M358969 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種積體電路測試卡’特別係關於一種 積體電路測試卡，其懸臂式探針於接觸一待測元件時具有 較小之橫向位移，因而可以應用於先進積體電路元件（具有 高密度接墊且細間距排列之待測積體電路元件）之電氣特 性。 ' 【先前技術】 一般而言，晶圓上的積體電路元件必須先行測試其電 氣特性，藉以判定積體電路元件是否良好。 路將被選出以進行後續之封裝製程，而不良品將被= 避免增加額外的封裝成本。冑成封裝之積體電路元件必須 再進行另一次電性測試以筛選出封裝不良品，進而提升最 終成品良率。換言之，積體電路元件在製造的過程中，必 須進行數次的電氣特性測試。 圖1及圖2例示一習知積體電路測試卡丨〇測試一待測元 件20之示意圖。該積體電路測試卡1〇包含一電路板12、一 設置於該電路板12上之支撐物14、以及以環氧樹脂18固設 於該支撐物14上之複數根探針16。該積體電路測試卡丨❹係 藉由該探針丨2接觸該待測元件2〇之接墊22，俾便形成一訊 號通路以傳送測試訊號至該待測元件2〇並傳送測試參數至 一測試機台（未顯示於圖中）。 參考圖2’進行電氣特性測試時，該待測元件2〇將上升 (或該測試卡Π)下降）使得該探針16之針尖邮接觸該待測 134944.doc M358969 ' 元件2〇之接塾22。在接觸該待測元件20之接塾22時，該探 ' 針16藉由其懸臂16Α變形而消除接觸時產生之應力，避免該 探針16損壞該待測元件20。特而言之，該探針16之針尖16Β 實質上係相對於其懸臂16Α之一預定部位24(位於該支撐物 14之邊緣）旋轉，俾便在垂直方向位移知。此外，由於採用 懸臂結構設計’該探針16之針尖16B在水平方向亦相應地橫 向位移Δχΐ。 _ 隨著先進積體電路元件之線寬與間距不斷縮小，接墊 22的尺寸亦相應地縮小。習知採用懸臂結構設計之探針μ 在接觸該待測元件2〇之接塾22時所產生之橫向位移Δχΐ太 大，因而無法應用於先進積體電路元件（具有高密度接墊且 細間距排列之待測積體電路元件）之電氣特性測試。 為了解決上述問題，習知技藝改用垂直式探針，取代M358969 V. New Description: [New Technology Field] This creation is about an integrated circuit test card. It is especially about an integrated circuit test card. The cantilever probe has a small contact when it touches a component to be tested. The lateral displacement can be applied to the electrical characteristics of advanced integrated circuit components (integrated circuit components to be tested having high-density pads and fine pitches). [Prior Art] In general, an integrated circuit component on a wafer must first be tested for its electrical characteristics to determine whether the integrated circuit component is good. The road will be selected for subsequent packaging processes, and defective products will be avoided to avoid additional packaging costs. The integrated circuit components of the package must be subjected to another electrical test to screen out defective packages, thereby improving the final yield. In other words, the integrated circuit component must be tested for electrical characteristics several times during the manufacturing process. 1 and 2 illustrate a schematic diagram of a conventional integrated circuit test card test 1 to be tested. The integrated circuit test card 1 includes a circuit board 12, a support 14 disposed on the circuit board 12, and a plurality of probes 16 secured to the support 14 by an epoxy resin 18. The integrated circuit test card contacts the pad 22 of the device under test 2 by the probe 丨 2, and forms a signal path to transmit a test signal to the device under test 2 传送 and transmits the test parameters to A test machine (not shown). When the electrical characteristic test is performed with reference to FIG. 2', the device under test 2〇 will rise (or the test card) is lowered) so that the tip of the probe 16 is in contact with the 134944.doc M358969' component 2 twenty two. Upon contact with the interface 22 of the device under test 20, the probe 16 is deformed by its cantilever 16Α to eliminate stress generated during contact, thereby preventing the probe 16 from damaging the device under test 20. In particular, the tip 16 of the probe 16 is substantially rotated relative to a predetermined portion 24 of the cantilever 16 (located at the edge of the support 14) and the chin is displaced in the vertical direction. In addition, due to the cantilever structure design, the tip 16B of the probe 16 is correspondingly displaced laterally by Δχΐ in the horizontal direction. _ As the line width and spacing of advanced integrated circuit components continue to shrink, the size of the pads 22 is correspondingly reduced. It is known that the probe μ designed by the cantilever structure has a lateral displacement Δχΐ which is generated when the contact 22 of the device to be tested is contacted, so that it cannot be applied to an advanced integrated circuit component (having a high-density pad and fine pitch). Electrical characteristics test of the integrated circuit components to be tested. In order to solve the above problems, the conventional technique is replaced by a vertical probe.
懸臂式探針，例如 US 5,977,787、US 5,952,843 及 US 6’476,626揭示之垂直式探針技術。垂直式探針雖然可以藉 • 由本身之縱向彈性變形提供針尖在接觸待測積體電路元件 所需之縱向位移，因而在接觸該待測元件2〇之接墊Μ時實 質上並不會產生橫向位移’可有效解決上述問題。惟，垂 直式探針之成本明顯較懸臂式探針昂貴’且其結構設計亦 衍生出其它問題，例如當垂直式探針本身之變形量過大時 ，相鄰探針將因彼此接觸而發生短路或相互碰撞。 【新型内容】 本創作提供一種積體電路測試卡，其懸臂式探針於接 觸一待測元件時具有較小之橫向位移，因而可以應用於先 134944.doc M358969 . 進積體電路元件（呈士一 T b、有咼密度接墊且細間距排列之待測積 • 體電路元件）之電氣特性。 本創作之積體電路測試卡之一實施例，包含一電路板 «X置於β電路板上之—支撲物、以及固設於該支樓物上 之複數根懸臂式探針。該懸臂式探針包含一針尖、局部固 β又於該支樓物上之—尾段、以及炎置於該尾段與該針災間 之-中間段’其中該中間段並未固設於該支撐物上，該中 鲁 間段與该尾段之間存有一轉折。 本創作之積體電路測試卡之另一實施例，包含一電路 板、設置於該電路板上之一支撐物、以及固設於該支撑物 上之複數根懸臂式探針。該懸臂式探針包含一尾段、一針 尖、以及夾置於該尾段與該針尖間之一中間段，其中該尾 段係局部固设於該支撐物上，該針尖具有一傾斜部及一尖 部’該中間段並未g}設於該支撐物上，該中間段與該尾段 之間存有一轉折。 • 上文已相當廣泛地概述本創作之技術特徵及優點，俾 使下文之本創作詳細描述得以獲得較佳瞭解。構成本創作 之申請專利範圍標的之其它技術特徵及優點將描述於下文 。本創作所屬技術領域中具有通常知識者應瞭解，可相當 容易地利用下文揭示之概念與特定實施例可作為修改或設 • 計其它結構或製程而實現與本創作相同之目的。本創作戶斤 • 屬技術領域中具有通常知識者亦應瞭解，這類等效建構無 法脫離後附之申請專利範圍所界定之本創作的精神和範圍 134944.doc M358969 【實施方式】 圖3及圖4例示本創作之積體電路測試卡3〇之一實施例 。該積體電路測試卡30包含一電路板32、設置於該電路板 32上之一支擇物34、以及固設於該支樓物34上之複數根懸 臂式探針36。該探針包含一針尖36C、局部固設於該支撐物 34上之一尾段36A、以及夾置於該尾段3 6A與該針尖3 6C間 之一中間段36B。其中該中間段36B並未固設於該支撐物34 上。 在本創作之一實施例中，在該探針36尚未接觸該待測 元件20之接墊22時，該中間段36B與該尾段36A之間存有一 轉折36D ’二者之夾角小於180度’亦即該中間段36B與該 尾段36A乃該探針36之不同部位。此外’該中間段36B可採 水平設置，亦即平行於該電路板12之底面或該待測元件2〇 之上表面；相對地，該尾段3 6 A係採傾斜設置，亦即傾斜於 該電路板12之底面。在本創作之一實施例中，該中間段36B 與該針尖36C之夾角大於90度。該支撐物34具有一傾斜面 34·，該尾段36A係藉由環氧樹脂38局部固設於該傾斜面34· 上。該針尖36C係以傾斜方式設置，亦即以傾斜方式接觸該 待測元件20之接墊22。 參考圖4 ’進行電氣特性測試時，該待測元件2 〇將上升 (或該測試卡30下降）使得該探針36之針尖36c與該待測元 件20之接墊22接觸❶在接觸該待測元件2〇之接墊22時，該 探針36藉由其懸臂（即該尾段36A與該中間段36B)變形而消 134944.doc -6 - M358969 除接觸時產生之應力，俾便避免該探針36損壞該待測元件 ' 20 °特而言之’該探針36之針尖36C及中間段36B實質上係 相對於該尾段36A之一預定部位4〇(位於該支撐物34之邊緣 )變形或旋轉，俾便在垂直方向位移Ay而消除應力。 藉由該針尖36C及該中間段36B實質上相對於該預定 部位40變形或旋轉’該探針3 6之針尖36C在水平方向之橫向 位移為’明顯小於圖2所示之Δχ1(在相同·的Ay下）。亦即 φ ’本創作之積體電路測試卡30雖然採用懸臂式探針36，但 疋藉由改變該探針36之結構設計，仍然可以縮小接觸談待 測το件20之接墊22時的橫向位移’因而得以應用於先進積 體電路元件（具有高密度接墊且細間距排列之待測積體電 路元件）之電氣特性，免除使用垂直式探針之昂貴成本及彼 此接觸而發生短路或相互碰撞等問題。 圖5及圖6例示本創作之積體電路測試卡6〇之另一實施 例。該積體電路測試卡60包含一電路板62、設置於該電路 鲁 板62上之一支撐物64、以及固設於該支撐物64上之複數根 懸臂式探針66。該探針66包含一針尖66C、局部固設於該支 撐物64上之一尾段66A、以及夾置於該尾段66八與該針尖 66C間之一中間段66B。該尾段66A係局部固設於該支撐物 64上，该針尖66C具有一傾斜部72及一尖部74，該傾斜部72 之寬度逐漸縮小，該中間段66B係夾置於該尾段66A與該傾 斜部72之間且並未固設於該支撐物64上。 在本創作之一實施例中，在該探針66尚未接觸該待測 134944.doc M358969 元件20之接墊22時，該中間段66B與該尾段66A之間存有一 . 轉折，二者之夾角小於180度，亦即該中間段66B與該尾段 66A乃該探針66之不同部位。此外，該中間段66B可採水平 設置，亦即平行於該電路板12之底面或該待測元件20之上 表面；相對地，該尾段66A係採傾斜設置，亦即傾斜於該電 路板12之底面。在本創作之一實施例中，該中間段66B與該 傾斜部72之夹角大於90度。該支撐物64具有一傾斜面64'， 該尾段66A係藉由環氧樹脂68局部固設於該傾斜面64'上。 該針尖66C之尖部74係以垂直方式設置，亦即以垂直方式接 觸該待測元件20之接墊22。 參考圖5，進行電氣特性測試時，該待測元件20將上升 (或該測試卡60下降）使得該探針66之針尖66C與該待測元 件20之接墊22接觸。在接觸該待測元件20之接墊22時，該 探針66藉由其懸臂（即該尾段66A與該中間段66B)變形而消 除接觸時產生之應力，俾便避免該探針66損壞該待測元件 . 20。特而言之，該探針66之針尖66C及中間段66B實質上相 對於該尾段66A與該中間段66B之預定部位70(位於該支撐 物64之邊緣）變形或旋轉，俾便在垂直方向位移Ay而消除應 力。 特而言之，藉由該針尖66C及該中間段66B實質上相對 • 於該預定部位70變形或旋轉，該探針66之針尖66C在水平方 向之橫向位移為Ax3，明顯小於圖2所示之Αχ 1 (在相同的Ay 下）。亦即，本創作之積體電路測試卡60雖然採用懸臂式探 134944.doc M358969 針66 ’但是藉由改變該探針％之結構設計，仍$可以縮小 '接觸該待'則元件20之接墊22時的橫向位移，因而可以應用 於先進積體電路元件（具有高密度接墊且細間距排列之待 測積體電路元件）之電氣特性，免除使用垂直式探針之昂貴 成本及彼此接觸而發生短路或相互碰撞等問題。 本創作之技術内容及技術特點已揭示如上，然而本創 作所屬技術領域中具㈣常知識者應瞭解，衫背離後附 ·_請專利範圍所界定之本創作精神和範圍内，本創作之教 示及揭示可作種種之替換及修御。例如，上文揭示之許多 製程可以不同之方法實施或以其它製程予以取代，或者採 用上述二種方式之組合。 此外，本案之權利範圍並不侷限於上文揭示之特定實施 例的製程、機台、製造、物質之成份、裝置、方法或步驟 。本創作所屬技術領域中具有通常知識者應瞭解，基於本 創作教示及揭示製程、機台、製造、物質之成份、裝置、 •方法或步驟，無論現在已存在或曰後開發者，其與本案實 施例揭示者係以實質相同的方式執行實質相同的功能，而 達到實質相同的結果，亦可使用於本創作。因此，以下之 申請專利範圍係用以涵蓋用以此類製程、機台、製造、物 質之成份、裝置、方法或步驟。 【圖式簡單說明】 藉由參照前述說明及下列圖式’本創作之技術特徵及優 點得以獲得完全瞭解。 圖1及圖2例示一習知積體電路測試卡測試—待測元件之 134944.doc M358969 示意圖； 圖3及圖4例示本創作之積體電路測試卡之一實施例；以 及 圖5及圖6例示本創作之積體電路測試卡之另一實施例。 【主要元件符號說明】 〔習知〕The cantilevered probes are disclosed, for example, in the vertical probe technique disclosed in U.S. Patent No. 5,977,787, U.S. Patent No. 5,952,843, and to U.S. Patent No. 6,476,626. Although the vertical probe can provide the longitudinal displacement required by the tip of the needle to contact the integrated circuit component to be tested by the longitudinal elastic deformation of the probe, it does not substantially generate the contact with the component to be tested. The lateral displacement' can effectively solve the above problems. However, the cost of the vertical probe is significantly more expensive than that of the cantilever probe, and its structural design also causes other problems. For example, when the deformation amount of the vertical probe itself is too large, adjacent probes will be short-circuited due to contact with each other. Or collide with each other. [New content] This creation provides an integrated circuit test card. The cantilever probe has a small lateral displacement when it contacts a component to be tested, so it can be applied to the first 134944.doc M358969. The electrical characteristics of a Tb, a tandem density pad and a fine pitch arrangement of the product to be tested. An embodiment of the integrated circuit test card of the present invention comprises a circuit board «X placed on the beta circuit board - a baffle, and a plurality of cantilever probes fixed on the support. The cantilever probe comprises a tip, a partial solid β and a tail segment on the branch, and an intermediate portion between the tail segment and the needle disaster zone, wherein the middle segment is not fixed On the support, there is a turning point between the middle and middle sections and the tail section. Another embodiment of the integrated circuit test card of the present invention comprises a circuit board, a support disposed on the circuit board, and a plurality of cantilever probes fixed to the support. The cantilever probe includes a tail section, a tip, and an intermediate portion between the tail section and the tip, wherein the tail section is partially fixed on the support, the tip has an inclined portion and A tip portion 'the middle portion is not g} is disposed on the support, and a transition is formed between the middle portion and the tail portion. • The technical features and advantages of this creation have been fairly broadly outlined above, so that a detailed description of the creations below will be better understood. Other technical features and advantages of the subject matter of the patent application of this creation will be described below. It will be appreciated by those of ordinary skill in the art that the present invention may be practiced with the same or equivalent embodiments of the invention. It is also understood by those who have general knowledge in the technical field that such equivalent construction cannot be separated from the spirit and scope of the creation as defined in the appended patent application. 134944.doc M358969 [Embodiment] FIG. 3 and Fig. 4 illustrates an embodiment of the integrated circuit test card 3 of the present invention. The integrated circuit test card 30 includes a circuit board 32, a support member 34 disposed on the circuit board 32, and a plurality of cantilever probes 36 fixed to the support member 34. The probe includes a tip 36C, a tail section 36A partially secured to the support 34, and an intermediate section 36B interposed between the tail section 36A and the tip 3 6C. The intermediate section 36B is not fixed to the support 34. In an embodiment of the present invention, when the probe 36 has not touched the pad 22 of the device under test 20, a transition 36D between the intermediate segment 36B and the tail segment 36A is less than 180 degrees. That is, the intermediate section 36B and the tail section 36A are different parts of the probe 36. In addition, the intermediate section 36B can be horizontally disposed, that is, parallel to the bottom surface of the circuit board 12 or the upper surface of the device under test 2; in contrast, the tail section 3 6 A is inclined, that is, inclined The bottom surface of the circuit board 12. In one embodiment of the present invention, the intermediate segment 36B is at an angle greater than 90 degrees from the tip 36C. The support 34 has an inclined surface 34. The tail portion 36A is partially fixed to the inclined surface 34· by an epoxy resin 38. The tip 36C is disposed in an inclined manner, that is, in contact with the pad 22 of the member to be tested 20 in an inclined manner. Referring to FIG. 4', when the electrical characteristic test is performed, the device under test 2 〇 will rise (or the test card 30 is lowered) such that the tip 36c of the probe 36 is in contact with the pad 22 of the device under test 20, and is in contact with the device. When the component 22 is tested, the probe 36 is deformed by its cantilever (ie, the tail section 36A and the intermediate section 36B) to eliminate the stress generated by the contact of 134944.doc -6 - M358969, so as to avoid The probe 36 damages the device under test '20 ° in particular'. The tip 36C and the intermediate segment 36B of the probe 36 are substantially opposite to a predetermined portion 4 of the tail segment 36A (located on the support 34) The edge is deformed or rotated, and the squat displaces Ay in the vertical direction to eliminate stress. By the needle tip 36C and the intermediate section 36B being substantially deformed or rotated relative to the predetermined portion 40, the lateral displacement of the tip 36C of the probe 36 in the horizontal direction is significantly smaller than the Δχ1 shown in FIG. 2 (in the same Under Ay). That is, the integrated circuit test card 30 of the present invention uses the cantilever probe 36, but by changing the structural design of the probe 36, it is still possible to reduce the contact with the pad 22 of the member 20 to be tested. The lateral displacement' is thus applied to the electrical characteristics of advanced integrated circuit components (integrated circuit components to be tested with high-density pads and fine pitches), eliminating the costly use of vertical probes and short-circuiting or contact with each other. Collision and other issues. Fig. 5 and Fig. 6 illustrate another embodiment of the integrated circuit test card 6 of the present invention. The integrated circuit test card 60 includes a circuit board 62, a support 64 disposed on the circuit board 62, and a plurality of cantilever probes 66 secured to the support 64. The probe 66 includes a tip 66C, a tail section 66A partially secured to the support 64, and an intermediate section 66B interposed between the tail section 66 and the needle tip 66C. The tail section 66A is partially fixed to the support 64. The needle tip 66C has an inclined portion 72 and a tip portion 74. The width of the inclined portion 72 is gradually reduced, and the intermediate portion 66B is sandwiched between the tail portion 66A. The support member 64 is not fixed to the inclined portion 72. In an embodiment of the present invention, when the probe 66 has not touched the pad 22 of the 134944.doc M358969 component 20 to be tested, there is a transition between the intermediate segment 66B and the tail segment 66A. The angle is less than 180 degrees, that is, the intermediate section 66B and the tail section 66A are different portions of the probe 66. In addition, the intermediate section 66B can be horizontally disposed, that is, parallel to the bottom surface of the circuit board 12 or the upper surface of the device under test 20; in contrast, the tail section 66A is inclined, that is, inclined to the circuit board. The bottom of the 12th. In one embodiment of the present invention, the intermediate section 66B and the angled portion 72 are at an angle greater than 90 degrees. The support 64 has an inclined surface 64' which is partially fixed to the inclined surface 64' by an epoxy resin 68. The tip 74 of the tip 66C is disposed in a vertical manner, i.e., in a vertical manner, the pad 22 of the device under test 20 is contacted. Referring to FIG. 5, when the electrical characteristic test is performed, the device under test 20 will rise (or the test card 60 is lowered) such that the tip 66C of the probe 66 comes into contact with the pad 22 of the component 20 to be tested. When contacting the pad 22 of the device under test 20, the probe 66 is deformed by the cantilever (ie, the tail segment 66A and the intermediate segment 66B) to eliminate the stress generated during the contact, thereby preventing the probe 66 from being damaged. The component to be tested. 20. In particular, the tip 66C and the intermediate section 66B of the probe 66 are substantially deformed or rotated relative to the predetermined portion 70 of the tail section 66A and the intermediate section 66B (at the edge of the support 64), and the squat is vertical. The direction shifts Ay to eliminate stress. In particular, by the needle tip 66C and the intermediate section 66B being substantially deformed or rotated relative to the predetermined portion 70, the lateral displacement of the tip 66C of the probe 66 in the horizontal direction is Ax3, which is significantly smaller than that shown in FIG. Then 1 (under the same Ay). That is to say, although the integrated circuit test card 60 of the present invention adopts the cantilever type 134944.doc M358969 pin 66', but by changing the structural design of the probe%, it is still possible to reduce the 'contact the waiting' component 20 The lateral displacement of the pad 22 can be applied to the electrical characteristics of advanced integrated circuit components (integrated circuit components to be tested having high density pads and fine pitches), eliminating the expensive cost of using vertical probes and contacting each other. Problems such as short circuits or collisions. The technical content and technical characteristics of this creation have been revealed as above. However, those who have (4) common knowledge in the technical field of this creation should understand that the shirt is divorced from the attached spirit and the scope of the creation is defined by the scope of the patent. And reveals that it can be used for various replacements and repairs. For example, many of the processes disclosed above may be implemented in different ways or in other processes, or a combination of the two. Moreover, the scope of the present invention is not limited to the particular embodiments of the process, machine, manufacture, compositions, means, methods or steps of the particular embodiments disclosed. Those of ordinary skill in the art to which this creation belongs should understand that, based on the present teachings, and revealing processes, machines, manufacturing, material components, devices, methods, or steps, whether or not they exist now or later, The embodiment revealer performs substantially the same function in substantially the same manner, and achieves substantially the same result, and can also be used in the present creation. Therefore, the scope of the following claims is intended to cover such components, devices, manufactures, components, devices, methods or steps. BRIEF DESCRIPTION OF THE DRAWINGS The technical features and advantages of the present invention can be fully understood by referring to the foregoing description and the following drawings. 1 and 2 illustrate a conventional integrated circuit test card test - 134944.doc M358969 schematic diagram of the component to be tested; FIG. 3 and FIG. 4 illustrate an embodiment of the integrated circuit test card of the present invention; and FIG. 5 and 6 shows another embodiment of the integrated circuit test card of the present invention. [Main component symbol description] [Practical]
10 測試卡 12 電路板 14 支撐物 16 探針 16A 尾段 16B 針尖 18 環氧樹脂 20 待測元件 22 接墊 24 預定部位 〔本創作〕 30 測試卡 32 電路板 34 支撐物 34' 傾斜面 36 探針 36A 尾段 36B 中間段 36D 轉折 134944.doc -10- M3 5 8969 36C 針尖 38 移氣樹脂 40 預定部位 60 測試卡 62 電路板 64 支撐物 64' 傾斜面 66 探針 66A 尾段 66B 中間段 66C 針尖 66D 轉折 68 環氧樹脂 70 預定部位 72 傾斜部 74 尖部10 Test card 12 Circuit board 14 Support 16 Probe 16A Tail section 16B Tip 18 Epoxy 20 Component to be tested 22 Pad 24 Predetermined part [this creation] 30 Test card 32 Circuit board 34 Support 34' Inclined surface 36 Needle 36A Tail section 36B Middle section 36D Transition 134944.doc -10- M3 5 8969 36C Tip 38 Gasoline resin 40 Pre-determined part 60 Test card 62 Circuit board 64 Support 64' Inclined surface 66 Probe 66A Tail section 66B Middle section 66C Tip 66D Transition 68 Epoxy 70 Predetermined part 72 Inclined portion 74 Tip
134944.doc134944.doc