M375920 五、新型說明： 【新型所屬之技術領域】 置，且特別是有關於一種 本創作是有關於一種電腦装 應用散熱模組的電腦裝置。 【先前技術】M375920 V. New description: [New technical field] It is especially related to one. This creation is a computer device for a computer-mounted thermal module. [Prior Art]
板上=== ==處：機 幸I·认曰μ Λ H 寻裝置’其中以中央處理器與 主機板上的晶片組是否散熱良善最為重要。 二目别供電腦主機所使用的散熱裝置’往往 ^各發熱鱗加上散_片、解管與散賊扇來達成 ^之目的。翻賴導管之熱傳導特性，可將發熱源之 …里傳遞至散賊再H由散熱風扇所引起之氣流，帶 離散熱則上的熱量，然而熱導管的直接導熱率較差，因 而其散熱效果有所侷限。 再者，上述這些熱導管或散熱鰭片皆為直接組裴在主 機板上以便能直接與發熱源接觸，此舉卻造成主機板需承 载上述這些散熱裝置的重量，主機板容易因此而變形。 另外，為了增加主機板的承載能力以避免主機板變 形，亦需利用主機内部額外的空間設置能夠支撐主機板的 支架，以分散上述散熱裴置的重量，此舉雖能解決主機板 變形的問題，卻另造成電腦主機的體積過大而不易縮減的 困擾。 ' 3 M375920 【新型内容】 本創作提供一種散熱模組與應用此散熱模組的電腦 裝置，其具有較佳的散熱效果與較低的製作成本。 本創作的一實施例提出一種散熱模組，其適用於一電 腦裝置，電腦裝置包括一殼體與一主機板，且主機板具有 至少一發熱源。散熱模組包括一本體以及至少一導熱枉。 本體鎖固至设體，且主機板組裳至本體。導熱柱嵌入於本 體。此導熱柱的一端接觸於發熱源，而導熱柱的另一端接 觸於殼體。 本創作的一實施例提出一種電腦裝置，包括一殼體、 一主機板以及一散熱模組。殼體具有多個散熱鰭片。主機 板具有至少一發熱源。散熱模組組裝至殼體’而主機板組 裝至散熱模組，且散熱模組同時接觸殼體與發熱源。 基於上述，在本創作的上述實施例中，機殼具有散熱 籍而散熱模組同時接觸發熱源與機殼，因而使散熱模 組能將發熱騎產生的熱量直接傳導至殼體，並經由散熱 鰭片發散至電腦裝置之外。再者，散熱模組是直接組裝在 设體上’此舉使得主機板能免除散熱模組的負擔而避免變 形的可能性。 杏^讓本創作之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 圖1是依照本創作一實施例的一種電腦裝置的示意 圖 ο 二;圖2是圖1的電腦裝置的爆炸圖。請同時參考圖1及 :電腦裝置100包括一殼體11〇、一主機板12〇、—散 ς =挺130、一輸入輪出連接板14〇以及一底板15〇。在本 例中，電腦裝置100例如是個人電腦、工業電腦或汽 用電腦等。在此，本實施例並未對此設限。 圖3是圖2的電腦襞置中散熱模組與主機板於另一視 =不意圖。請同時參考圖2及圖3，底板150藉由多個 …糸151而組裝至殼體11〇，以形成可容置主機板12〇、輸 )輪出連接板14〇與散熱模組130的空間。殼體11〇具有 ^個散熱鰭片112,其可在殼體110製成時一同擠壓而成 型。在本實施例中，主機板12〇具有兩個發熱源122、124， /、中發熱源122為中央處理器，而發熱源丨24為南橋或北 橋晶片組，惟本實施例並未對發熱源122、124的數量予以 限制。 再者，輸入輸出連接板14〇具有一開口 142，散熱模 '、且130穿過開口 142而組裝至殼體，主機板12〇組裝 至散熱模組130，且散熱模組130同時接觸殼體11〇與發 熱源122、124，因此發熱源122、124所產生的熱量能直 接經由散熱模組130傳導至殼體11〇，並經由殼體η〇的 散熱鰭片112而散溢出電腦裝置1〇〇。 此外’由於主機板120無須負荷散熱模組13〇的重 量，因此得以避免發生習知主機板容易變形或是需額外增 加構件以支撐主機板’此舉進而使本實施例的殼體110内 的空間得以縮小或做為其他設計所利用。 * + 方面，輸入輸出連接板140組裴在殼體no内， 把=連接至主機板12G。在本實施例中，輸人輸出連接 板具有多個連接ϋ 144與多個按叙 146，用以與其他 ^邊裝置連接。在本實施射’輸人輸出連接板140與主 ，板12G麵設置，以使主機板12()狀缩小化與制式化， 進而使發熱源122、124集中配置在主機板12〇上，以增 加散熱，組13G導熱的效果。再者，—旦主機板12〇因制 ^化而里產後，輸入輸出連接板14〇便能朝向不同的客製 ^求而進行製作，此舉亦能增加電腦裝置1⑽在設計上 多樣性。 圖4至圖6分別以不同位置繪示圖！的電腦裝置在散 熱模組處的剖面圖。請先參考圖3、圖4及圖5，散熱模組 130包括一本體132與兩個導熱柱134、136,其中本體132 牙越輸入輸出連接板140的開口 142,並藉由多個螺絲131 而鎖固在殼體110上。導熱柱134、136嵌入於本體132 且分別對應於發熱源122、124。各導熱柱134、136的一 端接觸於發熱源122、124，而各導熱柱134、136的另一 端則接觸於殼體110。 在本實施例中’導熱柱134、136的材質例如是|呂合 金、銀合金或銅合金，其熱傳導係數大於本體132的熱傳 導係數’因而能使發熱源122、124所產生的熱量迅速地被 傳導至殼體110，而不會在傳導途中留存在殼體11()内部 造成電腦裝置100溫度上升。在此並未限制導熱柱134、 136的材質，設計者可依據發熱源122、124而選定適合的 材質，凡是讓導熱柱134、136的熱傳導係數大於本體ι32 的熱傳導係數者皆可適用於本實施例。 再者’本實施例並未限制導熱柱134、136配置在本 體132上的數量與位置，設計者可依據主機板12〇上發熱 源122、124的數量與位置而對導熱柱134、136進行對應 地配置，以讓散熱模組130在設計上具有多樣性，並適合 各種不同規格的主機板120。 請同時參考圖2及圖6，電腦裝置1〇〇還包括多個鎖 固件160’用以將主機板120與散熱模組13〇鎖固在一起。 值得注意的是，鎖固件16〇包括一螺絲本體162與—彈箬 墊圈164，其中彈簧墊圈164套設在螺絲本體16;、上。$ 螺絲本體162鎖固於主機板12〇與散熱模組13〇上時，^ 由彈f塾圈164的彈性，使用者因而能藉此調整散熱“ 13〇接觸於發熱源122、124的緊密程度。 所述’在本創作的電腦裝置中，散熱模組直接組 :須機板則組裝在_模組上，因此主機板 …1擔散細組的重量，以有效地避免變形的情形發生。 ^者’散熱模組包括多個導熱柱，湘其良好的轨傳 殼體發熱源產生的熱量直接料至殼體，以經由 管相_…4而散逸出€職置，與習知技射的熱導 較心製:成t創作之電腦裝置具有較佳的散熱效率以及 本倉nr作已以實施例揭露如上，然其並_以限定 本創作’任何所屬技術領域中具有通常知識者，在不脫離 動與潤飾，故本 所界定者為準。 本創作之精神和範圍内’當可作些許之更 創作之保護範圍當視後附之申請專利範圍 【圖式簡單說明】 圖 圖1是依照本創作-實施例的1電職置的示章 圖2是圖1的電腦裝置的爆炸圖。 圖3是圖2的電腦農置中散熱模組與主機板於另一視 角的示意圖。 圖=至圖6分別以不同位置緣示圖i的電腦裝置在散 熱模組處的剖面圖。 【主要元件符號說明】 100 :電腦裝置 112 :散熱鰭片 122、124 :發熱源 131、151 :螺絲 134、136 :導熱柱 142 :開口 146 :按紐 160 :鎖固件 164 :彈簧墊圈 110 :殼體 120 :主機板 B0 :散熱模組 132 :本體 140 :輸入輸出連接板 144 :連接器 150 :底板 162 :螺絲本體On the board === == at the machine: Fortunately I· 曰 Λ μ Λ H 寻 装置 ’ ” ” ” ” ” ” ” ” ” ” ” ” The two heat sinks used by the computer mainframe are often used for the purpose of the heat scales plus the scatter, the unwinding and the thief fan. The heat transfer characteristics of the catheter can be transmitted to the thief and then the air flow caused by the cooling fan, with the heat of the discrete heat, but the direct thermal conductivity of the heat pipe is poor, so the heat dissipation effect is Limitations. Moreover, the heat pipes or the heat dissipating fins are directly assembled on the main board so as to be in direct contact with the heat source, which causes the main board to bear the weight of the heat dissipating devices, and the main board is easily deformed. In addition, in order to increase the carrying capacity of the motherboard to avoid deformation of the motherboard, it is also necessary to use an additional space inside the host to set a bracket capable of supporting the motherboard to disperse the weight of the heat sink, which can solve the problem of deformation of the motherboard. However, it also causes the computer mainframe to be too large and not easily reduced. ' 3 M375920 【New Content】 This creation provides a heat dissipation module and a computer device using the heat dissipation module, which has better heat dissipation effect and lower production cost. An embodiment of the present invention provides a heat dissipation module suitable for use in a computer device. The computer device includes a housing and a motherboard, and the motherboard has at least one heat source. The heat dissipation module includes a body and at least one heat conducting crucible. The body is locked to the body, and the motherboard group is attached to the body. The thermal column is embedded in the body. One end of the heat conducting column is in contact with a heat source, and the other end of the heat conducting column is in contact with the housing. An embodiment of the present invention provides a computer device including a housing, a motherboard, and a heat dissipation module. The housing has a plurality of fins. The motherboard has at least one source of heat. The heat dissipation module is assembled to the housing ‘and the motherboard is assembled to the heat dissipation module, and the heat dissipation module simultaneously contacts the housing and the heat source. Based on the above, in the above embodiment of the present invention, the casing has a heat dissipation and the heat dissipation module simultaneously contacts the heat source and the casing, so that the heat dissipation module can directly transfer the heat generated by the heat riding to the casing, and through the heat dissipation. The fins diverge outside of the computer device. Moreover, the heat dissipation module is directly assembled on the device. This allows the motherboard to eliminate the burden of the heat dissipation module and avoid the possibility of deformation. The above features and advantages of the present invention are more apparent and understood, and the following detailed description is made in conjunction with the accompanying drawings. 1 is a schematic view of a computer device according to an embodiment of the present invention. FIG. 2 is an exploded view of the computer device of FIG. 1. Please refer to FIG. 1 together: the computer device 100 includes a casing 11 〇, a motherboard 12 〇, a ς 挺 挺 130, an input wheel ejector 14 〇, and a bottom plate 15 〇. In this example, the computer device 100 is, for example, a personal computer, an industrial computer, or a gasoline computer. Here, the embodiment does not limit this. FIG. 3 is a view of the heat dissipation module and the motherboard in the computer device of FIG. 2 in another view. Referring to FIG. 2 and FIG. 3 simultaneously, the bottom plate 150 is assembled to the housing 11 by a plurality of 糸 151 to form a housing board 12 〇, ) 轮 连接 〇 〇 〇 and the heat dissipation module 130 space. The housing 11 has a heat sink fin 112 which can be extruded together when the housing 110 is made. In this embodiment, the motherboard 12 has two heat sources 122, 124, the middle heat source 122 is a central processor, and the heat source 24 is a south bridge or a north bridge chip set, but the embodiment does not heat up. The number of sources 122, 124 is limited. Furthermore, the input/output connection board 14A has an opening 142, the heat dissipation module 'and 130 is assembled to the housing through the opening 142, the main board 12 is assembled to the heat dissipation module 130, and the heat dissipation module 130 simultaneously contacts the housing. 11〇 and the heat source 122, 124, so the heat generated by the heat source 122, 124 can be directly transmitted to the casing 11 through the heat dissipation module 130, and the computer device 1 is scattered through the heat sink fin 112 of the casing η Hey. In addition, since the main board 120 does not need to load the weight of the heat dissipation module 13〇, it is possible to avoid the occurrence of the conventional motherboard being easily deformed or the additional member is required to support the main board. This further enables the inside of the housing 110 of the present embodiment. Space is reduced or used as a design. * + In the aspect, the I/O connection board 140 is placed in the housing no, and the = is connected to the main board 12G. In this embodiment, the input output connector has a plurality of ports 144 and a plurality of buttons 146 for connection with other devices. In the present embodiment, the input and output connection board 140 is disposed on the surface of the main board 12G so as to reduce and format the main board 12 (), so that the heat sources 122 and 124 are collectively disposed on the main board 12 Increase heat dissipation, group 13G heat conduction effect. Furthermore, once the motherboard 12 is manufactured due to manufacturing, the input/output connection board 14 can be manufactured for different customizations, which also increases the design diversity of the computer device 1 (10). Figures 4 to 6 are shown in different positions! A cross-sectional view of the computer device at the heat dissipation module. Referring to FIG. 3, FIG. 4 and FIG. 5, the heat dissipation module 130 includes a body 132 and two heat conducting columns 134 and 136. The body 132 has an opening 142 of the input and output connecting plate 140 and is provided by a plurality of screws 131. It is locked to the housing 110. The thermally conductive columns 134, 136 are embedded in the body 132 and correspond to the heat sources 122, 124, respectively. One end of each of the heat conducting columns 134, 136 is in contact with the heat generating sources 122, 124, and the other end of each of the heat conducting columns 134, 136 is in contact with the housing 110. In the present embodiment, the material of the heat conducting columns 134, 136 is, for example, |Lu alloy, silver alloy or copper alloy, and the heat transfer coefficient thereof is larger than the heat transfer coefficient of the body 132, so that the heat generated by the heat sources 122, 124 can be quickly Conduction to the housing 110 does not leave the interior of the housing 11 () during conduction causing the temperature of the computer device 100 to rise. The material of the heat conducting columns 134 and 136 is not limited herein. The designer can select a suitable material according to the heat sources 122 and 124. Any heat transfer coefficient of the heat conducting columns 134 and 136 is larger than the heat transfer coefficient of the body ι32. Example. Furthermore, the present embodiment does not limit the number and position of the heat conducting columns 134, 136 disposed on the body 132. The designer can perform the heat conducting columns 134, 136 according to the number and position of the heat generating sources 122, 124 on the motherboard 12. Correspondingly, the heat dissipation module 130 is versatile in design and is suitable for the motherboards 120 of various specifications. Referring to FIG. 2 and FIG. 6, the computer device 1 further includes a plurality of locks 160' for locking the motherboard 120 and the heat dissipation module 13A together. It should be noted that the locking member 16 includes a screw body 162 and a magazine washer 164, wherein the spring washer 164 is sleeved on the screw body 16; When the screw body 162 is locked on the main board 12 〇 and the heat dissipation module 13 ,, the elasticity of the 塾 塾 ring 164 can be adjusted by the user, thereby adjusting the heat dissipation of the 13 〇 contact with the heat source 122, 124. In the computer device of the present invention, the heat dissipation module is directly grouped: the machine board is assembled on the _ module, so the motherboard ... 1 carries the weight of the fine group to effectively avoid deformation. ^The 'heat-dissipation module includes a plurality of heat-conducting columns, and the heat generated by the good heat-generating source of the rail-transmitting shell is directly sent to the casing to dissipate through the pipe phase _...4, and the conventional technology The thermal conductivity of the shot is more flexible: the computer device created by T has better heat dissipation efficiency and the present invention has been disclosed in the above embodiments, but it is limited to the author of any of the technical fields. It does not deviate from the movement and retouching, so the definition of this article shall prevail. The spirit of the creation and the scope of the scope of protection can be made for a few more creative scopes of the patent application scope [simplified description of the schema] 1 is an electric office in accordance with the present creation-embodiment 2 is an exploded view of the computer device of FIG. 1. FIG. 3 is a schematic view of the heat dissipation module and the motherboard of the computer farm of FIG. 2 in another view. FIG. Sectional view of the computer device at the heat dissipation module. [Main component symbol description] 100: Computer device 112: Heat sink fins 122, 124: Heat source 131, 151: Screws 134, 136: Heat transfer column 142: Opening 146: Button 160: Locking 164: Spring washer 110: Housing 120: Main board B0: Heat dissipation module 132: Main body 140: Input/output connection board 144: Connector 150: Base plate 162: Screw body