TWM366171U - Probe dynamic impedance measuring instrument equipped with image alignment system and laser cleaning apparatus - Google Patents

Probe dynamic impedance measuring instrument equipped with image alignment system and laser cleaning apparatus Download PDF

Info

Publication number
TWM366171U
TWM366171U TW98200279U TW98200279U TWM366171U TW M366171 U TWM366171 U TW M366171U TW 98200279 U TW98200279 U TW 98200279U TW 98200279 U TW98200279 U TW 98200279U TW M366171 U TWM366171 U TW M366171U
Authority
TW
Taiwan
Prior art keywords
probe
measurement
machine
platform
image
Prior art date
Application number
TW98200279U
Other languages
Chinese (zh)
Inventor
Caroline Yeh
Original Assignee
Dimond Shamrock Entpr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dimond Shamrock Entpr Co Ltd filed Critical Dimond Shamrock Entpr Co Ltd
Priority to TW98200279U priority Critical patent/TWM366171U/en
Publication of TWM366171U publication Critical patent/TWM366171U/en

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)

Description

M366171 五、新型說明: 【新型所屬之技術領域】 本創作係有關-種具像對位$缺雷騎絲置之探針動 態阻抗量測機,尤指半導體封裝測試廢對其測試製程上一種必需 的檢測設備與工具維修的數據依據。 【先前技術】 • 轉制試麟其產品或紅品_試王具,為-種非導体 籲承座,制試區塊是按照制品的外觀尺寸及⑽數量及排列方 式所設計製作而成。探針的安裝數量等同於⑽數量,隨著科技發 展,半導體集成電路⑽的引腳數已達_支以上,而此用以檢 測半導體集成電路之治具則統稱為測試治具(S〇cket) 隨著測試座使用時數增加,衍生出探針維護及更換問題,過 去的方式完全依照工程人員的經驗判斷或針對測試治具使用次數 的規定壽命,JL接進行職座整體更換作業,但實際上測試治具 中可能只有少數社測試探針需要驗。由於探針獅外徑極為 細小,在精職,探騎H雇抗制機之職軸探針頭接觸 時’操作者需以目視方式,逐步調整移動平台位置,讓探針頭與 -測試頭儘可能相互對準中心點,而傳統之動態阻抗測試機只提供 第-支探狀雜魏,其後的數十或數百支探針只能按照設定 於電腦内的移動間隔進行水平或垂直方向移動。基本上以人類肉 眼辨識能力及視角等問題,這是一件銀辛又不易達成的工作,對 M366171 於阻抗讀值的準確性也產生不可信賴的疑慮, 而測試時更可能因M366171 V. New description: [New technology field] This is a kind of probe dynamic impedance measuring machine with a para-positioned ray-deficient position, especially a semiconductor package test and a test process. The data base for the necessary testing equipment and tool repair. [Prior Art] • Converted to test its products or red products _ test equipment, is a kind of non-conductor, the test block is designed according to the product's appearance size and (10) quantity and arrangement. The number of probes installed is equivalent to (10). With the development of technology, the number of pins of the semiconductor integrated circuit (10) has reached more than _, and the fixture for detecting semiconductor integrated circuits is collectively referred to as a test fixture (S〇cket). As the number of test sockets increases, the probe maintenance and replacement problems are derived. The past method is based on the experience of the engineering staff or the specified life of the test fixture. JL is connected to the overall replacement work, but In fact, there may be only a few social test probes in the test fixture that need to be tested. Since the outer diameter of the probe lion is extremely small, the operator needs to visually adjust the position of the mobile platform in a visual manner, so that the probe head and the test head are in contact with each other. The center point is aligned with each other as much as possible, while the traditional dynamic impedance tester only provides the first-branch probe, and the dozens or hundreds of probes thereafter can only be horizontal or vertical according to the movement interval set in the computer. Move in direction. Basically, the human eye recognition ability and perspective are a work that is difficult to achieve, and the M366171 also has unreliable doubts about the accuracy of the impedance reading.

對位不準、測試座本身加1誤差或祕阻抗測試機移動平台XY 軸累積公差、甚至測試治具固定時偏斜等因素,造成探針頭與測 试頭接觸>ί立置偏移或接觸s積不足,而影響量之測精確度。此外, 測試治具使用—段時間後,其上之探針頭會積聚金屬錫或灰塵, 測試時流_針之電齡使其尖端產生熱,促使沾生氧化物, 導致接觸阻抗增加,影響正常探針阻抗讀值,目前僅能由操作人 •員以刷子做表面清潔,不但浪費時間人力,也無法徹底清除沾錫。 緣此,本創作人深感傳統習用之動態阻抗測試機,仍存有許 多缺失有觀進,乃積乡絲從事麟項產品設計觀上之經驗, 長期研思並不斷改進,終於設計出一種更能符合使用者需求之「具 影像對位系統及雷射清潔裝置之探針動態阻抗測試機」者。 【新型内容】 ° 本創作「郷像職祕及㈣清絲置之探針動態阻抗量 測機」之轉設計目_在提供—種肋朗铸_成電路測 试治具中探狀彈力、_阻抗及負餘力衫4之探針動態 阻抗量測機,其同時建置有高精度三軸移動平台、高速影像處理 系統及雷射光清置為-體,迅速截取探針购影像及自動進 行探針頭部h點對位,並糊進彳汰鱗結及嫩數據之 比對,可大幅提升量測之精確度及節省操作人力、時間 【實施方式】 ’、 M366171 β #Μ $ i及第二圖,本創作係有關—種具影像對位系統 及雷射π潔裝置之探針動態阻抗量測機,該探針動態阻抗測試機 (1)主要疋用以量測半導體集成電路測試治具⑼中探針㈤之彈 力、動態阻抗及貞絲力衫正常者。該騎祕阻抗量測機(1) 包括Χ-Υ軸移動平台⑵、ζ軸移動臂⑶、⑽攝影機⑷、雷射 脈衝光產生機⑸、電腦⑹、LCD顯示器⑺及列表機⑻所組成。 其中欲量測之測試治具⑼係裝設於該χ γ轴移動平台⑵上而可 馨縱向或橫向移動者,ζ軸移動臂⑶則安裝於χ γ轴移動平台⑵ 上方,其底部分別裝設一用以量測測試治具中探針(81)彈力、動 癌阻抗及負載能力之探棒(31)及一用以搜尋探針(91)頭部影像及 對位之CCD攝影機⑷。雷射脈衝光產生機⑸安裝於χ γ軸移動平 台(2)行程範圍内,錢糊雷射脈衝光能量以清除探針⑼)頭表 面沾污者。電腦(6)負責各系統之連結與資料傳遞,其内建影像處 理及探針頭對位軟體,搭配LCD顯示器⑺以清楚顯示截取之探針 書⑼)頭影像,另電腦⑹内建有測試設定數據與量測數據比對軟 體,並可藉由印表機(8)輸出該量測比對數據及曲線圖表以判定測 試治具中探針(91)之各項功能是否正常,如第八圖所示者。 - 請參閱第三圖及第四圖,半導體集成電路測試治具(9)中係設 ^有數裝設於彈簧(92)上之探針(91)。該探針(91)係可藉由本創作 之探針動態阻抗測試機(1)量測其彈力、動態阻抗及負載能力者 首先將測試治具(9)固定於X-Y軸移動平台(2)上,並移動至z軸 M366171 移動#(3)下方,藉由CCD攝影機⑷執行影雜取及探針⑼)頭 P對位’若探針(91)聊中心點位置偏移,則可藉由x—Y轴移動 平台⑵上微動以修正偏移位置。此時z轴移動臂⑶下降,使其底 私量測探棒⑽制試料巾之探職)觸,⑽行探針之 阻抗、彈力及負載能力制,再藉由電動預先設定之各項數據 比對而可判定該探針⑽是否異常者。判定為不合格之探針㈤ 將自動祕至f舰衝光產生機⑸下方,触諸脈衝光清潔探 籲針(91)頭,再返回量測區重新量測,如仍不合格即歸類為不良品。 該探針(91)完成敬為合格品之量戦不合格品完成第二次量測 後’ X-Y㈣動平台⑵將自動移動至下一探針量測位置,重複上 述量測步驟至完摘有制作業完成為止,如第五圖至第七圖所 示者。 綜上所述,本創作具影像對位系統及雷射清潔裝置之探針動 態阻抗量測機可迅速截取探針頭部影像及自動進行探針頭部中心 _點對位,並利用電腦進行系統連結及測試數據之比對,可大幅提 升量測之精確度及節省操作人力、時間與成本。確為一結合新穎性 與產業利用價值之創作。 ' - 上述僅為本創作之較佳實施例,並非用以限制本創作,任何 依據本創作之構想所做之改變,在不脫離本創作之精神範圍内 對於各種變化、修飾與應用所產生的等效作用,均包含於本案的 專利範圍内,合予陳明。 M366171 【圖式簡單說明】 態阻抗 第一圖係本創作具影像對位系統及雷射清潔裝置之探針動 量測機之立體圖。 第二圖係本鱗探針麟阻抗量峨量酬試料之立體圖 第三圖係本創作量測之測試治具之立體示意圖。 第四圖係第三圖中測試治具内之探針及彈著組合之立體圖。 第五圖係本創作量測測試治具之平面示意圖。 #第六圖係本創作量測測試治具内探針阻抗之電路圖。 第七圖係本創作探針動態阻抗量測機之操作流程圖。 第八圖係本創作巾之電雌各系鱗結之示意圖。 【主要元件符號說明】 (5)雷射脈衝光產生機 (7)LCD顯示器 (8)列表機 (91)探針 (92)彈簧 ⑴探針動態阻抗量測機(2)X-Y軸移動平纟(3)Z轴移動臂 (31)探棒 (4)CCD攝影機 ❿ (6)電腦 (9)測試治具Misalignment, 1 error in the test seat itself, cumulative tolerance of the XY axis of the mobile impedance tester, and even deflection of the test fixture, causing the probe head to contact the test head. Or the contact s product is insufficient, and the measurement accuracy is affected. In addition, after the test fixture is used for a period of time, the probe head on it will accumulate metal tin or dust. During the test, the electric age of the needle will cause the tip to generate heat, which will cause the oxide to be contaminated, resulting in an increase in contact resistance and affecting normal. The probe impedance reading value can only be cleaned by the operator's brush with a brush, which not only wastes time and manpower, but also can completely remove the tin. Therefore, the creator deeply feels that the traditional dynamic impedance testing machine still has many missing and observing experiences. The experience of the product is based on the design concept of Lin products. After long-term research and continuous improvement, I finally designed a kind of experience. A "Dynamic Impedance Tester with Image Alignment System and Laser Cleaning Device" that better meets the needs of users. [New Content] ° The design of the "Digital Impedance Measuring Machine for the Image and the (4) Clear Wire-based Probe Dynamic Impedance Measuring Machine" is provided in the design of the ribbed cast _ into the circuit test fixture. _ Impedance and negative balance shirt 4 probe dynamic impedance measuring machine, which simultaneously has a high-precision three-axis mobile platform, high-speed image processing system and laser light clearing as a body, quickly intercepting the probe to purchase images and automatically The head of the probe is h-aligned and pasted into the scale of the scale and the tender data, which can greatly improve the accuracy of the measurement and save manpower and time. [Embodiment] ', M366171 β #Μ $ i and In the second picture, the author is related to a probe dynamic impedance measuring machine with an image alignment system and a laser π cleaning device. The probe dynamic impedance testing machine (1) is mainly used for measuring semiconductor integrated circuit testing. The elastic force, dynamic impedance and the crepe shirt of the probe (5) in the fixture (9) are normal. The riding impedance measuring machine (1) comprises a Χ-Υ axis moving platform (2), a 移动 axis moving arm (3), a (10) camera (4), a laser pulse light generating machine (5), a computer (6), an LCD display (7) and a list machine (8). The test fixture (9) to be measured is mounted on the γ γ-axis moving platform (2) and can be moved longitudinally or laterally, and the 移动-axis moving arm (3) is installed above the γ γ-axis moving platform (2), and the bottom is separately mounted A probe (31) for measuring the spring force, the cancer resistance and load capacity of the probe (81) in the test fixture, and a CCD camera (4) for searching the head image and the alignment of the probe (91) are provided. The laser pulse light generator (5) is mounted on the χ γ-axis moving platform (2) stroke range, and the money is laser-pulsed to remove the probe (9)). The computer (6) is responsible for the connection and data transmission of each system. The built-in image processing and probe head alignment software is equipped with an LCD display (7) to clearly display the captured probe book (9)) head image, and the computer (6) has built-in test. The setting data and the measurement data are compared with the software, and the measurement comparison data and the curve chart are output by the printer (8) to determine whether the functions of the probe (91) in the test fixture are normal, such as The one shown in the eight figures. - Please refer to the third and fourth figures. The semiconductor integrated circuit test fixture (9) is equipped with a number of probes (91) mounted on the spring (92). The probe (91) can be used to measure the elastic force, dynamic impedance and load capacity of the probe dynamic impedance testing machine (1), and the test fixture (9) is first fixed on the XY axis mobile platform (2). And move to the z-axis M366171 under the movement #(3), by the CCD camera (4) to perform the image capture and probe (9)) the head P alignment 'if the probe (91) chat center point position offset, by The x-Y axis moves the platform (2) to jog to correct the offset position. At this time, the z-axis moving arm (3) is lowered, so that the bottom private measuring probe (10) can be touched by the test towel, (10) the probe impedance, the elastic force and the load capacity system, and then the electric pre-set data are obtained. It is possible to determine whether the probe (10) is abnormal or not. The probe that is judged to be unqualified (5) will be secretly under the f-light generator (5), touch the pulse light to clean the probe needle (91), and then return to the measurement area for re-measurement. If it is still unqualified, it will be classified. For defective products. The probe (91) is completed as a quantity of qualified products. After the second measurement is completed, the X-Y (four) moving platform (2) will automatically move to the next probe measuring position, and the above measuring steps are repeated. The picking operation is completed as shown in the fifth to seventh figures. In summary, the probe dynamic impedance measuring machine with image alignment system and laser cleaning device can quickly intercept the probe head image and automatically perform the probe head center point alignment, and use a computer to perform The comparison of system links and test data can greatly improve the accuracy of measurement and save manpower, time and cost. It is indeed a combination of novelty and the use of industrial value. The above is only a preferred embodiment of the present invention and is not intended to limit the creation of the present invention. Any changes made in accordance with the concept of the present invention may be made without departing from the spirit and scope of the present invention. Equivalent effects are included in the patent scope of this case and are combined with Chen Ming. M366171 [Simple description of the diagram] State impedance The first figure is a perspective view of the probe measuring machine with the image alignment system and the laser cleaning device. The second picture is a three-dimensional diagram of the slanting probe 麟 阻抗 峨 峨 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三The fourth figure is a perspective view of the probe and the bounce combination in the test fixture in the third figure. The fifth picture is a schematic plan view of the test measurement test fixture. #六图 is a circuit diagram of the probe impedance in the test fixture. The seventh figure is the operation flow chart of the dynamic probe measuring instrument of the present probe. The eighth figure is a schematic diagram of the scales of the electric females of the present invention. [Main component symbol description] (5) Laser pulse light generator (7) LCD display (8) List machine (91) Probe (92) Spring (1) Probe dynamic impedance measuring machine (2) XY axis moving flat (3) Z-axis moving arm (31) probe (4) CCD camera ❿ (6) computer (9) test fixture

Claims (1)

M366171 六、申請專利範圍 I 一種具影像對位系統及 機,其包括: 年月 Θ 修正 田 射光清潔裝置之探針_阻抗量剛 一 x-γ軸移動平台,使欲制之職治具裝設於該χ γ 動平台上而可縱向或橫向移動者; -Ζ娜動臂,其係安裝於χ_γ轉動平台上方,該ζ 動臂底部分別裝設-用以量測測試治具中探針之阻抗、彈力及負 鲁载之探棒及-用以截取探針頭部影像及對位之CCD攝影機; -雷射脈衝魅生機,其係安裝於M軸移動平台行程 内而可以雷射脈衝光清除探針頭表面沾污; -負責各系統連結與資料傳遞之電腦,其内建影像處理 =對位軟體量測數據比對軟體,並可藉由LCD顯示器顯示探針 ’5V像及藉由印表機輸出該量測比對數據及曲線圖表者; 由上述元件組成之動態阻抗量測機,其特徵在於:該固定於 χ~γ軸移動平台上之測試治具移動至2軸移動臂下方時,可藉由 CCD攝影機執行雜齡雜觸騎錄進行偏祕正,此時ζ =動臂下降,使其底部之制探棒與職治具巾之探針頭接觸 測探針植抗、彈力及負載能力,關定為不合格之探針將 動移動至雷射脈衝光產生機下方清雜針頭,再返回重新量測 未針完成判定為合格品之量測或不合格品完成第二次量測後只 轴移動平台可移動至τ _探針量測位置以_量測者 8 M366171 8 四、指定代表圖 日 補无 (一) 本案指定代表圖為:第(一)圖。 j (二) 本代表圖之元件符號簡單說明: (1)探針動態阻抗量測機 (2)X-Y轴移動平台(3)Ζ軸移動臂 (5)雷射脈衝光產生機 (6)電腦 (7)LCD顯示器 (8)列表機M366171 VI. Patent Application Scope I An image alignment system and machine, including: Year Θ 修正 Corrected field light cleaning device probe _ impedance amount just one x-γ axis mobile platform, so that the required fixture is installed On the γ γ moving platform, it can be moved longitudinally or laterally; - Ζina boom, which is mounted above the χ_γ rotating platform, and the bottom of the squat arm is respectively installed - for measuring the probe in the test fixture Impedance, elastic force and negative lug probe and CCD camera for intercepting the probe head image and alignment; - Laser pulse charm machine, which is installed in the M-axis mobile platform stroke and can be laser pulsed light Clear the surface of the probe head; - Responsible for each system connection and data transfer computer, its built-in image processing = alignment software measurement data comparison software, and can display the probe '5V image and display by LCD display The printer outputs the measurement comparison data and the curve chart; the dynamic impedance measuring machine composed of the above components is characterized in that the test fixture fixed on the χ~γ axis moving platform moves to the 2-axis moving arm When it is below, it can be used by CCD The camera performs the misunderstanding of the miscellaneous ages. At this time, the arm is lowered, so that the probe at the bottom and the probe head of the occupational towel are in contact with the probe, the elastic force and the load capacity. The probe that is determined to be unqualified will move to the clear needle under the laser pulse light generator, and then return to the re-measurement of the needle to complete the measurement or the non-conforming product after the second measurement is completed. The axis movement platform can be moved to τ _ probe measurement position to _ Measurer 8 M366171 8 IV. Designation of representative maps. (1) The representative map of this case is: (1). j (2) A brief description of the component symbols of this representative diagram: (1) Probe dynamic impedance measuring machine (2) XY axis moving platform (3) Ζ axis moving arm (5) Laser pulse light generating machine (6) Computer (7) LCD display (8) list machine
TW98200279U 2009-01-09 2009-01-09 Probe dynamic impedance measuring instrument equipped with image alignment system and laser cleaning apparatus TWM366171U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98200279U TWM366171U (en) 2009-01-09 2009-01-09 Probe dynamic impedance measuring instrument equipped with image alignment system and laser cleaning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98200279U TWM366171U (en) 2009-01-09 2009-01-09 Probe dynamic impedance measuring instrument equipped with image alignment system and laser cleaning apparatus

Publications (1)

Publication Number Publication Date
TWM366171U true TWM366171U (en) 2009-10-01

Family

ID=44388015

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98200279U TWM366171U (en) 2009-01-09 2009-01-09 Probe dynamic impedance measuring instrument equipped with image alignment system and laser cleaning apparatus

Country Status (1)

Country Link
TW (1) TWM366171U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI484188B (en) * 2010-10-12 2015-05-11 Hon Hai Prec Ind Co Ltd System and method for simulating a probe of an image capturing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI484188B (en) * 2010-10-12 2015-05-11 Hon Hai Prec Ind Co Ltd System and method for simulating a probe of an image capturing device

Similar Documents

Publication Publication Date Title
KR101053014B1 (en) Alignment method, needle position detection device and probe device
KR100945328B1 (en) Method for detecting tip position of probe, alignment method, apparatus for detecting tip position of probe and probe apparatus
CN102478385B (en) Probe card detection method and system
CN105372499B (en) A kind of microresistivity survey equipment and measuring method
JP2008243860A5 (en)
KR950015701A (en) Probing method and probe device
CN106771979A (en) A kind of pair of calibration method of probe flying probe device
CN201897468U (en) Probe card detecting system
Li et al. The mathematical model and novel final test system for wafer-level packaging
TW200844426A (en) On-line mechanical visional inspection system of an object and method thereof
TWM366171U (en) Probe dynamic impedance measuring instrument equipped with image alignment system and laser cleaning apparatus
CN210181111U (en) Resistance measuring device
CN104620121B (en) Probe device
JP2010204122A5 (en)
JP5314328B2 (en) Arm offset acquisition method
JP5571224B2 (en) Needle tip position detection device and probe device
JP2007005490A (en) Testing prober, tester, and testing method of semiconductor device
CN114814557A (en) Electrostatic gun and method for performing electrostatic discharge test by using same
CN106247918A (en) A kind of probe-type film thickness measuring machine automatic knifing measuring equipment and using method thereof
CN215005756U (en) Defect detecting device
TWI382187B (en) Automatic and antidromic magnetic levitation project equipment and a detection method for the same
CN208547302U (en) A kind of electronic joint external detection detection device
TWI798010B (en) Particle measuring device, three-dimensional shape measuring device, probe device, particle measuring system, and particle measuring method
Liu et al. Novel analysis model for investigation of contact force and scrub length for design of probe card
JP5832200B2 (en) Apparatus and method for acquiring defect analysis image of wiring board using X-ray

Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model