M359806 五、新型說明： 【新型所屬之技術領域】 、本創作係關於一種聚光元件，特別是一種以溶膠凝膠 方式製成，用於發光二極體模組之石英透鏡聚光元件。 【先前技術】 目則發光二極體（LED)有逐漸取代傳統的白熾燈炮和 ^素燈炮的趨勢，其主要原因是發光二極體的亮度提升且 價格逐漸下降。發光二極體目前不僅使用在住家、辨公場 所等處的照明，更被應祕路燈、交通指示燈、車前燈等 温濕度變化較大的環境，為其提供省電、高亮度的照明能 力。 一般而言，晶片材料的選擇會決定發光二極體的亮度 的5〇%，另外的50 %則取決於發光二極體的封裝技術及 封裝材料。發光二極體的封裝材料有環氧樹脂、基板和聚 光疋件’目前常料基板有塑膠基板、紹基板和陶竟基 板。而發光二極體的主要封裝製程有手動轉、灌膠封裝 和模壓封裝，藉由人工或是機台操作，將基板和聚光元件 以環氧樹脂接合。 在很多情況下，由於基板和聚光元件間的接合情況不 良’在進行運輪、焊接的過程中，或是因氣候的變化，發 光二極體模組會產生聚光元件脫'落的情形，這種情形將大 幅度影響發光二極體的發光效能，同時可能對用路人及車 輛行駛造成安全上的問題。選用結合性良好的環氧樹脂或 3 M359806 文進基板和聚光元件接合方式，將有助於改善此情況。 【新型内容】 本創作提供一種具有高穿透率、高耐候性、可阻絕水 氣對於發光一極體晶片影響，且可強化與基板結合能力的 聚光元件。 為逹上述目的所使用之主要技術手段為以溶膠凝膠 方式製成石英透鏡聚光元件，具有高穿逸率及高耐候性。 此聚光元件底面外緣具有數個缺角，可在發光二極體進行 封裝製程中，讓黏著用環氧樹脂從缺角溢出，對聚光元件 底面外緣形成包覆效果，強化聚光元件和基板的黏合強 度，同時阻絕水氣對於發光二極體晶片的影響。 【實施方式】 請參閱帛1圖所示，係為本創作石英透鏡聚光元件— # 紹圭實施例之剖面圖。此石英透鏡聚光元件為以溶膠凝勝 方式所製成，包含-半球狀凸起物1〇1及一底面1〇2。 而後請參考第2圖，係為本創作石英透鏡聚光元件一 — 較佳實施例之俯視圖，其底面有一外緣2(H，外緣有四個 缺角202。 接下來請參考第3圖，係為發光二極體之封褒方式， 將發光二極體晶片則固定於基板3〇2的中央凹槽的電極 (未繪示）之上，加裝導線3〇3使晶片3〇1與基板3〇2上之 另-電極（未緣示）連接以形成週路。再於接合處綱注入 環氧樹脂，將石英透鏡聚光元件305黏合於基板3〇2之 4 M359806 u合時’環氧樹脂會從缺角溢出，並向前後左右擴張 *覆盍於外緣之上，對石英透鏡聚光元件底面外緣形成包 覆效果，如此可增強石英透鏡聚光元件與基板間的黏合強 度。 、$然本創作已以一較佳實施例揭露如上，然其並非用 α限疋本創作，任何熟習此技藝者，在不脫離本創作之精 神和範圍内，當可作各種之更動與潤飾，因此本創作之保 φ 魏圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖：石英透鏡聚光元件剖面圖。 第2圖：石英透鏡聚光元件俯視圖。 第3圖：發光二極體封裝剖面圖。 【主要元件符號說明】 101石英透鏡凸起物 102石英透鏡底面 201石英透鏡底面外緣 202石英透鏡底面外緣缺角 3〇1發光二極體晶片 302基板 303 導線 5 M359806 304接合處 305石英透鏡聚光元件M359806 V. New description: [New technical field] This creation is about a concentrating element, especially a quartz lens concentrating element made of sol-gel method for illuminating diode modules. [Prior Art] The trend of light-emitting diodes (LEDs) has gradually replaced the traditional incandescent bulbs and bulbs. The main reason is that the brightness of the LEDs is increased and the price is gradually decreasing. At present, the light-emitting diodes are not only used for lighting in homes, public places, etc., but also provide energy-saving and high-brightness lighting in environments where temperature and humidity, such as secret street lights, traffic lights, and headlights, vary greatly. . In general, the choice of wafer material will determine 5% of the brightness of the LED, and the other 50% will depend on the packaging technology and packaging material of the LED. The packaging materials of the light-emitting diodes are epoxy resin, substrate and light-emitting element. At present, the conventional substrate has a plastic substrate, a substrate and a ceramic substrate. The main packaging process of the LED is a manual transfer, a potting package and a molded package. The substrate and the concentrating element are epoxy-bonded by manual or machine operation. In many cases, due to poor bonding between the substrate and the concentrating element, the illuminating diode module may cause the concentrating element to fall off during the process of carrying the wheel, welding, or due to climate changes. This situation will greatly affect the luminous efficacy of the light-emitting diodes, and may cause safety problems for pedestrians and vehicles. The use of a well-bonded epoxy or 3 M359806 splicing substrate and concentrating element bonding will help to improve this situation. [New content] This creation provides a concentrating element that has high transmittance, high weather resistance, can block the influence of moisture on the light-emitting one-pole wafer, and can strengthen the ability to bond with the substrate. The main technical means used for the above purposes is to form a quartz lens concentrating element by a sol-gel method, which has a high rate of wear and high weather resistance. The outer edge of the bottom surface of the concentrating element has a plurality of corners, and the epoxy resin for the adhesive can be overflowed from the corner when the LED is packaged, and the outer edge of the bottom surface of the concentrating element is coated to enhance the concentrating. The bonding strength of the component and the substrate, while blocking the influence of moisture on the LED chip. [Embodiment] Please refer to Fig. 1 for a schematic view of a quartz lens concentrating element - #绍圭 embodiment. The quartz lens concentrating element is made by a sol-gel method, and includes a hemispherical protrusion 1〇1 and a bottom surface 1〇2. Please refer to FIG. 2, which is a top view of a preferred embodiment of the quartz lens concentrating element. The bottom surface has an outer edge 2 (H, and the outer edge has four notches 202. Next, please refer to FIG. The sealing method of the light-emitting diode is fixed on the electrode (not shown) of the central groove of the substrate 3〇2, and the wire 3〇3 is added to make the chip 3〇1 Connected to the other electrode (not shown) on the substrate 3〇2 to form a circumferential path. The epoxy resin is injected into the joint, and the quartz lens concentrating element 305 is bonded to the substrate 3〇2 4 M359806 u 'Epoxy resin will overflow from the corners, and expand forward and backward * to cover the outer edge, forming a coating effect on the outer edge of the bottom surface of the quartz lens concentrating element, thus enhancing the space between the quartz lens concentrating element and the substrate The bonding strength has been disclosed above in a preferred embodiment. However, it is not limited to the use of alpha, and any person skilled in the art can make various kinds without departing from the spirit and scope of the creation. Change and retouch, so the preservation of this creation φ Weiwei is attached to the application The definition of the patent scope shall prevail. [Simplified description of the drawings] Fig. 1 is a cross-sectional view of a quartz lens concentrating element. Fig. 2 is a top view of a quartz lens concentrating element. Fig. 3 is a sectional view of a light emitting diode package. Main component symbol description] 101 quartz lens protrusion 102 quartz lens bottom surface 201 quartz lens bottom surface outer edge 202 quartz lens bottom surface outer edge notch 3〇1 light-emitting diode wafer 302 substrate 303 wire 5 M359806 304 joint 305 quartz lens Optical component