M354171 八、新型說明： 【新型所屬之技術領域】 本創作係關於-種積體電路測試裝置，特別係關於〜 種藉由加壓流體調節技術控制—平台之均溫性的積體 測試裝置。 【先前技術】 一般而言，晶圓上的積體条,々_ ,丨 積體电路TL件必須先行測試其電 氣特性，藉以判定積體電路元件是否良好。良好的積體電 路將被選出以進行後續之封裝製程，而不良品將被捨棄以 避免增加額外的封裝成本。完成封裝之積體電路元件必須 再進行另-次電性測試以筛選出封褒不良品，進而提升最 終成品良率。換言之，積體電路元件在製造的過程中，必 /頁進行數次的電氣特性測試。 d在進行測試時，積體電路元件係放置於具有—溫度控 制^置之基座上，該溫度控制裝置再根據測試規範調整測 減壤境之溫度，待測試環境之溫度穩定後才能進行測試。 此2，在測試過程中，該基座必須移動該積體電路元件， 使得測試卡之探針得以接觸不同的積體電路元件或接觸同 -積體電路元件之不同訊號接塾。然而，該基座之移動會 ^起測^環境之溫度變動，使得處於該測試環境之物件（二 平口、測S式卡或探針）的物理性質或化學性質產生變化 (例如’物質之熱脹冷縮特性造成物件產生形變），影響物件 相對位置，導致量測過程無法順利進行。 口此’移動基座之後必須等待測試環境之溫度趨於穩 135483.doc M354171 定後’才可進行後續測試’方可確保量測結果之準嫁性 然而，等待測試環境之溫度趨於穩定通常耗費相當的時間 ，導致測試成本增加。 US 4,820,976 >US 6,468,098 ,χ ^ US 6,906,543 ^^^ 專利揭示具有溫度調整機構之測試卡。這三篇美國專利揭 不之技術係藉由溫度調整機構局部調整該測試卡之電路板 的溫度，俾便麵制試卡之材料不會因溫度變異而 物理及化學變化。妙品 、古-贫、， ‘、、、、，廷二扁果國專利揭示之溫度調整 機構並無法避免處於該測試環境之物件(例如，平台、測試 卡或探針）的物理性質或化學性質因溫度變異而產生變: 例如’物質之熱脹冷縮特性造成物件產生形變），影響物件 之相對位置，導致量測過程無法順利進行。 【新型内容】 本創作提供一種藉由加壓流體調節技術控制—平么之 均溫性的積體電路測試裝置’其可降低該平台因溫度：異 而發生熱>張冷縮問題，影響其承載之物件的相對位置。 =作，積體電路測試裝置之—實施例，包含界定一 至-设體、設置於該殼體内且被建構以承接一待測 兀件的一承座、今罟q n，丄 ' 又置该承座中且被建構以控制該承座之溫 ;的一溫控元件、設置於該殼體上且被建構以承接至少一 探針的一平台、以；^切·里七丁， Α巾 °又；〜’D内之至少一流動線路， 八中该流動線路可導人—流體以調節該平台之溫度。 么、本創作之積體電路測試裝置之另—實施例，包含一平 。以及至少—流動線路，該 ’ 開口且被建構以設 135483.doc M354171 置於-測試室上並承接至少―探針，該探針係經由該開口 接觸-待測元件。該流動線路係設置於該平台内且可導入 一流體以調節該平台之溫度。 省知積體电路測41置在移動基座時會引起測試環境 t溫度擾動，使得處於該測試環境之物件的物理性質或化 學性質產生料，影響物⑲mm卡及探針）之相對位 .£ ’導致量測過程無法順利進行。因此，必須等待測試環 φ 狄溫度擾動現象消除後’才進行後續測試，方可確保量 測結果之準確性。相對地，本創作係在該平台内部設置該 流動線路以導入-流體，俾便將該平台之溫度擾動控制在 一可容許的範圍内。如此，即可避免該平台因局部溫度變 異而產生熱漲冷縮，改變設置於該平台上之物件（例如，測 試卡及探針）的相對位置。 上文已相當廣泛地概述本創作之技術特徵及優點，俾 使下文之本創作詳細描述得以獲得較佳瞭解。構成本創作 • 之申請專利範圍標的之其它技術特徵及優點將描述於下文 本創作所屬技術領域中具有通常知識者應瞭解，可相當 容易地利用下文揭示之概念與特定實施例可作為修改或設 計其它結構或製程而實現與本創作相同之目的。本創作所 屬技術領域中具有通常知識者亦應瞭解，這類等效建構無 法脫離後附之申請專利範圍所界定之本創作的精神和範圍 0 【實施方式】 圖1及圖2例示一習知之測試系統3〇〇，其使用探針卡 135483.doc M354171M354171 VIII. New description: [New technical field] This creation is about the integrated circuit test device, especially the integrated test device for the temperature uniformity of the platform controlled by the pressurized fluid regulation technology. [Prior Art] In general, the integrated strip on the wafer, the 々_, and the TL circuit TL must first test its electrical characteristics to determine whether the integrated circuit components are good. A good integrated circuit will be selected for subsequent packaging processes, and defective products will be discarded to avoid additional packaging costs. Integral circuit components that have been packaged must be subjected to additional electrical tests to screen out defective packages to improve final product yield. In other words, the integrated circuit component must be tested several times for electrical characteristics during the manufacturing process. d When performing the test, the integrated circuit components are placed on the pedestal with the temperature control device, and the temperature control device adjusts the temperature of the measured and lowered soil according to the test specification, and the test environment can be tested after the temperature is stable. . In the test, the pedestal must move the integrated circuit component so that the probe of the test card can contact different integrated circuit components or contact different signal contacts of the same-integrated circuit component. However, the movement of the susceptor will change the temperature of the environment, so that the physical properties or chemical properties of the object (two flat ports, S-type cards or probes) in the test environment are changed (for example, 'the heat of matter' The expansion and contraction characteristics cause deformation of the object, which affects the relative position of the object, which makes the measurement process impossible. After the mobile base, the temperature of the test environment must wait for the stability of the test environment to stabilize 135483.doc M354171 can be followed by 'subsequent test' to ensure the accuracy of the measurement results. However, waiting for the temperature of the test environment to stabilize It takes a considerable amount of time, resulting in an increase in testing costs. US 4,820,976 > US 6,468,098, χ ^ US 6,906,543 ^^^ discloses a test card having a temperature adjustment mechanism. The three U.S. patents disclose that the temperature of the circuit board of the test card is partially adjusted by the temperature adjustment mechanism, and the material of the squeegee test card is not physically and chemically changed due to temperature variations. Wonderful, ancient-poor, ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The nature changes due to temperature variability: for example, 'the thermal expansion and contraction of the substance causes deformation of the object, which affects the relative position of the object, which makes the measurement process impossible. [New content] This creation provides an integrated circuit test device for controlling the temperature uniformity of the flat by the pressurized fluid regulation technology, which can reduce the temperature of the platform: heat generation occurs, and the problem of cold shrinkage is affected. The relative position of the objects it carries. The embodiment of the integrated circuit testing device includes a socket defining a first to a housing, being disposed in the housing and configured to receive a component to be tested, and a temperature control element disposed in the socket to control the temperature of the socket; a platform disposed on the housing and configured to receive at least one probe, to cut; ° again; ~ at least one of the flow lines in the 'D, the flow line can guide the human-fluid to adjust the temperature of the platform. Another embodiment of the integrated circuit test device of the present invention comprises a flat. And at least a flow line, the opening is configured to be placed on the test chamber and to receive at least a probe through which the probe contacts the element to be tested. The flow line is disposed within the platform and a fluid can be introduced to adjust the temperature of the platform. When the mobile base is placed on the mobile base, the temperature of the test environment t is disturbed, so that the physical or chemical properties of the object in the test environment are generated, and the relative position of the 19 mm card and the probe is affected. 'The measurement process could not be carried out smoothly. Therefore, it is necessary to wait for the test loop φ Di temperature disturbance phenomenon to be eliminated before performing subsequent tests to ensure the accuracy of the measurement results. In contrast, the author sets the flow line inside the platform to introduce a fluid, and the temperature disturbance of the platform is controlled within an allowable range. In this way, the platform can be prevented from being heated and contracted due to local temperature variations, and the relative positions of the objects (for example, the test card and the probe) disposed on the platform can be changed. The technical features and advantages of the present invention have been broadly summarized above, and the detailed description of the present disclosure is better understood. Other technical features and advantages of the subject matter of the present invention will be described in the technical field of the following text creation. It should be understood that the concept disclosed below and the specific embodiments can be used as a modification or design. Other structures or processes achieve the same purpose as the present creation. It should be understood by those of ordinary skill in the art to which the present invention belongs. The equivalent construction cannot be deviated from the spirit and scope of the present invention as defined in the appended claims. [Embodiment] FIGS. 1 and 2 illustrate a conventional Test system 3〇〇, which uses probe card 135483.doc M354171
302接觸位於溫控單元304上之晶圓31{)。該晶圓3ι〇具有待 測元件312^312(：，該溫控單元3()4可藉由三轴载台在X 、YAZ等三個軸向移動。該溫控單元3〇4改變溫度或該三 轴載台306移動都將增加測試環境溫度達到穩定所需 間。該溫控單元304改變溫度將導平台3〇8、探針卡及探= 302等構件之尺寸隨溫度上升而膨脹，必須待膨脹現象穩定 後，方可進行測試。此外，該三軸载台鳩移動（如圖2所示 者）將改變構件之位置而處於不同I度，亦必須待構件之溫 度穩定後，探針302方可接觸晶圓31〇進行測試。 圖3及圖4例示本創作之積體電路測試裝置丨〇〇之—實 施例。該積體電路測試裝置100包含一殼體4〇、設置於該= 體40内之三維載台70 '設置於該殼體4〇内且被建構以承接 一待測元件62的一承座60、設置該承座6〇中且被建構以控 制該承座60之溫度的一溫控元件（例如，加熱器）64、設置於 該殼體40上之一平台50、以及設置於該平台5〇内之至少— 流動線路52，其中該流動線路52可導入一流體以調節該平 台50之溫度。該殼體4〇界定一測試室42，該平台5〇係被建 構以承接至少一測試卡1〇，該測試卡1〇係經由一固持器％ 而設置於該平台50上。該測試卡10包含一電路板12、設置 在該電路板12上之一支撑物14、固定在該支撑物14上之複 數根探針16、以及電氣連接該探針1 6與一導線2 6之一導通 孔20。該探針16係以環氧樹脂24固定於該支撑物14上。 參考圖4 ’該平台50包含一下板5〇A、一上板5〇b及一 135483.doc M354171 導管56。該下板50A係設置於該殼體40上且具有一下凹溝 54A ’該上板5〇3係設置於該下板5〇a之上且具有一上凹溝 54B。該上凹溝54B之位置及形狀係對應該下凹溝54A ,且 該導管56係設置於該下凹溝54A與該上凹溝54B内。該平台 50具有一開口 58，該測試卡10之探針16係經由該開口 58接 觸該待測元件62之接墊。該下凹溝54A、該上凹溝54B及該 導管56構成該流動線路52，其迴繞該平台50之開口 58。 特而言之，該流動線路52包含至少一流體入口以及一 流體出口 ’且該流體可為氣體、液體或氣液混合物。此外 ’ 3亥平台5 0可包含複數個板件，且該流動線路5 2係設置於 该板件之一内。再者’圖4例示該流動線路52包含單一導管 56 ’然而本創作所屬技術領域中具有通常知識者應瞭解該 流動線路52包含複數條導管56，其具有各式各樣的圖案設 計。 本創作係在該平台50内部設置該流動線路52以導入一 /”>·體’俾便將該平台5 〇之溫度擾動控制在一可容許的範圍 内。如此，即使該三維載台70將該待測元件62(可能處於高 溫或低溫）移動至該反應室42之任何區域，該流動線路52仍 可保持該平台5 0之溫度均勻，俾便避免設置於該平台5 〇上 之物件（例如，該固持器30、該測試卡1〇及該探針16)因該平 口 5 0之局部溫度變異所產生之熱漲冷縮現象而改變相對位 置。 圖5例示本創作之積體電路測試裝置200之一實施例。 135483.doc M354171 §亥積體電路測试裝置200包含一殼體140、設置於該殼體140 内之三維載台170、設置於該殼體14〇内且被建構以承接一 待測元件162的一承座16〇、設置該承座ι6〇中且被建構以控 制該承座160之溫度的一溫控元件丨64、設置於該殼體14〇 上之一平台50、以及設置於該平台50内之至少一流動線路 1 52 ’其中該流動線路52可導入一流體以調節該平台5〇之溫 度。該忒體140界定一測試室142，該平台5〇係被建構以承 接至少一探針載台110，且至少一探針12〇係置放於該探針 載台110上。 習知積體電路測試裝置在移動基座時會導致測試環境 之溫度擾動，使得處於該測試環境之物件的物理性質或化 子性虞產生變化，影響物件（例如，測試卡及探針）之相對位 置，導致量測過程無法順利進行。因此，必須耗費相當時 間等待測試環境之溫度擾動現象消除後，才可進行後續測 試’方可確保量測結果之準確性。 相對地，本創作係在該平台50内部設置該流動線路52 以導入一流體，俾便將該平台5〇之溫度擾動控制在一可容 許的範圍内。如此，即可避免該平台50因局部溫度變異而 產生熱漲冷縮’改變設置於該平台5〇上之物件(例如，該固 持益30、该測試卡10、該載台110及該探針16、120)的相對 位置。 本創作之技術内容及技術特點已揭示如上，然而本創 屬技術領域中具有通常知識者應瞭解，在不背離後附 135483.doc -10- M354171 申請專利範圍所界定之本創作精神和範圍内，本創作之教 示及揭示可作種種之替換及修飾。例如，上文揭示之許多 製耘可以不同之方法實施或以其它製程予以取代，或者採 用上述二種方式之組合。302 contacts wafer 31{) located on temperature control unit 304. The wafer 3 ι has an element to be tested 312 312 (:, the temperature control unit 3 () 4 can be moved in three axial directions of X, YAZ, etc. by a three-axis stage. The temperature control unit 3 〇 4 changes the temperature. Or the movement of the three-axis stage 306 will increase the temperature required for the test environment to reach a stable state. The temperature control unit 304 changes the temperature to expand the size of the components such as the guide platform 3〇8, the probe card and the probe 302 with temperature. It must be tested after the expansion phenomenon has stabilized. In addition, the movement of the three-axis stage (as shown in Figure 2) will change the position of the member at different degrees I, and must be stabilized after the temperature of the member is stabilized. The probe 302 can be in contact with the wafer 31 for testing. Figures 3 and 4 illustrate an integrated circuit test device of the present invention - an embodiment. The integrated circuit test device 100 includes a housing 4 The three-dimensional stage 70' in the body 40 is disposed in the casing 4 and is configured to receive a socket 60 of the component to be tested 62, is disposed in the socket 6 and is constructed to control the bearing a temperature control element (eg, heater) 64 at the temperature of the seat 60, a platform disposed on the housing 40 50, and at least - a flow line 52 disposed in the platform 5, wherein the flow line 52 can introduce a fluid to adjust the temperature of the platform 50. The housing 4 defines a test chamber 42, the platform 5 The test card 1 is configured to receive at least one test card 1 , and the test card 1 is disposed on the platform 50 via a holder. The test card 10 includes a circuit board 12 and a support disposed on the circuit board 12 . a plurality of probes 16 fixed to the support 14, and a conductive via 16 electrically connected to the probe 16 and a wire 26. The probe 16 is fixed to the support by an epoxy resin 24. Referring to Figure 4, the platform 50 includes a lower plate 5A, an upper plate 5〇b, and a 135483.doc M354171 conduit 56. The lower plate 50A is disposed on the housing 40 and has a lower groove. 54A 'The upper plate 5〇3 is disposed above the lower plate 5〇a and has an upper groove 54B. The position and shape of the upper groove 54B corresponds to the lower groove 54A, and the pipe 56 is provided The lower groove 54A and the upper concave groove 54B. The platform 50 has an opening 58 through which the probe 16 of the test card 10 is The opening 58 contacts the pad of the component under test 62. The lower groove 54A, the upper groove 54B and the conduit 56 constitute the flow line 52 which wraps around the opening 58 of the platform 50. In particular, the flow line 52 includes at least one fluid inlet and one fluid outlet' and the fluid may be a gas, liquid or gas-liquid mixture. Further, the '3H platform 50 may include a plurality of plates, and the flow line 52 is disposed on the plate In addition, 'FIG. 4 illustrates that the flow line 52 includes a single conduit 56'. However, those of ordinary skill in the art to which this disclosure pertains will appreciate that the flow line 52 includes a plurality of conduits 56 having a wide variety of patterns. design. The present invention sets the flow line 52 inside the platform 50 to introduce a /"> body" to control the temperature disturbance of the platform 5 to an allowable range. Thus, even if the three-dimensional stage 70 The element to be tested 62 (which may be at a high temperature or a low temperature) is moved to any area of the reaction chamber 42, and the flow line 52 can maintain the temperature of the platform 50 evenly, so as to avoid objects placed on the platform 5 (For example, the holder 30, the test card 1〇, and the probe 16) change the relative position due to the thermal expansion and contraction phenomenon caused by the local temperature variation of the flat port 50. Fig. 5 illustrates the integrated circuit of the present invention. An embodiment of the test apparatus 200. 135483.doc M354171 § The integrated circuit test apparatus 200 includes a housing 140, a three-dimensional stage 170 disposed in the housing 140, and is disposed in the housing 14〇 and A temperature control element 64 configured to receive a socket 16 of the device to be tested 162, disposed in the socket and configured to control the temperature of the socket 160, is disposed on the casing 14 a platform 50, and at least a first class disposed in the platform 50 Line 1 52 ' wherein the flow line 52 can introduce a fluid to adjust the temperature of the platform 5 . The body 140 defines a test chamber 142 that is configured to receive at least one probe stage 110, and At least one probe 12 is placed on the probe stage 110. The conventional integrated circuit test device causes a temperature disturbance of the test environment when the base is moved, so that the physical properties of the object in the test environment are The change in the child's nature affects the relative position of the object (for example, the test card and the probe), which makes the measurement process impossible. Therefore, it takes a considerable amount of time to wait for the temperature disturbance in the test environment to be eliminated before the subsequent test can be performed. In order to ensure the accuracy of the measurement results, in contrast, the creation of the flow line 52 inside the platform 50 to introduce a fluid, the temperature disturbance of the platform 5 is controlled within an allowable range. In this way, the platform 50 can be prevented from being heated and contracted due to local temperature variation, and the object placed on the platform 5 can be changed (for example, the holding benefit 30, the test card 1) 0, the relative position of the stage 110 and the probes 16, 120). The technical content and technical features of the present invention have been disclosed as above, but those of ordinary skill in the art of the present invention should understand that without departing from the attached 135483 .doc -10- M354171 The teachings and disclosures of this creation may be variously substituted and modified within the spirit and scope of the invention as defined in the scope of the patent application. For example, many of the techniques disclosed above may be implemented in different ways or in other ways. The process is replaced or a combination of the two is used.
此外，本案之權利範圍並不侷限於上文揭示之特定實 施例的製程、冑台、製造、物質之成份、裝置、方法或步 驟。本創作所屬技術領域中具有通常知識者應瞭解，基於 本創作教示及揭示製程、機台、製造、物f之成份、裝置 方法或步驟’無淪現在已存在或日後開發者，其與本案 實施例揭示者係以實質相因沾古4 #/一 員貝相Η的方式執行實質相同的功能， 而達到貫質相同的結果’亦可接用於士左丨 力」便用於本創作。因此，以下 之申請專利範圍係用以涵葚用w νμ + '由皿用以此類製程、機台、製造、 物質之成份、裝置、方法或步驟。【圖式簡單說明】 錯由參照前述說明及下別闻4 汉下列圖式，本創作之技術特徵及 優點得以獲得完全瞭解。 圖 圖 :以及 1及圖2例示一習知之測試系統； 3及圖4例不本創作之籍辨— F <積體電路測試裝置之一實施例 圖5例示本創作之積體 【主要元件符號說明】 電路測試裝置之一實施例 〇 1〇 測試卡 12 電路板 135483.doc M354171 14 支撑物 16 探針 20 導通孔 24 環氧樹脂 30 固持器 40 殼體 42 測試室 ® 50 平台 50A 下板 50B 上板 52 流動線路 54A 下凹溝 54B 上凹溝 56 導管 W 58 開口 60 承座 62 待測元件 64 溫控元件 70 三維載台 100 積體電路測試裝置 110 探針載台 135483.doc -12- M354171Moreover, the scope of the present invention is not limited by the scope of the particular embodiments disclosed herein. Anyone with ordinary knowledge in the technical field of this creation should understand that based on this creative teaching and revealing the process, machine, manufacturing, composition, device method or step 'innocent, now or future developers, and the implementation of this case For example, the revealer performs the same function in the same way as the essence of the 4#/one member of the shell, and the result of the same quality is also used in the creation of the left-handed force. Therefore, the following patent claims are intended to cover the use of w νμ + ' from a dish for such processes, machines, manufactures, components, devices, methods or steps. [Simple description of the schema] The technical features and advantages of this creation are fully understood by referring to the above description and the following diagrams. Figure: and 1 and Figure 2 illustrate a conventional test system; 3 and Figure 4 illustrate the creation of the book - F < one of the integrated circuit test device embodiment Figure 5 illustrates the integrated body of the creation [main components DESCRIPTION OF SYMBOLS One example of circuit test apparatus 〇1〇Test card 12 Circuit board 1354.doc M354171 14 Support 16 Probe 20 Via 24 Epoxy 30 Holder 40 Housing 42 Test room® 50 Platform 50A Lower plate 50B Upper plate 52 Flow line 54A Lower groove 54B Upper groove 56 Pipe W 58 Opening 60 Bearing 62 Element to be tested 64 Temperature control element 70 Three-dimensional stage 100 Integrated circuit test device 110 Probe stage 135483.doc -12 - M354171
120 探針 140 殼體 142 測試室 160 承座 162 待測元件 164 溫控元件 170 三維載台 300 測試系統 302 探針 304 溫控單元 306 載台 308 平台 310 晶圓 312A- 待測元件 135483.doc -13 -120 probe 140 housing 142 test chamber 160 socket 162 element to be tested 164 temperature control element 170 three-dimensional stage 300 test system 302 probe 304 temperature control unit 306 stage 308 platform 310 wafer 312A - component to be tested 135483.doc -13 -