M270488 八、新型說明：： 【新型所屬之技術領域】 本新型是有關於一種測試裝置，特別是指一種在進行 晶圓測試（wafer probing)時可作包含高頻信號測試的晶圓 針測機（Prober)。 【先前技術】 一般可切割成複數可處理高頻信號之晶粒（chip)的晶 圓（wafer )，在製備完成後，會以晶圓針測機進行測試，逐 一檢測每一晶粒的電性，特別是關於高頻信號處理的電性 ，以篩檢出不良品，而只對通過電性檢測的晶粒繼續進行 後續的封裝製程，以節省生產成本。 參閱圖1 ’ 一般可作高頻信號測試的晶圓針測機包含一 測減座裝置、一測试頭裝置、一測試軟體裝置，及一轉接 界面裝置，而為使說明清楚起見，圖1中僅以測試頭裝置i 、轉接界面裝置2的分解圖示，與待測晶圓10()的相互關 係，作一繪示說明。 測試座裝置具有一基座單元，及間隔地設置於基座單 元下方且可相對基座早元位移的挟持單元，挟持單元可置 換地固定待測晶圓100，並帶動待測晶圓i 〇〇相對基座單元 移動。 測試頭裝置1對應設置於測試座裝置之基座單元上方 ’並可以相對測試座裝置移動。 測試軟體裝置分別與測試座裝置、測試頭裝置1電連 接，而可以控制挾持單元位移，並可以預設軟體對待測晶 M270488 圓100其中之一待測晶粒進行包含高頻訊號的電性測試。 轉接界面裝置2包含一第一界面單元3，及一第二界面 單元4，第一界面單元3定位後鎖固於測試頭裝置1上，第 二界面單元4則定位後與測試座裝置的基座單元相鎖固。M270488 8. Description of the new model: [Technical field to which the new model belongs] The new model relates to a testing device, especially a wafer pin tester that can be used for high frequency signal testing during wafer probing. (Prober). [Previous technology] Generally, wafers that can be cut into a plurality of chips that can process high-frequency signals. After the preparation is completed, the wafer pin tester is used to test each chip's electricity one by one. Performance, especially regarding the electrical properties of high-frequency signal processing, to screen out defective products, and only continue the subsequent packaging process for the die that have passed the electrical detection to save production costs. Referring to FIG. 1 ′, a wafer pin tester that can be generally used for high-frequency signal testing includes a test submount device, a test head device, a test software device, and a transition interface device. To make the description clear, In FIG. 1, only the exploded illustrations of the test head device i and the interface device 2 are used, and the relationship between the test head device i and the interface device 10 to be tested is illustrated. The test base device has a base unit and holding units spaced below the base unit and capable of being displaced relative to the early element of the base. The holding unit replaceably fixes the wafer under test 100 and drives the wafer under test i. 〇 Move relative to the base unit. The test head device 1 is disposed above the base unit of the test base device and is movable relative to the test base device. The test software device is electrically connected to the test base device and the test head device 1 respectively, and can control the displacement of the holding unit. The software can be preset to perform an electrical test including high-frequency signals on one of the test crystals M270488 round 100. . The transfer interface device 2 includes a first interface unit 3 and a second interface unit 4. The first interface unit 3 is locked to the test head device 1 after positioning, and the second interface unit 4 is positioned with the test base device after positioning. The base unit is phase locked.
第一界面單元3具有一内含有電路的承載板31 (Load Board)，及一包含有複數高頻信號插腳321 (RF pin)之高 頻信號測試座32 (Bread kit)，承載板31與測試頭裝置1 對應地定位鎖固後彼此電連接，高頻信號插腳321供後續 測試時關於高頻信號的傳輸。 第二界面單元4具有一套設組件41 ( Pogo Tower)，及 一針測卡42 (Probe Card)，針測卡42並包括一對應高頻信 旒測試座32以供多數高頻信號插腳321插置電連接的高頻 信號插接埠421，當後續高頻信號插腳321插置電連結後可 進行關於高頻信號的傳輸。 針測卡42與套設組件42相對定位並電連接後，共同 藉基座單元之一頂蓋200 (Ring Carrier)相對基座單元固定 測试座裝置之挾持單元可帶動待測晶圓1〇〇，而使針測卡 42直接與待測晶圓_接觸並電連接，進而可進行後續的 電性檢測。 ，配合參閱圖2 ’開始進行電性檢測前，必須先進行業者 習稱之Docking過程，即將第一界面單元3藉著移動測試頭 裝置1相對與定位在基座單元上的第二界面單元4位移， 進而使第一界面單元3夕7¾ | 4c 之承載板31、咼頻信號測試座32對 應與第二界面單元4之套今么日杜/η 么丨，“ 嘗°又組件41、針測卡42、針測卡42 M270488 之高頻^號插接琿421形成電連接’使得不但—般檢測電 之穩定緊密連結而 子信號得以傳輸’同時供高頻信號測試之傳輸，更藉著高 頻信號測試座32與高頻信號插接埠421 穩定傳遞。 由於Docking過程必須先將第一界面單元3定位鎖固於 測試頭裝置1上，再將針測卡42、套設级件41定位電連接 ，並藉頂i 200定位鎖固在測試座裝置上後，再相對移動 測試頭裝置！以帶動第_界面單元3使其與第二界面單元4 對應定位連結，特別是，此時高頻信號測試座32必須與高 頻信號插㈣421穩定緊密連結，使得測試軟體裝置、測 試頭裝置1、轉接界面裝置2、待測晶圓1〇〇形成通路後， 才算完成測試準備卫作；接著才可以挾持單元帶動待測晶 圓100與針測卡42接觸並電連接，再以測試軟體裝置之預 設軟體對其進行包含高頻信號的電性測試。 由上述說明可知，雖然在測試前定位組裝的工作繁複 且極為耗費工時，但是仍可以對待測晶圓1〇()進行包含高 頻信號的電性測試。 但是’由於供測試時有關高頻信號傳輸的高頻信號測 試座32與面頻信號插接埠421的定位連結，在第一、二界 面單元3、4對應定位連結後，常會發生高頻信號插腳321 插置於南頻信號插接埠421的接觸深度不足而導致有關高 頻信號的測試失敗，導致誤測率提高。 因此’目前可對高頻信號測試的晶圓針測機必須加以 改善，以降低誤測率。 M270488 【新型内容】 因此’本_之目的，即在提供—料崎低誤測率 的曰B圓針測機之高頻信號轉接界面裝置。 * ⑨是’本新型—種晶圓針測機之高頻信號轉接界面裝 • \該晶圓針測機包含—可置換地固持-可切割成複數待 7曰曰粒之晶圓的測試座裝置、—可以預設軟體對該一待測 晶粒進行包含高頻信號之電性測試的測試軟體裝置，及一 • 肖該測試軟體裝置相電連接且可相對該測試座裝置移動的 賴頭裝置’該高頻信號轉接界面裝置包含一第一界面單 元、一第二界面單元，及一導線單元。 該第-界面單元具有-第-電路、複數對應與該第一 電路電連接的第一電性接點，及複數對應與該第一電路電 連接的高頻信號接點，該第一界面單元定位後鎖固於該測 _裝置上而與該測試頭裝置相電連接，而可以該第—電 Μ該測試頭裝置之電路尺度對應該待測晶粒之電路尺度 φ 縮減。 又 該第二界面單元定位後鎖固該測試座裝置上，具有一 可直接與該待測晶粒電連接的針測卡、—與該針測卡電連 接的第二電路、複數對應與該第二電路電連接的第二電性 接點’及複數對應與該第二電路電連接的高頻信號插接谭 ，該測試《置帶動該第一界面單元相對該測試作裝置位 移而使該複數第-電性接點與該第二電性接點對應地定位 連結，而使該第-電路與該第二電路相對應電連接。The first interface unit 3 has a load board 31 (Load Board) containing a circuit, and a high frequency signal test kit 32 (Bread kit) including a plurality of high frequency signal pins 321 (RF pins). The load board 31 and a test board The head device 1 is electrically connected to each other after being positioned and locked correspondingly. The high-frequency signal pin 321 is used for transmission of high-frequency signals during subsequent tests. The second interface unit 4 has a set of components 41 (Pogo Tower) and a probe card 42 (Probe Card). The probe card 42 also includes a corresponding high-frequency signal test socket 32 for the insertion of most high-frequency signal pins 321. The electrically connected high-frequency signal plug-in port 421 can transmit high-frequency signals after subsequent high-frequency signal pins 321 are inserted into the electrical connection. After the stylus card 42 is relatively positioned and electrically connected with the sleeve assembly 42, the holding unit of the test base device fixed by the top cover 200 (Ring Carrier) of the base unit to the base unit can drive the wafer to be tested. 〇, and the pin test card 42 is directly in contact with the wafer to be tested and is electrically connected, so that subsequent electrical testing can be performed. Please refer to Figure 2 'Before the electrical test is started, the industry must call the Docking process, that is, the first interface unit 3 is opposed to the second interface unit 4 positioned on the base unit by moving the test head device 1 Displacement, so that the bearing plate 31 and the high-frequency signal test base 32 of the first interface unit 3 ¾ | 4c correspond to the set of the second interface unit 4 today and tomorrow / "41. Test card 42, pin test card 42 M270488 The high-frequency ^ plug 珲 421 forms an electrical connection 'so that not only the general and stable detection of electricity is tightly connected and the sub-signals can be transmitted' At the same time for the transmission of high-frequency signal testing, The high-frequency signal test socket 32 and the high-frequency signal insertion port 421 are stably transmitted. Because of the Docking process, the first interface unit 3 must be positioned and locked on the test head device 1, and then the pin test card 42 and the set stage 41 After positioning the electrical connection and fixing it on the test base device by the top i 200 positioning, move the test head device relatively! To drive the _ interface unit 3 so that it corresponds to the positioning connection of the second interface unit 4, especially at this time High-frequency signal test base 32 must It must be firmly and tightly connected with the high-frequency signal inserter 421, so that the test software device, test head device 1, transition interface device 2, and wafer 100 to be tested can form a path before the test preparation is completed; The unit drives the wafer under test 100 to be in contact with the probe card 42 and is electrically connected, and then uses the preset software of the test software device to perform an electrical test that includes high-frequency signals. As can be seen from the above description, although the assembly is positioned before the test The work is tedious and labor-intensive, but electrical tests including high-frequency signals can still be performed on the wafer under test 10 (). However, 'because of the high-frequency signal test base 32 and the surface frequency for high-frequency signal transmission during the test For the positioning link of the signal plug port 421, after the first and second interface units 3 and 4 correspond to the positioning link, it will often happen that the high frequency signal pin 321 is inserted into the south frequency signal plug port 421 and the contact depth is insufficient, resulting in high frequency. The failure of the signal test leads to an increase in the false test rate. Therefore, the wafer pin tester currently capable of testing high frequency signals must be improved to reduce the false test rate. M270488 [New content Therefore, the purpose of 'this_' is to provide the high-frequency signal interface device of B-round pin tester with low error detection rate of Matsuzaki. * ⑨ is' this new type — high-frequency signal of wafer pin tester Transfer interface installation • \ The wafer pin tester includes—replaceably held—a test base device that can be cut into multiple wafers to be processed, and can include preset software to include a test die. Test software device for electrical testing of high-frequency signals, and a lizard device electrically connected to the test software device and movable relative to the test base device. The high-frequency signal transfer interface device includes a first interface unit. A second interface unit and a lead unit. The first interface unit has a first circuit, a plurality of first electrical contacts corresponding to the first circuit electrically connected to the first circuit, and a plurality of corresponding electrical connections to the first circuit. High-frequency signal contacts, the first interface unit is positioned and locked on the test device and is electrically connected to the test head device, and the circuit scale of the first-to-mth test head device should be measured The circuit size φ of the die is reduced. After the second interface unit is positioned and locked on the test base device, there is a pin test card which can be electrically connected directly to the die to be tested, a second circuit electrically connected to the pin test card, and plural numbers corresponding to the pin test card. The second electrical contact 'and a plurality of electrical contacts which are electrically connected to the second circuit correspond to the high-frequency signal plugs which are electrically connected to the second circuit. The plurality of first electrical contacts are positioned and connected in correspondence with the second electrical contacts, so that the first circuit is electrically connected to the second circuit correspondingly.
Sx導、友單元具有相反且才目電連帛的—帛一連結端子與 8 M270488 一第二連接端子，該第一連接端子是與該第一界面 卞疋的 複數咼頻信號接點相電連接，該第二連接端子是與該第一 界面單元的複數高頻信號插接埠相電連接，使該測試軟體 裝置以預設軟體對該一與該針測卡電連接之待測晶粒進行 包含高頻信號之電性測試。 订 本新型之功效在於以導線單元電連接第一界面單元的 南頻信號接點與第二界面單元的高頻信號插接埠，而可有 效傳輸關於高頻信號的測試，以降低誤測率。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。 在本新型被詳細描述之前，要注意的是，在以下的說 明内谷中’類似的元件是以相同的編號來表示。 參閲圖3與圖4，本新型晶圓針測機之高頻信號轉接界 面虞置5的一較佳實施例，是適用於前述所說明的晶圓針 測機，而可以降低包含高頻信號之電性測試的誤測率。 晶圓針測機包含測試座裝置、測試頭裝置丨、測試軟體 裝置’及咼頻信號轉接界面裝置。而為使說明清楚起見， 圖3僅以測試頭裝置丨、高頻信號轉接界面裝置5的分解圖 示與待測晶圓10 0的相互關係，作一繪示說明。 測忒座裝置具有基座單元，及對應地設置於基座單元 下方且可相對基座單元位移的挾持單元，挾持單元可置換 地固疋待測晶圓i 〇〇，並帶動待測晶圓丨〇〇相對基座單元移 9The Sx guide and the friend unit are opposite and visually connected-one connection terminal and 8 M270488 a second connection terminal. The first connection terminal is electrically connected to a plurality of audio signal contacts of the first interface. Connection, the second connection terminal is electrically connected to the plurality of high-frequency signal plug-in ports of the first interface unit, so that the test software device uses a preset software to electrically connect the test die with the probe card. Conduct electrical tests that include high frequency signals. The effect of the new model is that the south frequency signal contact of the first interface unit is electrically connected to the high frequency signal insertion port of the second interface unit by the wire unit, and the test about the high frequency signal can be effectively transmitted to reduce the false test rate. . [Embodiment] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. Before the present invention is described in detail, it is to be noted that in the following description, similar elements are denoted by the same reference numerals. Referring to FIG. 3 and FIG. 4, a preferred embodiment of the high-frequency signal transfer interface 5 of the new wafer prober is suitable for the wafer prober described above, and can reduce the Frequency of electrical signals. The wafer prober includes a test base device, a test head device, a test software device ', and a high-frequency signal conversion interface device. In order to make the description clear, FIG. 3 uses only an exploded view of the test head device 丨 and the high-frequency signal switching interface device 5 and the relationship between the test wafer 100 and a drawing to make a description. The gage holder device has a base unit and a holding unit correspondingly disposed below the base unit and capable of being displaced relative to the base unit. The holding unit replaceably fixes the wafer to be tested i 00 and drives the wafer to be tested.丨 〇〇 Move 9 relative to the base unit
M270488 動0 測試頭裝置1相間隔地設置於測試座裝置上方，並可 以相對基座單元移動。 測試軟體裝置分別與測試座裝置、測試頭裝置電連接 ’而可以控制挾持單元位移，並可以預設軟體對待測晶圓 100進行電性測試。 高頻信號轉接界面裝置5包含一第一界面單元6、一第 二界面單元7,及一導線單元8。第一界面單元6定位後鎖 固於測試頭裝置1上，第二界面單元7定位後與測試座裝 置的基座單元相鎖固，且經過簡單的初步D〇cking過程使第 一、二界面單元6、7相對應定位電連接，再藉導線單元8 電連接第一、二界面單元6、7有關高頻信號傳輸的部分後 ，即可對待測晶圓100之晶粒進行包含高頻信號的電性測 試。 第一界面單元6包含一内含第一電路的承載板61，及 複數設於承載板表面且與該第一電路相電連接的高頻信號 接點62，當承載板61與測試頭裝置丨對應地定位鎖固後， 第一電路與測試頭裝置丨的電路相電連接，進而將測試頭 裝置1之電路佈局尺度對應待測晶粒之電路佈局尺度縮減 第二界面單元7包括一具有第二電路的套設組件71及 一設置有咼頻信號插接埠721的針測卡72。針測卡72與套 设組件72相對定位並電連接後，高頻信號插接埠721與第 二電路成電連接狀態，並共同藉基座單元之一頂蓋2〇〇 ( 10 M270488The M270488 moving 0 test head unit 1 is spaced above the test base unit and can be moved relative to the base unit. The test software device is electrically connected to the test base device and the test head device respectively, so that the displacement of the holding unit can be controlled, and the software can be preset to perform an electrical test on the wafer 100 to be tested. The high-frequency signal switching interface device 5 includes a first interface unit 6, a second interface unit 7, and a lead unit 8. The first interface unit 6 is locked to the test head device 1 after positioning, and the second interface unit 7 is locked to the base unit of the test base device after positioning, and the first and second interfaces are made through a simple preliminary docking process. Units 6 and 7 are positioned to be electrically connected, and then the wire unit 8 is used to electrically connect the high frequency signal transmission part of the first and second interface units 6 and 7, and then the crystals of the wafer 100 to be tested can include high frequency signals. Electrical test. The first interface unit 6 includes a carrier board 61 containing a first circuit, and a plurality of high-frequency signal contacts 62 provided on the surface of the carrier board and electrically connected to the first circuit. When the carrier board 61 and the test head device 丨After correspondingly positioning and locking, the first circuit is electrically connected to the circuit of the test head device, thereby reducing the circuit layout size of the test head device 1 corresponding to the circuit layout size of the die to be tested. The second interface unit 7 includes a A two-circuit set assembly 71 and a pin test card 72 provided with a high-frequency signal insertion port 721. After the pin test card 72 is positioned relative to the sleeve assembly 72 and electrically connected, the high-frequency signal plug-in port 721 is electrically connected to the second circuit, and jointly borrows the top cover of one of the base units 2000 (10 M270488
Ring Carrier)相對基座單元固定。測試座裝置之挾持單元 可帶動待測晶圓1 〇〇，而使針測卡42直接與待測晶圓100 接觸並電連接’進而可進行後續的包含高頻信號的電性檢 測。 導線單元8具有一柔性的本體81，及佈設於本體81中 的一第一連結端子82與一第二連接端子83，本體81呈極 薄的長條態樣，第一、二連接端子82、83分別佈設於本體 81之相反兩端且彼此相對應地電連接，第一連接端子Μ是 與第一界面單元6之複數高頻信號接點62對應地電連接， 在本例中是以固接於高頻信號接點為例說明。第二連接端 子83是一可與高頻信號插接埠721相對應配合的快速接頭 ，而可脫離地與高頻信號插接埠721緊密地連結，進而使 第一界面單元6的高頻信號接點62與第二界面7之高頻信 號插接埠721藉導線單元8電連接，以在電性測試時傳輸 南頻信號。 第一、二界面單元6、7先以導線單元8彼此電連接第 一界面單元6的高頻信號接點62與第二界面7之高頻信號 插接琿72卜再藉著移動測試頭裝置12帶動第_界面單元 6相對第二界面單元7移動定位，使第-界面單元6與第： 界面單元7對應定位並形成電連接，而形成通路以進行： 續包含高頻信號的電性檢測。 丁 < 應用本新型晶圓針測機丨之高頻信號轉接界面裝置 時’在進行測試前組裝定位的準備卫作與f知的' 5 相似，需將第一界面單元6定位鎖固於測試頭裝置1上 M270488 字針測卡71、套設組件72藉由頂蓋定位鎖固在測試 座虞置上’之後，本新型晶圓針測機丨之高頻信號轉接界 面#f 5 S為導線單元8之第一連結端子82已固接於第-界面單tl 6之南頻信號接點63，所以僅需將第二連社端子 83簡單地對應地插置於第二界面單元7的高頻信_接埠 721後，即可確實地以導線單元8電連接第―、二界面單元 6、7之間有關高頻信號的相關傳輸；接著再相對移動測試 頭裝置1帶，第一界面單元6，使第一界面單元62對應地 與第-界面單元定位並電連接後，即使測試軟體裝置、測 試頭裝置1、高頻信號轉接界面裝置5形成通路，完成測試 準備。接著，即可以挾持單元帶動待測晶M 1GG使其中^ 一待測晶粒與針測卡72接觸並電連接，以測試軟體裝置之 預"又軟體對其進行包含高頻信號的電性測試。 由上述說明可知，本新型晶圓針測機1之高頻信號轉 接界面裝£ 5主要是利用導線單元8以簡單快速地插置方 式’續實地預先電連接第―、二界面單元6、7關於高頻信 號的傳輸，使得高頻信號的傳輸電連接確實之後，再相對 移動測試頭裝置i帶動第一界面單元6，使第一界面單元6 對應地與第二界面單元7定位連結’而可進行包含高頻信 號的電性測試’確實可以改善習知轉接界面裝置2在第— 一界面單兀3、4對應定位連結後，會因為高頻信號播腳Ring Carrier) is fixed to the base unit. The holding unit of the test base device can drive the wafer under test 100, so that the pin test card 42 directly contacts and is electrically connected to the wafer under test 100 ', and then the subsequent electrical inspection including high-frequency signals can be performed. The lead unit 8 has a flexible body 81 and a first connection terminal 82 and a second connection terminal 83 arranged in the body 81. The body 81 is in a very thin and long shape. The first and second connection terminals 82, 83 are respectively arranged at opposite ends of the main body 81 and are electrically connected correspondingly to each other. The first connection terminal M is electrically connected to the plurality of high-frequency signal contacts 62 of the first interface unit 6 in a corresponding manner. Connected to the high-frequency signal contact as an example. The second connection terminal 83 is a quick connector that can be matched with the high-frequency signal plug-in port 721, and is detachably tightly connected with the high-frequency signal plug-in port 721, so that the high-frequency signal of the first interface unit 6 The contact point 62 is electrically connected to the high-frequency signal plug-in port 721 of the second interface 7 through the wire unit 8 to transmit the south frequency signal during the electrical test. The first and second interface units 6 and 7 are electrically connected to each other by the wire unit 8 between the high-frequency signal contact 62 of the first interface unit 6 and the high-frequency signal plug of the second interface 7 (72), and then by moving the test head device 12 drives the _ interface unit 6 to move relative to the second interface unit 7 so that the-interface unit 6 and the: interface unit 7 are positioned correspondingly and form an electrical connection, and a path is formed for: continued electrical detection including high frequency signals . D < When applying the high-frequency signal transfer interface device of the new wafer pin tester 丨 The preparation work for assembly and positioning before testing is similar to that of F'5, the first interface unit 6 needs to be positioned and locked. After the M270488 pin probe card 71 and the set assembly 72 on the test head device 1 are positioned and locked on the test base by the top cover, the high-frequency signal conversion interface of the new wafer prober 丨 f 5 S is the first connection terminal 82 of the lead unit 8 has been fixed to the south frequency signal contact 63 of the first interface tl 6, so only the second association terminal 83 needs to be simply inserted into the second interface correspondingly. After the high-frequency signal _ port 721 of the unit 7, the relevant transmission of high-frequency signals between the first and second interface units 6 and 7 can be electrically connected with the wire unit 8; then, the test head device 1 is moved relatively, and the first An interface unit 6 allows the first interface unit 62 to be positioned and electrically connected to the first interface unit correspondingly, even if the test software device, the test head device 1, and the high-frequency signal transfer interface device 5 form a path to complete the test preparation. Then, the holding unit can be used to drive the test crystal M 1GG so that one of the test crystals is in contact with the probe card 72 and is electrically connected to test the software device's electrical properties including high-frequency signals. test. As can be seen from the above description, the high-frequency signal conversion interface of the new wafer prober 1 is mainly installed by using the wire unit 8 in a simple and fast way to insert electrical connections to the first and second interface units 6 and 6, 7 Regarding the transmission of high-frequency signals so that the high-frequency signal transmission is electrically connected, then move the test head device i relatively to drive the first interface unit 6 so that the first interface unit 6 is correspondingly positioned and connected to the second interface unit 7 ' And electrical tests including high-frequency signals can be performed. Indeed, the conventional interface device 2 can be improved after the first and second interface units 3 and 4 correspond to the positioning link.
Ml、高頻信號插接埠421接觸深度不足而導致有關高頻作 號的測試失敗’導致誤測率提高的缺點，確實達到本新型 之創作目的。 12 M270488 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及說明書内容所作之簡單的等效變化與修飾，皆仍屬 本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一分解示意圖，說明一習知晶圓針測機之一測 試頭裝置、一轉接界面裝置的構造，以及與待測晶圓的相 互關係； 圖2是一示意圖，說明圖1之晶圓針測機的測試頭裝 置與轉接界面裝置，以及與待測晶圓相互定位並形成電連 接的狀態； ’ 圖3是一分解示意圖，說明本新型晶圓針測機之一測 試頭裝置、一高頻信號轉接界面裝置，以及與待測晶圓的 相互關係；及 圖4是一示思圖，說明圖3之晶圓針測機的測試頭裝 置與高頻信號轉接界面裝置，以及與待測晶圓相互定位並 形成電連接的狀態。 13 M270488 【主要元件符號說明】 100 待測晶圓 裝置 200 頂蓋 6 第一界面單元 1 測試頭裝置 61 承載板 2 轉接界面裝置 62 高頻信號接點 3 第一界面單元 7 第二界面單元 31 承載板 71 套設組件 32 高頻信號測試座 72 針測卡 321 高頻信號插腳 721 高頻信號插接埠 4 第二界面單元 8 導線單元 41 套設組件 81 本體 42 針測卡 82 第一連結端子 421 高頻信號插接埠 83 第二連接端子 5 高頻信號轉接界面 14Ml. The shortcoming of the high-frequency signal plug-in port 421's insufficient contact depth leads to the failure of the test of high-frequency signals', which leads to an increase in the rate of false detection, and indeed achieves the creative purpose of this new model. 12 M270488 However, the above are only the preferred embodiments of the new model. When the scope of the implementation of the new model cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and the description of the new model , Are still covered by the new patent. [Brief description of the drawings] FIG. 1 is an exploded view illustrating the structure of a test head device, a transition interface device of a conventional wafer prober, and the relationship between the device and a wafer to be tested; FIG. 2 is a schematic view, Explain the test head device and transition interface device of the wafer prober of FIG. 1 and the state of mutual positioning and electrical connection with the wafer to be tested; FIG. 3 is an exploded view illustrating the new wafer prober A test head device, a high-frequency signal conversion interface device, and the relationship between the test head device and the wafer to be tested; and FIG. 4 is a diagram illustrating the test head device and high frequency of the wafer pin tester of FIG. 3 Signal transfer interface device, and a state in which the signal transfer interface device and the wafer to be tested are mutually positioned and electrically connected. 13 M270488 [Description of main component symbols] 100 Wafer device under test 200 Top cover 6 First interface unit 1 Test head device 61 Carrier board 2 Transfer interface device 62 High-frequency signal contact 3 First interface unit 7 Second interface unit 31 Carrying board 71 Set components 32 High-frequency signal test socket 72-pin test card 321 High-frequency signal pins 721 High-frequency signal socket 4 Second interface unit 8 Lead unit 41 Set-up component 81 Body 42 Pin test card 82 First Connection terminal 421 High-frequency signal insertion port 83 Second connection terminal 5 High-frequency signal transfer interface 14