hard chimney effect

The present invention relates to a heat dissipating structure, in particular to a heat dissipating channel of a heat dissipating substrate, which is provided with an appropriate proportion of a wide and narrow channel design. When combined with a heat source application, a wide and narrow channel design of the heat dissipating channel is formed to form a cypress effort effect. A heat dissipation structure that uses a chimney effect to generate a chimney-type heat rejection effect and achieve a rapid heat dissipation effect.

In order to reduce the huge heat generated by electronic equipment that is constantly operating at high speed, various heat sink fins and their materials, combined with their application methods, are constantly being improved to achieve higher efficiency for heat dissipation, and conventional heat sink fins. The structure of the film, as shown in the first figure, is designed to maximize the heat dissipation surface area, but is limited by the size and space of the applied electronic device. Therefore, the number of heat dissipation surface areas or heat dissipation channels is limited. It is not easy to improve effectively.

Moreover, the design methods of the conventional heat dissipation channels are distributed in a manner of uniform width, and the heat dissipation efficiency is changed according to the wind speed of the heat dissipation fan. In the system without the heat dissipation fan, the heat dissipation effect is poor.

In other ways, such as Skiving (planing process) or Buckle fin (pleture process) to find a larger heat dissipation effect of the heat dissipation structure, and the problem that the cost of the appearance part and the mold cannot be too high, the practicality is not good. .

In view of the shortcomings of the prior art, the main purpose of this creation is to provide a heat dissipation structure using the chimney chimney effect, which is modified by the average number of heat dissipation channels distributed on the heat dissipation substrate. Good, the appropriate width and narrow channel design is set in the heat dissipation channel, and after being combined with the heat dissipation base, the heat dissipation channel is formed into a closed heat dissipation channel; when combined with the heat source application, the wide and narrow channel design of the heat dissipation channel is adopted. The formation of the cypress effort suction effect produces a chimney-type rapid heat removal effect.

In order to achieve the above object, the present invention provides a heat dissipation structure using a chimney chimney effect, comprising: a heat dissipation substrate having a plurality of heat dissipation channels distributed thereon, the heat dissipation channels having a proper proportion of wide and narrow channels, the heat dissipation substrate And a heat-dissipating base; and a heat-dissipating base is coupled to the heat-dissipating base body, so that the heat-dissipating channel forms a closed heat-dissipating channel, and the outer surface of the heat-dissipating base is provided with a plurality of joint structures that can be connected to other heat sources.

Among them, in order to achieve the chimney-type rapid heat-dissipating effect, the heat-dissipating base system is vertically placed in the electronic device, so that the heat-dissipating channel forms a chimney-like rising heat dissipation effect.

Among them, the appropriate ratio of the wide and narrow channels of the heat dissipation channel is preferably a ratio of 2:1, so that the rising suction of the chimney channel can achieve the maximum effect.

The heat dissipation base body and the heat dissipation base thereof are manufactured by a material superior to heat dissipation, and can achieve the effect of heat dissipation and multiplication.

Wherein, the plurality of heat dissipation channels on the heat dissipation substrate are evenly distributed.

In a preferred embodiment, the heat dissipation substrate is in contact with a heat source, and the heat of the heat source can be quickly generated by the effect of the suction force formed by the narrow and wide heat dissipation channels to generate a chimney-type rapid heat removal effect. The heat dissipating base is connected to a plurality of heat-conducting tubes. The two ends of the heat-conducting tube are respectively provided with a joint seat, and the joint seat at one end is connected to the joint structure of the heat-dissipation base, and the joint seat at the other end is connected to other heat source through The heat pipe guides the heat generated by the external heat source to the heat dissipation substrate to quickly dissipate heat through the heat dissipation channel, and achieves a good heat dissipation effect on the measured.

The above is only to explain the problems to be solved by the creation, the technical means to solve the problems, and the effects thereof, and the specific details of the creation will be described in detail in the following embodiments and related drawings.

1‧‧‧heating structure

11‧‧‧heating substrate

111‧‧‧ wide road

112‧‧‧narrow road

12‧‧‧heating base

13‧‧‧Dissipation channels

2‧‧‧heat source

3‧‧‧Other sources of fever

4‧‧‧Heat pipe

41‧‧‧ joint seat

42‧‧‧ joint seat

5‧‧‧Chassis

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. The description of the drawings is as follows: FIG. 1 is a perspective view of a prior art.

The second picture is a three-dimensional combination diagram of the creation.

Figure 3 is a three-dimensional exploded view of the creation.

The fourth picture is a schematic diagram of the heat dissipation effect of the chimney effect generated by the creation.

Figure 5 is a perspective view of a preferred embodiment of the present invention.

The preferred embodiments of the present invention are disclosed in the following drawings. For the sake of clarity, many practical details will be described in the following description. In addition, some conventional structures are used to simplify the drawings. The components will be shown in a simplified schematic form in the drawings.

Please refer to FIG. 2 and FIG. 3 at the same time, which is a three-dimensional combination diagram and a three-dimensional exploded view of the creation. As shown in the figure, a heat dissipation structure 1 using a chimney effect is included in the creation, including a heat dissipation substrate 11, which dissipates heat. A plurality of heat dissipating channels 13 are distributed on the substrate (the average distribution of the plurality of heat dissipating channels in the embodiment), and the heat dissipating channels 13 have a proper proportion of the wide channel 111 and the narrow channel 112, and the heat dissipating substrate 11 can directly interfere with the CPU. The main heat source 2; and a heat dissipating base 12 can be combined with the heat dissipating base 11 to form the heat dissipating channel 13 to form a closed heat dissipating channel, and the outer surface of the heat dissipating base 12 is provided with a plurality of other heat sources. The joint structure (because of various implementations, it is also a conventional application, so it is not shown in the figure).

The so-called Bemoulli's Principle, a law in fluid mechanics, was proposed by Swiss fluid physicist Daniel Bob in 1738 (Hydrodynamica) to describe fluids along a stable, non-viscous, incompressible Streamline movement behavior, in the case of thermal energy, is an air fluid.

The creation is to generate a chimney-type rapid heat-dissipating effect, and the heat-dissipating substrate 11 is vertically placed in the electronic device (the second figure is in an inverted state, and when actually placed, the narrow channel 112 is The upper and wide lanes 111 are below), so that the heat dissipation channel 13 forms a chimney-like rising heat dissipation effect.

Please refer to FIG. 4 at the same time, which is a schematic diagram of the heat extraction (chimney effect) of the cypress force generated by the creation. The proper ratio of the wide channel 111 to the narrow channel 112 of the heat dissipation channel 13 is preferably 2:1. The proportional design maximizes the suction suction of the chimney passage; the thermal energy is drawn from the wide lane 111 at the bottom of the heat dissipation channel 13 and is subject to the design of the upper narrow channel 112, which produces a chimney suction effect and produces a chimney type. The heat dissipation effect is increased (as indicated by the arrow in the figure), and the thermal energy is rapidly extracted from the discrete thermal substrate 11.

The traditional design methods of the heat dissipation channels 13 are distributed in a uniform width manner, and the effect of the suction force of the cypress is not generated. The heat dissipation efficiency changes according to the wind speed of the heat dissipation fan. In the system without the heat dissipation fan, the heat dissipation effect is poor. In the present invention, the heat dissipation channel 13 is designed to have a proper ratio of the width 111 and the narrow channel 112, and the upper and lower width channels are disposed, and the heat dissipation substrate 11 is vertically disposed in the electronic device chassis 5 (as shown in FIG. 5). Shown that the heat dissipation channel 13 is the effect of applying the chimney chimney effect, generating a chimney-like rising heat dissipation effect, and the creation is so improved in the limited heat dissipation surface area of the heat dissipation structure 1 and the space limited by the electronic device chassis 5. A big breakthrough.

The heat dissipation base 11 and the heat dissipation base 12 are manufactured by a material superior to heat dissipation, and can achieve the effect of heat dissipation.

In a preferred embodiment, as shown in FIG. 5, the heat dissipation substrate 11 is in contact with a main heat source 2, and the heat generated by the main heat source 2 can be quickly formed by the upper and lower wide heat dissipation channels 13 The heat-absorbing base 12 is connected to the plurality of heat-conducting tubes 4, and the two ends of the heat-conducting tube 4 are respectively provided with the joint seat 41 and the joint seat 42 at one end. The joint 41 is connected to the joint structure of the heat sink base 12 (which is also a conventional application, and is not shown in the drawings). The other end joint 42 is connected to the other heat source 3 and is externally connected through the heat pipe 4. The heat generated by the heat source is guided to the heat dissipation substrate 11 to be quickly dissipated through the heat dissipation channel 13, and the heat dissipation effect can be achieved in the actual measurement.

The good thermal conductivity of the creation is especially suitable for the electronic device case 5 without a cooling fan. If it is installed in the electronic device case 5 with a cooling fan, the heat dissipation effect will be more Excellent.

From the above detailed description of the specific implementation of the present creation, it can be clearly seen that the present invention designs the heat dissipation channel 13 to have an appropriate ratio of the wide lane 111 and the narrow lane 112 pattern, and the upper narrow and the lower width channel effect, and The heat dissipation base 11 is vertically disposed in the electronic device chassis 5, and the heat dissipation channel 13 is applied with the effect of the chimney effect, generating a chimney-like rising heat dissipation effect, and the limited heat dissipation surface area of the heat dissipation structure 1 is limited to the electronic device chassis. In the space of 5, it can greatly improve the heat dissipation effect, and the improvement of this creation is a big breakthrough.

The present invention has been described above in the above preferred embodiments, and is not intended to limit the present invention. Any skilled person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. The scope of protection of the creation is subject to the definition of the scope of the patent application attached to this specification.

1‧‧‧heating structure

11‧‧‧heating substrate

111‧‧‧ wide road

112‧‧‧narrow road

12‧‧‧heating base

2‧‧‧heat source

Claims (6)

A heat dissipation structure using a chimney chimney effect, comprising: a heat dissipation substrate having a plurality of heat dissipation channels distributed thereon, the heat dissipation channel having a proper proportion of a wide and narrow channel design, the heat dissipation substrate being in contact with a heat source; The heat dissipation base is coupled to the heat dissipation base body, so that the heat dissipation channel forms a closed heat dissipation channel, and the heat dissipation base outer edge surface is provided with a plurality of joint structures that can be connected to other heat sources. The heat dissipation structure using the chimney chimney effect as described in claim 1, wherein the heat dissipation base system is vertically placed in the electronic device. The heat dissipation structure of the application of the chimney chimney effect according to the first item of claim 1, wherein the heat dissipation substrate and the heat dissipation base thereof are manufactured by a material superior to heat dissipation. The heat dissipation structure using the cypress effort chimney effect as recited in claim 1, wherein the appropriate ratio of the wide and narrow lanes is 2:1. The heat dissipation structure of the application of the chimney chimney effect as described in claim 1, wherein the heat dissipation base is connectable to the plurality of heat transfer tubes, and the two ends of the heat transfer tubes are respectively provided with joint seats. According to the heat dissipation structure of the application of the chimney chimney effect described in Item 1 of the claim, the plurality of heat dissipation channels are evenly distributed.