五、新型說明： 【新型所屬之技術領域】 本創作是有關於一種用於電子儲存裝置之封裝結構。 【先前技術】 血電腦、手機、數位相機、數位攝影機及個人數位 =理，電子裝置熱賣，伴隨著數位影音多舰的興起，使得電 Γϊϊί置’例如硬碟及記憶卡的需求量大幅增加。特別地， 同▼上的方便性，現在的硬碟及記憶卡的體積越來越小。 舉例來說，微型化的硬碟包含固態硬碟(solM State Disk， =1)、微型硬碟(micr〇办㈣等。此外，目前常用的記憶卡則 〇 3 USB 隨身碟(USB disc)、數位安全卡(Secure Digital card， D card)、迷你數位安全卡(mini SD card)、微型數位安全卡 (micr〇 SD card)、多媒體卡(Multi Media Card，MMC)及快閃記 憶卡(Compact Flash card, CF card)等。 其中’ USB隨輕目為其攜帶方便、修錢、可靠度 特性而成為目前最普遍的可攜式電子儲存裝置。USB隨 身碟主要包含基板 '控制器裸晶(c〇ntr〇Uer die)、記憶體裸晶 die)、連接器以及外殼等。此外，控制器裸^及記憶 體稞s日係先分別封裝後，以表面黏著技術(surface瓜⑽扯 technology，SMT)黏著於基板上，接著將聯接器黏於此基板， 再加上外殼後即完成隨身碟。 二，而，以此方法製造的隨身碟外殼無法完全將控制晶片及 記憶晶片密封於殼體内，所以容易受到外界環境因素的影響。 所以二1知的隨身碟也無法通過較嚴苛的可靠度測試，因而無 法於南緯度的寒冷的環境中使用。 【新型内容】 因此，本創作之一範疇在於提供一種用於電子儲存事 之封裝J吉構，以解決先前技術中的問題。 伽、=據—具體實施例’本創叙雜賴包含基板、複數 子電子7L件、控制器裸晶、至少一記憶體裸晶以及連接器。V. New description: [New technical field] The present invention relates to a package structure for an electronic storage device. [Prior Art] Blood computers, mobile phones, digital cameras, digital cameras, and personal digital devices. The popularity of electronic devices is accompanied by the rise of digital audio and video multi-ships, which has led to a significant increase in the demand for electronic devices such as hard disks and memory cards. In particular, with the convenience of ▼, the current hard disk and memory card are getting smaller and smaller. For example, miniaturized hard drives include solid state drives (solM State Disk, =1), mini hard drives (micr) (four), etc. In addition, currently used memory cards are USB3 USB flash drives (USB disc), Secure Digital card (D card), mini SD card, micro-digit security card (micr〇SD card), multimedia card (MMC) and flash memory card (Compact Flash) Card, CF card), etc. Among them, USB is the most popular portable electronic storage device for its easy carrying, repairing and reliability characteristics. The USB flash drive mainly contains the substrate 'controller bare crystal (c 〇ntr〇Uer die), memory die die, connector and case. In addition, the controller bare and the memory 稞s are packaged separately, and then adhered to the substrate by surface adhesion technology (surface melon (10) technology, SMT), and then the connector is adhered to the substrate, and then the outer casing is attached. That is to complete the pen drive. Secondly, the flash drive case manufactured by this method cannot completely seal the control wafer and the memory chip in the casing, so it is easily affected by external environmental factors. Therefore, the 2nd known flash drive cannot pass the harsher reliability test, so it cannot be used in the cold environment of the southern latitude. [New Content] Therefore, one of the scope of the present invention is to provide a package for electronic storage to solve the problems in the prior art. Gamma, = Data - Specific Embodiments This invention includes a substrate, a plurality of electrons 7L, a controller die, at least one memory die, and a connector.
:板/、有相對之上表面以及下表面，其巾，連接電路形成 ,面’且複數個接觸電極形成於下絲，並電連接至連接 電路。該等被動電子元件、控制器裸晶以及 S 件、㈣哭技曰接連接電路。此外，該等被動電子元 控制益稞S日以及至少-記憶體裸晶由絕緣材料包覆。 ，-步’連接器定義有相對之第一侧以 稷數個端子設置在第一側 ^ /、甲 部電路連接之爾。、，H々 朝向弟二側之一端’提供外 一， —亚且’各個端子分別對應該等接觸電極中之 ，並为別黏著至所對應的接觸電極。 根據另一具體實施例，本創 複數個被動電子元件、控制器裸晶以及至少^、 2具有姆之絲邮及下表面，並且 於上表面，域油魏魅連接 ^成 H部t抒雜_，雜㈣===面+ 兀件、控制器裸晶以及至少一記_放曰/+取3等被動電子 接至連接電路。此外，鱗被;於紐上並電連 少一記憶體裸晶由絕緣材料包覆2、控制器裸晶以及至 成所需之規格及外型，不需—kf直接研磨絕緣材料，以形 及時間。 不㊉在外加塑膠框，藉此節省製造成本 關於本創作之優點鱼精神 — 所附圖式得到進—步的瞭解。错由以下的創作詳述及 【實施方式】 電子储存裝置」可以是，但不受限於，：：之 CF卡、SSD卡、微型硬碟等。 心身碟、 請一併參見圖一 A $圖一Γ，闻A „ _ 一具體實施例的封裝姓構3之頂視二Γ '、、曰不根據本創作之 構3的底㈣· ^ 圖，圖—B緣示該封裝結 連線之剖=C則繪示圖—B中之縣結構沿著⑽ 數個本賤實關之雖結構3包纽板、複 實—子几件32、控制器裸晶34以及記憶體裸晶36。於 =翻中’基板30可以是印刷電路板。此外，為了增加資 的儲存量，根據本創作之用於電子儲存裝置的封裝姓播3可 ^包含複數個記憶體裸日日日36。並且，於實際應 °己憶體裸晶可以形成堆疊的(stack)結構並且彼此電連接。 基板30具有相對的上表面300以及下表面3〇2。其中， /連接電路304形成於上表面300，並且複數個接觸電極3〇6 形成於基板30之下表面3〇2並電連接至連接電路3〇4。 該等被動電子元件32可以包含電阻器、電容器、電感器、 振盪器或其它元件。於一具體實施例中，該等被動電子元件 32可以藉由表面黏著技術黏著於基板30之下表面3〇2同時電 連接至連接電路304。 控制器裸晶34及記憶體裸晶36係黏著於基板3〇之上表 =3〇2並電連接至連接電路綱。於實際應财，控制器裸晶 及記，_裸晶36可以藉由銀雜雜錄著_著於基板 ^之上表面300，之後可以藉由打線接合(wire b〇n f過銲線將控繼裸晶34及記㈣裸晶36分継接至預先設 板30之上表面細的接合點(bGnding，使得控制器 稞曰曰34及記憶體裸晶36電連接至連接電路3〇4。 2具體實施例中，本創作的封裝結構還包含發光二極體 於實務3G之上絲，並連接控繼裸晶34。 料s麟控制贿晶34可在記憶體裸晶36受到存取時控制 ^光=發光。此外’如圖—C所示’絕緣材料38於 形成—開口，使發光二極體39之發光面 了路出歸先二極體39不高出絕緣 二極體較不易受到外力破壞。 貝面使ϋ 外’於本具體實施例中，控制器裸晶34、記情體裸曰曰 〇 + 5 疋碌_曰(eP〇xy resin)。除了提供 38亦能降低控制器裸晶 力，外’絶緣材枓 辛的景道，々丨丨心^ 及從體裸日日％叉到外界環境因 贿人姐㈣魏，持其正常運 著於美板^30 ^二34及兄憶體裸晶36不需先經過封裝即黏 意的i 許多封裝成本。需注 可攜式働具有較==’。％知爾硬碟能夠做成一 40，’本創作之封裝結構還可包含連接器 八本身義相對之第一侧400以及第二側402。並且，連 M375289 ，器包含複數個端子彻及複數個插孔，並且每一個端子柳 /插对。此外，每—個端子__應形成於 3^ —-/表^ 3〇2之該等接觸電極3〇6中之一個接觸電極 並黏固端子400位在連接器40之第一側之一端伸出插孔 _ 二所對應的接觸電極306 ’而每一個端子400朝向連 j 40之第二側之一端係位於插孔中。藉此，外部電子裝置The board/haves an opposite upper surface and a lower surface, the towel is formed by a connecting circuit, and a plurality of contact electrodes are formed on the lower wire and electrically connected to the connecting circuit. These passive electronic components, controller bare crystals and S-pieces, and (4) crying technology connection circuits. In addition, the passive electronic element control benefits and at least - the memory die is covered by an insulating material. The -step' connector is defined with a number of terminals on the first side with a number of terminals set on the first side ^ /, a circuit connection. , H々 is provided to one end of the two sides of the second side, and the other terminals are respectively corresponding to the contact electrodes, and are not adhered to the corresponding contact electrodes. According to another specific embodiment, the plurality of passive electronic components, the controller die, and at least ^, 2 have the wire and the lower surface of the wire, and on the upper surface, the domain oil Wei Mei connection ^ into the H part t noisy _, miscellaneous (four) === face + element, controller bare crystal and at least one _ discharge / + take 3 passive electronic connection to the connection circuit. In addition, the scales are on the ridge and the electricity is connected to the memory. The bare die is covered with insulating material. 2. The bare die of the controller and the required specifications and appearance. It does not require -kf to directly polish the insulating material. And time. Don't add a plastic frame to save manufacturing costs. About the advantages of this creation, the spirit of the fish — the understanding of the drawing. The following is a detailed description of the creation and the following. [Embodiment] The electronic storage device may be, but is not limited to, a CF card, an SSD card, a mini hard disk, or the like. The mind and body disc, please refer to Figure 1 A $ Figure 1 Γ, smell A „ _ a specific embodiment of the package name 3 of the top view of the package, ', 曰 not according to the bottom of the creation of the structure 3 (four) · ^ map Fig. B shows the section of the package connection line = C is shown in the figure - the county structure in B is along the (10) number of the basics, although the structure is 3 packs of new boards, complex parts - several pieces 32 The controller die 34 and the memory die 36. The substrate 30 can be a printed circuit board. In addition, in order to increase the storage amount of the package, the package name for the electronic storage device according to the present creation 3 can be ^ A plurality of memory bare day and day 36 are included. Also, the actual die should be formed into a stacked structure and electrically connected to each other. The substrate 30 has an opposite upper surface 300 and a lower surface 3〇2. Wherein, the /connection circuit 304 is formed on the upper surface 300, and a plurality of contact electrodes 3〇6 are formed on the lower surface 3〇2 of the substrate 30 and electrically connected to the connection circuit 3〇4. The passive electronic components 32 may include resistors. , capacitor, inductor, oscillator or other component. In one embodiment, the passive The sub-element 32 can be adhered to the lower surface 3〇2 of the substrate 30 by a surface adhesion technique while being electrically connected to the connection circuit 304. The controller die 34 and the memory die 36 are adhered to the substrate 3〇=3〇 2 and electrically connected to the connection circuit. In actual accounting, the controller bare crystal and remember, _ bare crystal 36 can be placed on the upper surface 300 of the substrate by silver miscellaneous recording, and then can be bonded by wire bonding ( The wire b〇nf over-welding wire will control the bare die 34 and the (four) bare die 36 minutes to the fine surface of the pre-set plate 30 (bGnding, so that the controller 稞曰曰 34 and the memory die 36 Electrically connected to the connection circuit 3〇4. In a specific embodiment, the package structure of the present invention further comprises a light-emitting diode on the practical 3G filament, and is connected to control the bare crystal 34. The material sin control bribe crystal 34 can be When the memory bare crystal 36 is accessed, the light is controlled to emit light. In addition, the insulating material 38 is formed in the opening as shown in Fig. C, so that the light emitting surface of the light emitting diode 39 is turned off the returning diode 38. Not higher than the insulating diode is less susceptible to damage by external forces. The surface of the shell is made in this embodiment, controlled Bare crystal 34, remember body nude 曰曰〇 + 5 疋 曰 曰 曰 曰 e e e e e 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 ^ And from the body naked day% fork to the external environment due to the bribe sister (four) Wei, holding its normal transport in the US board ^30 ^ two 34 and brother recall body bare crystal 36 do not need to go through the package that is sticky i Package cost. Need to note that portable 働 has a =='.% know that the hard disk can be made into a 40, 'The package structure of this creation can also include the connector 8 itself relative to the first side 400 and the second side 402. And, even the M375289, the device contains a plurality of terminals and a plurality of jacks, and each terminal willow/plug. In addition, each of the terminals __ should be formed on one of the contact electrodes 3〇6 of the 3^-/tables 3〇2 and the adhesion terminal 400 is located at one end of the first side of the connector 40. Extending the socket _ two corresponding contact electrodes 306' and each terminal 400 is located in the socket toward one end of the second side of the connection j 40. Thereby, the external electronic device
之端子可以插入至插孔中並與連接器如之端子彻 以進行資料的存取。 电職 “待被動電子元件32、控制器裸晶34及記憶體裸晶36黏 者至基板30後，控制器裸晶34及記憶體裸晶％可由絕緣材 料包覆。進一步，連接器40被黏著至基板30之接觸電極 306明庄思，於實務中，本創作之封裝結構的被動電子元件、 控制器裸晶、記憶體裸晶及發光二極體可視情況被設置於基板 的上表面或下表面，並不受限於前述之實施例。The terminal can be inserted into the jack and accessed with the connector such as the terminal for data access. After the electric electronic component 32, the controller bare crystal 34 and the memory bare crystal 36 are adhered to the substrate 30, the controller bare crystal 34 and the memory bare crystal % may be covered by the insulating material. Further, the connector 40 is The contact electrode 306 adhered to the substrate 30 is mingzhuang. In practice, the passive electronic components of the package structure, the controller bare crystal, the memory bare crystal and the light emitting diode may be disposed on the upper surface of the substrate or The lower surface is not limited to the foregoing embodiments.
請再參見圖二A以及圖二B，圖二A繪示根據本創作之 一具體實施例的封裝結構3之底視圖；圖二B則繪示圖二A 之封裝結構3沿著〇-〇連線之剖面圖。 如圖所示，本創作之封裝結構3的基板3〇可被封裝於殼 體37中。此外，殼體37可由上殼體部份37〇及下殼體部份 372組成。上殼體部份37〇及下殼體部份372可互相結合’致 使基板30及連接器40固定於由上殼體部份370及下殼體372 部份定義之容置空間中。 進一步’根據本創作之上殼體部份370及下殼體部份372 可以由塑膠材料製成。並且，上殼體部份37〇及下殼體部份 372可藉由超音波焊接(ultrasonic welding)方式互相接合。實務 7 IVU/3Z«y 上’超音波焊接可轉成快速的自動化生產，因此可以省去 過人讀裝殼體所需駐時及人力成本。另外，超音波 以使殼體具有較高崎合度，目此電子錯、㈣器裸晶及 憶體裸晶較不紋到外界環境的影響，可靠度因此獲得提°。 舉例而言’本_之殼驗科被水氣侵入。 请-併參見圖三A至圖三c ’圖三A繪示根據本創作 具體實施例的封裳結構3之頂視圖；圖三B緣示該封裝奸 構3的底視圖；圖三c則繪示圖三B中之封裝結構沿著= 連線之剖面圖。 如圖所示，本具體實施例之封裳結構3包含基板3 =固被動電子元件32、控制器裸晶34以及記憶體裸晶％。於 實際應用中，基板30可以是印刷電路板。此外，為了增加資 料的儲存量，根據本創作之用於電子儲存裝置的封裝結構3可 吨含複數個記憶體裸晶36。並且，於實際應尉，複數個 此憶體裸晶可鄉成堆疊的結顧域此電連接。 基板30具有相對的上表面300以及下表面302。其中， 一連接電路304形成於上表面3〇〇，並且於基板3〇之孩面， 302直接形成複數個與連接電路3〇4電連接之卿規格端 3〇6，用與外部電子農置電性插接，進行資料之存取。 該等破動電子元件32可以包含電阻器、電容器、電减哭、 器或其它元件。於—具體實施例中，該等被動電ϋ牛 2可以猎由絲黏著技術黏著於基板3〇之下表面3〇2同時電 連接至連接電路3〇4。 控制器裸晶34及記憶體裸晶36係黏著於基板3〇之上表 面300並電連接至連接電路3〇4。於實際應用中，控制器裸晶 8 =及記憶體裸晶36可以藉由銀義或其它黏著繼著於基板 之上表面300 ’之後可以藉由打線接合方式， 透過銲線將控彻裸晶34及記憶體裸晶％分別連接至預先設 置於基板30之上表面3〇〇的接合點___，使得控制器 稞晶34及記憶體裸晶36電連接至連接電路3〇4。 ° Κ 外’於本具體實施例中，控制器裸晶34及記憶體裸晶 3θ6，由絕緣材料38包覆。於實際應用中，絕緣材料38可以 ^環氧樹g旨(epoxy resin)。除了提供絕緣的功能外，絕緣材料 亦能降低控制器裸晶％及記憶體裸晶36丨到外界環 素的影響，例如水氣的侵人或溫度的變化，轉持其正常運 控制◎裸晶34及記題裸晶36不需先經過封裝即黏 者於基板30之上表面，且端子郷直接設於基板上 ，可4去許多封裝成本。需注意的是，透過本創作之封裝方 ，，習知的硬碟涵做成—可攜式硬碟而具有較高的機 心^卜^本具體實施财，於絕緣材料38包覆完成後， σ接研磨絕緣材料38 (例如，磨平絕緣材料％的表面 磨絕緣材料38的邊緣形成斜⑴，⑽成所f之規格或外=， 而不需再外加塑膠框，藉此節省製造成本及時間。 於實務中’ SSD卡的SATA接頭也可如圖三a所示 接形成於基板3〇上，*不需再連翻相連接器。” 一步’請—併參見圖四A至圖四C，圖四A緣示根據 本創作之-具體實關賊裝結構3之舰圖；圖四B ^ 該封裝結構3的底視圖；示圖四 = 沿著〇·〇連線之剖關。 封裝'、構 39，施例中，本創作的封裝結構還包含發光二極體 产"V ▲板3°之上表面，並連接控制11裸晶34。 ί^Ι^!ΐΒθθ 34 36 一木體39發光。此外，如圖四c所示，發光 之發光面於絕緣材料38卿成之開口露出。 =樣地，於本具體實施例中，於絕緣材料％包覆完成後， 磨絕W如’磨视_438 _面或研 而不需再外加塑膠框，藉此節省製造成規格或料， 八二再參見圖五A以及圖五3，圖五A以及圖五B 二別^根據本創作之一具體實施例的封裝結構3之頂視 所示’當應用尺寸較大的記憶體裸晶36時，本創作 、裝、、"構3的基板30可視情況設計成其它外觀。 二極=9，，^ΪΒ所示’本創作的封裝結構同樣包含發光 絕緣材料38^^於基^之上表面_，且其發光面接近 f材科38之邊緣。於實射，發光二極體％之發光面也可 之外。同樣地，於本具體實施例中，於絕 緣材枓8匕覆元成後，可直接研磨絕緣材料38⑽如 38的表面或研磨絕緣材料38的邊緣形成斜角)，以 =1=規格或外型’而不需再外加_，藉此節省製造 社構術’根據本創作之用於電子儲存裳置的封裝 品的可靠度提昇、封裝成本 能更加清楚 藉由以上較佳具體實施例之詳述，係希望 M375289 描述本創作之特徵與精神，而並 體實施例⑽摘作之範•加㈣較佳具 希望能涵蓋各種改孿及且相笙，卜 也’其目的是 之專利範圍的範二及因所欲申請 所有可能的改變以及具相等性的安排。擇致使，、涵盖 11 M375289 【圖式簡單說明】 圖一 A繪示根據本創作之一具體實施例的封裝結構3之 頂視圖。 圖一 B繪示圖一 A之封裝結構3的底視圖。 圖一 C繪示圖一 B之封裝結構沿著0-0連線之剖面圖。 圖二A繪示根據本創作之一具體實施例的封裝結構3之 -底視圖。 . 圖二B繪示圖二A之封裝結構3沿著0-0連線之剖面圖。春 圖三A繪示根據本創作之一具體實施例的封裝結構3之 頂視圖。 圖三B繪示圖三A之封裝結構3的底視圖。 圖三C繪示圖三B之封裝結構沿著0-0連線之剖面圖。 圖四A繪示根據本創作之一具體實施例的封裝結構3之 頂視圖。 圖四B繪示圖四A之封裝結構3的底視圖。 圖四C繪示圖四B之封裝結構沿著0-0連線之剖面圖。 圖五A以及圖五B分別繪示根據本創作之一具體實施例 的封裝結構3之頂視圖。 12 M375289 【主要元件符號說明】 3 :封裝結構 30 ： 300 :上表面 302 304 :連接電路 306 32 :被動電子元件 34 ： 36 .記憶體裸晶 38 ： 40 :連接器 400 402 :第二側 404 37 :殼體 370 372 :下殼體部份 39 ： 基板 :下表面 :接觸電極 控制斋裸晶 絕緣材料 :第一侧 :端子 :上殼體部份 發光二極體 13Referring to FIG. 2A and FIG. 2B, FIG. 2A shows a bottom view of the package structure 3 according to an embodiment of the present invention; FIG. 2B shows the package structure 3 of FIG. 2A along the 〇-〇 Cross-sectional view of the connection. As shown, the substrate 3A of the package structure 3 of the present invention can be packaged in the case 37. Further, the housing 37 may be composed of an upper housing portion 37 and a lower housing portion 372. The upper housing portion 37 and the lower housing portion 372 are coupled to each other to cause the substrate 30 and the connector 40 to be secured in the housing space defined by the upper housing portion 370 and the lower housing 372 portion. Further, the upper housing portion 370 and the lower housing portion 372 may be made of a plastic material. Also, the upper housing portion 37 and the lower housing portion 372 can be joined to each other by ultrasonic welding. Practice 7 IVU/3Z«y 'Ultra-ultrasonic welding can be converted into fast automated production, thus eliminating the time and labor costs required to read the housing. In addition, the ultrasonic wave is used to make the casing have a high degree of closeness, so that the electronic error, the (4) bare crystal and the memory bare crystal are less affected by the external environment, and the reliability is improved. For example, the shell of the book was invaded by moisture. Please refer to FIG. 3A to FIG. 3C'. FIG. 3A shows a top view of the cover structure 3 according to the specific embodiment of the present creation; FIG. 3B shows the bottom view of the package 3; FIG. A cross-sectional view of the package structure in Figure 3B along the = line is shown. As shown, the closure structure 3 of the present embodiment includes a substrate 3 = solid passive electronic component 32, controller die 34, and memory die %. In practical applications, substrate 30 can be a printed circuit board. In addition, in order to increase the amount of material stored, the package structure 3 for an electronic storage device according to the present invention may contain a plurality of memory bare crystals 36. Moreover, in actual application, a plurality of such dead bodies may be connected to each other in a stacking manner. The substrate 30 has opposing upper and lower surfaces 300, 302. Wherein, a connection circuit 304 is formed on the upper surface 3〇〇, and on the substrate 3, the 302 directly forms a plurality of clear-type terminals 3〇6 electrically connected to the connection circuit 3〇4, and is used for external electronics. Electrically plugged in for accessing data. The broken electronic components 32 can include resistors, capacitors, electric crying, or other components. In a specific embodiment, the passive electric yak 2 can be adhered to the lower surface 3〇2 of the substrate 3 by wire bonding technology and electrically connected to the connecting circuit 3〇4. The controller die 34 and the memory die 36 are adhered to the upper surface 300 of the substrate 3 and electrically connected to the connection circuit 3〇4. In practical applications, the controller bare crystal 8 = and the memory bare crystal 36 can be soldered to the upper surface of the substrate by silver or other adhesions, and then can be controlled by wire bonding through the bonding wire. 34 and the memory die % are respectively connected to the bonding point ___ previously provided on the upper surface 3 of the substrate 30 such that the controller transistor 34 and the memory die 36 are electrically connected to the connection circuit 3〇4. In the present embodiment, the controller die 34 and the memory die 3θ6 are covered by an insulating material 38. In practical applications, the insulating material 38 can be an epoxy resin. In addition to providing the function of insulation, the insulating material can also reduce the influence of the controller's bare crystal% and the memory bare crystal 36丨 to the external cyclin, such as water intrusion or temperature change, and its normal operation control ◎ naked The crystal 34 and the scattered bare crystal 36 do not need to be packaged and adhered to the upper surface of the substrate 30, and the terminal 郷 is directly disposed on the substrate, which can save a lot of packaging costs. It should be noted that, through the encapsulation of the present invention, the conventional hard disk culvert is made into a portable hard disk and has a high movement, and the specific implementation is performed after the covering of the insulating material 38 is completed. σ is connected to the abrasive insulating material 38 (for example, the edge of the surface-ground insulating material 38 which smoothes the insulating material % forms a slope (1), (10) is in the specification of the f or the outer =, without the need to add a plastic frame, thereby saving manufacturing costs And in time. In practice, the SATA connector of the SSD card can also be formed on the substrate 3〇 as shown in Figure 3a. * No need to connect the flip-flop connector.” One step 'please—see Figure 4A to Figure Four C, Figure 4A shows the ship map according to this creation - the specific actual thief-installed structure 3; Figure 4 B ^ The bottom view of the package structure 3; Figure 4 = along the 〇·〇 connection Package ', structure 39, in the example, the package structure of this creation also contains the upper surface of the light-emitting diode "V ▲ plate 3, and connected to control 11 bare crystal 34. ί^Ι^!ΐΒθθ 34 36 A wood body 39 emits light. Further, as shown in FIG. 4c, the light-emitting surface of the light is exposed at the opening of the insulating material 38. In the embodiment, after the % of the insulating material is coated, the W is removed, such as 'grinding _ 438 _ face or grinding, without adding a plastic frame, thereby saving manufacturing specifications or materials, and see FIG. A and FIG. 5, FIG. 5A and FIG. 5B. According to the top view of the package structure 3 according to a specific embodiment of the present invention, when the memory die 33 having a larger size is applied, the present creation, The substrate 30 of the device, and the structure 3 can be designed to have other appearances as the case may be. Two poles = 9,, ^ ΪΒ 'The package structure of the present invention also includes a light-emitting insulating material 38 ^ ^ on the upper surface _, and The light-emitting surface is close to the edge of the f-material 38. In the actual embodiment, the light-emitting surface of the light-emitting diode can also be used. Similarly, in the specific embodiment, after the insulating material is formed, Directly grinding the insulating material 38 (10) such as the surface of 38 or the edge of the abrasive insulating material 38 to form an oblique angle), with =1 = specification or appearance 'without need to add _, thereby saving manufacturing socialism' according to the present creation The reliability of the package for electronic storage is improved, and the packaging cost can be more clearly DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT, it is hoped that M375289 describes the features and spirit of the present creation, and that the embodiment (10) is a model of the addition of the fourth (4) preferred to cover various modifications and contradictions. The purpose is the scope of the patent scope and all possible changes and equal arrangements for the application. Optional, cover 11 M375289 [Simple diagram of the drawing] Figure 1A shows a specific embodiment according to the present creation FIG. 1B is a bottom view of the package structure 3 of FIG. 1A. FIG. 1C is a cross-sectional view of the package structure of FIG. 1B along line 0-0. A bottom view of the package structure 3 in accordance with one embodiment of the present invention is shown. Figure 2B is a cross-sectional view of the package structure 3 of Figure 2A taken along line 0-0. Figure 3A shows a top view of a package structure 3 in accordance with one embodiment of the present invention. FIG. 3B is a bottom view of the package structure 3 of FIG. 3A. Figure 3C is a cross-sectional view of the package structure of Figure 3B taken along line 0-0. Figure 4A is a top plan view of a package structure 3 in accordance with one embodiment of the present invention. FIG. 4B is a bottom view of the package structure 3 of FIG. Figure 4C is a cross-sectional view of the package structure of Figure 4B taken along line 0-0. 5A and 5B respectively illustrate top views of a package structure 3 in accordance with one embodiment of the present invention. 12 M375289 [Main component symbol description] 3 : Package structure 30 : 300 : Upper surface 302 304 : Connection circuit 306 32 : Passive electronic component 34 : 36 . Memory die 38 : 40 : Connector 400 402 : Second side 404 37: Housing 370 372: Lower housing portion 39: Substrate: Lower surface: Contact electrode control Ramadan insulating material: First side: Terminal: Upper housing partial light-emitting diode 13