M359013 五、新型說明： 【新型所屬之技術領域】 本創作為m片燒錄及打印機，用於實施積 路晶片的燒錄作業及打印作業。 【先前技術】 ^著各類型電子產品越來越普及，也使得每個電子 產品的必要元件-積體電路晶片（integ瞻也㈤ 扣 chip)的需求量越來越大。積體電路晶片在設置於電子產 都需經過燒錄(burning)的作業，將積體電路放置 :: ::機内的燒錄座上’然後該燒錄座會將預先定義 且右:燒人至積體電路晶片中，讓積體電路晶片能夠 〃有控制電子產品的其他元件的功能。 、烏葬Γ為少晶片燒錄的作業時間，目前晶片燒錄普 =:自動化晶片燒錄機來完成，例如中華民國專利 虎議6360所提出的『IC燒錄 曰 1進而士曰加晶片的出貨速度。 二習知積體電路晶片燒錄作業的程序，主要步驟 ㈣林=方式將—置放有晶片的料盤放置於該自 内。然後自動燒錄機的機械手臂會依序地吸取 座上，以J體’並將積體電路晶片放置於燒錄 錄完成的晶片放置回料盤中。如此， 工：f i驟直到全部晶片都燒錄完成，再透過人 手動將料盤從燒錄機取出。 3 M359013 放至Si印：自/iff取出的料盤再經由人工方式置 將料盤的晶片依序取出 堪、有機械手臂，其能 印作業(耐㈣），將每ft放置於打印頭下方進行打 gj將母—個晶片頂面 或標記以供辨識或管理用。 P上付唬、文子 然而，由於晶片燒錄作業盥 台中進行，因此容易具有下列^!7作業疋在不同的機 2 機轉送到打印機時，需花費多 印的作業成本，並且^緩===晶片燒錄及打 機與打印機具有部分類似的構件r:如機械手 而也造成晶片燒錄及打印的作業成 -種 【新型内容】 機21乍I之主要目在於提供一種晶片燒錄及打印 m減少晶片的燒錄及打印的整體作業時間。 =上述目的’本創作提出一種晶片燒錄及打印 機，包括：-機座，其上側固定有至少一支撐 一 燒錄模組’其設置於該機座的上側；一機械手^且 其固定於該支撐結構上；一％## 祆 Π 打印模組，其設置於該機械手臂模 本創作具有以下有益效果： M359013 ΐ 整合於同-機台内，因此晶 片在k錄完後即能立即進行打印作f，不需再轉送 2 到別的機台中，進而節省打印的作業時間。 該晶片燒錄及打印機的結構、元 :細立設置-燒錄機及-打印機而言其= 簡’也較減少成本。 八、、, 3 該機械手臂模、_定於該支撐結構上， 上側有-段距離，使得機座:上： 月匕夠有更多空間架設其他元件，例如出料平台。 為使能更進-步了解本創作之特徵及技術内容，, 有關本創作之詳細㈣及圖式，“所附圖式 ㈣，並料料摘作細限制者。 請參閱第-圖至第四圖所示為本 2印機’其包括-機座10、一燒錄模組t = 权組3 0、-吸料模組4〇、一打印模組5〇、 出料平台6 0及一檢測模組7 〇。 體所^座1 〇為晶片燒錄及打印機的主體，其由-板 機：3丄:曰曰丨片燒錄及打印機的其他元件都是架構在該 〇上側。而該機座1〇下側設置有一箱體丄6， 具有氣壓模組、電源模組及控制電路模組 不等，用以提供動力或控制訊號於後述各元件。 二座10上側設置有二直立的支撐結構11，該 分別位於該機座1 〇上側的左右兩 ^專支撐結構11的頂面距離機座10上側有一P 距。而該機座1 〇上側另設置有一殼體工2，該殼^ M359013 1 2旎將機座1 〇上側完全遮蓋住，且該晶片燒錄及打 印機的其他元件（例如··支撐結構丄丄、燒錄模組2 〇、 機械手臂模組30、出料平台6〇及檢測模組7 〇)都 位於該殼體12内，保護該些元件不易直接被碰撞或接 觸。M359013 V. New Description: [New Technology Field] This is a m-chip burning and printer for the programming and printing of integrated chips. [Prior Art] As the popularity of various types of electronic products has become more and more popular, the demand for integrated circuit-integrated circuit chips (integical) has become more and more demanding. The integrated circuit chip is placed in the electronic production and needs to be burned. The integrated circuit is placed on: :::> on the burning seat inside the machine'. Then the burning seat will be pre-defined and right: burning people In the integrated circuit chip, the integrated circuit chip can have the function of controlling other components of the electronic product. The burial time of the burial is the operation time of the less wafer burning. At present, the wafer burning is completed by the automatic wafer burning machine. For example, the IC burning program of the Republic of China Patent No. 6360 proposes "IC burning 曰1 and then the 曰 曰 晶片 wafer Shipping speed. The procedure of the second conventional integrated circuit chip burning operation, the main steps (4) Lin = mode - the tray on which the wafer is placed is placed inside. Then, the robot of the automatic burner will sequentially suck the holder, and place the integrated circuit wafer on the wafer to be placed in the recording tray. In this way, the work is completed until all the wafers are burned, and then the tray is manually taken out from the burner. 3 M359013 Placed on Si: The tray taken out from /iff is manually placed to remove the wafer of the tray in sequence, with a robotic arm, which can print jobs (resistance (4)), placing each ft under the print head Gj will be used to identify or manage the top surface of the wafer or mark. However, since the wafer burning operation is carried out in the middle of the wafer, it is easy to have the following ^! 7 jobs. When transferring to a printer from a different machine, it takes a lot of printing costs, and ^=== = wafer burning and machine and printer have some similar components r: such as robots, which also cause wafer burning and printing operations. [New content] The main purpose of the machine 21乍I is to provide a wafer burning and Printing m reduces the overall operating time of burning and printing of the wafer. = the above purpose 'This creation proposes a wafer burning and printer, comprising: - a base on which an upper side is fixed with at least one support and a programming module' disposed on the upper side of the base; a robot ^ and fixed thereto The support structure; a %## 祆Π printing module, which is set in the robot arm template has the following beneficial effects: M359013 整合 integrated in the same machine, so the wafer can be immediately executed after the k recording Printing f, no need to transfer 2 to another machine, thus saving printing time. The structure of the chip burning and printer, the unit: the fine setting - the burner and the printer - are also reduced in cost. VIII,,, 3 The mechanical arm mold, _ is set on the support structure, and the upper side has a-segment distance, so that the base: upper: the moon has enough space to erect other components, such as the discharge platform. In order to enable further understanding of the characteristics and technical content of this creation, the details (4) and drawings of the creation, "the drawing (4), and the materials are excerpted as fine restrictions. Please refer to the figure - to the first The four figures show that the two printers include a base 10, a programming module t = a weight group 30, a suction module 4, a printing module 5, a discharge platform 60, and A detection module 7 〇 体 ^ 体 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片The lower side of the base is provided with a box body 6 having a pneumatic module, a power module and a control circuit module for providing power or control signals to the components described below. An upright support structure 11 is disposed on the upper side of the upper side of the base 1 and has a P distance from the upper side of the base 10. The upper side of the base 1 is further provided with a shell 2 The shell ^ M359013 1 2旎 completely covers the upper side of the base 1 and the chip is burned and other components of the printer (for example, support) The structure 烧, programming module 2 机械, robot arm module 30, discharge platform 6 〇 and detection module 7 〇) are all located in the housing 12 to protect the components from direct collision or contact.
^冗又體1 2的前側開設有一開口 1 3，該開口 1 3從 該殼體1 2的下侧-直往上延伸至殼體〗2的上側。該 威體1 2的後側另開設有—缺口！ 4，其由殼體工2的 下側往上延伸-段距離’該缺σ14的高度及寬度分別 略大於後述的出料平台6 〇的高度及寬度。 該機座1 〇上側另凹設有 … 夏竹僧丄υ，丹1IL於孩 機座1 ◦的左前端，該置料槽1 5能提供收容晶片8 〇 該載具可為料盤(tray)、料管㈣或料帶 該燒錄模組2 0可分離地設置於該機座i 〇的上 ，，並靠近機座1 Q的右端。該燒龍 :數個燒錄座21，該等燒錄座21可另^ ==燒錄至晶片8〇中。由於該燒錄SC 模:^式’因此使用者可依需求更換不_型的燒錄 該機械手臂模组3 Q由—第—方㈣ 方向傳動f 3 2所組成，該機械手臂模 組40及打印模組50於機座10 = 私動。该弟-方向傳動臂3 i為一左右 上方 兩端固定於該二支撐結構1 1上。而第-方^ ;、，其 2為-前後延伸的橫襟，其設置於該 6 M359013 傳動臂3 2左能帶動及導引該第二方向 二方該打印模組5〇都設置於該第 吸料模組4 〇的寸古侧十，且該打印模組5〇位於該 吸料模組4 〇及：扣：該第二方向傳動臂3 2能帶動該 ‘ 印模組50前後水平地移動。 方向傳動臂31及第二方向傳動臂^9γ •由一馬達或氣壓叙作為動力谓而士—得動13 2可 (圖未示）為例。，、、巾是以馬達 1，而第一上側也可只固定一個支撐結構1 1上。第—方3 1的—端固定於該支撐結構1 二4 t向傳動臂31的另 丄 固定於殼體12上等（圖未示）。^―，或-可以 而該機械手臂桓_ q η !· π (圖未示）（音扑且、右 也犯以一關節式機械手臂 同樣能遠^Ί 轉接頭的機械手臂）取代，並 J樣π達成f動吸料模組 - 10上方移動的功效。U及打㈣組5 0於機座 請參閱第五圖及六圖所 一管路與真办亏、者土 該及枓輻組4 0另具有 的末端設置；U未示)相連接，該吸料模組4 〇 運作時，該吸料頭4!會產生、1虽真二泵浦 住。 負壓而將晶片8 0吸取 該打印模組50末端具有一 5 1，該打印頭51的太诚呈古直移動的打印頭 未示）’其表面沾附有墨水二打；；：的浮凸物（圖 8 0表面時，能將，黑k献““”碩5 1接觸到晶片 犯㈣墨水轉印到晶片 7 M359013 晶片8 0表面具有特定的文字、標籤或符號等。 該出料平台6 Q設置於機座i 〇的上側，並位於該 機座1Q的右後端（位於該燒錄模組2◦的右方及置料 =15的後方）’且出料平台6Q的後端通過該殼體工 2的缺口 1 4伸出於該機座丄〇及殼體丄2外。 該出料平台6 〇上設置有一傳送臂6工及一托盤 62，該傳送臂61能帶動該托盤62前後地水平移 動’讓托盤6 2能在殼體1 2内外進出。該托盤6 2上 , 可放置一料盤9 〇。 該檢龍組7〇設置於機座i 〇的上側，並位㈣ 燒錄模組2 Q、置料槽1 5及出料平台6 Q三者之間°， 該檢測模組7 0能檢測當吸料模組4 〇抓取晶片 8 〇針腳的位置是否正確。如晶片8 0的針腳 位置偏移，則檢測模組7〇會發出訊號通 4 0將晶片8 0轉正，之徭兮明把/ n 次丁叶模、，且 曰M Γ 顿組4 0才能順利將 曰日片8 0置放入燒錄模組2 〇的燒錄座2丄中。 上述為本創作晶片燒錄及打印機的各元件的配置 =:1::，而該晶片燒錄及打印機實際的燒錄及打 P作業k程將於下述中說明。 w H1二首先，該機械手臂模組3 〇位於其初始位 置（機座10上侧的右端），而該出料平 62位於該機殼12内，並且域62上會放置該= 9 0 ,该料盤9 〇並未放置任何晶片8 〇。 構用者將多數個晶放置於—進料機 "不後然後再將該進料機構置於該機座1 ο 的置料槽1 5上。 戍丛J· υ 8 M359013 〇由置= :=30會帶動該吸料模組4 “對準該進料機亡該=模組 取住上移動將W8Q由吸 〇“===帶!該吸料模组4 測該晶片8 0的針腳是否正常且：0檢 移動至該燒錄模組2 0的其中_；： t == 4 0再 丄“广下移動將該晶片8〇:、置入該燒:座= 成兩種情之後的動作流齡 牛㈣」 1及步驟5 -2敘述。 該燒錄座2 ] If該吸，組4 0將晶片8 〇放置人 曰片8、η p掉1果此時恰好有另一燒錄座2 1上的 曰=〇已1錄完成’則該吸料模組4 〇會移動至該婷 n2 1上’並且將該燒錄座2工 揭: 該吸料模組4〇再移動至該出料4 :: 之後，料模組4。== 主置科槽1 5上方，吸取另一晶片8 〇。 該燒：：疒Γ當該吸料模組40將晶片80放置入 ^ 、’以上1後，如果此時恰好無任何燒錄座2 1上的 晶片8 0燒錄完成，則該吸料模組4 罢 料槽15上方，吸取另一晶片80Λ重新移動至置 步驟6:當全部的晶片8〇都已燒錄 放置於該托盤6 2上的料㈣0,此時該機械手臂模^ M359013 3 〇會帶動該打印模組5 〇移動到該料盤9 〇上方，並 且使該打印模組5 0對準該料盤9 〇上的其中一個晶 片^ 〇。該打印模組5 〇的打印頭5 1會向下移動接觸 到曰a片8 〇的頂面，將打印頭5丄上的墨水轉印至該晶 片8 〇頂面。之後該打印模組5 〇會移動到料盤9 〇上 的另一個晶片8 〇上進行打印作業，直到全部晶片8 都打印完成。 M ^ ^田王邛日日片8 0都打印完後，該機械手臂 3 〇會回到初始位置，而該托盤Θ 2及料盤9 〇合 f後移出於機殼i 2外，然後使用者再將該料盤9 〇取 ^業接下來可再重新執行下一批晶片8 0的燒錄及打印 用者料平台6 0也具有進料平台的功能，使 2了將襄有未燒錄打印的晶片δ Q的料盤9 0 送臂61再將料盤90移至殼體1 £=〇進行燒錄及打印作業。當晶 的Γίί’Γ機座1 ◦的置料槽15可作為晶片8 0 4槽，粍錄及打印完的晶片8 〇可放置於 後由人力或機具（圖未示)將晶片8〇 = 厶b 月& 音槽15也可同時具有進料及出料的功 一 w知置枓槽i 5能放置兩個料盤（或料帶 :祖:「個作為進料用，而另一個作為出料用。而此時， 平台6 0各元件（傳送臂6丄、托盤 不 =將:=平台？7組裝式，當不IS: 、” σ 6 〇攸該晶片燒錄及打印機拆卸移 M359013 除。 因此本創作的晶片燒錄及打印機 料的方式： π疋了叶出 A. 置料槽1 5放置未燒錄的晶片8 Q，而出料平 0放置燒錄及打印完成的w 8 Q，並且由^平台 6 0將§玄等晶片8 〇移出。 B. 出料平台6 ◦放置未燒錄的晶片8 〇，而置料槽工 5放置燒錄及打印完成的晶片 5將該等晶片80移出。8〇並且由置料槽1 c.，料槽1 5放置未燒錄的晶片8 〇以及燒錄、打印 元，的晶片80，並且由置料槽工5中將 打印完成的晶片8 〇移出。 細上所述，本創作的效果可總結如下： 2 1、模組2 0、該吸·組4()及打印模組5〇 正5於同—機座1。中，因此晶片80在燒錄完後 即能隨即進行㈣作業，節省打印作業的時間。 打印機的結構、元件及體積比起習知 3 間，也較減少成本。 〃 ‘、、、精 該機械手臂馳3㈣定於支#結構1 ljL，因此 =機械手臂模組30距離機座10上側有一段距 寻機座1〇上側能夠有更多空間架設其他元 件，例如該出料平台6 〇。 該出料平台6 0能直接將燒錄及打 :往後輪送至殼體12外，藉此使用； = = : 冗又體1 2後方收取該等晶片8 〇。 11 4 M359013 以ΐ所述僅為本創作之較佳實施例，非意欲偈限 = 利保護範圍’故舉凡運用本創作說明書及圖 以：：之：效變化，均同理皆包含於本創作之權利 保邊靶圍内，合予陳明。 【圖式簡單說明】 第-圖係本創作晶片燒錄及打 第二圖係本創作Η片悻鉾β 4 之立肢圖。 M乍日日片燒錄及打印機之另一立舻闾 第三圖係本創作晶片燒錄 =謂圖 第五圖係本創作晶片祕及打=/ —立體分解圖。 模組之立體圖。 '之吸料模組及打印 第六圖係本創作晶片燒錄及打 模組之側視圖。 恢之吸料模組及打印 【主要元件符號說明】 1〇 機座 11 支撐結構 1 2 殼體 1 3 開口 1 4 缺口 15 置料槽 1 6 箱體 2 0 燒錄模組 2 1 燒錄座 3 0機械手臂模組 31第一方向傳動臂 32 f二方向傳動臂 12 M359013 吸料核組 4 0 4 1 吸料頭 5 0 打印模組 5 1 打印頭 60 出料平台 6 1 傳送臂 6 2 托盤 7 0 檢測模組 8 0 晶片 9 0 料盤The front side of the redundant body 1 2 is provided with an opening 1 3 which extends from the lower side of the housing 12 to the upper side of the housing 2. The rear side of the power body 12 is additionally provided with a gap! 4, which extends upward from the lower side of the casing 2 - the distance of the section σ is slightly larger than the height and width of the discharge platform 6 后 which will be described later. The upper side of the base 1 is recessed... Xia Zhuyu, Dan 1IL is at the left front end of the child's base 1 ,, the hopper 15 can provide a receiving wafer 8 〇 the carrier can be a tray, The tube (4) or the strip is detachably disposed on the base i , and adjacent to the right end of the base 1 Q. The burnt dragon: a plurality of burners 21, which can be burned into the wafer 8〇. Since the SC mode is: ^ type, the user can replace the non-type type of the robot arm module 3 Q by the first-fourth (four) direction drive f 3 2, the robot arm module 40 And the printing module 50 is on the base 10 = private. The directional-direction transmission arm 3 i is a left and right upper end and is fixed to the two support structures 1 1 . And the first square ^;, the 2 is - the front and rear extending transverse 襟, which is disposed on the 6 M359013 transmission arm 3 2 can drive and guide the second direction, the print module 5 〇 is disposed on the The first suction module 4 is located at the front side of the printing module 4, and the printing module 5 is located at the suction module 4 and: buckle: the second direction transmission arm 3 2 can drive the front and rear of the printing module 50 Move on the ground. The direction transmission arm 31 and the second direction transmission arm ^9 γ are exemplified by a motor or a pneumatic pressure as a driving force-moving 13 2 (not shown). The , , and the towel are the motor 1, and the first upper side can also be fixed to only one support structure 1 1 . The end of the first side 3 1 is fixed to the support structure 1 and the other side of the transmission arm 31 is fixed to the casing 12 or the like (not shown). ^―, or- can be replaced by the robot arm 桓 _ q η !· π (not shown) (sound and right, also the mechanical arm with an articulated arm that can also be far away from the adapter) And J-like π achieves the effect of moving the suction module - 10 above. U and hit (four) group 50 in the frame, please refer to the fifth and sixth diagrams of a pipe and the real office, the earth and the spokes group 40 have another end setting; U not shown) connected When the suction module 4 is operated, the suction head 4! will be generated, and 1 will be pumped. Negative pressure to suck the wafer 80 to the end of the printing module 50 has a 5 1, the print head 51 of the print head 51 is too straight to move the print head is not shown) 'the surface is covered with ink two dozen;; The protrusion (when the surface of Fig. 80 can be, the black k is given """ 5 1 contact with the wafer (4) ink is transferred to the wafer 7 M359013 The surface of the wafer 80 has a specific text, label or symbol, etc. The platform 6 Q is disposed on the upper side of the base i , and is located at the right rear end of the base 1Q (located on the right side of the programming module 2◦ and behind the stock = 15) and after the discharge platform 6Q The end protrudes from the casing 丄〇 and the casing 丄2 through the notch 14 of the casing 2. The discharge platform 6 is provided with a transfer arm 6 and a tray 62, and the transfer arm 61 can drive The tray 62 is horizontally moved back and forth 'to allow the tray 6 2 to enter and exit inside and outside the housing 12. 2. On the tray 6 2, a tray 9 可 can be placed. The inspection group 7 is disposed on the upper side of the base i ,. Parallel (4) between the programming module 2 Q, the receiving trough 15 and the discharging platform 6 Q, the detecting module 70 can detect when the suction module 4 〇 grabs the wafer 8 If the position of the pin is correct, if the pin position of the chip 80 is offset, the detection module 7 will send a signal to the terminal 40 to turn the wafer 80 to the positive, and then the n-th singular mode, and 曰M Γ顿组40 can successfully place the 曰日片80 into the burning 丄2 of the programming module 2 。. The above configuration of the chip burning and printer components =: 1::, The wafer programming and the actual burning and P-operation of the printer will be described below. w H1 2 First, the robot arm module 3 is located at its initial position (the right end of the upper side of the base 10). The discharge flat 62 is located in the casing 12, and the = 90 is placed on the field 62. The tray 9 is not placed with any wafer 8 〇. The constructor places a plurality of crystals on the feeder. "No later, then the feeding mechanism is placed on the receiving tank 1 5 of the base 1 戍 J J· υ 8 M359013 〇 置 = := 30 will drive the suction module 4 The feeder is dead. = The module is moved to move the W8Q by sucking "=== belt! The suction module 4 measures whether the stitch of the wafer 80 is normal and the 0 check moves to the burning mode. Group 2 0 Where _;: t == 4 0 and then 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广 广The burning seat 2 ] If the suction, the group 40 puts the wafer 8 〇 placed on the cymbal 8 , η p drops 1 fruit at this time, there is exactly another 烧 = 〇 has been recorded 1 completed The suction module 4 移动 will move to the top of the TN 1 and the work piece 2 will be uncovered: the suction module 4 〇 moves to the discharge 4 :: and then the material module 4 . == Above the main slot 1 5, draw another wafer 8 〇. The burning:: When the suction module 40 places the wafer 80 into the ^, 'above 1, if there is no burning of the wafer 80 on the burning seat 2 1 at this time, the suction mold Above the striker 15 of the group 4, the other wafer 80 is sucked and moved back to the step 6: when all the wafers 8 have been burned, the material placed on the tray 6 (4) 0, at this time, the robot arm mold M359013 3 The printing module 5 is moved to the top of the tray 9 and the printing module 50 is aligned with one of the wafers on the tray 9 . The print head 51 of the print module 5 is moved downwardly to the top surface of the 曰a sheet 8 , to transfer the ink on the print head 5 至 to the top surface of the wafer 8. The print module 5 then moves to another wafer 8 on the tray 9 to perform a print job until all of the wafers 8 have been printed. After the M ^ ^Tian Wang邛 day film 80 is printed, the robot arm 3 will return to the initial position, and the tray Θ 2 and the tray 9 will be moved to the outside of the casing i 2 and then used. Then, the tray 9 can be retried and then the next batch of wafers 80 can be re-executed and the print user platform 60 also has the function of the feeding platform, so that the 2 pieces will be unburned. The tray 90 of the printed wafer δ Q is transported and the tray 90 is moved to the housing 1 to be burned and printed. When the crystal Γίί'Γ 1 置 置 置 置 可 can be used as a wafer 804, the recorded and printed wafer 8 can be placed after the human or machine (not shown) will be the wafer 8 〇 =厶b month & sound tank 15 can also have the function of feeding and discharging at the same time. I can place two trays (or material belt: ancestor: "one for feeding, and the other for one As a discharge, at this time, the components of the platform 60 (transfer arm 6 丄, tray not = will: = platform? 7 assembled, when not IS:, σ 6 〇攸 the wafer burning and printer removal M359013 is divided. Therefore, the method of wafer burning and printer material of this creation: π 疋 叶 出 A. The storage tank 1 5 places the unburned wafer 8 Q, and the discharge is flat 0, and the burned and printed finished w 8 Q, and the 平台 等 等 等 等 。 。 。 。 。 B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B The wafers 80 are removed. 8 〇 and the unstacked wafers 8 and the wafers 80 of the burn-in, print cells are placed by the grooving tank 1 c., the troughs 15 , and by the grooving tank 5 The printed wafer 8 is removed. As described above, the effect of the creation can be summarized as follows: 2 1. Module 2 0, the suction group 4 () and the printing module 5 〇正5 in the same - the base 1. Therefore, the wafer 80 can be immediately (4) operated after the burnout, saving the time of the print job. The structure, components and volume of the printer are lower than the conventional ones, and the cost is reduced. 〃 ', ,, fine The mechanical arm is 3 (four) fixed to the structure #1jjL, so = the mechanical arm module 30 has a space from the upper side of the machine base 10 from the upper side of the machine seat 1 can have more space to erect other components, such as the discharge platform 6 〇 The discharge platform 60 can directly burn and hit: the rear wheel is sent to the outside of the casing 12, thereby using; ==: the redundant body 1 2 receives the wafers 8 〇. 11 4 M359013 The description is only a preferred embodiment of the present invention, and is not intended to limit the scope of protection. Therefore, the use of the present specification and the drawings is as follows:: the effect change, all of which are included in the right of the creation of the edge target In the encirclement, he will be given to Chen Ming. [Simple description of the diagram] The second picture is the vertical limb of the creation of the Η 悻鉾 4 4 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 4 4 4 4 4 4 4 4 4 4 The chip secret and the == - stereo exploded view. The stereoscopic view of the module. 'The suction module and the sixth print are the side view of the creation of the chip burning and module. Restore the suction module and print [ Main component symbol description] 1 〇 base 11 support structure 1 2 housing 1 3 opening 1 4 notch 15 storage slot 1 6 housing 2 0 programming module 2 1 burning seat 3 0 mechanical arm module 31 first Directional transmission arm 32 f Two-direction transmission arm 12 M359013 Suction core group 4 0 4 1 Suction head 5 0 Print module 5 1 Print head 60 Discharge platform 6 1 Transfer arm 6 2 Pallet 7 0 Detection module 80 0 Wafer 9 0 tray
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