TWM362051U - Structure for cleaning - Google Patents

Structure for cleaning Download PDF

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Publication number
TWM362051U
TWM362051U TW098202863U TW98202863U TWM362051U TW M362051 U TWM362051 U TW M362051U TW 098202863 U TW098202863 U TW 098202863U TW 98202863 U TW98202863 U TW 98202863U TW M362051 U TWM362051 U TW M362051U
Authority
TW
Taiwan
Prior art keywords
cleaning
carrier
unit
cleaning structure
cleaning unit
Prior art date
Application number
TW098202863U
Other languages
English (en)
Inventor
zhi-an Gu
Dong-Zhong Zheng
Hong-Jia Chen
Original Assignee
Tung An Dev Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tung An Dev Ltd filed Critical Tung An Dev Ltd
Priority to TW098202863U priority Critical patent/TWM362051U/zh
Publication of TWM362051U publication Critical patent/TWM362051U/zh
Priority to US12/685,269 priority patent/US20100212100A1/en

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Classifications

    • B08B1/32—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Description

M362051 五、新型說明： 【新型所屬之技術領域】 動機2=，一種清潔結構’尤指一種可配合相關之致 動機構於精密電子元件之表面清潔，使各清料元利料 之功效者 端面凹弧部，而__社、清潔效率快以及去除髒污率^ 【先前技術】 按’ -般之精密電子元件（如··石夕晶圓、硬碟盤、半導體 及CPU晶片）所需之清潔結構如中華民國專利第4議號之 「清潔用海雜子」，其係由具有彈性的聚乙烯醇縮乙‘多 孔質體海騎構成’騎在侧部麵配設錄的突起，並使該 突起的頂部_觀_清雜的清潔面來清舰清潔體，A 中該突起的頂部是由光滑度高的表層部所形成；藉此，可配合 所需之致誠構絲硫設之錄突起，達到清雜密電子 元件之功效。 而另-習用者如中華民國專「於可轉動基座上製造單 片多孔墊之方法及材料」’其包括可轉動基座，其包括一内表 面及-外表面；多孔塾材料’其覆蓋該基座之至少—部分之外 表面’以驗自紐雜㈣，⑽孔墊材料與絲座結合； 該多孔墊材料與該基座結合，而維持突出物於該多孔塾材料表 面上之對準；藉此，可配合所需之致動機構以突出物達到清潔 精密電子元件之功效。 雖然上述兩種習用之「清潔用海、綿輥子」與「於可轉動基 3 M362051 座上製造單片多孔墊之方法及材料」皆可達 件之功效，但是由於該「清潔用海綿幸昆子」之突= 光滑度高喊層部鄉成，且該突起之頂 $了 疋由 「於可轉動基座上製造單Μ孔墊之方法及材而該 型後亦為一平面，因此，其二者於 之大出物成 本即為不規則面之精密電子元件二接觸原 無法符合實際使用時之所需。 ^用之>月潔結構並 【新型内容】 精密ΐΐ 運用於 而達到接獨，使各清料元_其端面凹弧部'， 載體.以目的’本創作係—種清潔結構，其至少包含- ^端ΓΛ齡瓣似各清潔單 %〜_之=具有—呢部，且各哪部之醇係介於70 【實施方式】 例之第1立及第2圖』所示，係分別為本創作第一實施 圖。如圖所=圖及本創作第一實施例之剖面狀態示意 以及夕本創作係—種清潔結構，其至少係由一載體1 依所ί以::::2::成，而該載體1與各清潔單元2係可 -體成型製二 、聚乙烯醇(PVA)或高分子材料 M362051 上述所提之載體1係呈一圓筒狀，且其中央處係具有一套 接部1 1。 各清潔單元2分別佈設於該載體1之外側緣，而各清潔單 元2之知面係分別具有一凹弧部2 1，且各凹弧部2 1之曲率 係介於70%〜99%之間，其中各清潔單元2係可為圓柱體或 為多邊體。 凊參閱『第3圖』所示，係本創作第一實施例之使用狀態 示意圖。如圖所示：當運用時，係可使一個或多數個載體1利
用其套接部1 1與相關之致動機構3結合，使該致動機構3以 滾動之方式帶_« 1，並依所需之清潔狀態及位置移動該 致動機構3 ’使載體i外側緣之各清料元2與相關精密電子 兀件4之表面接觸進行所f之清冑，而由於各清料元2端面 所=凹弧部2 1之曲率係介於7Q%〜99%之間，因此，可於 各/月潔單元2使用時達到接觸面大、清潔效率快以及去除辨污 率高之功效。 請參閱
弟4及第5圖』所示，係分別為本創作第二實施 例之立體相^意圖及賴作第二實_之制狀態示意 圖ά圖所示·本創作除上述第一實施例所提結構型態之 體1 a設為—圓盤狀，使各清潔單元2分_設於 ‘1?，二、面上，且該載體1 a之另—面上係可設有組接 °广’各清潔單元2係可為圓柱體與多邊體； 機構；:吏a上_部12 a m目關之致動 a，並依所f之以旋轉之方式帶_載體1 1外側緣之各二 置移動該致動機構3a，使載體a 各4早元2與相關精密電子元件4之表面接觸 5 M362051 之雜，如此，除可卿於獨之致械構^及不 同之^方式之外，_可_上述第—實施例所提之功效。 T、上所述本創作核結射有效改善制之讎缺點， i、·:相狀致軸構卿於精密電子元件之表面清潔，使各 其端面凹弧部，而達到接觸社、清潔效率快以 ，去除辩污率高之魏，進而使本創作之產生能更進步、更實 用、更符合制者之賴，確⑽合鋪 依法提出專利申請。 m研羑
，以上所述者’僅為本創作之較佳實施例而已，當不能以 創作實施之細；故’凡依本創作申料利範圍及創 =明書内容所作之簡單的等效變化與修飾，皆應 專利涵蓋之範圍内。 【圖式簡單說明】 第1圖係'本創作第一實施例之立體外觀示意圖。 第2圖’係本創作第一實施例之剖面狀態示意圖。 第3圖’係本創作第一實施例之使用狀態示意圖。 ^4圖係、本創作第二實施例之立體外觀示意圖。 第5圖，係本創作第二實施例之使用狀態示意圖。 【主要元件符號說明】 載體1、1a 套接部1 1 組接部12 a 6 M362051 清潔單元2 凹弧部2 1 致動機構3、3a 電子元件4

Claims (1)

  1. M362051 六、申請專利範圍： 1 . 一種清潔結構，其包括·· 一載體；以及 元二潔=係分別設於“上，而各清潔單 2 專利範圍第1項所述之清潔結構，其中，該載體係呈 你冋狀’且其中央處係具有—套接部，而各清潔單元係八 別佈设於該載體之外側緣。 ’、刀 3 ·=申請專利範㈣1項所述之清潔結構，其+，簡體係呈 -圓盤狀’而各清料元係分義設於該載體之—面上 該載體之另-面上係可設有組接部。 4·依中？專利範圍第1項所述之清潔結構，其中，該載體與各 清潔單元以複合材料一體成型所構成。 一 5依申明專利範圍第1項所述之清潔結構，其中，該载體與各 /月漂單元以海'綿一體成型所構成。 6·依申請專利範圍第1項所述之清潔結構’其中，該载體與各 清潔單元以PU —體成型所構成。 7. 依申請專利範圍第1項所述之清潔結構，其中，該載體與各 清潔單元以聚乙烯醇一體成型所構成。 8. 依申請專利範圍第1項所述之清潔結構，其中，該载體與各 清潔單元以高分子材料一體成型所構成。 ' 依申請專利範圍第1項所述之清潔結構，其中，各清潔單元 係可為圓柱體。 8 M362051 I Ο _依申請專利範圍第1項所述之清潔結構，其中，各清潔單 元係可為多邊體。 II ·依申請專利範圍第1項所述之清潔結構，其中，各清潔單 元係可為圓柱體與多邊體。
TW098202863U 2009-02-26 2009-02-26 Structure for cleaning TWM362051U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW098202863U TWM362051U (en) 2009-02-26 2009-02-26 Structure for cleaning
US12/685,269 US20100212100A1 (en) 2009-02-26 2010-01-11 Cleaning Apparatus for Sophisticated Electric Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098202863U TWM362051U (en) 2009-02-26 2009-02-26 Structure for cleaning

Publications (1)

Publication Number Publication Date
TWM362051U true TWM362051U (en) 2009-08-01

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ID=42629594

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (2)

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US (1) US20100212100A1 (zh)
TW (1) TWM362051U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI648107B (zh) * 2012-04-03 2019-01-21 伊利諾工具工程公司 凹型結核海綿刷

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5645752B2 (ja) * 2011-05-25 2014-12-24 株式会社荏原製作所 基板洗浄方法及びロール洗浄部材
US9202723B2 (en) 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US8778087B2 (en) 2012-04-03 2014-07-15 Illinois Tool Works Inc. Conical sponge brush for cleaning semiconductor wafers
KR102389613B1 (ko) 2015-05-06 2022-04-22 삼성전자주식회사 기판 세정 장치
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2287768A (en) * 1940-05-04 1942-06-30 Du Pont Roller having surface of sponge rubber knobs
JPS596974A (ja) * 1982-07-05 1984-01-14 カネボウ株式会社 洗浄方法
US4975999A (en) * 1988-03-25 1990-12-11 Ehl Development Inc. Keyboard cleaner
US5190568B1 (en) * 1989-01-30 1996-03-12 Ultimate Abrasive Syst Inc Abrasive tool with contoured surface
US4969226A (en) * 1989-03-23 1990-11-13 Cabot Corporation Scrubbing sponge
US5174795A (en) * 1990-05-21 1992-12-29 Wiand Ronald C Flexible abrasive pad with ramp edge surface
US5437754A (en) * 1992-01-13 1995-08-01 Minnesota Mining And Manufacturing Company Abrasive article having precise lateral spacing between abrasive composite members
US5311634A (en) * 1993-02-03 1994-05-17 Nicholas Andros Sponge cleaning pad
TW317223U (en) * 1994-01-13 1997-10-01 Minnesota Mining & Mfg Abrasive article
DE9402910U1 (de) * 1994-02-22 1995-06-22 Sterkel Gmbh Pinsel Und Farbro Rolle für den Farbauftrag sowie Strukturelement für diese
US6080092A (en) * 1994-10-06 2000-06-27 Xomed Surgical Products, Inc. Industrial cleaning sponge
US6027573A (en) * 1994-10-06 2000-02-22 Xomed Surgical Products, Inc. Industrial cleaning sponge apparatus and method for extracting residue from a sponge material
US5778481A (en) * 1996-02-15 1998-07-14 International Business Machines Corporation Silicon wafer cleaning and polishing pads
US5844030A (en) * 1996-07-09 1998-12-01 Andros; Nicholas Charged ion cleaning devices and cleaning system
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
US5870792A (en) * 1997-03-31 1999-02-16 Speedfam Corporation Apparatus for cleaning wafers and discs
US5870793A (en) * 1997-05-02 1999-02-16 Integrated Process Equipment Corp. Brush for scrubbing semiconductor wafers
US5966766A (en) * 1997-10-06 1999-10-19 Advanced Micro Devices, Inc. Apparatus and method for cleaning semiconductor wafer
US6070284A (en) * 1998-02-04 2000-06-06 Silikinetic Technology, Inc. Wafer cleaning method and system
KR100562446B1 (ko) * 1998-02-19 2006-03-20 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 연마 용품 및 유리 연마 방법
US6182323B1 (en) * 1998-03-27 2001-02-06 Rippey Corporation Ultraclean surface treatment device
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
US20020006767A1 (en) * 1999-12-22 2002-01-17 Applied Materials, Inc. Ion exchange pad or brush and method of regenerating the same
US6776699B2 (en) * 2000-08-14 2004-08-17 3M Innovative Properties Company Abrasive pad for CMP
US20020100132A1 (en) * 2001-01-30 2002-08-01 Mcmullen Daniel T. Porous polymeric substrate treatment device and method
US20020121289A1 (en) * 2001-03-05 2002-09-05 Applied Materials, Inc. Spray bar
US6904637B2 (en) * 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
US6616516B1 (en) * 2001-12-13 2003-09-09 Lam Research Corporation Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates
US6854153B1 (en) * 2003-09-03 2005-02-15 Kenneth C. Mueller Computer keyboard cleaner
US6981291B2 (en) * 2003-09-26 2006-01-03 The Hartz Mountain Corporation Motorized cleaning apparatus
KR101122792B1 (ko) * 2004-01-29 2012-03-21 어플라이드 머티어리얼스, 인코포레이티드 스크러버 브러쉬를 맨드릴 상에 설치하는 장치 및 방법
US20070006405A1 (en) * 2005-07-07 2007-01-11 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for wafer cleaning
US8407846B2 (en) * 2006-03-07 2013-04-02 Applied Materials, Inc. Scrubber brush with sleeve and brush mandrel for use with the scrubber brush
US20100043160A1 (en) * 2008-08-20 2010-02-25 United Microelectronics Corp. Wafer cleaning roller

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI648107B (zh) * 2012-04-03 2019-01-21 伊利諾工具工程公司 凹型結核海綿刷

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