M356319 八、新型說明： • 【新型所屬之技術領域】 本創作種練發n，特指―_化構纽可有升生產效 率的光收發器組裝結構。 【先前技術】 . 所光收發器於光纖網路技射，主要功能仙來作為光電訊 ‘號轉換，電訊躲光收發H而轉換為光職並將該光訊賴送至與該 ⑩光收發器輕合之光纖’經由光纖將光訊號以高速傳遞至下一個光收發 器’再將接收到❸光訊號轉換為電訊號，而供資訊裝置進行=資料處理。 第1圖及第2圖係顯示-般光收發器。如圖i及圖2所示，一般 光收發器1具備有發送光訊號的光發敎模树T〇SA)11以及接收光訊 號的光接收讀組(R〇SA)12，該等次敝分顺具有㈣桃的主電 路板13連接； 該光發送次模組11(以下簡稱T0SA)至少具有：一貫穿孔mi的 鲁巾s蓋(CAP)lll，-將電訊號轉換為光訊號並發射出光訊號之光訊號發 :射晶片（Chip) 112 ; 一基座(header)113，·以及一用以使光纖F與光訊號 發射晶片耦接的光纖接頭埠(Barrei)ii4,且該光纖接頭埠114内於光纖 端處設有一凸透鏡(圖中未示）；其中該光訊號發射晶片112係設於該 基座113上’且該帽蓋上對應於該貫穿孔lm處設有一平面透鏡 Π5，該帽蓋111係罩住容置有光訊號發射晶片112的基座Π3周圍， 而在容置有該發射晶片112之基座113與帽蓋111之間形成氣密視窗 (Flat window) 116 ’當光訊號發射晶片112將電訊號轉換為光訊號時， 5 M356319 該光訊號透過平面透鏡115並利用光纖接頭蜂ii4内所設之凸透鏡麵 接至光纖F，且該光纖F外包覆有陶瓷套管14。 該光接收次模組12(以下簡稱R0SA)結構大致與光發送次模組結 構相同’至少係由-具有-貫穿孔1211之帽蓋121、一用以偵測光並 <將光訊號轉換為電訊號之光檢知晶片122、一基座123以及光纖接頭 、埠124所組成，其運作原理與光發送次模組相同，惟差異在於光路方 向與光發送次模組互為反向且於該光纖接頭埠124内未設有凸透鏡， _而是在該帽蓋121之貫穿孔1211上設有凸透鏡，藉由該凸透鏡使來自 光纖F之光利用該凸透鏡聚光至光檢知晶片122。其中該帽蓋⑵係 罩住容置有光檢知晶片122之基座123周圍，而在容置有該檢知晶片 122之基座123與帽蓋121之間形成氣密視窗126，當光訊號經光纖接 頭埠124導出時，會先通過帽蓋121上之凸透鏡125，將光源折射聚 焦於光檢知晶;W22，於光檢知晶片122將光訊號轉換為電訊號並傳 送至主電路板13。 惟，上述之光收發器之結構及其原理雖十分地成熟，並為業界常用 ^型結構，但此種光收發結構製造過程與其所婦之成本卻 效降低；其原因在於有二點： 屬於古—：收卷器的核心轉，光檢知晶片以及光訊號發射晶片皆 ==電子元件’亦即，該晶片須處在無水氣作業環射， _贿⑴、121來罩住設在基座仍、123 _訊號發_ m)，使該等晶請、瓜被封 密視S 116、126…並於該視窗内部含有情性氣體(如氮氣 6 M356319 等）。此種方式雖為實用’但未保持氣密而有導致帽蓋lu、ΐ2ι以及 基座113、123組裝成本過於昂貴之問題，該帽蓋出、m與其貫穿 孔上所設之透鏡115、125之間須絕對氣密之外，該帽蓋m、i2i與 裝設晶片（光檢知晶片122或是光訊號發射晶片112)之基座113、⑵ 間’亦須以高廢放電方式將兩者燒結為一體，燒結過程中必須在充滿 氮氣的環境中進行，才得以使帽蓋m、121躲座113、123間所形 成的氣密視窗充滿氮氣，達到穩定晶片工作環境。 而目前由於已發展雜歡之光檢知晶W及光峨發射晶片， 故已無須於充滿氮氣之環境下進行封裝，但仍舊需利用到該帽蓋山、 121，以安置透鏡。 其一，-般容置有光檢知晶片122及光訊號發射晶片ιΐ2的基座 113、123下端係利用高低不同的接腳端子s利用焊接與主電路板u 進行連接，製造時須將各接腳一一地焊接在主銳板13上，十分費 時，且易產生雜訊’除此之外’ T〇SA u及R〇SA 12所構成的零件數 過多’公絲域確_，易魅驗公差#_，魏透鏡與光訊 絲射晶片112(光檢知晶片122)難以準_光。為了解決各接腳一一 焊接在主電路板13上之缺點，目前有利用一軟性電路板將發光次模組 TOSA11及接收光次模組職12整個次模組谭接在軟性電路板上， 再由該軟性電路板触電職13職，而可赌決此缺點。惟此方法 仍無法簡化零件數。 、為此’如何有效改善前述之光收發器之生產成本過高及有效簡化 組成零件等㈣，乃為本所急欲鑛的課題。 7 M356319 【新型内容】 及水氣之主要目的在提供—種光收發11，係採用不受環境 射晶片而可解決氣密封裝的問題，並將該 等曰曰片直接趙絲性電路板上，藉讀性電路板端子平整且可一次 性的快速焊接的特性，取代傳統須焊接的端子接腳，並可省略諸 多構件並加速產能。M356319 VIII. New description: • [New technical field] This creation is a kind of optical transceiver assembly structure that can be used to enhance production efficiency. [Prior Art] The optical transceiver is used in fiber-optic network technology, and the main function is to use the photoelectric signal as the number conversion, the telecommunication to hide and receive the H and convert it to the optical position, and send the optical signal to the 10 optical transceiver. The optical fiber that is lightly coupled 'transmits the optical signal to the next optical transceiver via the optical fiber', and then converts the received twilight signal into a telecommunication signal for information processing by the information device. Figures 1 and 2 show a general optical transceiver. As shown in FIG. 2 and FIG. 2, the general optical transceiver 1 is provided with a light emitting tree T〇SA)11 for transmitting optical signals and a light receiving read group (R〇SA) 12 for receiving optical signals. The main circuit board 13 having the (four) peach is connected; the optical transmission sub-module 11 (hereinafter referred to as T0SA) has at least: a rib cover (CAP) of the perforated mi, and converts the electrical signal into an optical signal and transmits The optical signal of the optical signal is: a chip 112; a header 113, and a fiber connector Bar (Barrei) ii4 for coupling the optical fiber F to the optical transmitting chip, and the optical connector A convex lens (not shown) is disposed in the end of the fiber 114; wherein the optical signal emitting chip 112 is disposed on the base 113 and a flat lens is disposed on the cap corresponding to the through hole lm. The cap 111 covers the periphery of the base 3 on which the optical signal emitting chip 112 is housed, and a flat window 116 is formed between the base 113 and the cap 111 in which the emitting wafer 112 is accommodated. 'When the optical signal transmitting chip 112 converts the electrical signal into an optical signal, 5 M356319 the optical signal passes through the planar lens 115. The convex lens provided in the fiber connector bee ii4 is used to face the optical fiber F, and the optical fiber F is covered with a ceramic sleeve 14. The structure of the light receiving sub-module 12 (hereinafter referred to as R0SA) is substantially the same as that of the light transmitting sub-module. 'At least the cap 121 having the through-hole 1211, one for detecting light and < converting the optical signal The optical signal detecting chip 122, a pedestal 123, and the optical fiber connector and the cymbal 124 are configured, and the operation principle is the same as that of the optical transmitting secondary module, except that the optical path direction and the optical transmitting secondary module are opposite to each other. A convex lens is not disposed in the fiber optic connector 124, and a convex lens is disposed on the through hole 1211 of the cap 121. The convex lens is used to condense light from the optical fiber F to the optical detecting wafer 122. . The cap (2) covers the periphery of the pedestal 123 that houses the photodetecting wafer 122, and forms a hermetic window 126 between the pedestal 123 and the cap 121 that accommodates the detecting wafer 122. When the signal is led out through the fiber connector 埠124, the light source is first refracted and focused on the optical detector by the convex lens 125 on the cap 121; W22, the optical signal is converted into an electrical signal by the optical detection chip 122 and transmitted to the main circuit. Board 13. However, the structure and principle of the optical transceiver described above are very mature, and are commonly used in the industry. However, the manufacturing process of the optical transceiver structure and the cost of the woman are reduced; the reason is that there are two points: Ancient—the core of the winder, the light detection chip and the optical emission chip are == electronic components', that is, the wafer must be in the airless operation, _ bribe (1), 121 to cover the base Block still, 123 _ signal _ m), so that the crystal, melon is sealed S 116, 126 ... and inside the window contains emotional gas (such as nitrogen 6 M356319, etc.). Although this method is practical, but it is not kept airtight, there is a problem that the caps lu, ΐ2, and the pedestals 113, 123 are too expensive to assemble, and the caps, m, and the lenses 115 and 125 provided on the through holes are provided. In addition to being absolutely airtight, the caps m, i2i and the pedestals 113, (2) of the mounted wafer (the optical detection wafer 122 or the optical emission wafer 112) must also be placed in a high-discharge manner. The sintering is integrated, and the sintering process must be carried out in a nitrogen-filled environment, so that the airtight window formed between the caps m and 121 can be filled with nitrogen to stabilize the working environment of the wafer. At present, since the photodetection crystal and the optical emission wafer have been developed, it is not necessary to package in a nitrogen-filled environment, but it is still necessary to use the cap mountain 121 to accommodate the lens. First, the lower ends of the pedestals 113 and 123 of the photodetecting chip 122 and the optical transmitting wafer ι 2 are connected to the main circuit board u by soldering using different pin terminals s. The pins are welded one by one to the main sharp plate 13, which is very time consuming and easy to generate noise. In addition, the number of parts formed by the T〇SA u and the R〇SA 12 is too large. Charisma tolerance #_, Wei lens and optical wire wafer 112 (light detection chip 122) is difficult to _ light. In order to solve the shortcomings of soldering the pins on the main circuit board 13, the flexible sub-module TOSA11 and the receiving sub-module 12 are connected to the flexible circuit board by using a flexible circuit board. Then the soft circuit board is in charge of the job, and can be tempted to overcome this shortcoming. However, this method still does not simplify the number of parts. For this reason, how to effectively improve the production cost of the aforementioned optical transceiver and effectively simplify the components (4) is the subject of the company's urgent desire. 7 M356319 [New content] The main purpose of water and gas is to provide a kind of optical transmission and reception 11, which can solve the problem of hermetic packaging by using an environmentally-friendly wafer, and direct these slabs on a Zhaoxian circuit board. It replaces the traditional terminal pins to be soldered by the flat and disposable soldering of the read circuit board terminals, and can omit many components and accelerate the production capacity.
本創作有關一種光收發器，其包含: 一主控制電路； 一光訊號發射次模組，其包括 一光訊號騎晶；1，_轉魏賴換為光職並發射光 訊说之晶片；及 -光纖接稱，縣住光魏⑼且財—光纖貫穿插入 孔’於該貫穿插人孔另-端設有—凸透鏡，用以使來自發射光 訊號之晶片所射出之光折射並聚焦耦合至光纖F ; 一光訊號接收次模組，其包括 一光δίΐ號檢知晶片，係用以將接受自光纖的光訊號轉換成電 訊號；以及 一光纖接頭埠，係具有一光纖貫穿插入孔，且於該貫穿插入 孔另一端設有一凸透鏡用以使自光纖射出之光訊號聚焦投射至 該光訊5虎檢知晶片上； 以及 至少兩個軟性電路板分別用以連接該主控制電路與該光訊號 8 M356319 發射次模減連接齡控繼路與絲訊輯收次模組，該軟性 祕祕分為次模組設置端及軒連接端，端子連接端係與該主 控制電路連接’次模組設置端係與光訊號發射晶片及光訊號檢知 晶片直接焊接。 、 依據本創狀級發器，其巾於練性電路板上之次模組設置端 ·、之欲焊接光訊號發射晶片（光訊號檢知晶片）之相反側，設有一支撐 座，用以容置並支撐該次模組設置端以及光訊號發射晶片（光訊號檢知 ®晶片），藉以在將該等晶片直接焊接於軟性電路板上時，提供一支撐 點，俾提供晶片焊接時之定位精度。該支稽座並不侷限必須為電路板 材質，任何可提供支撐力的材質皆可為本創作所述之支撐座，例如： 丙烯酸系樹脂、環氧樹脂、玻璃纖維材質等之絕緣材質。 依據本創作之光收發器，其中該光訊號發射晶片及光訊號檢知晶 片係分別介以一底基座(submount)有間隔地與該軟性電路板直接焊接。 依據本創作之光收發器，其中於該光訊號發射次模組及該光訊號 鲁接收次模組中所用之光纖接頭埠具有相同構造。 依據本創作之光收發器，其中該光訊號接收次模組侧之該軟性電 路板上又設有一電訊號增裝置，用以使由光訊號檢知晶片自光所轉換 成之電訊號被增幅。 依據本創作之光收發器，其中該主控制電路係設於一硬基板上， 該硬基板可為一般印刷電路板。 依據本創作之光收發器，由於本創作係採用不受環境及水氣影響 的光訊號檢知晶片及光訊號發射晶片，故本創作之光訊號發射組及光 9 M356319 訊號接收組不需使用防治水氣的氣密視窗陶wind〇w)結構，如:帽慕 (Cap)、基座(header)等較為昂貴且組裝成本較高的構件。 此外本創狀級發ϋ ’祕係錢將歧餘知⑼（光訊號發 射晶片）直接設於軟性電路板的次模組設置端上，並直接利用該光纖操 ，頭埠(Barrel)内設置之凸透鏡使光訊號產生聚焦，因此於光訊號接收次 .、模組及光訊號發射次模組可共用相同的光纖接頭埠，而無須分別製造 用於光訊麵收次模組及光峨鶴:域組之賴接稱，故在構件 ⑩之製造成本上具有相當優勢。 本創作之光收發器之構成’當來自主電路板之電訊號藉由該軟性 電路板傳送至該光訊號發射晶片時，於該晶片將電訊號轉換成光訊 號，且該光訊號直接射入光纖接頭埠並利用該光纖接頭埠内所設之凸 透鏡聚焦耦合至光纖；而當光訊號經光纖接頭埠導出時，該光訊號直 接利用光纖接頭埠内所設之凸透鏡聚焦至光訊號檢知晶片，並由光訊 號檢知晶片將光訊號轉換成電訊號並藉由軟性電路板上所設之電路傳 鲁送至主電路板，藉此完成光_電轉換及傳送程序。 . 依據前述之主要特徵，其中該光訊號發射晶片可採用垂直共振腔 面射型雷射(VCSEL,Vertical-Cavity Surface-Emitting Lasei·；)。 【實施方式】 有關本創作為上述之目的，所採用之技術手段及其餘功效，兹舉 較佳實施例，並配合圖式加以說明如下： 请參閱第3至5圖，第3圖為本創作光收發器之立體分解圖；第 4圖為本創作光收發器之光訊號發射組及光訊號接收組之立體分解 M356319 圖；第5圖為本創作光收發器之立體示意圖；及第6圖為本創作光收 發器剖面示意圖，係顯示TOSA與ROSA之光線折射路徑。 如該等圖所示，本創作提供一種光收發器，至少包含：一主控制 電路20、一光訊號發射次模組3〇、一光訊號接收組4〇以及至少兩個 , 軟性電路板50 ;其中，光訊號發射次模組3〇以及光訊號接收次模組 ' 係分设於軟性電路板50上，且該軟性電路板50之另端與該主控制 電路20作一電性連接；其中 • 該主控制電路20係一印刷電路板，用以將電訊號傳送至光訊號發 射次模組30以及接收來自光訊號接收組4〇之電訊號。 該光訊號發射次模組30 ’用以將主控制電路20所傳送之電訊號 轉換為光訊號並耦合至光纖，該光訊號發射次模組3〇係包含:一用以 接收來自主電路板20之電訊號並將其轉為光訊號及發射的光訊號發 射晶片31以及一光纖接頭埠32，其中該光纖接頭埠32上設有一光纖 貫穿插入孔33供穿插光纖F’並罩住該光訊號發射晶片31，該光纖接 •頭埠32内於該貫穿孔33之另一端設有一凸透鏡34(參見第6圖)使該 晶片31所發射之光訊號可聚焦並耦合至光纖^^，亦即，該光纖接頭埠 32内設有一凸透鏡34，用以使來自光訊號發射晶片31所發之光折射 並聚焦，使其準確地耦合至光纖F。 該光訊號接收組40，用以將光訊號轉換為電訊號並提供至主控制 電路，該光訊號接收組40係包含:一用以接收光訊號並將其轉為電訊 號的光訊號檢知晶片41以及一光纖接頭埠42 ;其中該光纖接頭埠42 設有一光纖貫穿插入孔43用以供光纖F插接，並罩住光訊號檢知晶片 11 M356319 w該光纖接頭埠42内於該貫穿孔a之另一端設有一凸透鏡料(參見 第6圖）’使該光纖？所發射之光訊號可聚焦並箱合至光訊號檢知晶片 41上’亚由該光訊號檢知晶片41將光訊號轉換成電訊號，並提供至 主才:制電路20進行訊號處理，此外，前述之光訊號檢知器晶片41以 ，及光訊號發射晶片3卜於本創作中並不加以侷限為何種結構，而本實 •施例巾統發射以31可採職直共振腔面棚雷射，其詳細規格與 特性’為熟悉該項技藝人士所能輕易了解，並非本案所訴求之重點， _於此不加以贅述。 本創作之光收發器中，至少兩軟性電路板5〇各設有連接電路51， 用以將電訊號於主控制電路與光訊號發射次模組以及光訊號接收 次模組40間進行傳遞，且該連接電路51係區分為次模組設置端511 及端子連接端512，分別位於軟性電路板50二端(如第4圖所示），而 端子連接端512與該主控制電路20電性連接。於該次模組設置端，該 光訊號發射次模組30之光訊號發射晶片31以及光訊號接收次模組40 鲁之光訊號檢知晶片41分別介以一底安裝座與該軟性電路板有間隔地 直接焊接於該軟性電路板上。於該光訊號接收次模組40 —方之該軟性 電路板上又可設有一電訊號增幅裝置45用以使由光轉換成之電訊號 增幅而易被檢知。藉此，透過軟性電路板50端子可平整且一次性地快 速焊接的特性，有效取代傳統須一一焊接端子接腳S之方法，從而達 到簡化組成構件並加速產能。 此外，本創作之光收發器，又可於該軟性電路板50上之次模組設 置端之欲焊接光訊號發射晶片31(光訊號檢知晶片41)之相反側，設有 12 M356319 支撐座6G ’用以容置並讀該次模錄置端以及絲號發射晶片 31(光訊號檢知晶片41)，藉以在將該等晶片直接焊接於軟性電路板上 ~提供支觀’俾提供晶牌麟之定位精度。 本創作由於細不受魏及水氣影響的光訊驗知“ 41及光 、減31 ’故本創作之光訊號發射組及光訊號接收組不需使用 '防/口水氣的氣密視窗(Flat wind〇w)結構，如:帽蓋(⑽、基座細㈣ 等較為昂貴且組裝成本較高的構件。 • 此外於本創作中，將光訊號檢知晶片41及光訊號發射晶片31直 接焊接於概板5㈣:域_置端511上，並將凸舰直接設在 光纖接頭阜32 42上，直接利用該光纖接頭埠内設置之凸透 鏡使光訊號產生聚f、，目此絲峨触捕減光減發射次模組 可共用_的光纖接辆，心彡胁膽於光訊號接收次模組及 光訊號發射次额之光纖接稱，故謂件之製造成本上具有相當優 勢0The present invention relates to an optical transceiver, comprising: a main control circuit; an optical signal transmitting sub-module, comprising an optical signal riding crystal; 1, _ transferring Wei Lai to the optical position and transmitting the optical chip; - Optical fiber connection, the county live Guangwei (9) and the financial-fiber insertion hole is provided at the other end of the insertion hole - a convex lens for refracting and focusing coupling the light emitted from the light-emitting chip to The optical fiber F; an optical signal receiving sub-module, comprising: a light δ ΐ 检 detection chip for converting the optical signal received from the optical fiber into an electrical signal; and a fiber connector 埠 having a fiber insertion hole, And a convex lens is disposed at the other end of the insertion hole for focusing the optical signal emitted from the optical fiber onto the optical detection chip; and at least two flexible circuit boards are respectively connected to the main control circuit and the Optical signal 8 M356319 launches the secondary mode minus the connection age control relay and the silk signal collection module. The soft secret is divided into the secondary module setting end and the Xuan connection end, and the terminal connection end is connected with the main control circuit. Module design The terminal is directly soldered to the optical emission chip and the optical signal detection chip. According to the present invention, the towel is provided on the opposite side of the secondary module setting end of the flexible circuit board, and the opposite side of the optical signal transmitting chip (optical signal detecting chip) is provided, and a support seat is provided for Storing and supporting the sub-module setting end and the optical signal transmitting chip (Optical Signal Detection® wafer), thereby providing a support point when the wafer is directly soldered to the flexible circuit board, and providing the wafer soldering positioning accuracy. The pedestal is not limited to the material of the board. Any material that can provide support can be used as the support for the creation, such as: acrylic, epoxy, fiberglass and other insulation materials. According to the optical transceiver of the present invention, the optical signal transmitting chip and the optical signal detecting chip are directly soldered to the flexible circuit board at intervals by a submount. According to the optical transceiver of the present invention, the optical fiber connector used in the optical signal transmitting submodule and the optical signal receiving submodule has the same configuration. According to the optical transceiver of the present invention, the optical signal board on the sub-module receiving side of the optical signal receiving circuit further comprises an electrical signal adding device for causing the optical signal to be detected by the optical signal to be converted into an electric signal. . According to the optical transceiver of the present invention, the main control circuit is disposed on a hard substrate, and the hard substrate can be a general printed circuit board. According to the optical transceiver of the present invention, the optical signal transmitting group and the optical 9 M356319 signal receiving group of the present invention are not required to use the optical signal detecting chip and the optical signal transmitting chip which are not affected by the environment and moisture. A gas-tight window that prevents moisture, such as caps, headers, and the like, which are relatively expensive and costly to assemble. In addition, this creator-level hairpin 'secret money will know the difference (9) (optical signal emission chip) directly on the secondary module setting end of the flexible circuit board, and directly use the fiber optic operation, set in the barrel The convex lens makes the optical signal focus, so the optical signal receiving sub-module, the module and the optical signal transmitting sub-module can share the same optical fiber connector, without separately manufacturing the optical surface receiving module and the light crane The domain group is connected, so it has a considerable advantage in the manufacturing cost of the component 10. The optical transceiver of the present invention is configured to convert an electrical signal from the main circuit board to the optical signal transmitting chip by the flexible circuit board, and convert the electrical signal into an optical signal, and the optical signal is directly injected into the optical signal. The optical fiber connector is coupled and coupled to the optical fiber by using a convex lens disposed in the optical fiber connector, and when the optical signal is output through the optical fiber connector, the optical signal is directly focused to the optical signal detecting chip by using a convex lens disposed in the optical fiber connector The optical signal is detected by the optical signal to convert the optical signal into an electrical signal and transmitted to the main circuit board through a circuit provided on the flexible circuit board, thereby completing the optical-electrical conversion and transmission process. According to the above main features, the optical signal emitting wafer can be a vertical cavity-type laser (VCSEL, Vertical-Cavity Surface-Emitting Lasei). [Embodiment] The technical means and the remaining functions of the present application are as described above, and the following description is given with reference to the following figures: Please refer to Figures 3 to 5, and Figure 3 is the creation. 3D exploded view of the optical transceiver; FIG. 4 is a perspective view of the optical signal transmitting group and the optical signal receiving group of the optical transceiver of the M356319; FIG. 5 is a perspective view of the optical transceiver; This is a schematic diagram of the cross section of the optical transceiver, showing the light refraction path of TOSA and ROSA. As shown in the figures, the present invention provides an optical transceiver comprising at least a main control circuit 20, an optical signal transmission submodule 3A, an optical signal receiving group 4A, and at least two, a flexible circuit board 50. The optical transceiver sub-module 3〇 and the optical signal receiving sub-module are disposed on the flexible circuit board 50, and the other end of the flexible circuit board 50 is electrically connected to the main control circuit 20; • The main control circuit 20 is a printed circuit board for transmitting electrical signals to the optical signal transmitting sub-module 30 and receiving electrical signals from the optical signal receiving group 4〇. The optical signal transmitting sub-module 30 ′ is configured to convert the electrical signal transmitted by the main control circuit 20 into an optical signal and coupled to the optical fiber, and the optical signal transmitting sub-module 3 includes: one for receiving from the main circuit board The electrical signal of 20 is converted into an optical signal and a transmitted optical signal transmitting chip 31 and a fiber optic connector 32. The optical fiber connector 32 is provided with a fiber insertion hole 33 for inserting the optical fiber F' and covering the light. The signal emitting chip 31 is provided with a convex lens 34 (see FIG. 6) at the other end of the through hole 33. The optical signal emitted by the chip 31 can be focused and coupled to the optical fiber. That is, the fiber optic connector 32 is provided with a convex lens 34 for refracting and focusing the light emitted from the optical signal emitting chip 31 to be accurately coupled to the optical fiber F. The optical signal receiving group 40 is configured to convert the optical signal into an electrical signal and provide the electrical signal to the main control circuit. The optical signal receiving group 40 includes: an optical signal detecting function for receiving the optical signal and converting it into an electrical signal. The optical fiber connector 埠 42 is provided with a fiber insertion hole 43 for inserting the optical fiber F and covering the optical signal detecting chip 11 M356319 w. The other end of the hole a is provided with a convex lens material (see Fig. 6) 'to make the fiber? The emitted optical signal can be focused and binned onto the optical signal detecting chip 41. The optical signal is converted into an electrical signal by the optical signal detecting chip 41, and is provided to the main circuit: the circuit 20 performs signal processing. The optical signal detector chip 41 and the optical signal transmitting chip 3 are not limited to the structure in the present creation, and the actual embodiment of the system is launched with a 31-receivable straight cavity. Laser, its detailed specifications and characteristics 'is easy to understand for those skilled in the art, is not the focus of the case, _ not to repeat here. In the optical transceiver of the present invention, at least two flexible circuit boards 5 are respectively provided with connection circuits 51 for transmitting electrical signals between the main control circuit and the optical signal transmitting submodule and the optical signal receiving submodule 40. The connection circuit 51 is divided into a secondary module setting end 511 and a terminal connecting end 512, which are respectively located at two ends of the flexible circuit board 50 (as shown in FIG. 4), and the terminal connecting end 512 and the main control circuit 20 are electrically connected. connection. The optical signal transmitting chip 31 and the optical signal receiving sub-module 40 of the optical signal transmitting sub-module 30 are respectively connected with a bottom mount and the flexible circuit board. Solder directly on the flexible circuit board at intervals. Further, on the flexible circuit board, the optical signal receiving circuit 40 can be provided with a signal amplifying means 45 for increasing the amplitude of the electric signal converted into light and being easily detected. Thereby, the smooth soldering of the terminals of the flexible circuit board 50 and the rapid soldering at one time effectively replace the conventional method of soldering the terminal pins S, thereby simplifying the constituent members and accelerating the productivity. In addition, the optical transceiver of the present invention can also be provided with a 12 M356319 support base on the opposite side of the secondary module setting end of the flexible circuit board 50 to be soldered to the optical signal transmitting chip 31 (optical signal detecting chip 41). 6G' is used to accommodate and read the mold recording terminal and the wire number emission chip 31 (optical signal detection chip 41), thereby directly soldering the wafers on the flexible circuit board to provide a support The positioning accuracy of the brand. This creation is due to the fact that it is not affected by the influence of Wei and moisture. "41 and light, minus 31", the optical signal transmitting group and the optical receiving group of this creation do not need to use the airtight window of 'anti-mouth/water vapor (Flat wind) 〇w) structure, such as: cap ((10), base fine (four), etc., which are relatively expensive and costly to assemble. • In addition, in this creation, the optical signal detecting chip 41 and the optical signal emitting chip 31 are directly soldered to Profile 5 (4): Domain _ terminal 511, and the convex ship is directly placed on the fiber connector 阜32 42, directly using the convex lens provided in the fiber connector 使 to generate the optical signal, so the wire is caught The optical sub-modulation sub-module can share the optical fiber connection of the optical fiber, and the optical fiber is received by the optical signal receiving sub-module and the optical signal transmission sub-input, so that the manufacturing cost of the component has a considerable advantage.
而本創作所採用之軟性電路板5G(_般_ Fpc)，該軟性電路板 5〇的端子連接端512為-平整狀，故，於組裝時可利用焊接機台同時 將端子連接端5!2與主控制電路20快速地烊接為一體，而位於另端的 次模組設置端5Π正面是供光訊號接收纽4〇設置，而該背面(正面的 相反侧)可設有-適當支撐座60，用以支撐光訊號發射組如及光訊號 接收組40。該支撐座60並不舰輕路板材質，任何可提供支撐力 的絕緣材質，皆可定義為本創作所述之支撐座 脂、環氧樹脂、玻璃纖維等絕緣材質。 60 ’舉凡丙稀酸系樹 13 M356319 本創作已藉上述較佳具體例進行更詳細說明，惟本創作並不限定 於上述所舉例之實施例，凡在賴作所揭示之猶思想範_，可對 該等結構作各種變化及修飾，該等變化及修飾仍屬本創作之範圍。 【圖式簡單說明】 第1圖為習用光收發器之立體分解圖； 第2圖為習用光收發器剖面示意圖，係顯示T〇SA.ROSA之光 '線折射； ⑩第3圖為本創作光收發器之立體分解圖； 第4圖為本創作光收發器之光訊號發射組及光訊號接收組之立體 分解圖； 第5圖為本創作光收發器之立體示意圖；及 第6圖為本創作光收發器剖面示意圖，係顯示TOSA與ROSA之 先線折射路。 【主要元件符號說明】 1 光收發器 10 主控制電路 11 光訊號發送次模組 111,121 帽蓋 12 光訊號接收次模組 112 光訊號發射晶片 113 、 123 基座 114、124 光纖接頭埠 14 M356319The flexible circuit board 5G (_General_Fpc) used in the creation, the terminal connection end 512 of the flexible circuit board 5〇 is flat-shaped, so that the terminal can be connected at the same time by the welding machine during assembly! 2 is quickly connected to the main control circuit 20, and the secondary module setting end 5 at the other end is provided for the optical signal receiving button 4, and the back side (the opposite side of the front side) can be provided with a suitable supporting seat 60, for supporting the optical signal transmitting group, such as the optical signal receiving group 40. The support base 60 is not a light-duty road board material, and any insulating material that can provide supporting force can be defined as an insulating material such as a support base grease, an epoxy resin, or a glass fiber. 60 'Existing acrylic tree 13 M356319 This creation has been described in more detail by the above-mentioned preferred specific examples, but the creation is not limited to the above-exemplified embodiments, and the ideology of the essay revealed by Lai, Various changes and modifications can be made to the structures, and such changes and modifications are still within the scope of the present invention. [Simple diagram of the diagram] Figure 1 is an exploded perspective view of a conventional optical transceiver; Figure 2 is a schematic cross-sectional view of a conventional optical transceiver, showing the light 'line refraction of T〇SA.ROSA; 10 Figure 3 is the creation An exploded perspective view of the optical transceiver; FIG. 4 is an exploded perspective view of the optical signal transmitting group and the optical signal receiving group of the optical transceiver; FIG. 5 is a perspective view of the optical transceiver of the present invention; The schematic diagram of the cross section of the present optical transceiver shows the first line refraction path of TOSA and ROSA. [Main component symbol description] 1 Optical transceiver 10 Main control circuit 11 Optical signal transmission sub-module 111, 121 Cap 12 Optical signal receiving sub-module 112 Optical signal transmitting chip 113, 123 Base 114, 124 Optical fiber connector 埠 14 M356319
115 ' 125 透鏡 116 、 126 氣密視窗 122 光訊號檢知晶片 13 主電路板 14 陶瓷套管 S 接腳端子 F 光纖 20 主控制電路 30 光訊號發射次模組 31 光訊號發射晶片 32 光纖接頭埠 33 光纖貫穿插入孔 34 凸透鏡 40 光訊號接收次模組 41 光訊號檢知晶片 42 光纖接頭琿 43 光纖貫穿插入孔 44 凸透鏡 45 電訊號增幅裝置 50 軟性電路板 51 連接電路 511 次模組設置端' 15 M356319 512 端子連接端 60 支撐座115 ' 125 lens 116 , 126 airtight window 122 optical signal detection chip 13 main circuit board 14 ceramic sleeve S pin terminal F optical fiber 20 main control circuit 30 optical signal transmission sub-module 31 optical signal emission chip 32 optical fiber connector 33 Fiber insertion hole 34 Convex lens 40 Optical signal receiving sub-module 41 Optical signal detection chip 42 Optical fiber connector 珲43 Fiber insertion hole 44 Convex lens 45 Telecommunications amplification device 50 Flexible circuit board 51 Connection circuit 511 Secondary module setting end ' 15 M356319 512 terminal connection 60 support
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